DE3817879A1 - Mounting plate - Google Patents

Mounting plate

Info

Publication number
DE3817879A1
DE3817879A1 DE19883817879 DE3817879A DE3817879A1 DE 3817879 A1 DE3817879 A1 DE 3817879A1 DE 19883817879 DE19883817879 DE 19883817879 DE 3817879 A DE3817879 A DE 3817879A DE 3817879 A1 DE3817879 A1 DE 3817879A1
Authority
DE
Germany
Prior art keywords
carrier plate
ls
characterized
according
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19883817879
Other languages
German (de)
Inventor
Anton Huber
Hans-Georg Kumpfmueller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE3813077 priority Critical
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19883817879 priority patent/DE3817879A1/en
Publication of DE3817879A1 publication Critical patent/DE3817879A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60RVEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239Electronic boxes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/023Stackable modules
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/049PCB for one component, e.g. for mounting onto mother PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10507Involving several components
    • H05K2201/10515Stacked components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10689Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742Details of leads
    • H05K2201/10886Other details
    • H05K2201/10946Leads attached onto leadless component after manufacturing the component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1572Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447Lead-in-hole components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/368Assembling printed circuits with other printed circuits parallel to each other

Abstract

The invention relates to a mounting plate (T) - for example for ultracompact car electronics circuits - for supporting at least a single electronic component (E, F) and for fastening on a baseplate (L) supporting the mounting plate (T), having - an upper plate side and a lower plate side, - rows of conducting pins (LS) which project perpendicularly from the plane (UE) of the lower plate side, of which at least two rows are arranged in dual-in-line form, - conducting tracks and - contact points (K), to which the terminals of the component (E, F) to be mounted on the upper plate side or on the lower plate side respectively can be or are conductively fastened, - the separation (A) at least of the dual-in-line conducting pin rows (LS) being greater than the installation width (B) of a semiconductor-chip housing (P), - the separation (A) being, however, smaller than the corresponding width of the baseplate (L), i.e. the width measured parallel to the separation A, and - the length (S) of the conducting pins (LS) is, in each case, greater than the installation height (H) of the semiconductor-chip housing (P) (Figs. 1 to 3). <IMAGE>

Description

The invention relates to the preamble of claim 1 defined special carrier plate, which is over for itself is known. Such carrier plates are very often so-called ge printed circuits.

Although the invention was primarily for computer control developed for automotive transmissions; however, it has beyond Also important for other applications.

Known advantages of such carrier plates are e.g. that

  • - They are suitable for carrying various components, e.g. discrete components such as capacitors, resistors, networks and transistors, but also semiconductors, chips - in their own housings or bare chips - and other components,
  • - They are attached to the carrier plate in different ways can be, e.g. by inserting conductor pins of construction parts in contact points of the carrier plate, which in turn are formed by vias, after which the conductors pens if necessary, e.g. by gush solder, can be soldered,
  • the conductor pins also e.g. by bonding to other contacts surfaces of the support plate can be attached, and
  • -The components also by means of resistance layers without conductor pins can be formed using thin-film or thick-film technology, which are e.g. printed by screen printing or are evaporated and / or sputtered in a vacuum, whereby such layered components can also be multi-layered can.

The object of the invention

  • - namely a particularly compact structure of the circuit enable,
  • - To avoid that a base plate equipped with a circuit is very large and therefore particularly prone to breakage - for example in a car accident - by the invention is intended to enable the safety of the base plate to be broken in an elegant manner to save space by reducing its size,
  • - To enable that in the circuit for calibration and / or test temporarily use additional electronic components can be stuck

is ge by the measures specified in claim 1 solves. The invention therefore relates to a special carrier plate, to be attached to the base plate. As a base plate not only a conductor equipped with a circuit is suitable plate, but also other reason supporting a circuit plates such as Layer circuit carriers.

The additional measures specified in the subclaims allow additional advantages to be achieved. Among other things, ge allow the measures according to claim
2, to be able to attach a particularly large number of components to the carrier plate without having to make the surface of the carrier plate, for example, the same size as that of the base plate;
3, to achieve particularly short conduction paths between the component attached to the carrier plate - or between the components attached to the carrier plate - on the one hand and the semiconductor chip attached under the carrier plate on the base plate - or the semiconductor chips attached under the circuit board - on the other hand, where, for example, the high-frequency behavior can be improved or the clock frequency of the respective component and the semiconductor chip can be chosen to be particularly high;
4 to offer a compact, rigid end product;
5, to achieve a detachable plug connection between the carrier plate and the base plate, this plug connection being additionally soldered if necessary, for example soldered by wave soldering, and thus permanently no longer being easily detachable;
6, to be able to use conductor pins, which can be bent at their outermost ends, at which they touch contact surfaces of the base plate, from the direction perpendicular to the plane of the carrier plate underside, wherein these bent ends of the conductor pins can be solidly fastened permanently to the contact surfaces ;
7, to be able to greatly increase the number of supply lines and route lines from the components fastened to the carrier plate without having to greatly increase the space requirement of the carrier plate on the base plate;
8, to achieve further freedom to increase the number of lines and routes;
9 to be able to apply the resistance layer on the carrier plate in such a way that heat dissipation is particularly easy;
10, to be able to insert larger sections of a circuit composed of discrete components, or a complete small circuit, by means of the carrier plate on the base plate;
11, to be able to insert a highly complicated circuit with many own functions by means of the carrier plate on the base plate;
12, to be able to connect a microprocessor chip attached to the base plate via particularly short lines to one or more memory chips attached to the carrier plate, so that the high-frequency behavior is particularly favorable;
13 to be able to apply a particularly high density of functions or components on the carrier plate;
14 to offer a particularly favorable use for the invention;
15 to enable a versatile application of the invention, and
16 and 17, in an unusual way to enable space savings even in the case of base plates carrying layer elements.

The invention is illustrated schematically in the figures Drawed embodiments explained further. Here shows

Fig. 1 is a plan view of a carrier plate fitted with the base plate, which in turn can be here a printed circuit board,

FIG. 2 shows a section through the most important section of the example shown in FIG. 1, and

Fig. 3 shows a variant of the example shown in Fig. 2.

All figures therefore show an example of the carrier plate T , which carries at least one single electronic component, cf. E in FIGS. 1 and 2 and E and F in FIG. 3. Here, E is in each case fastened on the upper side of the carrier plate, but the component F shown in FIG. 3 on the underside of the plate, which surface of the base plate L shown in FIGS. 1 and 2 is turned.

The rows of conductor pins LS protrude perpendicularly from the plane UE of the underside of the plate, of which only two, namely dual-in-line rows of conductor pins LS are shown in the figures for the sake of simplicity. For the sake of clarity, the lines on the carrier plate T , which produce the connection between the connections of the components E / F on the one hand and the conductor pins LS on the other hand, are not entered in the figures, but of course are present, as is customary with carrier plates. In addition, the carrier plate T carries, as usual, contact points, for example bushings K , to which the electrical connections of the component E or F to be attached to the plate top or bottom are in each case conductively attachable or already attached.

According to the invention, the distance A , cf. Figs. 2 and 3, at least the dual-line in-circuit pin rows LS respectively greater than the installation width W of a semiconductor chip package P, which is the support plate T between the conductor pin rows LS on the base plate L half under - here PCB L - is attached. This circuit board L also has, as is customary in the case of circuit boards, lines and contact points which, for reasons of clarity, are not shown or are not shown in detail, cf. D in Fig. 2.

On the circuit board L , which is much larger than the carrier plate te T , a variety of electrical components is BEFE Stigt, see. For example, the capacitors C shown in Fig. 1, opposing R , network N , semiconductor chips U and the special semiconductor chip housing P attached under the carrier. The figures show that part of such components scattered over the support plate can also be arranged on the base plate L in such a way that they are only partially covered by the support plate T instead of completely, although it was assumed in FIG. 1 that that both the semiconductor chip housing P and a discrete resistor R and a further chip housing U are completely covered by the carrier plate T.

The distance A and thus the width of the carrier plate T , cf. Figures 2 and 3, but is significantly smaller than the parallel lying lying width of the base plate L ; ie the carrier plate T covers - at least in this direction - only a part of the base plate L and thus only a part of the components C , P , U , R , etc., which are more or less scattered on the base plate L.

Through the carrier plate T , the entire circuit is installed in at least two floors, namely on the ground floor on the base plate L and on the first floor on the carrier plate T. In principle, a further carrier plate T can be attached above the carrier plate T , which in turn can for example be significantly smaller than the carrier plate T forming the first floor. In this case, the ratio of the carrier plate T forming the first tier to the carrier plate forming the second tier corresponds to the same ratio as the base plate L shown in FIG. 2 to the carrier plate T.

Such a tiered structure, in which the carrier plate T carries electronic components E / F , which cooperate with the components P , U , R , C , etc. mounted on the base plate L , a very particularly compact structure of the whole is achieved Circuit. It is avoided that a single very large-area base plate was used for this circuit, which would be particularly prone to breakage. Instead, the base plate L is smaller than otherwise necessary in an elegant manner, and the comparatively small support plate T is attached as a support for components E / F as a further level. Because of their dual in-line design, the support plate T can additionally be built and arranged on the base plate L in such a way that it also acts to reinforce the base plate L , so that the support plate additionally increases the rigidity and breaking strength of the base plate L. In addition, the support plate T is exposed above the arranged on the base plate L construction elements that the cooling especially of the parts E carried on the plate top of the support plate T is particularly good, so that there also heat losses generating resistance layers can be attached that a heat build-up is relatively easy to avoid. In addition, the carrier plate T is suitable for calibration and / or testing of the components C , R , N , U , P attached to the base plate L by the components E and / or F - or possibly even the ones attached to the carrier plate T. Entire carrier plate T together with all of its components E and / or F - can subsequently be removed from the circuit C , R , U , N , P again as soon as the test or the calibration is completed. The carrier plate T or its components E / F can thus be either easily detachable, for example plugged in, or, if necessary, also permanently attached, for example soldered, as required.

The smaller the distance A between the dual-in-line conductor pin rows LS is selected, the smaller the line lengths that can be achieved between components E and / or F on the one hand and the components attached directly below or next to the carrier plate T on the base plate L. P , U , C , R etc. on the other hand. Such an arrangement with particularly short, low-inductance lines allows particularly high frequencies to be permitted, that is to say, for example, to permit a particularly high clock frequency if it is a digitally operated circuit.

Particularly short lines and thus particularly high operating frequencies can be achieved if the distance A between the dual in-line conductor pin rows LS is smaller than the sum of the installation widths B of three dual in-line semiconductor chip housings which are arranged next to one another on the base plate L. P - or even more so if this distance A is even smaller than the installation width of two dual-in-line semiconductor chip housings P which are arranged next to one another on the base plate L , as was assumed in the figures.

Particularly to improve the high-frequency properties of the circuit, a plurality of such carrier plates T can also be attached to one another on the base plate L.

The length S of the conductor pins L of the carrier plate T given below the underside of the carrier plate must in each case be greater, cf. S in Fig. 2 and 3, as the installation height H of that semiconductor chip housing P , which is covered by the carrier plate T on the base plate L , especially when (also) components F are attached to the bottom of the carrier plates. This also makes it possible for the conductor pins LS to be inserted into contact holes D of the base plate L - and additionally soldered in if necessary - can be, see. the corresponding indications in Fig. 2. This enables a firm, mechanically rigid connection between the base plate L and the support plate T , which increases the rigidity - often also the breaking strength - especially when the support plate T tends to bend more or less Areas of the base plate L , for example in the central region of the base plate L is attached, where particularly strong deflections of the printed circuit board L occur when there are strong mechanical impacts if there was no rigidly and rigidly connected support plate T present. It is favorable for this stiffening effect if the number of conductor pins LS of the carrier plate T is as large as possible or if the corresponding length of the carrier plate T is quite large.

However, the conductor pins LS can also have bent ends, which in turn are placed on contact surfaces of the base plate L , where the bent ends can be connected to the contact surfaces, for example by bonding, firmly and stiffly. The invention is therefore not restricted to conductor pins LS which are inserted through bushings D of the printed circuit board L.

The number of leads and leads of the carrier plate T attached components E and / or F can be greatly increased by the fact that even more rows of conductor pins LS are introduced than are indicated in the figures. Thus, at least four, in a rectangle arranged rows of Lei terstiften LS attached to the support plate T to be, and / or it can be mounted further conductor pin rows on the support plate T is not shown in the figure in parallel to the dual-in-line conductor pin rows LS be.

The carrier plate T can in principle carry any components, that is to say not only discrete components or resistance layers, but in particular also chips or chip housings E and / or F. The variety of possible components is therefore large enough that the invention can be adapted in every respect to the respective needs of the circuit in question.

If the component E and / or F is a semiconductor chip housing, the performance, for example the number of functions, which has the entire circuit mounted on the base plate L including the carrier plate T , can be greatly increased. For example, the invention permits that the components E and F carried by the carrier plate T are each memory chips with a very high storage capacity, so that with the aid of the carrier plate T according to the invention - if necessary in principle also retrospectively - the storage capacity and thus also the functionality of one on the Base plate L attached microcomputers can be further increased. This is particularly the case when the components E , F carried by the carrier plate T are attached to both the upper and the lower side of the carrier plate T , so that a correspondingly high performance of the circuit can be achieved in a spatially highly compact manner .

This attachment of memory chips E / F on the carrier plate T even allows such chips to be loaded first with data which are required for calibration and / or to test the entire circuit, and then to reload these chips E / F and / or as free to leave available memory capacity in the circuit. The memory locations of these chips then fulfill very different functions one after the other.

The base plate L can thus be a printed circuit board L , for example a printed circuit for basically any application.

The base plate can, however, also - instead of or in addition - be a support for layer elements, for example printed, vapor-deposited and / or sputtered resistance layers, such layer elements also being able to be attached below the support plate T , covered by the support plate T. It is even possible that only one or more such layer elements are attached under the carrier plate T , that is, between the rows of dual in-line conductors. The invention is therefore particularly versatile.

The invention, e.g. the examples shown in the figures, are particularly suitable for automotive electronics, in which Vibrations and even an occasional major accident are possible should not cause any breakage. Especially in Auto electronics is very often due to the installation environment to meet the specified condition that the entire circuit in a specially shaped protective capsule is to be accommodated - the Protective capsule is no longer in the figure for the sake of simplicity shown. This protective capsule is often said to be compact and therefore if possible not thin and large, but as much as possible or less be a cube or cuboid with side lengths, which are at most only relatively small factors, e.g. to the Factor 2 or 3, should differ in terms of their length.

Claims (17)

1. Carrier plate ( T ) - eg for highly compact automotive electronics circuits - for carrying at least one single electronic component ( E , F ), and for mounting on a carrier plate ( T ) carrying base plate ( L ), with
  • - top and bottom of the plate,
  • - On and / or next to the underside of the plate, rows of conductor pins (LS) protruding perpendicularly from the plane (UE) of the underside of the plate, of which at least two rows are arranged dual in-line,
  • - conductor tracks and
  • - Contact points ( K ) at which the connections of the component / components ( E , F ) to be attached in each case on the top or underside of the plate can be conductively fastened or fastened, characterized in that
  • - The distance ( A ) at least the dual-in-line conductor pin rows (LS) is larger than the installation width ( B ) of a semiconductor chip housing ( P ) - that is larger than, for example, the installation width ( B ) of a microprocessor housing ( P ), which in turn For example, on a base plate ( L ) carrying a large number of electrical components ( C , R , N , U , P ) that is very large in comparison to the carrier plate ( T ),
  • - The distance ( A ) is smaller than the corresponding, naem Lich parallel to the distance ( A ) measured width of the base plate ( L ) on which the carrier plate ( T ) is to be fastened, and
  • - The length ( S ) of the conductor pins (LS) is in each case greater than the installation height ( H ) of the semiconductor chip housing ( P ) ( FIGS. 1 to 3).
2. carrier plate ( T ) according to claim 1, characterized in that
  • - The distance ( A ) between the dual in-line conductor pin rows ( LS) is smaller than the sum of the installation widths ( B ) of three adjacent dual-in-line semiconductor chip housings ( P ).
3. carrier plate ( T ) according to claim 2, characterized in that
  • - The distance ( A ) between the dual in-line conductor pin rows ( LS) is smaller than the installation width ( B ) of two side by side on the base plate ( L ) attached dual-in-line semiconductor chip housing ( P ) ( Fig. 1 to 3).
4. carrier plate ( T ) according to one of the preceding claims, characterized in that
  • - It (T ) carries at least one component ( E , F ) and
  • - It (T) is attached to the base plate by means of its conductor pins (LS) .
5. carrier plate ( T ) according to claim 4, characterized in that
  • - The conductor pins (LS) , inserted in the contact holes ( D ) of the base plate ( L ), are soldered into these contact holes ( D ) ( Fig. 2).
6. carrier plate ( T ) according to one of the claims 1 to 4, characterized in that
  • - The conductor pins (LS) , placed on contact surfaces of the base plate ( L ), are bonded to these contact surfaces.
7. carrier plate ( T ) according to one of the preceding claims, characterized in that
  • - It has at least four rows of conductor pins (LS) arranged in a rectangle.
8. carrier plate ( T ) according to one of the preceding claims, characterized in that
  • - Further rows of pins of the carrier plate ( T ) are attached parallel to the dual-in-line rows of pins (LS) .
9. carrier plate ( T ) according to one of the preceding claims, characterized in that
  • - The component carried by her - or at least one of the components she carries - is a layered technology - for example, printed or vapor-deposited - resistance layer.
10. carrier plate ( T ) according to one of the preceding claims, characterized in that
  • - The component it carries ( E , F ) - or at least one of the components it carries ( E , F ) - a discrete construction part ( E , F ) - for example, a capacitor, resistor or transistor - is.
11. carrier plate ( T ) according to one of the preceding claims, characterized in that
  • - The component it carries ( E , F ) - or at least one of the components it carries ( E , F ) - contains a semiconductor chip.
12. carrier plate ( T ) according to claim 11, characterized in that
  • - The component ( E , F ) - or at least one of the components it carries ( E , F ) - contains a memory chip, and
  • - The semiconductor chip housing ( P ) - or one (P) of the two semiconductor chip housings - contains a microprocessor chip working together with the memory chip ( FIGS. 2 and 3).
13. carrier plate ( T ) according to one of the preceding claims, characterized in that
  • - Several components ( E , F ) are worn by it, and
  • - At least one component ( E , F ) is fastened to both their top and bottom sides ( FIG. 3).
14. Carrier plate ( T ) according to one of the preceding claims, preferably according to claim 12, characterized in that
  • - It, for the automotive electronics, is contained in a circuit constructed by means of semiconductor chips ( U , P , E ) and
  • - The circuit in operation only a little heat loss, compared to a corre sponding circuit constructed only from discrete components, developed.
15. carrier plate ( T ) according to one of the preceding claims, preferably according to claim 14, characterized in that
  • - The base plate ( L ) is a printed circuit board ( L ).
16. carrier plate ( T ) according to one of the preceding claims, characterized in that
  • - The base plate ( L ) under the carrier plate ( T ), namely between the dual-in-line conductor pin rows (LS) , at least one layer element - for example printed thick-film and / or vapor-deposited and / or sputtered thin-film resistance layers - as a component.
17. Carrier plate ( T ) according to claim 16, characterized in that
  • - The base plate ( L ) between the dual-in-line conductor pin rows (LS) , carries only one or more layer elements connected via lines.
DE19883817879 1988-04-19 1988-05-26 Mounting plate Withdrawn DE3817879A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE3813077 1988-04-19
DE19883817879 DE3817879A1 (en) 1988-04-19 1988-05-26 Mounting plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19883817879 DE3817879A1 (en) 1988-04-19 1988-05-26 Mounting plate

Publications (1)

Publication Number Publication Date
DE3817879A1 true DE3817879A1 (en) 1989-11-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE19883817879 Withdrawn DE3817879A1 (en) 1988-04-19 1988-05-26 Mounting plate

Country Status (1)

Country Link
DE (1) DE3817879A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0473912A2 (en) * 1990-07-24 1992-03-11 DEERE &amp; COMPANY Electric circuit and method to manufacture the same
EP0547957A1 (en) * 1991-12-18 1993-06-23 Automobiles Peugeot Central electrical unit of a vehicle, particularly of an automobile
DE10337443A1 (en) * 2003-08-14 2005-03-24 Siemens Ag Circuit layout for a motor vehicle's passenger safety system has a main board (MB) with circuit components (CC) and an additional board to carry other CC and to fit on the MB with a support
US6913472B2 (en) 2002-06-28 2005-07-05 Siemens Vdo Automotive Corporation Method and apparatus for attaching a sensor assembly in a control unit

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0473912A2 (en) * 1990-07-24 1992-03-11 DEERE &amp; COMPANY Electric circuit and method to manufacture the same
EP0473912A3 (en) * 1990-07-24 1993-10-20 Deere & Co Electric circuit and method to manufacture the same
EP0547957A1 (en) * 1991-12-18 1993-06-23 Automobiles Peugeot Central electrical unit of a vehicle, particularly of an automobile
FR2685565A1 (en) * 1991-12-18 1993-06-25 Peugeot Electrical servitude box, particularly for a motor vehicle.
US6913472B2 (en) 2002-06-28 2005-07-05 Siemens Vdo Automotive Corporation Method and apparatus for attaching a sensor assembly in a control unit
US7147486B2 (en) 2002-06-28 2006-12-12 Siemens Vdo Automotive Corporation Method and apparatus for attaching a sensor assembly in a control unit
DE10337443A1 (en) * 2003-08-14 2005-03-24 Siemens Ag Circuit layout for a motor vehicle's passenger safety system has a main board (MB) with circuit components (CC) and an additional board to carry other CC and to fit on the MB with a support

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