DE3366266D1 - Method of manufacturing an insulated gate field effect device and device manufactured by the method - Google Patents

Method of manufacturing an insulated gate field effect device and device manufactured by the method

Info

Publication number
DE3366266D1
DE3366266D1 DE8383200968T DE3366266T DE3366266D1 DE 3366266 D1 DE3366266 D1 DE 3366266D1 DE 8383200968 T DE8383200968 T DE 8383200968T DE 3366266 T DE3366266 T DE 3366266T DE 3366266 D1 DE3366266 D1 DE 3366266D1
Authority
DE
Germany
Prior art keywords
manufacturing
field effect
insulated gate
gate field
effect device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383200968T
Other languages
English (en)
Inventor
Henricus Godefridus Rafae Maas
Francois Marinus Klaassen
Johannes Arnoldus Appels
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Application granted granted Critical
Publication of DE3366266D1 publication Critical patent/DE3366266D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0843—Source or drain regions of field-effect devices
    • H01L29/0847—Source or drain regions of field-effect devices of field-effect transistors with insulated gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66568—Lateral single gate silicon transistors
    • H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
    • H01L29/6659—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7833—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's
    • H01L29/7834—Field effect transistors with field effect produced by an insulated gate with lightly doped drain or source extension, e.g. LDD MOSFET's; DDD MOSFET's with a non-planar structure, e.g. the gate or the source or the drain being non-planar

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
DE8383200968T 1982-07-05 1983-06-29 Method of manufacturing an insulated gate field effect device and device manufactured by the method Expired DE3366266D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL8202686A NL8202686A (nl) 1982-07-05 1982-07-05 Werkwijze ter vervaardiging van een veldeffektinrichting met geisoleerde stuurelektrode, en inrichting vervaardigd volgens de werkwijze.

Publications (1)

Publication Number Publication Date
DE3366266D1 true DE3366266D1 (en) 1986-10-23

Family

ID=19839970

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383200968T Expired DE3366266D1 (en) 1982-07-05 1983-06-29 Method of manufacturing an insulated gate field effect device and device manufactured by the method

Country Status (6)

Country Link
US (1) US4545110A (de)
EP (1) EP0098652B1 (de)
JP (1) JPS5922366A (de)
CA (1) CA1206625A (de)
DE (1) DE3366266D1 (de)
NL (1) NL8202686A (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8302541A (nl) * 1983-07-15 1985-02-01 Philips Nv Werkwijze ter vervaardiging van een halfgeleiderinrichting, en halfgeleiderinrichting vervaardigd volgens de werkwijze.
NL8400224A (nl) * 1984-01-25 1985-08-16 Philips Nv Werkwijze ter vervaardiging van een halfgeleiderinrichting en inrichting vervaardigd door toepassing daarvan.
NL8402223A (nl) * 1984-07-13 1986-02-03 Philips Nv Werkwijze ter vervaardiging van een halfgeleiderinrichting en inrichting, vervaardigd door toepassing daarvan.
NL8402859A (nl) * 1984-09-18 1986-04-16 Philips Nv Werkwijze voor het vervaardigen van submicrongroeven in bijvoorbeeld halfgeleidermateriaal en met deze werkwijze verkregen inrichtingen.
FR2573919B1 (fr) * 1984-11-06 1987-07-17 Thomson Csf Procede de fabrication de grilles pour circuit integre
JPS61140122A (ja) * 1984-12-13 1986-06-27 Mitsubishi Electric Corp 負荷時タツプ切換装置
US4653173A (en) * 1985-03-04 1987-03-31 Signetics Corporation Method of manufacturing an insulated gate field effect device
GB2172743B (en) * 1985-03-23 1988-11-16 Stc Plc Improvements in integrated circuits
US4649629A (en) * 1985-07-29 1987-03-17 Thomson Components - Mostek Corp. Method of late programming a read only memory
NL8700640A (nl) * 1987-03-18 1988-10-17 Philips Nv Halfgeleiderinrichting en werkwijze ter vervaardiging daarvan.
JPS63262873A (ja) * 1987-04-21 1988-10-31 Fuji Xerox Co Ltd 半導体装置
GB2215515A (en) * 1988-03-14 1989-09-20 Philips Electronic Associated A lateral insulated gate field effect transistor and a method of manufacture
JPH0258206A (ja) * 1988-08-23 1990-02-27 Mitsubishi Electric Corp 負荷時タップ切換装置
EP0452720A3 (en) * 1990-04-02 1994-10-26 Nat Semiconductor Corp A semiconductor structure and method of its manufacture
US5039621A (en) * 1990-06-08 1991-08-13 Texas Instruments Incorporated Semiconductor over insulator mesa and method of forming the same
EP0730309B1 (de) * 1995-02-21 1998-10-14 STMicroelectronics S.r.l. Hochspannungs-MOSFET mit Feldplatten-Elektrode und Verfahren zur Herstellung
US5888873A (en) * 1996-11-06 1999-03-30 Advanced Micro Devices, Inc. Method of manufacturing short channel MOS devices
US6525340B2 (en) * 2001-06-04 2003-02-25 International Business Machines Corporation Semiconductor device with junction isolation
US7166867B2 (en) * 2003-12-05 2007-01-23 International Rectifier Corporation III-nitride device with improved layout geometry
JP2006275124A (ja) * 2005-03-29 2006-10-12 Shinwa Sangyo Co Ltd 都市ガス用ガスコック

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5284981A (en) * 1976-01-06 1977-07-14 Mitsubishi Electric Corp Production of insulated gate type semiconductor device
JPS54140483A (en) * 1978-04-21 1979-10-31 Nec Corp Semiconductor device
US4173818A (en) * 1978-05-30 1979-11-13 International Business Machines Corporation Method for fabricating transistor structures having very short effective channels
JPS5621372A (en) * 1979-07-31 1981-02-27 Fujitsu Ltd Manufacture of semiconductor device
NL187328C (nl) * 1980-12-23 1991-08-16 Philips Nv Werkwijze ter vervaardiging van een halfgeleiderinrichting.
US4419809A (en) * 1981-12-30 1983-12-13 International Business Machines Corporation Fabrication process of sub-micrometer channel length MOSFETs

Also Published As

Publication number Publication date
JPS5922366A (ja) 1984-02-04
EP0098652B1 (de) 1986-09-17
EP0098652A3 (en) 1984-02-22
CA1206625A (en) 1986-06-24
NL8202686A (nl) 1984-02-01
EP0098652A2 (de) 1984-01-18
US4545110A (en) 1985-10-08

Similar Documents

Publication Publication Date Title
DE3366266D1 (en) Method of manufacturing an insulated gate field effect device and device manufactured by the method
HK45486A (en) Insulated gate semiconductor device and method for fabricating same
DE3174468D1 (en) Semiconductor device and method of manufacturing the same
DE3370721D1 (en) Insulated gate field effect transistor and method of manufacturing the same
DE3279955D1 (en) Insulated gate field effect transistor
DE3275684D1 (en) Insulated gate field effect transistor
GB2080023B (en) Lateral insulated gate field effect transistor
JPS56160074A (en) Method of manufacturing mos field effect transistor device
DE3275680D1 (en) Insulated gate field effect transistor and its manufacture
JPS5615529A (en) Semiconductor device and method of fabricating same
JPS55160473A (en) Semiconductor device and method of fabricating same
EP0111899A3 (en) Semiconductor device and method of manufacturing the same
DE3069594D1 (en) Semiconductor device and method of manufacturing the same
DE3260256D1 (en) Method and device for the manufacturing of an effect yarn
JPS5797678A (en) Method of producing insulated gate type field effect transistor
JPS55150275A (en) Insulated gate field effect transistor and method of fabricating same
JPS55132054A (en) Semiconductor device and method of fabricating same
DE3376043D1 (en) Semiconductor device and method of making the same
JPS57164572A (en) Field effect transistor device and method of producing same
JPS5596653A (en) Semiconductor device and method of fabricating same
DE3380285D1 (en) Mos semiconductor device and method of producing the same
EP0070744A3 (en) Insulated gate field effect transistor
JPS5756975A (en) V-mos field effect semiconductor device and method of producing same
DE3071046D1 (en) An insulated gate field effect transistor
GB2084794B (en) Methods of manufacturing insulated gate field effect transistors

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee