DE3829159A1 - Vorrichtung zur aufnahme von halbleiterscheibchen - Google Patents

Vorrichtung zur aufnahme von halbleiterscheibchen

Info

Publication number
DE3829159A1
DE3829159A1 DE3829159A DE3829159A DE3829159A1 DE 3829159 A1 DE3829159 A1 DE 3829159A1 DE 3829159 A DE3829159 A DE 3829159A DE 3829159 A DE3829159 A DE 3829159A DE 3829159 A1 DE3829159 A1 DE 3829159A1
Authority
DE
Germany
Prior art keywords
supports
support
slots
essentially
cross
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE3829159A
Other languages
German (de)
English (en)
Other versions
DE3829159C2 (https=
Inventor
Eberhard Zell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WESTDEUTSCHE QUARZSCHMELZE GMB
Original Assignee
WESTDEUTSCHE QUARZSCHMELZE GMB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WESTDEUTSCHE QUARZSCHMELZE GMB filed Critical WESTDEUTSCHE QUARZSCHMELZE GMB
Priority to DE3829159A priority Critical patent/DE3829159A1/de
Publication of DE3829159A1 publication Critical patent/DE3829159A1/de
Application granted granted Critical
Publication of DE3829159C2 publication Critical patent/DE3829159C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/13—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE3829159A 1988-08-27 1988-08-27 Vorrichtung zur aufnahme von halbleiterscheibchen Granted DE3829159A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE3829159A DE3829159A1 (de) 1988-08-27 1988-08-27 Vorrichtung zur aufnahme von halbleiterscheibchen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3829159A DE3829159A1 (de) 1988-08-27 1988-08-27 Vorrichtung zur aufnahme von halbleiterscheibchen

Publications (2)

Publication Number Publication Date
DE3829159A1 true DE3829159A1 (de) 1990-03-08
DE3829159C2 DE3829159C2 (https=) 1993-08-05

Family

ID=6361751

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3829159A Granted DE3829159A1 (de) 1988-08-27 1988-08-27 Vorrichtung zur aufnahme von halbleiterscheibchen

Country Status (1)

Country Link
DE (1) DE3829159A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4428169A1 (de) * 1994-08-09 1996-02-15 Steag Micro Tech Gmbh Träger für Substrate
US5582649A (en) * 1996-02-29 1996-12-10 The United States Of America As Represented By The Secretary Of The Air Force Wafer transfer apparatus for use in a film deposition furnace

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH570700A5 (https=) * 1973-10-19 1975-12-15 Heraeus Schott Quarzschmelze
US4053294A (en) * 1976-05-19 1977-10-11 California Quartzware Corporation Low stress semiconductor wafer carrier and method of manufacture
DE8021868U1 (de) * 1980-08-16 1981-01-29 Heraeus Quarzschmelze Gmbh, 6450 Hanau Traegerhorde fuer halbleiterscheiben
EP0056326A2 (en) * 1981-01-14 1982-07-21 Northern Telecom Limited Coating of semiconductor wafers and apparatus therefor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH570700A5 (https=) * 1973-10-19 1975-12-15 Heraeus Schott Quarzschmelze
US4053294A (en) * 1976-05-19 1977-10-11 California Quartzware Corporation Low stress semiconductor wafer carrier and method of manufacture
DE8021868U1 (de) * 1980-08-16 1981-01-29 Heraeus Quarzschmelze Gmbh, 6450 Hanau Traegerhorde fuer halbleiterscheiben
EP0056326A2 (en) * 1981-01-14 1982-07-21 Northern Telecom Limited Coating of semiconductor wafers and apparatus therefor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4428169A1 (de) * 1994-08-09 1996-02-15 Steag Micro Tech Gmbh Träger für Substrate
WO1996005611A1 (de) * 1994-08-09 1996-02-22 Steag Microtech Gmbh Donaueschingen Träger für substrate
US5582649A (en) * 1996-02-29 1996-12-10 The United States Of America As Represented By The Secretary Of The Air Force Wafer transfer apparatus for use in a film deposition furnace

Also Published As

Publication number Publication date
DE3829159C2 (https=) 1993-08-05

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee