DE3508005A1 - Verfahren und vorrichtung zum reinigen der leiterstifte an einer "dual-in-line"-halbleiter-packung vor dem loeten - Google Patents
Verfahren und vorrichtung zum reinigen der leiterstifte an einer "dual-in-line"-halbleiter-packung vor dem loetenInfo
- Publication number
- DE3508005A1 DE3508005A1 DE19853508005 DE3508005A DE3508005A1 DE 3508005 A1 DE3508005 A1 DE 3508005A1 DE 19853508005 DE19853508005 DE 19853508005 DE 3508005 A DE3508005 A DE 3508005A DE 3508005 A1 DE3508005 A1 DE 3508005A1
- Authority
- DE
- Germany
- Prior art keywords
- soldering
- semiconductor package
- cleaned
- dual
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title claims description 111
- 239000004065 semiconductor Substances 0.000 title claims description 71
- 238000004140 cleaning Methods 0.000 title claims description 67
- 238000005476 soldering Methods 0.000 title claims description 63
- 239000004020 conductor Substances 0.000 claims description 55
- 238000000889 atomisation Methods 0.000 claims description 22
- 150000002500 ions Chemical class 0.000 claims description 21
- 239000011261 inert gas Substances 0.000 claims description 19
- 230000005684 electric field Effects 0.000 claims description 16
- 238000010849 ion bombardment Methods 0.000 claims description 15
- 230000000712 assembly Effects 0.000 claims description 14
- 238000000429 assembly Methods 0.000 claims description 14
- 239000000356 contaminant Substances 0.000 claims description 13
- 238000004544 sputter deposition Methods 0.000 claims description 13
- 239000007789 gas Substances 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 230000000873 masking effect Effects 0.000 claims description 10
- 238000012545 processing Methods 0.000 claims description 10
- 239000012535 impurity Substances 0.000 claims description 9
- 238000003780 insertion Methods 0.000 claims description 9
- 230000037431 insertion Effects 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000012423 maintenance Methods 0.000 claims description 3
- 238000005108 dry cleaning Methods 0.000 claims 2
- 230000000977 initiatory effect Effects 0.000 claims 2
- 101100447665 Mus musculus Gas2 gene Proteins 0.000 claims 1
- 239000004033 plastic Substances 0.000 description 17
- 239000000463 material Substances 0.000 description 11
- 239000002904 solvent Substances 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 239000003921 oil Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000005238 degreasing Methods 0.000 description 4
- 239000000428 dust Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 150000003568 thioethers Chemical class 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 239000003599 detergent Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000010891 electric arc Methods 0.000 description 3
- 239000003925 fat Substances 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 239000012670 alkaline solution Substances 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 238000000866 electrolytic etching Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- -1 ferrous metals Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 239000000344 soap Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- LGXVIGDEPROXKC-UHFFFAOYSA-N 1,1-dichloroethene Chemical group ClC(Cl)=C LGXVIGDEPROXKC-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000000752 ionisation method Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical group [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 235000014593 oils and fats Nutrition 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000011403 purification operation Methods 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 229950011008 tetrachloroethylene Drugs 0.000 description 1
- 235000013311 vegetables Nutrition 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4835—Cleaning, e.g. removing of solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Analytical Chemistry (AREA)
- Materials Engineering (AREA)
- Plasma & Fusion (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- ing And Chemical Polishing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Cleaning In General (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US58684184A | 1984-03-06 | 1984-03-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3508005A1 true DE3508005A1 (de) | 1986-03-27 |
Family
ID=24347305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19853508005 Withdrawn DE3508005A1 (de) | 1984-03-06 | 1985-03-06 | Verfahren und vorrichtung zum reinigen der leiterstifte an einer "dual-in-line"-halbleiter-packung vor dem loeten |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS615598A (enrdf_load_stackoverflow) |
| DE (1) | DE3508005A1 (enrdf_load_stackoverflow) |
| GB (1) | GB2159753B (enrdf_load_stackoverflow) |
| NL (1) | NL8500637A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4032328A1 (de) * | 1989-11-06 | 1991-09-19 | Wls Karl Heinz Grasmann Weichl | Verfahren und vorrichtung zur verarbeitung von zu verloetenden fuegepartnern |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2661544B1 (fr) * | 1990-04-27 | 1994-05-27 | Commissariat Energie Atomique | Procede et dispositif de decontamination par decapage ionique. |
| US5223691A (en) * | 1991-06-03 | 1993-06-29 | Motorola, Inc. | Plasma based soldering method requiring no additional heat sources or flux |
| DE19654250A1 (de) * | 1996-08-26 | 1998-03-05 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zum Herstellen oxidationsempfindlicher Lötverbindunden |
| US6468833B2 (en) * | 2000-03-31 | 2002-10-22 | American Air Liquide, Inc. | Systems and methods for application of substantially dry atmospheric plasma surface treatment to various electronic component packaging and assembly methods |
| US8444041B2 (en) * | 2011-04-08 | 2013-05-21 | Lincoln Global, Inc. | Brazing system and method |
| CN108511329B (zh) * | 2018-06-15 | 2024-03-15 | 德阳帛汉电子有限公司 | 一种芯片清洗装置 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB806381A (en) * | 1956-07-27 | 1958-12-23 | Gen Motors Corp | Improvements in or relating to methods of, and apparatus for, etching metal surfaces by ionic bombardment and to articles produced thereby |
| DE1289382B (de) * | 1963-08-16 | 1969-02-13 | Licentia Gmbh | Verfahren zur Oxydation eines Silizium-Halbleiterkoerpers |
| BE758321A (fr) * | 1969-11-03 | 1971-04-01 | Rca Corp | Procede de metallisation de dispositifs a semi-conducteurs |
| GB1305313A (enrdf_load_stackoverflow) * | 1970-02-13 | 1973-01-31 | ||
| FR2082505A5 (enrdf_load_stackoverflow) * | 1970-03-18 | 1971-12-10 | Radiotechnique Compelec | |
| GB1347849A (en) * | 1971-04-21 | 1974-02-27 | Nat Res Dev | Metal oxide semiconductor transistors |
| JPS5712651B2 (enrdf_load_stackoverflow) * | 1974-05-23 | 1982-03-12 | ||
| GB1462929A (en) * | 1974-09-03 | 1977-01-26 | Olson D M | Vaginal speculum |
| US3994793A (en) * | 1975-05-22 | 1976-11-30 | International Business Machines Corporation | Reactive ion etching of aluminum |
| JPS54124853A (en) * | 1978-03-23 | 1979-09-28 | Hiroyasu Funakubo | Press contacting method and apparatus of minute metal strain |
| GB2144669B (en) * | 1982-12-07 | 1986-02-26 | Standard Telephones Cables Ltd | Cleaning electrical contacts |
-
1985
- 1985-03-05 GB GB08505650A patent/GB2159753B/en not_active Expired
- 1985-03-06 DE DE19853508005 patent/DE3508005A1/de not_active Withdrawn
- 1985-03-06 JP JP60044517A patent/JPS615598A/ja active Granted
- 1985-03-06 NL NL8500637A patent/NL8500637A/nl not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4032328A1 (de) * | 1989-11-06 | 1991-09-19 | Wls Karl Heinz Grasmann Weichl | Verfahren und vorrichtung zur verarbeitung von zu verloetenden fuegepartnern |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS615598A (ja) | 1986-01-11 |
| NL8500637A (nl) | 1985-10-01 |
| JPH0262959B2 (enrdf_load_stackoverflow) | 1990-12-27 |
| GB2159753A (en) | 1985-12-11 |
| GB2159753B (en) | 1988-09-07 |
| GB8505650D0 (en) | 1985-04-03 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8128 | New person/name/address of the agent |
Representative=s name: MOLL, W., DIPL.-PHYS. DR.RER.NAT. GLAWE, U., DIPL. |
|
| 8141 | Disposal/no request for examination |