DE3210826A1 - Multilayer printed-circuit board - Google Patents

Multilayer printed-circuit board

Info

Publication number
DE3210826A1
DE3210826A1 DE19823210826 DE3210826A DE3210826A1 DE 3210826 A1 DE3210826 A1 DE 3210826A1 DE 19823210826 DE19823210826 DE 19823210826 DE 3210826 A DE3210826 A DE 3210826A DE 3210826 A1 DE3210826 A1 DE 3210826A1
Authority
DE
Germany
Prior art keywords
signal
layers
circuit board
board according
conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19823210826
Other languages
German (de)
Other versions
DE3210826C2 (en
Inventor
Gundolf Dipl Ing Milde
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19823210826 priority Critical patent/DE3210826C2/en
Publication of DE3210826A1 publication Critical patent/DE3210826A1/en
Application granted granted Critical
Publication of DE3210826C2 publication Critical patent/DE3210826C2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0253—Impedance adaptations of transmission lines by special lay-out of power planes, e.g. providing openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09327—Special sequence of power, ground and signal layers in multilayer PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09681—Mesh conductors, e.g. as a ground plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Abstract

The multilayer printed-circuit board is used for transmitting radio-frequency electrical signals in a spatial coupling arrangement for optical broadband networks. Each of the signal layers (3) carrying the radio frequency is in each case arranged between two screening layers (2, 4), and at least two screening layers (2, 4) are arranged between two adjacent signal layers (3). In consequence, the signal crosstalk is reduced to such an extent that the use of coaxial conductors can be dispensed with. <IMAGE>

Description

MehrlagenleiterplatteMultilayer circuit board

Die Erfindung bezieht sich auf eine Mehrlagenleiterplatte zur Übertragung von hochfrequenten elektrischen Signalen in einer Raumkoppelanordnung für optische Breitbandnetze.The invention relates to a multilayer printed circuit board for transmission of high-frequency electrical signals in a space coupling arrangement for optical Broadband networks.

Derartige Koppelanordnungen müssen in der Lage sein, analoge Signale in hohen Frequenzen und großer Bandbreite übertragen zu können. Eine mehrstufige Koppel-anordnung erfordert eine hohe Anzahl von Signal leitern. Um diese nicht zu lang werden zu lassen, ist eine kompakte Bauweise anzustreben. Diese läßt sich nicht wie bisher mit Hilfe von Koaxialkabeln verwirklichen.Such coupling arrangements must be able to receive analog signals to be able to transmit in high frequencies and wide bandwidth. A multi-level Coupling arrangement requires a large number of signal conductors. So as not to To make it long, a compact design is to be aimed for. This can not Realize as before with the help of coaxial cables.

Es ist bekannt, Mehrlagenleiterplatten mit Schirmlagen zu versehen, die zwischen den Signal lagen angeordnet sind und ein Signalübersprechen weitgehend verhindern. Dabei werden besonders kritische Leitungen in sogenannte Stripline-Lagen verlegt. Jeder dieser Leitungszüge ist beidseits von Schirmleitungen der benachbarten Schirmlagen überdeckt. Dabei ist es aber immer noch möglich, auf einer Leiterfolie beiderseitig sich kreuzende Signalleiter ohne zwischengelegte Schirmlage anzuordnen. Eine derartige Mehrlagenplatte genügt jedoch nicht den sehr hohen Anforderungen hinsichtlich der Übersprechdämpfung in einer Raumkoppelanordnung für optische Breitbandnetze. Da-die Leiterplatte von Kontaktstiften und Durchkontaktierungen durchsetzt ist, können die Schirmlagen nicht vollflächig ausgeführt werden. Außerdem benötigt man Freiätzungen zum Zusammenkleben der verschiedenen Lagen.It is known to provide multilayer printed circuit boards with shielding layers, which were arranged between the signal layers and signal crosstalk to a large extent impede. Particularly critical lines are placed in so-called stripline layers relocated. Each of these cable runs is on both sides of the shielding cables of the neighboring ones Covered shield layers. But it is still possible to use a conductor foil Arrange signal conductors that cross on both sides without an intermediate shield layer. However, such a multilayer plate does not meet the very high requirements with regard to the crosstalk attenuation in a space switching arrangement for optical broadband networks. Since the circuit board is interspersed with contact pins and vias, the shield layers cannot be implemented over the entire surface. You also need Etchings to glue the different layers together.

Der Erfindung liegt die Aufgabe zugrunde, eine Mehrlagen- leiterplatte zu schaffen, die eine sehr hohe Übersprechdämpfung auch bei sehr hohen Frequenzen aufweist.The invention is based on the object of a multilayer circuit board to create a very high crosstalk attenuation even at very high frequencies having.

Diese Aufgabe wird durch die Erfindung gemäß Anspruch 1 gelöst. Durch die Abschirmung der Signal lagen nach beiden Seiten und durch die Anordnung zweier aneinanderliegender Schirmlagen zwischen zwei aufeinanderfolgenden Signallagen wird eine sehr hohe Abschirmwirkung erreicht. Dabei können die Schirmlagen nicht nur Erdpotential, sondern auch andere Versorgungsspannungen führen.This object is achieved by the invention according to claim 1. By the shielding of the signal lay on both sides and by the arrangement of two adjacent shield layers between two successive signal layers is a very high shielding effect is achieved. The shield layers can not only do this Earth potential, but also other supply voltages.

Durch die Weiterbildung der Erfindung nach den Ansprüchen 2 bis 4 wird das Signalübersprechen sowohl zwischen Leitern einer Signal lage als auch verschiedener Signal lagen noch mehr verringert.By developing the invention according to claims 2 to 4 the signal crosstalk between conductors of one signal layer as well as different ones Signal were even more diminished.

Durch die Weiterbildung nach Anspruch 5 werden die Durchkontaktierungen für die Signal leiter so weit abgeschirmt, daß das Signalübersprechen auf einen unschädlichen Wert verringert wird. Durch die Weiterbildung nach Anspruch 6 wird erreicht, daß die durch Spannungsabfälle an den Schirmlagen hervorgerufenen Störspannungen weitgehend Leitungslängen-unabhängig werden.Through the development according to claim 5, the vias for the signal conductor so far shielded that the signal crosstalk on one harmless value is reduced. The development according to claim 6 is achieves that the interference voltages caused by voltage drops at the shield layers largely independent of cable length.

im folgenden wird die Erfindung anhand eines in der Zeichnung dargestellten Ausführungsbeispieles näher erläutert.In the following the invention is illustrated by means of one in the drawing Embodiment explained in more detail.

Die dargestellte Figur zeigt schematisiert einen teilweisen Querschnitt durch eine Mehrlagenleiterplatte,bei der auf Trägerfolien 5 gedruckte Leiterbahnen aufgebracht sind, die in Decklagen 1, Schirmlagen 2, 4 und Signallaz gen 3, 7 angeordnet sind. Die Schirmlagen 2 führen verschiedene Versorgungsspannungen, die Schirmlagen 4 sind an Erde gelegt. Die verschiedenen Leiterfolien 5 sind durch Klebefolien 6 miteinander verbunden.The figure shown shows schematically a partial cross section by means of a multilayer printed circuit board in which there are 5 printed conductors on carrier foils are applied, which are arranged in cover layers 1, shield layers 2, 4 and Signalaz conditions 3, 7 are. The shield layers 2 carry different supply voltages, the shield layers 4 are laid to earth. The various conductor foils 5 are covered by adhesive foils 6 connected with each other.

Die Decklagen 1 enthalten nur Lötaugen und sehr kurze Lei- terbahnen, die zum Zwecke der wahlweisen Durchtrennung nach außen verlegt sind. Die Signal lage 7 verbindet lediglich niederfrequente Schaltkreise. Zwischen den einzelnen Signal lagen 3 zur Übertragung hochfrequenter Signale sind jeweils zwei Schirmlagen 2, 4 angeordnet.The cover layers 1 contain only soldering eyes and very short lines terbahns, which are relocated to the outside for the purpose of optional cutting. The signal Position 7 only connects low frequency circuits. Between each Signal layers 3 for the transmission of high-frequency signals are two shield layers each 2, 4 arranged.

1 Figur 6 Patentansprüche Leerseite1 Figure 6 claims Blank page

Claims (5)

Patentansprüche G, Mehrlagenleiterplatte zur übertragung von hochfrequenten elektrischen Signalen in einer Raumkoppelanordnung für optische Breitbandnetze, wobei zwischen mehreren Signallagen der Leiterplatte großflächige Schirmlagen angeordnet sind, d a d u r c h g e k e n n z e i c h n e t daß jede der Hochfrequenz führenden Signal lagen (3) zwischen jeweils zwei Schirmlagen (2, 4) angeordnet ist und daß zwischen zwei benachbarten Signal lagen (3) mindestens zwei Schirmlagen (2, 4) angeordnet sind, von denen zumindest eine Erdpotential führt Claims G, multi-layer circuit board for the transmission of high frequencies electrical signals in a space switching arrangement for optical broadband networks, large-area shielding layers being arranged between several signal layers of the circuit board are, it is not shown that each of the high frequency leading Signal layers (3) are arranged between two shield layers (2, 4) and that At least two shield layers (2, 4) were arranged between two adjacent signal layers (3) are, of which at least one leads to earth potential 2. Mehrlagenleiterplatte nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , daß netzförmig angeordnete Potential leiter der Schirmlagen (2, 4) engmaschig ausgebildet sind, daß die Breite der Potential leiter mindestens gleich der doppelten Breite von Signal leitern in den Signallagen (3) ist und daß die Signal leiter zumindest annähernd mittig über den Potential leitern verlaufen.2. Multi-layer circuit board according to Claim 1, d a d u r c h g e k e n n n z e i c h n e t that arranged in a network Potential head of the shield layers (2, 4) are closely meshed that the width the potential ladder is at least twice the width of signal ladders in the signal layers (3) and that the signal head at least approximately in the middle the potential conductors run. 3. Mehrlagenleiterplatte nach Anspruch 1 oder 2, d a -d u r c h g e k e n n z e i c h n e t , daß die Signalleiter benachbarter Signal lagen (3) senkrecht zueinander verlaufen.3. Multi-layer circuit board according to claim 1 or 2, d a -d u r c h g It is not clear that the signal conductors of neighboring signals were perpendicular (3) run towards each other. 4. Mehrlagenleiterplatte nach Anspruch 1, 2 oder 3, d a -d u r c h g e k e n n z e i c h n e t , daß der Abstand zwischen den Signal leitern einer Signal lage (3) mindestens gleich dem zehnfachen der Leiterbreite ist.4. Multi-layer circuit board according to claim 1, 2 or 3, d a -d u r c h it is noted that the distance between the signal conductors is a Signal position (3) is at least ten times the conductor width. 5. Mehrlagenleiterplatte nach einem der vorhergehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t , daß Durch-kontaktierungen für Signalleiter Durchkontaktierungen benachbart sind, die mit den Schirmlagen (2, 4) verbunden sind.5. Multi-layer circuit board according to one of the preceding claims, d u r c h e k e n n n z e i c h n e t that through-contacts for signal conductors Vias are adjacent, which are connected to the shield layers (2, 4). 6, Mehrlagenleiterplatte nach einem der vorhergehenden Ansprüche, d a d u r c h g e k e n n z e i c h n e t , daß die Signal leiter benachbarter Signallagen (3) zueinander parallel und die Signalflußrichtungen entgegengesetzt verlaufen.6, multilayer circuit board according to one of the preceding claims, d u r c h e k e n n n z e i c h n e t that the signal conductors of neighboring signal layers (3) are parallel to each other and the directions of signal flow are opposite.
DE19823210826 1982-03-24 1982-03-24 Transmission line consisting of a multilayer circuit board Expired DE3210826C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19823210826 DE3210826C2 (en) 1982-03-24 1982-03-24 Transmission line consisting of a multilayer circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19823210826 DE3210826C2 (en) 1982-03-24 1982-03-24 Transmission line consisting of a multilayer circuit board

Publications (2)

Publication Number Publication Date
DE3210826A1 true DE3210826A1 (en) 1983-10-06
DE3210826C2 DE3210826C2 (en) 1985-09-26

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Family Applications (1)

