DE3223624A1 - Heat sink for electrical components - Google Patents

Heat sink for electrical components

Info

Publication number
DE3223624A1
DE3223624A1 DE19823223624 DE3223624A DE3223624A1 DE 3223624 A1 DE3223624 A1 DE 3223624A1 DE 19823223624 DE19823223624 DE 19823223624 DE 3223624 A DE3223624 A DE 3223624A DE 3223624 A1 DE3223624 A1 DE 3223624A1
Authority
DE
Grant status
Application
Patent type
Prior art keywords
heat
electrical components
heat sink
housing cover
outer side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19823223624
Other languages
German (de)
Other versions
DE3223624C2 (en )
Inventor
Robert Ing Grad Bradish
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3675Cooling facilitated by shape of device characterised by the shape of the housing
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention relates to a heat sink (4), which is preferably used as a housing cover, for electrical components which generate heat, which heat sink is provided with cooling ribs (7, 8) on both the component side and on the outer side. In this case, the ribbed surface on the component side increases the heat absorbtion, while the cooling ribs on the outer side improve the heat dissiptation to the environment. In consequence, an increase in the heat dissipation is acheived, for example via a housing cover, by improving the internal and external convection. The invention can be used for cooling electrical components. <IMAGE>
DE19823223624 1982-06-24 1982-06-24 Expired DE3223624C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19823223624 DE3223624C2 (en) 1982-06-24 1982-06-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19823223624 DE3223624C2 (en) 1982-06-24 1982-06-24

Publications (2)

Publication Number Publication Date
DE3223624A1 true true DE3223624A1 (en) 1984-01-05
DE3223624C2 DE3223624C2 (en) 1986-08-28

Family

ID=6166758

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19823223624 Expired DE3223624C2 (en) 1982-06-24 1982-06-24

Country Status (1)

Country Link
DE (1) DE3223624C2 (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0202335A1 (en) * 1984-11-15 1986-11-26 Japan Traffic Management Technology Association Signal light unit having heat dissipating function
EP0237151A1 (en) * 1986-02-10 1987-09-16 Northern Telecom Limited Infrared process and apparatus for infrared soldering components on circuit boards
DE8704499U1 (en) * 1987-03-26 1987-09-24 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt, De
DE3710198A1 (en) * 1987-03-27 1988-10-06 Zentro Elektrik Gmbh Kg Coolable arrangement
DE3801920A1 (en) * 1988-01-23 1989-08-03 Pfisterer Elektrotech Karl Device for connecting a branch conductor
DE4015030C1 (en) * 1990-05-10 1991-11-21 Bicc-Vero Elektronics Gmbh, 2800 Bremen, De
DE4313782A1 (en) * 1993-04-27 1994-11-03 Daimler Benz Ag Device for mounting electronic controllers in a motor vehicle
EP1258415A1 (en) * 2001-05-17 2002-11-20 Delphi Technologies, Inc. Modular motor and controller assembly for rear-wheel steering system
DE10235047A1 (en) * 2002-07-31 2004-02-12 Endress + Hauser Gmbh + Co. Kg Electronics housing with integrated heat spreader
EP1465252A1 (en) 2003-03-27 2004-10-06 STMicroelectronics, Inc. System and method for direct convective cooling of an exposed integrated circuit die surface
DE102004040557A1 (en) * 2004-08-16 2006-02-23 Kern, Dietmar, Dr.-Ing. Electronics heatsink
EP1703557A2 (en) * 2005-03-17 2006-09-20 Delphi Technologies, Inc. Electronic assembly with integral thermal transient suppression
WO2007008747A2 (en) * 2005-07-08 2007-01-18 Mobility Electronics, Inc. Power converter having housing with improved thermal properties
DE102007014713B3 (en) * 2007-03-23 2008-09-18 Sew-Eurodrive Gmbh & Co. Kg Cooling arrangement, converter and electric drive system
EP2071620A1 (en) * 2007-12-12 2009-06-17 Wen-Long Chyn Heat sink having enhanced heat dissipation capacity
EP2409328A1 (en) * 2009-03-16 2012-01-25 ATI Technologies ULC Multi-die semiconductor package with heat spreader
EP3270674A4 (en) * 2015-03-24 2018-04-04 Huawei Technologies Co., Ltd. Heat dissipation apparatus, radio remote unit, base station unit, communication base station and system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1895660U (en) * 1963-11-13 1964-07-02 Siemens Ag Cap for electrical devices for telegraph, in particular remote access systems.
DE2747712B2 (en) * 1977-10-25 1979-11-22 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt
GB1592072A (en) * 1978-01-23 1981-07-01 Plessey Co Ltd Heat dissipation arrangements for printed circuit boards
GB1604367A (en) * 1978-05-31 1981-12-09 Ard Tech Ass Eng Amplifier circuit boards

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1895660U (en) * 1963-11-13 1964-07-02 Siemens Ag Cap for electrical devices for telegraph, in particular remote access systems.
DE2747712B2 (en) * 1977-10-25 1979-11-22 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt
GB1592072A (en) * 1978-01-23 1981-07-01 Plessey Co Ltd Heat dissipation arrangements for printed circuit boards
GB1604367A (en) * 1978-05-31 1981-12-09 Ard Tech Ass Eng Amplifier circuit boards

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0202335A1 (en) * 1984-11-15 1986-11-26 Japan Traffic Management Technology Association Signal light unit having heat dissipating function
EP0202335B1 (en) * 1984-11-15 1989-10-25 Japan Traffic Management Technology Association Signal light unit having heat dissipating function
EP0237151A1 (en) * 1986-02-10 1987-09-16 Northern Telecom Limited Infrared process and apparatus for infrared soldering components on circuit boards
US4725716A (en) * 1986-02-10 1988-02-16 Northern Telecom Limited Infrared apparatus for infrared soldering components on circuit boards
DE8704499U1 (en) * 1987-03-26 1987-09-24 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt, De
DE3710198A1 (en) * 1987-03-27 1988-10-06 Zentro Elektrik Gmbh Kg Coolable arrangement
DE3801920A1 (en) * 1988-01-23 1989-08-03 Pfisterer Elektrotech Karl Device for connecting a branch conductor
DE4015030C1 (en) * 1990-05-10 1991-11-21 Bicc-Vero Elektronics Gmbh, 2800 Bremen, De
US5235491A (en) * 1990-05-10 1993-08-10 Bicc-Vero Electronics Gmbh Safety power supply
DE4313782A1 (en) * 1993-04-27 1994-11-03 Daimler Benz Ag Device for mounting electronic controllers in a motor vehicle
EP1258415A1 (en) * 2001-05-17 2002-11-20 Delphi Technologies, Inc. Modular motor and controller assembly for rear-wheel steering system
US6499558B2 (en) 2001-05-17 2002-12-31 Delphi Technologies, Inc. Modular motor and controller assembly for rear-wheel steering system
DE10235047A1 (en) * 2002-07-31 2004-02-12 Endress + Hauser Gmbh + Co. Kg Electronics housing with integrated heat spreader
EP1465252A1 (en) 2003-03-27 2004-10-06 STMicroelectronics, Inc. System and method for direct convective cooling of an exposed integrated circuit die surface
DE102004040557A1 (en) * 2004-08-16 2006-02-23 Kern, Dietmar, Dr.-Ing. Electronics heatsink
EP1703557A2 (en) * 2005-03-17 2006-09-20 Delphi Technologies, Inc. Electronic assembly with integral thermal transient suppression
EP1703557A3 (en) * 2005-03-17 2009-08-19 Delphi Technologies, Inc. Electronic assembly with integral thermal transient suppression
WO2007008747A2 (en) * 2005-07-08 2007-01-18 Mobility Electronics, Inc. Power converter having housing with improved thermal properties
WO2007008747A3 (en) * 2005-07-08 2007-07-12 Mobility Electronics Inc Power converter having housing with improved thermal properties
DE102007014713B3 (en) * 2007-03-23 2008-09-18 Sew-Eurodrive Gmbh & Co. Kg Cooling arrangement, converter and electric drive system
WO2008116539A2 (en) 2007-03-23 2008-10-02 Sew-Eurodrive Gmbh & Co. Kg Electrical device and use thereof
EP2071620A1 (en) * 2007-12-12 2009-06-17 Wen-Long Chyn Heat sink having enhanced heat dissipation capacity
EP2409328A1 (en) * 2009-03-16 2012-01-25 ATI Technologies ULC Multi-die semiconductor package with heat spreader
EP2409328A4 (en) * 2009-03-16 2014-01-15 Ati Technologies Ulc Multi-die semiconductor package with heat spreader
EP3270674A4 (en) * 2015-03-24 2018-04-04 Huawei Technologies Co., Ltd. Heat dissipation apparatus, radio remote unit, base station unit, communication base station and system

Also Published As

Publication number Publication date Type
DE3223624C2 (en) 1986-08-28 grant

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee