DE4225138A1 - Multichipmodul und Verfahren zu dessen Herstellung - Google Patents

Multichipmodul und Verfahren zu dessen Herstellung

Info

Publication number
DE4225138A1
DE4225138A1 DE4225138A DE4225138A DE4225138A1 DE 4225138 A1 DE4225138 A1 DE 4225138A1 DE 4225138 A DE4225138 A DE 4225138A DE 4225138 A DE4225138 A DE 4225138A DE 4225138 A1 DE4225138 A1 DE 4225138A1
Authority
DE
Germany
Prior art keywords
bumps
substrate
contact
layer
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4225138A
Other languages
German (de)
English (en)
Inventor
Max Dr Rer Nat Kuisl
Johann Dipl Ing Ziegler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DAIMLERCHRYSLER AG, 70567 STUTTGART, DE AEG INFRAR
Original Assignee
Daimler Benz AG
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daimler Benz AG, Licentia Patent Verwaltungs GmbH filed Critical Daimler Benz AG
Priority to DE4225138A priority Critical patent/DE4225138A1/de
Priority to EP93111497A priority patent/EP0581152B1/de
Priority to DE59307536T priority patent/DE59307536D1/de
Publication of DE4225138A1 publication Critical patent/DE4225138A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
    • H01L25/0655—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01049—Indium [In]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
DE4225138A 1992-07-30 1992-07-30 Multichipmodul und Verfahren zu dessen Herstellung Withdrawn DE4225138A1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE4225138A DE4225138A1 (de) 1992-07-30 1992-07-30 Multichipmodul und Verfahren zu dessen Herstellung
EP93111497A EP0581152B1 (de) 1992-07-30 1993-07-17 Verfahren zur Herstellung eines Multichipmoduls mittels Kontakhöcker
DE59307536T DE59307536D1 (de) 1992-07-30 1993-07-17 Verfahren zur Herstellung eines Multichipmoduls mittels Kontakhöcker

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4225138A DE4225138A1 (de) 1992-07-30 1992-07-30 Multichipmodul und Verfahren zu dessen Herstellung

Publications (1)

Publication Number Publication Date
DE4225138A1 true DE4225138A1 (de) 1994-02-03

Family

ID=6464423

Family Applications (2)

Application Number Title Priority Date Filing Date
DE4225138A Withdrawn DE4225138A1 (de) 1992-07-30 1992-07-30 Multichipmodul und Verfahren zu dessen Herstellung
DE59307536T Expired - Fee Related DE59307536D1 (de) 1992-07-30 1993-07-17 Verfahren zur Herstellung eines Multichipmoduls mittels Kontakhöcker

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE59307536T Expired - Fee Related DE59307536D1 (de) 1992-07-30 1993-07-17 Verfahren zur Herstellung eines Multichipmoduls mittels Kontakhöcker

Country Status (2)

Country Link
EP (1) EP0581152B1 (enrdf_load_stackoverflow)
DE (2) DE4225138A1 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4427516A1 (de) * 1994-08-03 1996-02-15 Siemens Ag Verfahren zur Herstellung einer dreidimensionalen Schaltungsanordnung
US5706578A (en) * 1994-02-16 1998-01-13 Siemens Aktiengesellschaft Method for producing a three-dimensional circuit arrangement

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2739284B1 (fr) * 1995-09-29 1997-11-07 Oreal Composition pour le traitement des matieres keratiniques comprenant au moins un polymere silicone greffe et au moins un amide a chaine grasse et utilisations
US11165010B2 (en) 2019-02-11 2021-11-02 International Business Machines Corporation Cold-welded flip chip interconnect structure

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2044494A1 (enrdf_load_stackoverflow) * 1970-09-08 1972-01-13
DE2150696A1 (de) * 1971-10-12 1973-04-19 Bosch Gmbh Robert Verfahren zur herstellung eines hybridschaltkreises
DE2415120A1 (de) * 1974-03-28 1975-10-02 Siemens Ag Verfahren zur herstellung von halbleiterchips tragenden chiptraegern
US4179802A (en) * 1978-03-27 1979-12-25 International Business Machines Corporation Studded chip attachment process
DE3607093A1 (de) * 1985-03-15 1986-09-18 Smiths Industries Plc, London Elektronisches bauteil
DE3640248A1 (de) * 1985-12-16 1987-06-19 Nat Semiconductor Corp Halbleitervorrichtung
EP0261799A1 (en) * 1986-08-28 1988-03-30 Fujitsu Limited Method for producing a terminal electrode of a semi-conductor device
US4752027A (en) * 1987-02-20 1988-06-21 Hewlett-Packard Company Method and apparatus for solder bumping of printed circuit boards
US4866507A (en) * 1986-05-19 1989-09-12 International Business Machines Corporation Module for packaging semiconductor integrated circuit chips on a base substrate
DE3937549A1 (de) * 1988-11-11 1990-05-17 Hitachi Ltd Elektronische schaltung und verfahren zur herstellung derselben
EP0414594A1 (fr) * 1989-08-18 1991-02-27 Commissariat A L'energie Atomique Procédé de réparation d'un dispositif à substrat porteur de circuits intégrés
EP0435584A1 (en) * 1989-12-29 1991-07-03 International Business Machines Corporation Multi-level circuit structure
DE4110373A1 (de) * 1990-03-30 1991-10-10 Hitachi Ltd Elektronische schaltungseinrichtung und verfahren zum herstellen derselben
DE4020048A1 (de) * 1990-06-23 1992-01-02 Ant Nachrichtentech Anordnung aus substrat und bauelement und verfahren zur herstellung
WO1992000604A1 (en) * 1990-06-22 1992-01-09 International Business Machines Corporation Metal bump for a thermal compression bond and method for making same
EP0469216A1 (en) * 1990-07-31 1992-02-05 International Business Machines Corporation Method of forming metal contact pads and terminals on semiconductor chips
WO1992006491A1 (en) * 1990-10-09 1992-04-16 Eastman Kodak Company Bonding of solid state device to terminal board
EP0493131A1 (en) * 1990-12-26 1992-07-01 Nec Corporation Method of connecting an integrated circuit chip to a substrate having wiring pattern formed thereon

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69128014T2 (de) * 1990-08-31 1998-05-20 Nippon Electric Co Herstellungsverfahren für integrierte Schaltungschip Packung

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2044494A1 (enrdf_load_stackoverflow) * 1970-09-08 1972-01-13
DE2150696A1 (de) * 1971-10-12 1973-04-19 Bosch Gmbh Robert Verfahren zur herstellung eines hybridschaltkreises
DE2415120A1 (de) * 1974-03-28 1975-10-02 Siemens Ag Verfahren zur herstellung von halbleiterchips tragenden chiptraegern
US4179802A (en) * 1978-03-27 1979-12-25 International Business Machines Corporation Studded chip attachment process
DE3607093A1 (de) * 1985-03-15 1986-09-18 Smiths Industries Plc, London Elektronisches bauteil
DE3640248A1 (de) * 1985-12-16 1987-06-19 Nat Semiconductor Corp Halbleitervorrichtung
US4866507A (en) * 1986-05-19 1989-09-12 International Business Machines Corporation Module for packaging semiconductor integrated circuit chips on a base substrate
EP0261799A1 (en) * 1986-08-28 1988-03-30 Fujitsu Limited Method for producing a terminal electrode of a semi-conductor device
US4752027A (en) * 1987-02-20 1988-06-21 Hewlett-Packard Company Method and apparatus for solder bumping of printed circuit boards
DE3937549A1 (de) * 1988-11-11 1990-05-17 Hitachi Ltd Elektronische schaltung und verfahren zur herstellung derselben
EP0414594A1 (fr) * 1989-08-18 1991-02-27 Commissariat A L'energie Atomique Procédé de réparation d'un dispositif à substrat porteur de circuits intégrés
EP0435584A1 (en) * 1989-12-29 1991-07-03 International Business Machines Corporation Multi-level circuit structure
DE4110373A1 (de) * 1990-03-30 1991-10-10 Hitachi Ltd Elektronische schaltungseinrichtung und verfahren zum herstellen derselben
WO1992000604A1 (en) * 1990-06-22 1992-01-09 International Business Machines Corporation Metal bump for a thermal compression bond and method for making same
DE4020048A1 (de) * 1990-06-23 1992-01-02 Ant Nachrichtentech Anordnung aus substrat und bauelement und verfahren zur herstellung
EP0469216A1 (en) * 1990-07-31 1992-02-05 International Business Machines Corporation Method of forming metal contact pads and terminals on semiconductor chips
WO1992006491A1 (en) * 1990-10-09 1992-04-16 Eastman Kodak Company Bonding of solid state device to terminal board
EP0493131A1 (en) * 1990-12-26 1992-07-01 Nec Corporation Method of connecting an integrated circuit chip to a substrate having wiring pattern formed thereon

Non-Patent Citations (10)

* Cited by examiner, † Cited by third party
Title
1984,Vol.27,No. 6, S.3341-3342 *
1989,Vol.32,No. 3B, S.36-37 *
et.al.: SOLDER BUMP FABRICATION BY ELECTROCHEMICAL METHOD FOR FLIP CHIP INTERCONNEC- TION: In: IEEE 1981, pp 149-155 *
et.al.: SUBSTRATE FOR ELECTRONIC COMPONENTS. In: MOTOROLA Technical Developments, Vol.11,Oct.1990,S.71-72 *
HACKE,Hans-Jürgen: Tape Automated Bonding. In: Feinwerktechnik & Messtechnik 98,1990,12, S.553- 556 *
IBM Technical Disclosure Bulletin: 1990,Vol.32,No.10B, S.476-477 *
KAWANOBE,T. *
MICRO SYSTEM Technologies 90, Springer-Verlag Berlin, Heidelberg, 1990, S.429-434 *
MOITIKA,F.: FLIP-CHIP ON PERSONALIZATION CHIP PACKAGE. In: IBM Technical Disclosure Bulletin, Vol.23,No.7A,Dec.1980,S.2770-2773 *
SHEEHY,Xavier *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5706578A (en) * 1994-02-16 1998-01-13 Siemens Aktiengesellschaft Method for producing a three-dimensional circuit arrangement
DE4427516A1 (de) * 1994-08-03 1996-02-15 Siemens Ag Verfahren zur Herstellung einer dreidimensionalen Schaltungsanordnung

Also Published As

Publication number Publication date
EP0581152B1 (de) 1997-10-15
DE59307536D1 (de) 1997-11-20
EP0581152A3 (enrdf_load_stackoverflow) 1994-03-16
EP0581152A2 (de) 1994-02-02

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Legal Events

Date Code Title Description
OM8 Search report available as to paragraph 43 lit. 1 sentence 1 patent law
8127 New person/name/address of the applicant

Owner name: DAIMLER-BENZ AKTIENGESELLSCHAFT, 70567 STUTTGART,

8120 Willingness to grant licences paragraph 23
8127 New person/name/address of the applicant

Owner name: DAIMLERCHRYSLER AG, 70567 STUTTGART, DE AEG INFRAR

8141 Disposal/no request for examination