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DE19823210826 Expired DE3210826C2 (en) 1982-03-24 1982-03-24 Transmission line consisting of a multilayer circuit board

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3511162A1 (en) * 1984-04-13 1985-10-24 Mitsubishi Denki K.K., Tokio/Tokyo DISPLAY DEVICE
EP0199309A2 (en) * 1985-04-19 1986-10-29 Wilhelm Sedlbauer GmbH Multiple switching element for interconnecting a great number of multiple terminals
DE3539040A1 (en) * 1985-11-04 1987-05-07 Telefonbau & Normalzeit Gmbh Track and circuit arrangement for printed circuit boards fitted with integrated circuits
DE3920081A1 (en) * 1989-06-20 1991-01-03 Foerster Inst Dr Friedrich SEARCH COIL ARRANGEMENT
US6162993A (en) * 1997-01-17 2000-12-19 Stemmann-Technik Gmbh Signal conductor
WO2013041070A1 (en) * 2011-09-19 2013-03-28 Erni Electronics Gmbh Electric multilayer printed circuit board

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE8623251U1 (en) * 1986-08-29 1987-12-23 Robert Bosch Gmbh, 7000 Stuttgart, De
EP0662259B1 (en) * 1992-09-23 1996-02-07 Siemens Aktiengesellschaft Shielded electric cable connector
DE19732254A1 (en) * 1997-07-26 1999-02-11 Kaba Benzing Gmbh Arrangement for transferring magnetic signals between the arrangement and a mobile communications partner, e.g. for monitoring and access control systems
DE10023354A1 (en) * 2000-05-12 2001-09-13 Siemens Ag Circuit board has electrically conducting structure in at least one defined area forming planar antenna terminated by at least one resistance in an at least approximately reflection-free manner

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2627297A1 (en) * 1975-06-20 1977-01-13 Int Computers Ltd Multilayer printed circuit board with power supply - is connected to two conducting planes beneath orthogonal conducting paths
DE2702844A1 (en) * 1976-03-30 1977-10-13 Ibm METHOD OF MANUFACTURING A MULTI-LAYER PRINTED CIRCUIT
DE2728360A1 (en) * 1976-06-30 1978-01-05 Ibm ARRANGEMENT FOR CONNECTING SEVERAL LEVELS WITH INTEGRATED CIRCUITS

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2627297A1 (en) * 1975-06-20 1977-01-13 Int Computers Ltd Multilayer printed circuit board with power supply - is connected to two conducting planes beneath orthogonal conducting paths
DE2702844A1 (en) * 1976-03-30 1977-10-13 Ibm METHOD OF MANUFACTURING A MULTI-LAYER PRINTED CIRCUIT
DE2728360A1 (en) * 1976-06-30 1978-01-05 Ibm ARRANGEMENT FOR CONNECTING SEVERAL LEVELS WITH INTEGRATED CIRCUITS

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Zeitschr."radio fernsehen elektronik" 28 (1979), Heft 8, S. 500-502 *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3511162A1 (en) * 1984-04-13 1985-10-24 Mitsubishi Denki K.K., Tokio/Tokyo DISPLAY DEVICE
US4677344A (en) * 1984-04-13 1987-06-30 Mitsubishi Denki Kabushiki Kaisha Display device
EP0199309A2 (en) * 1985-04-19 1986-10-29 Wilhelm Sedlbauer GmbH Multiple switching element for interconnecting a great number of multiple terminals
EP0199309A3 (en) * 1985-04-19 1988-08-17 Wilhelm Sedlbauer GmbH Multiple switching element for interconnecting a great number of multiple terminals
DE3539040A1 (en) * 1985-11-04 1987-05-07 Telefonbau & Normalzeit Gmbh Track and circuit arrangement for printed circuit boards fitted with integrated circuits
DE3920081A1 (en) * 1989-06-20 1991-01-03 Foerster Inst Dr Friedrich SEARCH COIL ARRANGEMENT
US6162993A (en) * 1997-01-17 2000-12-19 Stemmann-Technik Gmbh Signal conductor
WO2013041070A1 (en) * 2011-09-19 2013-03-28 Erni Electronics Gmbh Electric multilayer printed circuit board

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