DE3061149D1 - Non-bleeding thixotropic thermally conductive dielectric material - Google Patents

Non-bleeding thixotropic thermally conductive dielectric material

Info

Publication number
DE3061149D1
DE3061149D1 DE8080103557T DE3061149T DE3061149D1 DE 3061149 D1 DE3061149 D1 DE 3061149D1 DE 8080103557 T DE8080103557 T DE 8080103557T DE 3061149 T DE3061149 T DE 3061149T DE 3061149 D1 DE3061149 D1 DE 3061149D1
Authority
DE
Germany
Prior art keywords
bleeding
dielectric material
thermally conductive
conductive dielectric
thixotropic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8080103557T
Other languages
German (de)
English (en)
Inventor
Nandakumar Govinda Aakalu
Lawrence Arthur Rittmiller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3061149D1 publication Critical patent/DE3061149D1/de
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Lubricants (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Organic Insulating Materials (AREA)
DE8080103557T 1979-08-16 1980-06-24 Non-bleeding thixotropic thermally conductive dielectric material Expired DE3061149D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/067,481 US4265775A (en) 1979-08-16 1979-08-16 Non-bleeding thixotropic thermally conductive material

Publications (1)

Publication Number Publication Date
DE3061149D1 true DE3061149D1 (en) 1982-12-30

Family

ID=22076280

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8080103557T Expired DE3061149D1 (en) 1979-08-16 1980-06-24 Non-bleeding thixotropic thermally conductive dielectric material

Country Status (4)

Country Link
US (1) US4265775A (https=)
EP (1) EP0024498B1 (https=)
JP (1) JPS5628264A (https=)
DE (1) DE3061149D1 (https=)

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US5738936A (en) * 1996-06-27 1998-04-14 W. L. Gore & Associates, Inc. Thermally conductive polytetrafluoroethylene article
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JP2000169873A (ja) * 1998-12-02 2000-06-20 Shin Etsu Chem Co Ltd シリコーングリース組成物
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US6400565B1 (en) 2000-04-21 2002-06-04 Dell Products L.P. Thermally conductive interface member
JP4603700B2 (ja) 2001-01-04 2010-12-22 株式会社日立製作所 高熱伝導グリース組成物及びそれを用いた冷却装置
US20030128519A1 (en) * 2002-01-08 2003-07-10 International Business Machine Corporartion Flexible, thermally conductive, electrically insulating gap filler, method to prepare same, and method using same
EP1692219B1 (en) * 2003-11-05 2007-03-21 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
TWI385246B (zh) * 2004-05-21 2013-02-11 信越化學工業股份有限公司 聚矽氧烷潤滑油組成物
JP2007005670A (ja) * 2005-06-27 2007-01-11 Fujitsu Ltd 電子部品パッケージおよび接合組立体
DE102005045767B4 (de) * 2005-09-23 2012-03-29 Infineon Technologies Ag Verfahren zur Herstellung eines Halbleiterbauteils mit Kunststoffgehäusemasse
JP4933094B2 (ja) 2005-12-27 2012-05-16 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP2007177921A (ja) * 2005-12-28 2007-07-12 Nsk Ltd ボールねじ装置
JP4514058B2 (ja) 2006-08-30 2010-07-28 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5489409B2 (ja) * 2007-04-10 2014-05-14 コスモ石油ルブリカンツ株式会社 高熱伝導性コンパウンド
US20110038124A1 (en) * 2008-04-21 2011-02-17 Honeywell International Inc. Thermal interconnect and interface materials, methods of production and uses thereof
US8546476B2 (en) * 2009-07-14 2013-10-01 Sakai Chemical Industry Co., Ltd. Exoergic filler composition, resin composition, exoergic grease and exoergic coating composition
DE102010003330A1 (de) * 2010-03-26 2011-09-29 Robert Bosch Gmbh Wärmeleitende Anordnung zwischen zwei Bauteilen und Verfahren zum Herstellen einer wärmeleitenden Anordnung
WO2013158071A1 (en) * 2012-04-16 2013-10-24 Clustered Systems Company Cold plate with reduced bubble effects
CN108431946B (zh) 2016-01-07 2021-12-07 赛灵思公司 具有加强件的堆叠的硅封装组件
WO2018070351A1 (ja) 2016-10-14 2018-04-19 信越化学工業株式会社 熱伝導性複合シリコーンゴムシートおよびその製造方法
JP7031203B2 (ja) * 2017-09-29 2022-03-08 東洋インキＳｃホールディングス株式会社 放熱用接着シート、放熱接着部材用積層体、及び複合部材
JP6919716B2 (ja) 2017-11-09 2021-08-18 信越化学工業株式会社 熱伝導性シリコーングリース組成物
CN108192576B (zh) * 2017-12-05 2021-02-02 云南靖创液态金属热控技术研发有限公司 一种液态金属热界面材料及其制备方法和应用
JP6866877B2 (ja) 2018-05-31 2021-04-28 信越化学工業株式会社 低熱抵抗シリコーン組成物
JP7050704B2 (ja) 2019-02-07 2022-04-08 信越化学工業株式会社 熱伝導性粘着層を有する熱伝導性シリコーンゴムシート
WO2021178119A1 (en) * 2020-03-05 2021-09-10 Dow Global Technologies Llc Shear thinning thermally conductive silicone compositions
JP6997263B1 (ja) * 2020-07-10 2022-01-17 イビデン株式会社 熱伝達抑制シート及び組電池
CN119585364A (zh) 2022-07-29 2025-03-07 信越化学工业株式会社 导热性有机硅组合物及其制造方法
JP2024148978A (ja) 2023-04-07 2024-10-18 信越化学工業株式会社 シリコーン組成物

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US2428608A (en) * 1942-11-02 1947-10-07 Dow Chemical Co Plastic dielectric composition and shielded spark plug terminal construction comprising same
US3405066A (en) * 1965-01-22 1968-10-08 Union Carbide Corp High thermal conductivity fluid dielectric
US3499859A (en) * 1968-07-05 1970-03-10 Dow Corning Stable thermally conductive room temperature vulcanizable silicone rubber
US3882033A (en) * 1971-07-06 1975-05-06 Gen Electric Silicone grease for semiconductors
US3885984A (en) * 1973-12-18 1975-05-27 Gen Electric Methyl alkyl silicone thermoconducting compositions
DE2556420A1 (de) * 1975-12-15 1977-06-16 Wacker Chemie Gmbh Zu elastomeren haertbare massen auf grundlage von diorganopolysiloxanen und verfahren zum herstellen von organopolysiloxanelastomeren

Also Published As

Publication number Publication date
EP0024498B1 (en) 1982-11-24
US4265775A (en) 1981-05-05
EP0024498A1 (en) 1981-03-11
JPS5736302B2 (https=) 1982-08-03
JPS5628264A (en) 1981-03-19

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Legal Events

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8339 Ceased/non-payment of the annual fee