DE3366308D1 - Mounting of electronic components on printed circuit boards - Google Patents
Mounting of electronic components on printed circuit boardsInfo
- Publication number
- DE3366308D1 DE3366308D1 DE8383109223T DE3366308T DE3366308D1 DE 3366308 D1 DE3366308 D1 DE 3366308D1 DE 8383109223 T DE8383109223 T DE 8383109223T DE 3366308 T DE3366308 T DE 3366308T DE 3366308 D1 DE3366308 D1 DE 3366308D1
- Authority
- DE
- Germany
- Prior art keywords
- mounting
- printed circuit
- electronic components
- circuit boards
- boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1446—Treatment after insertion of lead into hole, e.g. bending, cutting, caulking or curing of adhesive but excluding soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA000412029A CA1177972A (en) | 1982-09-23 | 1982-09-23 | Mounting of electronic components on printed circuit boards |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3366308D1 true DE3366308D1 (en) | 1986-10-23 |
Family
ID=4123648
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8383109223T Expired DE3366308D1 (en) | 1982-09-23 | 1983-09-17 | Mounting of electronic components on printed circuit boards |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0104565B1 (de) |
JP (1) | JPS5974696A (de) |
CA (1) | CA1177972A (de) |
DE (1) | DE3366308D1 (de) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2556550B1 (fr) * | 1983-12-09 | 1987-01-30 | Lignes Telegraph Telephon | Procede de brasage de composants electroniques sur un circuit imprime et circuit hybride obtenu par ce procede |
JPS6285493A (ja) * | 1985-10-09 | 1987-04-18 | ソニー株式会社 | 電子部品の半田付け方法 |
US4761881A (en) * | 1986-09-15 | 1988-08-09 | International Business Machines Corporation | Single step solder process |
DE3720925A1 (de) * | 1987-06-25 | 1989-01-05 | Wabco Westinghouse Fahrzeug | Leiterplatte |
DE3808073C2 (de) * | 1988-03-11 | 1994-01-13 | Lothar Himmelreich | Infrarot-Lötofen zum Aufschmelzlöten von elektronischen Bauelementen auf Leiterplatten |
US5054193A (en) * | 1989-08-28 | 1991-10-08 | Hewlett-Packard Company | Printed circuit board fixture and a method of assembling a printed circuit board |
DE19511226A1 (de) * | 1995-03-27 | 1996-10-02 | Bosch Gmbh Robert | SMD-Verbindung für elektronische Steuergeräte in Kraftfahrzeugen |
DE10134379A1 (de) * | 2001-07-14 | 2003-01-30 | Hella Kg Hueck & Co | Verfahren zur Herstellung einer elektrischen Verbindung zwischen einem Steckerelement und einer Leiterplatte |
WO2009087113A1 (fr) * | 2008-01-12 | 2009-07-16 | Johnson Controls Technology Company | Procede de montage d'un composant electrique comprenant au moins deux broches de raccordement electrique sur un element de support comprenant au moins deux evidements et raccordement electrique entre un composant electrique et un element de support |
CN112867388B (zh) * | 2021-01-15 | 2022-05-13 | 深圳市格林赛德科技有限公司 | 一种集成电路加工贴片装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5376372A (en) * | 1976-12-17 | 1978-07-06 | Matsushita Electric Ind Co Ltd | Device for attaching chip circuit parts |
JPS5415174A (en) * | 1977-07-06 | 1979-02-03 | Hitachi Ltd | Method of soldering hybrid integrated circuit |
JPS5754389A (ja) * | 1980-09-19 | 1982-03-31 | Hitachi Ltd | Kairokibannohandazukehoho |
-
1982
- 1982-09-23 CA CA000412029A patent/CA1177972A/en not_active Expired
-
1983
- 1983-09-17 EP EP83109223A patent/EP0104565B1/de not_active Expired
- 1983-09-17 DE DE8383109223T patent/DE3366308D1/de not_active Expired
- 1983-09-20 JP JP58172319A patent/JPS5974696A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0104565A2 (de) | 1984-04-04 |
EP0104565A3 (en) | 1984-10-03 |
EP0104565B1 (de) | 1986-09-17 |
JPS5974696A (ja) | 1984-04-27 |
CA1177972A (en) | 1984-11-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |