DE3715999C2 - - Google Patents
Info
- Publication number
- DE3715999C2 DE3715999C2 DE3715999A DE3715999A DE3715999C2 DE 3715999 C2 DE3715999 C2 DE 3715999C2 DE 3715999 A DE3715999 A DE 3715999A DE 3715999 A DE3715999 A DE 3715999A DE 3715999 C2 DE3715999 C2 DE 3715999C2
- Authority
- DE
- Germany
- Prior art keywords
- membrane
- central region
- sensor
- electrode
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012528 membrane Substances 0.000 claims description 94
- 239000011888 foil Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000010276 construction Methods 0.000 description 8
- 230000035945 sensitivity Effects 0.000 description 7
- 239000007789 gas Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 239000010453 quartz Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000004868 gas analysis Methods 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000007567 mass-production technique Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
- G01D5/14—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
- G01D5/24—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
- G01D5/241—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes
- G01D5/2417—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes by varying separation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
- G01L9/0044—Constructional details of non-semiconductive diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Measuring Fluid Pressure (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61128930A JPH0726887B2 (ja) | 1986-05-31 | 1986-05-31 | コンデンサマイクロフオン型検出器用ダイアフラム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3715999A1 DE3715999A1 (de) | 1987-12-03 |
| DE3715999C2 true DE3715999C2 (https=) | 1989-12-14 |
Family
ID=14996912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19873715999 Granted DE3715999A1 (de) | 1986-05-31 | 1987-05-13 | Membran fuer ein kondensatormikrophon |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4776019A (https=) |
| JP (1) | JPH0726887B2 (https=) |
| DE (1) | DE3715999A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19647408C1 (de) * | 1996-03-21 | 1997-11-13 | Siemens Ag | Druckaufnehmer |
Families Citing this family (88)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5146435A (en) * | 1989-12-04 | 1992-09-08 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer |
| US5446413A (en) * | 1994-05-20 | 1995-08-29 | Knowles Electronics, Inc. | Impedance circuit for a miniature hearing aid |
| US5452268A (en) * | 1994-08-12 | 1995-09-19 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer with improved low frequency response |
| EP0758080B1 (de) * | 1995-08-09 | 1998-09-30 | Siemens Aktiengesellschaft | Mikromechanisches Bauelement mit perforierter, spannungsfreier Membran |
| USD396862S (en) | 1997-09-22 | 1998-08-11 | Parris Morgan | Microphone filter |
| AU4317099A (en) | 1998-06-05 | 1999-12-20 | Knowles Electronics, Inc. | Solid-state receiver |
| JP4338395B2 (ja) * | 2000-08-11 | 2009-10-07 | ノールズ エレクトロニクス,リミテッド ライアビリティ カンパニー | 小型ブロードバンド変換器 |
| US6987859B2 (en) | 2001-07-20 | 2006-01-17 | Knowles Electronics, Llc. | Raised microstructure of silicon based device |
| US6535460B2 (en) | 2000-08-11 | 2003-03-18 | Knowles Electronics, Llc | Miniature broadband acoustic transducer |
| US8617934B1 (en) | 2000-11-28 | 2013-12-31 | Knowles Electronics, Llc | Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages |
| US7434305B2 (en) | 2000-11-28 | 2008-10-14 | Knowles Electronics, Llc. | Method of manufacturing a microphone |
| US7166910B2 (en) * | 2000-11-28 | 2007-01-23 | Knowles Electronics Llc | Miniature silicon condenser microphone |
| US7439616B2 (en) * | 2000-11-28 | 2008-10-21 | Knowles Electronics, Llc | Miniature silicon condenser microphone |
| US7023066B2 (en) * | 2001-11-20 | 2006-04-04 | Knowles Electronics, Llc. | Silicon microphone |
| US7379553B2 (en) * | 2002-08-30 | 2008-05-27 | Nittobo Acoustic Engineering Co. Ltd | Sound source search system |
| US6781231B2 (en) * | 2002-09-10 | 2004-08-24 | Knowles Electronics Llc | Microelectromechanical system package with environmental and interference shield |
| US6886410B1 (en) * | 2003-12-30 | 2005-05-03 | Honeywell International Inc. | Modified dual diaphragm pressure sensor |
| US6901807B1 (en) * | 2003-12-30 | 2005-06-07 | Honeywell International Inc. | Positive and negative pressure sensor |
| US6991213B2 (en) * | 2003-12-30 | 2006-01-31 | Honeywell International Inc. | Dual diaphragm valve |
| JP4539450B2 (ja) | 2004-11-04 | 2010-09-08 | オムロン株式会社 | 容量型振動センサ及びその製造方法 |
| US7795695B2 (en) | 2005-01-27 | 2010-09-14 | Analog Devices, Inc. | Integrated microphone |
| DE102005008511B4 (de) | 2005-02-24 | 2019-09-12 | Tdk Corporation | MEMS-Mikrofon |
| DE102005008512B4 (de) | 2005-02-24 | 2016-06-23 | Epcos Ag | Elektrisches Modul mit einem MEMS-Mikrofon |
| FR2884101B1 (fr) * | 2005-03-30 | 2007-06-29 | Merry Electronics Co Ltd | Condensateur de microphone au silicium avec effort minimal du diaphragme |
| US20070071268A1 (en) * | 2005-08-16 | 2007-03-29 | Analog Devices, Inc. | Packaged microphone with electrically coupled lid |
| US7449356B2 (en) * | 2005-04-25 | 2008-11-11 | Analog Devices, Inc. | Process of forming a microphone using support member |
| US7885423B2 (en) * | 2005-04-25 | 2011-02-08 | Analog Devices, Inc. | Support apparatus for microphone diaphragm |
| US7825484B2 (en) * | 2005-04-25 | 2010-11-02 | Analog Devices, Inc. | Micromachined microphone and multisensor and method for producing same |
| US8155354B2 (en) | 2005-07-01 | 2012-04-10 | Ehrlund Goeran | Electro acoustic transducer |
| US20070040231A1 (en) * | 2005-08-16 | 2007-02-22 | Harney Kieran P | Partially etched leadframe packages having different top and bottom topologies |
| US8477983B2 (en) * | 2005-08-23 | 2013-07-02 | Analog Devices, Inc. | Multi-microphone system |
| US7961897B2 (en) * | 2005-08-23 | 2011-06-14 | Analog Devices, Inc. | Microphone with irregular diaphragm |
| US8351632B2 (en) * | 2005-08-23 | 2013-01-08 | Analog Devices, Inc. | Noise mitigating microphone system and method |
| DE102005053765B4 (de) | 2005-11-10 | 2016-04-14 | Epcos Ag | MEMS-Package und Verfahren zur Herstellung |
| DE102005053767B4 (de) | 2005-11-10 | 2014-10-30 | Epcos Ag | MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau |
| GB0605576D0 (en) | 2006-03-20 | 2006-04-26 | Oligon Ltd | MEMS device |
| TW200746869A (en) | 2006-03-29 | 2007-12-16 | Yamaha Corp | Condenser microphone |
