DE3238557A1 - Semiconductor device having plastic encapsulation - Google Patents

Semiconductor device having plastic encapsulation

Info

Publication number
DE3238557A1
DE3238557A1 DE19823238557 DE3238557A DE3238557A1 DE 3238557 A1 DE3238557 A1 DE 3238557A1 DE 19823238557 DE19823238557 DE 19823238557 DE 3238557 A DE3238557 A DE 3238557A DE 3238557 A1 DE3238557 A1 DE 3238557A1
Authority
DE
Grant status
Application
Patent type
Prior art keywords
plastic
semiconductor device
plastic encapsulation
encapsulation
splits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19823238557
Other languages
German (de)
Inventor
Reimer Dr Emeis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/02Containers; Seals
    • H01L23/04Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49541Geometry of the lead-frame
    • H01L23/49562Geometry of the lead-frame for devices being provided for in H01L29/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • H01L2924/1815Shape

Abstract

In plastic-encapsulated power semiconductor devices, mechanical stresses occur at the metal-plastic interface and result in the formation of splits after frequent changes in load. The ambient atmosphere is consequently able to penetrate the interior of the encapsulation and impair the electrical characteristics. The stresses can be reduced if the terminal contacts consist either of flat (3, 8) or cup-shaped (2, 7) ductile metal foils which are directly in contact with the plastic (6). <IMAGE>
DE19823238557 1982-10-18 1982-10-18 Semiconductor device having plastic encapsulation Withdrawn DE3238557A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19823238557 DE3238557A1 (en) 1982-10-18 1982-10-18 Semiconductor device having plastic encapsulation

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19823238557 DE3238557A1 (en) 1982-10-18 1982-10-18 Semiconductor device having plastic encapsulation
JP19400683A JPS5990945A (en) 1982-10-18 1983-10-17 Semiconductor element

Publications (1)

Publication Number Publication Date
DE3238557A1 true true DE3238557A1 (en) 1984-04-19

Family

ID=6175984

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19823238557 Withdrawn DE3238557A1 (en) 1982-10-18 1982-10-18 Semiconductor device having plastic encapsulation

Country Status (2)

Country Link
JP (1) JPS5990945A (en)
DE (1) DE3238557A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0278585A1 (en) * 1987-01-26 1988-08-17 Northern Telecom Limited Packaged solid state surge protector
US4851956A (en) * 1987-01-26 1989-07-25 Northern Telecom Limited Packaged solid-state surge protector
US4939619A (en) * 1987-01-26 1990-07-03 Northern Telecom Limited Packaged solid-state surge protector
EP0788152A2 (en) * 1996-01-30 1997-08-06 Kabushiki Kaisha Toshiba Internal compression bonded semiconductor device with a chip frame enabling a longer creepage distance
WO2008000215A1 (en) 2006-06-30 2008-01-03 Epcos Ag Housing for accommodating an electronic component and electronic component arrangement

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2515988Y2 (en) * 1991-02-07 1996-11-06 ティーオーエー株式会社 Noise control type broadcasting apparatus

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0278585A1 (en) * 1987-01-26 1988-08-17 Northern Telecom Limited Packaged solid state surge protector
US4851956A (en) * 1987-01-26 1989-07-25 Northern Telecom Limited Packaged solid-state surge protector
US4939619A (en) * 1987-01-26 1990-07-03 Northern Telecom Limited Packaged solid-state surge protector
US5422779A (en) * 1987-01-26 1995-06-06 Northern Telecom Limited Packaged solid-state surge protector
EP0788152A2 (en) * 1996-01-30 1997-08-06 Kabushiki Kaisha Toshiba Internal compression bonded semiconductor device with a chip frame enabling a longer creepage distance
EP0788152A3 (en) * 1996-01-30 1997-11-05 Kabushiki Kaisha Toshiba Internal compression bonded semiconductor device with a chip frame enabling a longer creepage distance
US5760425A (en) * 1996-01-30 1998-06-02 Kabushiki Kaisha Tobshiba Internal compression bonded semiconductor device with a chip frame enabling a longer creepage distance
WO2008000215A1 (en) 2006-06-30 2008-01-03 Epcos Ag Housing for accommodating an electronic component and electronic component arrangement
DE102006030248A1 (en) * 2006-06-30 2008-01-03 Epcos Ag Housing for receiving an electronic component and electronic Bauelementtaranordnung
US7820921B2 (en) 2006-06-30 2010-10-26 Epcos Ag Housing for accommodating an electronic component and electronic component arrangement

Also Published As

Publication number Publication date Type
JPS5990945A (en) 1984-05-25 application

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Legal Events

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8139 Disposal/non-payment of the annual fee