DE324472C - Process for producing fine copper deposits on iron - Google Patents

Process for producing fine copper deposits on iron

Info

Publication number
DE324472C
DE324472C DE1917324472D DE324472DD DE324472C DE 324472 C DE324472 C DE 324472C DE 1917324472 D DE1917324472 D DE 1917324472D DE 324472D D DE324472D D DE 324472DD DE 324472 C DE324472 C DE 324472C
Authority
DE
Germany
Prior art keywords
iron
fine copper
producing fine
copper deposits
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE1917324472D
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHEM FAB VORM WEILER TER MEER
Original Assignee
CHEM FAB VORM WEILER TER MEER
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHEM FAB VORM WEILER TER MEER filed Critical CHEM FAB VORM WEILER TER MEER
Application granted granted Critical
Publication of DE324472C publication Critical patent/DE324472C/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Description

Verfahren zur Erzeugung feiner Kupferniederschläge auf Eisen. Es ist bekannt, daß die Form elektrolytisch erhaltener Metallniederschläge durch .die Gegenwart von Kolloiden stark beeinflußt wird, und daß dieser Einfluß sich besonders in einer größeren Feinheit .des Gefüges geltend macht (vgl. Förster, Elektrochemie wäßriger Lösungen, z. Auflage, Seite 334 ff.). Gleichzeitig besitzen diese Niederschläge jedoch gegenüber den ohne Zusatzerhaltenen eine erhöhte Sprödigkeit.Process for producing fine copper deposits on iron. It is known that the form of electrolytically obtained metal precipitates by .the presence is strongly influenced by colloids, and that this influence is particularly evident in one greater fineness of the structure asserts (cf.Förster, Elektrochemie wäßriger Solutions, e.g. Edition, page 334 ff.). At the same time these have precipitations however, an increased brittleness compared to those obtained without an additive.

Es hat sich nun überraschender Weise herausgestellt, daß bei der Verkupferung von Eisen, wie sie zum Zwecke .des Drahtziehens durch Eintauchen des Drahtes in eine Kupfersulfatlösting ausgeübt wird, ein Zusatz geringer Mengen Leim oder Gelatine förderlich wirkt, obwohl es hier auf die Erzielung eines möglichst geschmeidigen L'berzuges ankommt. So kann. man z. B. mit Vorteil dem Verkupferungsbade einen Zusatz von o,i Prozent Leim geben.It has now been found, surprisingly, that in the copper plating of iron, such as are used for the purpose of drawing a wire by dipping the wire into a copper sulphate dissolving is applied, an addition of small amounts of glue or gelatine Has a beneficial effect, although here it is aimed at achieving a smooth as possible L'berzuges arrives. So can. one z. B. with advantage the copper plating an addition of o, i percent glue.

Vor der bekannten Verwendung von Hefe hat das Verfahren den Vorzug größerer Wirtschaftlichkeit - man kommt mit weit geringeren Substanzmengen zum Ziele - und größerer Sicherheit der Wirkung.The method has preference over the known use of yeast greater economic efficiency - you can achieve your goal with much smaller amounts of substance - and greater certainty of the effect.

Claims (1)

PATENT-ANspRUcH: Verfahren zur Erzeugung feiner Kupferniederschläge auf Eisen zum Zwecke des Drahtziehens, darin bestehend, claß man dem V erkupferungsbade geringe 1.Tengen von Gelatine, Leim o. dgl. zusetzt.PATENT CLAIM: Process for the production of fine copper precipitates on iron for the purpose of wire drawing, insisting in it, one let the copper-plating bath a small amount of gelatine, glue or the like added.
DE1917324472D 1917-06-26 1917-06-26 Process for producing fine copper deposits on iron Expired DE324472C (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE324472T 1917-06-26

Publications (1)

Publication Number Publication Date
DE324472C true DE324472C (en) 1920-08-28

Family

ID=6179692

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1917324472D Expired DE324472C (en) 1917-06-26 1917-06-26 Process for producing fine copper deposits on iron

Country Status (1)

Country Link
DE (1) DE324472C (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE758075C (en) * 1938-05-04 1951-08-02 E J Du Pont De Nemours & Compa Bath for the galvanic production of copper deposits

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE758075C (en) * 1938-05-04 1951-08-02 E J Du Pont De Nemours & Compa Bath for the galvanic production of copper deposits

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