| US8344487B2 (en) * | 2006-06-29 | 2013-01-01 | Analog Devices, Inc. | Stress mitigation in packaged microchips |
| US20080019543A1 (en) * | 2006-07-19 | 2008-01-24 | Yamaha Corporation | Silicon microphone and manufacturing method therefor |
| EP2044802B1 (en) * | 2006-07-25 | 2013-03-27 | Analog Devices, Inc. | Multiple microphone system |
| US20080042223A1 (en) * | 2006-08-17 | 2008-02-21 | Lu-Lee Liao | Microelectromechanical system package and method for making the same |
| US20080075308A1 (en) * | 2006-08-30 | 2008-03-27 | Wen-Chieh Wei | Silicon condenser microphone |
| US20080083957A1 (en) * | 2006-10-05 | 2008-04-10 | Wen-Chieh Wei | Micro-electromechanical system package |
| US7894622B2 (en) | 2006-10-13 | 2011-02-22 | Merry Electronics Co., Ltd. | Microphone |
| US20080175425A1 (en) * | 2006-11-30 | 2008-07-24 | Analog Devices, Inc. | Microphone System with Silicon Microphone Secured to Package Lid |
| US9078068B2 (en) * | 2007-06-06 | 2015-07-07 | Invensense, Inc. | Microphone with aligned apertures |
| US7694610B2 (en) * | 2007-06-27 | 2010-04-13 | Siemens Medical Solutions Usa, Inc. | Photo-multiplier tube removal tool |
| TW200913178A (en) * | 2007-07-31 | 2009-03-16 | Yamaha Corp | Semiconductor device, pre-mold package, and manufacturing method therefor |
| US20090060232A1 (en) * | 2007-08-08 | 2009-03-05 | Yamaha Corporation | Condenser microphone |
| US20090136064A1 (en) * | 2007-09-28 | 2009-05-28 | Yamaha Corporation | Vibration transducer and manufacturing method therefor |
| US20090190782A1 (en) * | 2007-09-28 | 2009-07-30 | Yamaha Corporation | Vibration transducer |
| JP4946796B2 (ja) * | 2007-10-29 | 2012-06-06 | ヤマハ株式会社 | 振動トランスデューサおよび振動トランスデューサの製造方法 |
| TWI358235B (en) * | 2007-12-14 | 2012-02-11 | Ind Tech Res Inst | Sensing membrane and micro-electro-mechanical syst |
| US7888754B2 (en) * | 2007-12-28 | 2011-02-15 | Yamaha Corporation | MEMS transducer |
| WO2009104389A1 (ja) * | 2008-02-20 | 2009-08-27 | オムロン株式会社 | 静電容量型振動センサ |
| KR200449885Y1 (ko) * | 2008-05-19 | 2010-08-17 | 주식회사 비에스이 | 콘덴서 마이크로폰용 스페이서 일체형 다이어프램 |
| CN101734606B (zh) * | 2008-11-14 | 2013-01-16 | 财团法人工业技术研究院 | 感测薄膜及应用其的微机电系统装置 |
| US8363860B2 (en) * | 2009-03-26 | 2013-01-29 | Analog Devices, Inc. | MEMS microphone with spring suspended backplate |
| EP2239961A1 (en) * | 2009-04-06 | 2010-10-13 | Nxp B.V. | Backplate for microphone |
| SE534314C2 (sv) * | 2009-11-10 | 2011-07-05 | Goeran Ehrlund | Elektroakustisk omvandlare |
| CN102714773A (zh) * | 2009-11-16 | 2012-10-03 | 美国亚德诺半导体公司 | 背板具有特定形状的通孔的传声器 |
| WO2011068344A2 (ko) * | 2009-12-01 | 2011-06-09 | (주)세미로드 | 멤스 마이크로폰 및 그 제조방법 |
| KR101112120B1 (ko) * | 2009-12-01 | 2012-04-10 | (주)세미로드 | 멤스 마이크로폰 및 그 제조방법 |
| CN102065354A (zh) * | 2010-04-19 | 2011-05-18 | 瑞声声学科技(深圳)有限公司 | 振膜和包括该振膜的硅电容麦克风 |
| CN101883306B (zh) * | 2010-04-27 | 2012-12-12 | 瑞声声学科技(深圳)有限公司 | 振膜及包括该振膜的电容麦克风 |
| CN101883307B (zh) * | 2010-05-04 | 2012-12-12 | 瑞声声学科技(深圳)有限公司 | 电容mems麦克风振膜 |
| JP5872163B2 (ja) * | 2011-01-07 | 2016-03-01 | オムロン株式会社 | 音響トランスデューサ、および該音響トランスデューサを利用したマイクロフォン |
| JP4924853B1 (ja) * | 2011-02-23 | 2012-04-25 | オムロン株式会社 | 音響センサ及びマイクロフォン |
| PH12014500968A1 (en) | 2011-11-04 | 2014-06-09 | Knowles Electronics Llc | Embedded dielectric as a barrier in an acoustic device and method of manufacture |
| KR101511946B1 (ko) | 2011-11-17 | 2015-04-14 | 인벤센스, 인크. | 사운드 파이프를 갖춘 마이크로폰 모듈 |
| US9738515B2 (en) * | 2012-06-27 | 2017-08-22 | Invensense, Inc. | Transducer with enlarged back volume |
| US9078063B2 (en) | 2012-08-10 | 2015-07-07 | Knowles Electronics, Llc | Microphone assembly with barrier to prevent contaminant infiltration |
| US9676614B2 (en) | 2013-02-01 | 2017-06-13 | Analog Devices, Inc. | MEMS device with stress relief structures |
| JP6127611B2 (ja) * | 2013-03-14 | 2017-05-17 | オムロン株式会社 | 静電容量型センサ、音響センサ及びマイクロフォン |
| US9338559B2 (en) | 2013-04-16 | 2016-05-10 | Invensense, Inc. | Microphone system with a stop member |
| CN104219598B (zh) * | 2013-05-31 | 2018-03-30 | 美律电子(深圳)有限公司 | 双振膜声波传感器 |
| DE102013106353B4 (de) * | 2013-06-18 | 2018-06-28 | Tdk Corporation | Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement |
| KR101531100B1 (ko) * | 2013-09-30 | 2015-06-23 | 삼성전기주식회사 | 마이크로폰 |
| CN103607684B (zh) * | 2013-11-29 | 2019-01-18 | 上海集成电路研发中心有限公司 | 电容式硅麦克风及其制备方法 |
| DE102014200500A1 (de) * | 2014-01-14 | 2015-07-16 | Robert Bosch Gmbh | Mikromechanische Drucksensorvorrichtung und entsprechendes Herstellungsverfahren |
| US10167189B2 (en) | 2014-09-30 | 2019-01-01 | Analog Devices, Inc. | Stress isolation platform for MEMS devices |
| US9752900B2 (en) * | 2015-07-10 | 2017-09-05 | Wyrobek International, Inc. | Multi-plate capacitive transducer |
| US9794661B2 (en) | 2015-08-07 | 2017-10-17 | Knowles Electronics, Llc | Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package |
| US10131538B2 (en) | 2015-09-14 | 2018-11-20 | Analog Devices, Inc. | Mechanically isolated MEMS device |
| DE102017203384B3 (de) * | 2017-03-02 | 2018-01-18 | Robert Bosch Gmbh | Mikromechanischer Drucksensor |
| CN207911008U (zh) * | 2018-02-06 | 2018-09-25 | 瑞声声学科技(深圳)有限公司 | Mems麦克风 |
| US11417611B2 (en) | 2020-02-25 | 2022-08-16 | Analog Devices International Unlimited Company | Devices and methods for reducing stress on circuit components |
| US11981560B2 (en) | 2020-06-09 | 2024-05-14 | Analog Devices, Inc. | Stress-isolated MEMS device comprising substrate having cavity and method of manufacture |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2352813A1 (de) * | 1973-10-20 | 1975-04-24 | Hartmann & Braun Ag | Zweistrahl-ultrarogasanalysator |
| DE2748089A1 (de) * | 1977-10-27 | 1979-05-03 | Hartmann & Braun Ag | Nichtdispersiver infrarot-gasanalysator |
| DE2751700A1 (de) * | 1977-11-19 | 1979-05-23 | Rainer C Friz | Lautsprechermehrwegmembrane mit mechanischer frequenzweiche |
| JPS58165645U (ja) * | 1982-04-22 | 1983-11-04 | 横河電機株式会社 | 差圧変換器 |
-
1986
- 1986-05-31 JP JP61128930A patent/JPH0726887B2/ja not_active Expired - Lifetime
-
1987
- 1987-05-13 US US07/049,146 patent/US4776019A/en not_active Expired - Fee Related
- 1987-05-13 DE DE19873715999 patent/DE3715999A1/de active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19647408C1 (de) * | 1996-03-21 | 1997-11-13 | Siemens Ag | Druckaufnehmer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0726887B2 (ja) | 1995-03-29 |
| US4776019A (en) | 1988-10-04 |
| JPS62284233A (ja) | 1987-12-10 |
| DE3715999A1 (de) | 1987-12-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |