DE3006314A1 - Brecheinrichtung - Google Patents

Brecheinrichtung

Info

Publication number
DE3006314A1
DE3006314A1 DE19803006314 DE3006314A DE3006314A1 DE 3006314 A1 DE3006314 A1 DE 3006314A1 DE 19803006314 DE19803006314 DE 19803006314 DE 3006314 A DE3006314 A DE 3006314A DE 3006314 A1 DE3006314 A1 DE 3006314A1
Authority
DE
Germany
Prior art keywords
substrate
suction
dividing lines
suction field
plates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19803006314
Other languages
German (de)
English (en)
Other versions
DE3006314C2 (https=
Inventor
Berthold 7410 Reutlingen Schweikert
Dieter Dr. Seipler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEIPLER DIETER GEORG DR 7410 REUTLINGEN DE
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE19803006314 priority Critical patent/DE3006314A1/de
Publication of DE3006314A1 publication Critical patent/DE3006314A1/de
Application granted granted Critical
Publication of DE3006314C2 publication Critical patent/DE3006314C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0041—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking
    • B28D5/0047—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing the workpiece being brought into contact with a suitably shaped rigid body which remains stationary during breaking using fluid or gas pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE19803006314 1980-02-20 1980-02-20 Brecheinrichtung Granted DE3006314A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19803006314 DE3006314A1 (de) 1980-02-20 1980-02-20 Brecheinrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803006314 DE3006314A1 (de) 1980-02-20 1980-02-20 Brecheinrichtung

Publications (2)

Publication Number Publication Date
DE3006314A1 true DE3006314A1 (de) 1981-09-03
DE3006314C2 DE3006314C2 (https=) 1990-03-01

Family

ID=6095073

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19803006314 Granted DE3006314A1 (de) 1980-02-20 1980-02-20 Brecheinrichtung

Country Status (1)

Country Link
DE (1) DE3006314A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4006070A1 (de) * 1990-02-27 1991-09-12 Braun Ag Verfahren und einrichtung zum zerteilen einer scheibe aus halbleitermaterial
CN103522428A (zh) * 2013-10-16 2014-01-22 内蒙古中环光伏材料有限公司 一种太阳能硅片加工方法及装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10007642C2 (de) * 2000-02-19 2002-03-14 Bosch Gmbh Robert Verfahren zum Trennen von Substraten im Nutzenformat mit vorgegebenen Sollbruchstellen

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1297954A (https=) * 1969-05-01 1972-11-29

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1297954A (https=) * 1969-05-01 1972-11-29

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4006070A1 (de) * 1990-02-27 1991-09-12 Braun Ag Verfahren und einrichtung zum zerteilen einer scheibe aus halbleitermaterial
CN103522428A (zh) * 2013-10-16 2014-01-22 内蒙古中环光伏材料有限公司 一种太阳能硅片加工方法及装置

Also Published As

Publication number Publication date
DE3006314C2 (https=) 1990-03-01

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Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: SEIPLER, DIETER GEORG, DR., 7410 REUTLINGEN, DE

8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee