DE3715999C2 - - Google Patents

Info

Publication number
DE3715999C2
DE3715999C2 DE3715999A DE3715999A DE3715999C2 DE 3715999 C2 DE3715999 C2 DE 3715999C2 DE 3715999 A DE3715999 A DE 3715999A DE 3715999 A DE3715999 A DE 3715999A DE 3715999 C2 DE3715999 C2 DE 3715999C2
Authority
DE
Germany
Prior art keywords
membrane
central region
sensor
electrode
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3715999A
Other languages
German (de)
English (en)
Other versions
DE3715999A1 (de
Inventor
Kimio Kyoto Jp Miyatake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Horiba Ltd
Original Assignee
Horiba Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Horiba Ltd filed Critical Horiba Ltd
Publication of DE3715999A1 publication Critical patent/DE3715999A1/de
Application granted granted Critical
Publication of DE3715999C2 publication Critical patent/DE3715999C2/de
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D5/00Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
    • G01D5/12Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
    • G01D5/14Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage
    • G01D5/24Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance
    • G01D5/241Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes
    • G01D5/2417Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means influencing the magnitude of a current or voltage by varying capacitance by relative movement of capacitor electrodes by varying separation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G01L9/0044Constructional details of non-semiconductive diaphragms
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Measuring Fluid Pressure (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
DE19873715999 1986-05-31 1987-05-13 Membran fuer ein kondensatormikrophon Granted DE3715999A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61128930A JPH0726887B2 (ja) 1986-05-31 1986-05-31 コンデンサマイクロフオン型検出器用ダイアフラム

Publications (2)

Publication Number Publication Date
DE3715999A1 DE3715999A1 (de) 1987-12-03
DE3715999C2 true DE3715999C2 (https=) 1989-12-14

Family

ID=14996912

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19873715999 Granted DE3715999A1 (de) 1986-05-31 1987-05-13 Membran fuer ein kondensatormikrophon

Country Status (3)

Country Link
US (1) US4776019A (https=)
JP (1) JPH0726887B2 (https=)
DE (1) DE3715999A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19647408C1 (de) * 1996-03-21 1997-11-13 Siemens Ag Druckaufnehmer

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US5446413A (en) * 1994-05-20 1995-08-29 Knowles Electronics, Inc. Impedance circuit for a miniature hearing aid
US5452268A (en) * 1994-08-12 1995-09-19 The Charles Stark Draper Laboratory, Inc. Acoustic transducer with improved low frequency response
EP0758080B1 (de) * 1995-08-09 1998-09-30 Siemens Aktiengesellschaft Mikromechanisches Bauelement mit perforierter, spannungsfreier Membran
USD396862S (en) 1997-09-22 1998-08-11 Parris Morgan Microphone filter
AU4317099A (en) 1998-06-05 1999-12-20 Knowles Electronics, Inc. Solid-state receiver
JP4338395B2 (ja) * 2000-08-11 2009-10-07 ノールズ エレクトロニクス,リミテッド ライアビリティ カンパニー 小型ブロードバンド変換器
US6987859B2 (en) 2001-07-20 2006-01-17 Knowles Electronics, Llc. Raised microstructure of silicon based device
US6535460B2 (en) 2000-08-11 2003-03-18 Knowles Electronics, Llc Miniature broadband acoustic transducer
US8617934B1 (en) 2000-11-28 2013-12-31 Knowles Electronics, Llc Methods of manufacture of top port multi-part surface mount silicon condenser microphone packages
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US7166910B2 (en) * 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US7439616B2 (en) * 2000-11-28 2008-10-21 Knowles Electronics, Llc Miniature silicon condenser microphone
US7023066B2 (en) * 2001-11-20 2006-04-04 Knowles Electronics, Llc. Silicon microphone
US7379553B2 (en) * 2002-08-30 2008-05-27 Nittobo Acoustic Engineering Co. Ltd Sound source search system
US6781231B2 (en) * 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
US6886410B1 (en) * 2003-12-30 2005-05-03 Honeywell International Inc. Modified dual diaphragm pressure sensor
US6901807B1 (en) * 2003-12-30 2005-06-07 Honeywell International Inc. Positive and negative pressure sensor
US6991213B2 (en) * 2003-12-30 2006-01-31 Honeywell International Inc. Dual diaphragm valve
JP4539450B2 (ja) 2004-11-04 2010-09-08 オムロン株式会社 容量型振動センサ及びその製造方法
US7795695B2 (en) 2005-01-27 2010-09-14 Analog Devices, Inc. Integrated microphone
DE102005008511B4 (de) 2005-02-24 2019-09-12 Tdk Corporation MEMS-Mikrofon
DE102005008512B4 (de) 2005-02-24 2016-06-23 Epcos Ag Elektrisches Modul mit einem MEMS-Mikrofon
FR2884101B1 (fr) * 2005-03-30 2007-06-29 Merry Electronics Co Ltd Condensateur de microphone au silicium avec effort minimal du diaphragme
US20070071268A1 (en) * 2005-08-16 2007-03-29 Analog Devices, Inc. Packaged microphone with electrically coupled lid
US7449356B2 (en) * 2005-04-25 2008-11-11 Analog Devices, Inc. Process of forming a microphone using support member
US7885423B2 (en) * 2005-04-25 2011-02-08 Analog Devices, Inc. Support apparatus for microphone diaphragm
US7825484B2 (en) * 2005-04-25 2010-11-02 Analog Devices, Inc. Micromachined microphone and multisensor and method for producing same
US8155354B2 (en) 2005-07-01 2012-04-10 Ehrlund Goeran Electro acoustic transducer
US20070040231A1 (en) * 2005-08-16 2007-02-22 Harney Kieran P Partially etched leadframe packages having different top and bottom topologies
US8477983B2 (en) * 2005-08-23 2013-07-02 Analog Devices, Inc. Multi-microphone system
US7961897B2 (en) * 2005-08-23 2011-06-14 Analog Devices, Inc. Microphone with irregular diaphragm
US8351632B2 (en) * 2005-08-23 2013-01-08 Analog Devices, Inc. Noise mitigating microphone system and method
DE102005053765B4 (de) 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
DE102005053767B4 (de) 2005-11-10 2014-10-30 Epcos Ag MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
GB0605576D0 (en) 2006-03-20 2006-04-26 Oligon Ltd MEMS device
TW200746869A (en) 2006-03-29 2007-12-16 Yamaha Corp Condenser microphone
US8344487B2 (en) * 2006-06-29 2013-01-01 Analog Devices, Inc. Stress mitigation in packaged microchips
US20080019543A1 (en) * 2006-07-19 2008-01-24 Yamaha Corporation Silicon microphone and manufacturing method therefor
EP2044802B1 (en) * 2006-07-25 2013-03-27 Analog Devices, Inc. Multiple microphone system
US20080042223A1 (en) * 2006-08-17 2008-02-21 Lu-Lee Liao Microelectromechanical system package and method for making the same
US20080075308A1 (en) * 2006-08-30 2008-03-27 Wen-Chieh Wei Silicon condenser microphone
US20080083957A1 (en) * 2006-10-05 2008-04-10 Wen-Chieh Wei Micro-electromechanical system package
US7894622B2 (en) 2006-10-13 2011-02-22 Merry Electronics Co., Ltd. Microphone
US20080175425A1 (en) * 2006-11-30 2008-07-24 Analog Devices, Inc. Microphone System with Silicon Microphone Secured to Package Lid
US9078068B2 (en) * 2007-06-06 2015-07-07 Invensense, Inc. Microphone with aligned apertures
US7694610B2 (en) * 2007-06-27 2010-04-13 Siemens Medical Solutions Usa, Inc. Photo-multiplier tube removal tool
TW200913178A (en) * 2007-07-31 2009-03-16 Yamaha Corp Semiconductor device, pre-mold package, and manufacturing method therefor
US20090060232A1 (en) * 2007-08-08 2009-03-05 Yamaha Corporation Condenser microphone
US20090136064A1 (en) * 2007-09-28 2009-05-28 Yamaha Corporation Vibration transducer and manufacturing method therefor
US20090190782A1 (en) * 2007-09-28 2009-07-30 Yamaha Corporation Vibration transducer
JP4946796B2 (ja) * 2007-10-29 2012-06-06 ヤマハ株式会社 振動トランスデューサおよび振動トランスデューサの製造方法
TWI358235B (en) * 2007-12-14 2012-02-11 Ind Tech Res Inst Sensing membrane and micro-electro-mechanical syst
US7888754B2 (en) * 2007-12-28 2011-02-15 Yamaha Corporation MEMS transducer
WO2009104389A1 (ja) * 2008-02-20 2009-08-27 オムロン株式会社 静電容量型振動センサ
KR200449885Y1 (ko) * 2008-05-19 2010-08-17 주식회사 비에스이 콘덴서 마이크로폰용 스페이서 일체형 다이어프램
CN101734606B (zh) * 2008-11-14 2013-01-16 财团法人工业技术研究院 感测薄膜及应用其的微机电系统装置
US8363860B2 (en) * 2009-03-26 2013-01-29 Analog Devices, Inc. MEMS microphone with spring suspended backplate
EP2239961A1 (en) * 2009-04-06 2010-10-13 Nxp B.V. Backplate for microphone
SE534314C2 (sv) * 2009-11-10 2011-07-05 Goeran Ehrlund Elektroakustisk omvandlare
CN102714773A (zh) * 2009-11-16 2012-10-03 美国亚德诺半导体公司 背板具有特定形状的通孔的传声器
WO2011068344A2 (ko) * 2009-12-01 2011-06-09 (주)세미로드 멤스 마이크로폰 및 그 제조방법
KR101112120B1 (ko) * 2009-12-01 2012-04-10 (주)세미로드 멤스 마이크로폰 및 그 제조방법
CN102065354A (zh) * 2010-04-19 2011-05-18 瑞声声学科技(深圳)有限公司 振膜和包括该振膜的硅电容麦克风
CN101883306B (zh) * 2010-04-27 2012-12-12 瑞声声学科技(深圳)有限公司 振膜及包括该振膜的电容麦克风
CN101883307B (zh) * 2010-05-04 2012-12-12 瑞声声学科技(深圳)有限公司 电容mems麦克风振膜
JP5872163B2 (ja) * 2011-01-07 2016-03-01 オムロン株式会社 音響トランスデューサ、および該音響トランスデューサを利用したマイクロフォン
JP4924853B1 (ja) * 2011-02-23 2012-04-25 オムロン株式会社 音響センサ及びマイクロフォン
PH12014500968A1 (en) 2011-11-04 2014-06-09 Knowles Electronics Llc Embedded dielectric as a barrier in an acoustic device and method of manufacture
KR101511946B1 (ko) 2011-11-17 2015-04-14 인벤센스, 인크. 사운드 파이프를 갖춘 마이크로폰 모듈
US9738515B2 (en) * 2012-06-27 2017-08-22 Invensense, Inc. Transducer with enlarged back volume
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
US9676614B2 (en) 2013-02-01 2017-06-13 Analog Devices, Inc. MEMS device with stress relief structures
JP6127611B2 (ja) * 2013-03-14 2017-05-17 オムロン株式会社 静電容量型センサ、音響センサ及びマイクロフォン
US9338559B2 (en) 2013-04-16 2016-05-10 Invensense, Inc. Microphone system with a stop member
CN104219598B (zh) * 2013-05-31 2018-03-30 美律电子(深圳)有限公司 双振膜声波传感器
DE102013106353B4 (de) * 2013-06-18 2018-06-28 Tdk Corporation Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement
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CN103607684B (zh) * 2013-11-29 2019-01-18 上海集成电路研发中心有限公司 电容式硅麦克风及其制备方法
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US9752900B2 (en) * 2015-07-10 2017-09-05 Wyrobek International, Inc. Multi-plate capacitive transducer
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DE2352813A1 (de) * 1973-10-20 1975-04-24 Hartmann & Braun Ag Zweistrahl-ultrarogasanalysator
DE2748089A1 (de) * 1977-10-27 1979-05-03 Hartmann & Braun Ag Nichtdispersiver infrarot-gasanalysator
DE2751700A1 (de) * 1977-11-19 1979-05-23 Rainer C Friz Lautsprechermehrwegmembrane mit mechanischer frequenzweiche
JPS58165645U (ja) * 1982-04-22 1983-11-04 横河電機株式会社 差圧変換器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19647408C1 (de) * 1996-03-21 1997-11-13 Siemens Ag Druckaufnehmer

Also Published As

Publication number Publication date
JPH0726887B2 (ja) 1995-03-29
US4776019A (en) 1988-10-04
JPS62284233A (ja) 1987-12-10
DE3715999A1 (de) 1987-12-03

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee