DE3602487C2 - - Google Patents
Info
- Publication number
- DE3602487C2 DE3602487C2 DE3602487A DE3602487A DE3602487C2 DE 3602487 C2 DE3602487 C2 DE 3602487C2 DE 3602487 A DE3602487 A DE 3602487A DE 3602487 A DE3602487 A DE 3602487A DE 3602487 C2 DE3602487 C2 DE 3602487C2
- Authority
- DE
- Germany
- Prior art keywords
- electrically conductive
- connector according
- conductive particles
- adhesive
- adhesive connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R31/00—Coupling parts supported only by co-operation with counterpart
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0221—Insulating particles having an electrically conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0233—Deformable particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0323—Carbon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/901—Printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/254—Polymeric or resinous material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60014952A JPS61173471A (ja) | 1985-01-28 | 1985-01-28 | 熱圧着コネクタ− |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3602487A1 DE3602487A1 (de) | 1986-07-31 |
DE3602487C2 true DE3602487C2 (ja) | 1991-02-07 |
Family
ID=11875309
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19863602487 Granted DE3602487A1 (de) | 1985-01-28 | 1986-01-28 | Waermeempfindlicher klebstoffverbinder fuer elektrische anschluesse |
Country Status (4)
Country | Link |
---|---|
US (1) | US4680226A (ja) |
JP (1) | JPS61173471A (ja) |
DE (1) | DE3602487A1 (ja) |
GB (1) | GB2170365B (ja) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU572615B2 (en) * | 1983-12-27 | 1988-05-12 | Sony Corporation | Electrically conductive adhesive sheet circuit board and electrical connection structure |
JPS62115679A (ja) * | 1985-11-15 | 1987-05-27 | 富士高分子工業株式会社 | 電気接続体 |
JPS6433808A (en) * | 1986-10-18 | 1989-02-03 | Japan Synthetic Rubber Co Ltd | Conductive particle and conductive adhesive including it |
JPH0534134Y2 (ja) * | 1986-10-31 | 1993-08-30 | ||
JPS63160352A (ja) * | 1986-12-24 | 1988-07-04 | Semiconductor Energy Lab Co Ltd | 半導体装置の実装方法 |
DE3852563T2 (de) * | 1987-05-01 | 1995-05-11 | Canon Kk | Verfahren zum Anschliessen eines externen Schaltkreises und Verpackungsstruktur. |
JPS6445074A (en) * | 1987-08-10 | 1989-02-17 | Minnesota Mining & Mfg | Flexible connector |
JPH0428145Y2 (ja) * | 1987-09-09 | 1992-07-07 | ||
US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
DE3824140A1 (de) * | 1988-07-15 | 1990-01-25 | Siemens Ag | Befestigen und elektrisches kontaktieren von piezokeramiken |
US5001542A (en) * | 1988-12-05 | 1991-03-19 | Hitachi Chemical Company | Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips |
JP2633680B2 (ja) * | 1989-03-29 | 1997-07-23 | 株式会社リコー | 導体パターン接続体とその接続方法 |
JPH03291947A (ja) * | 1990-04-09 | 1991-12-24 | Mitsubishi Electric Corp | ハイブリッド型デバイス |
KR930701561A (ko) * | 1990-06-08 | 1993-06-12 | 게리 엘. 그리스울드 | 전자 용품용 재처리가능한 접착제 |
US5143785A (en) * | 1990-08-20 | 1992-09-01 | Minnesota Mining And Manufacturing Company | Cyanate ester adhesives for electronic applications |
US5087494A (en) * | 1991-04-12 | 1992-02-11 | Minnesota Mining And Manufacturing Company | Electrically conductive adhesive tape |
US5162613A (en) * | 1991-07-01 | 1992-11-10 | At&T Bell Laboratories | Integrated circuit interconnection technique |
JPH0521519A (ja) * | 1991-07-16 | 1993-01-29 | Sharp Corp | 半導体装置 |
US5225966A (en) * | 1991-07-24 | 1993-07-06 | At&T Bell Laboratories | Conductive adhesive film techniques |
EP0526133B1 (en) * | 1991-07-26 | 1997-03-19 | Nec Corporation | Polyimide multilayer wiring substrate and method for manufacturing the same |
JP2513298Y2 (ja) * | 1991-08-28 | 1996-10-02 | 国際電信電話株式会社 | コ―ドレス電話機の子機構造 |
JPH05144495A (ja) * | 1991-11-22 | 1993-06-11 | Japan Aviation Electron Ind Ltd | 電気接続用コネクタ |
US5371327A (en) * | 1992-02-19 | 1994-12-06 | Shin-Etsu Polymer Co., Ltd. | Heat-sealable connector sheet |
AU4399193A (en) * | 1992-06-02 | 1993-12-30 | Alza Corporation | Iontophoretic drug delivery apparatus |
US5727310A (en) * | 1993-01-08 | 1998-03-17 | Sheldahl, Inc. | Method of manufacturing a multilayer electronic circuit |
US5620795A (en) * | 1993-11-10 | 1997-04-15 | Minnesota Mining And Manufacturing Company | Adhesives containing electrically conductive agents |
TW277152B (ja) * | 1994-05-10 | 1996-06-01 | Hitachi Chemical Co Ltd | |
US20010028953A1 (en) * | 1998-11-16 | 2001-10-11 | 3M Innovative Properties Company | Adhesive compositions and methods of use |
AU6487996A (en) | 1995-07-10 | 1997-02-10 | Minnesota Mining And Manufacturing Company | Screen printable adhesive compositions |
AU3460997A (en) * | 1996-07-15 | 1998-02-09 | Hitachi Chemical Company, Ltd. | Film-like adhesive for connecting circuit and circuit board |
JP3381601B2 (ja) * | 1998-01-26 | 2003-03-04 | 松下電器産業株式会社 | バンプ付電子部品の実装方法 |
JP3625646B2 (ja) * | 1998-03-23 | 2005-03-02 | 東レエンジニアリング株式会社 | フリップチップ実装方法 |
US6189208B1 (en) | 1998-09-11 | 2001-02-20 | Polymer Flip Chip Corp. | Flip chip mounting technique |
DE19957609A1 (de) * | 1998-12-30 | 2000-07-06 | Giesecke & Devrient Gmbh | Verfahren zum Herstellen einer zugleich haftenden und elektrisch leitfähigen Verbindung zwischen einem Modul und einem elektronischen Bauelement |
US6410415B1 (en) * | 1999-03-23 | 2002-06-25 | Polymer Flip Chip Corporation | Flip chip mounting technique |
DE60031436T2 (de) * | 1999-08-25 | 2007-08-30 | Hitachi Chemical Co., Ltd. | Klebemittel, verfahren zum verbinden von verdrahtungsanschlüssen und verdrahtungsstruktur |
JP3365367B2 (ja) | 1999-09-14 | 2003-01-08 | ソニーケミカル株式会社 | Cog実装品および接続材料 |
EP1329911A4 (en) * | 2000-08-04 | 2006-11-08 | Sekisui Chemical Co Ltd | CONDUCTIVE FINE PARTICLES, FINE PARTICLE ELECTRODEPOSITION METHOD, AND SUBSTRATE STRUCTURAL BODY |
WO2002035289A2 (en) * | 2000-10-24 | 2002-05-02 | Nanopierce Technologies Inc. | Method and materials for printing particle-enhanced electrical contacts |
JP4294048B2 (ja) * | 2006-11-29 | 2009-07-08 | 三洋電機株式会社 | 太陽電池モジュール |
CN101212085B (zh) * | 2006-12-29 | 2012-01-18 | 鸿富锦精密工业(深圳)有限公司 | 导电元件之粘合结构组合 |
JP5528786B2 (ja) | 2009-12-09 | 2014-06-25 | 矢崎総業株式会社 | 電線付き圧着端子及び塗布剤の硬化方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3347978A (en) * | 1963-06-03 | 1967-10-17 | Lockheed Aircraft Corp | Electrically conductive joints and gaskets |
US4113981A (en) * | 1974-08-14 | 1978-09-12 | Kabushiki Kaisha Seikosha | Electrically conductive adhesive connecting arrays of conductors |
JPS51114439A (en) * | 1975-04-02 | 1976-10-08 | Seiko Epson Corp | An adhesive having anisotropic electroconductivity |
JPS583343A (ja) * | 1981-06-29 | 1983-01-10 | Nippon Telegr & Teleph Corp <Ntt> | 複数端末制御方式 |
JPS58182685A (ja) * | 1982-04-20 | 1983-10-25 | セイコーエプソン株式会社 | 表示体パネル |
US4526818A (en) * | 1982-12-23 | 1985-07-02 | Epson Corporation | Liquid crystal display panel and process for the production thereof |
JPS6177279A (ja) * | 1984-09-21 | 1986-04-19 | 日立化成工業株式会社 | 回路の接続部材 |
JPS6178069A (ja) * | 1984-09-26 | 1986-04-21 | 日立化成工業株式会社 | 回路の接続部材 |
US4615919A (en) * | 1984-10-09 | 1986-10-07 | Canon Kabushiki Kaisha | Liquid crystal device |
-
1985
- 1985-01-28 JP JP60014952A patent/JPS61173471A/ja active Pending
-
1986
- 1986-01-24 US US06/821,965 patent/US4680226A/en not_active Expired - Fee Related
- 1986-01-28 DE DE19863602487 patent/DE3602487A1/de active Granted
- 1986-01-28 GB GB08602033A patent/GB2170365B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2170365A (en) | 1986-07-30 |
JPS61173471A (ja) | 1986-08-05 |
DE3602487A1 (de) | 1986-07-31 |
GB2170365B (en) | 1988-12-21 |
GB8602033D0 (en) | 1986-03-05 |
US4680226A (en) | 1987-07-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Free format text: PATENTANWAELTE MUELLER & HOFFMANN, 81667 MUENCHEN |
|
8339 | Ceased/non-payment of the annual fee |