DE2939266A1 - Module with relay mounted on circuit board - has holes for relay connection legs and its own connection legs - Google Patents
Module with relay mounted on circuit board - has holes for relay connection legs and its own connection legsInfo
- Publication number
- DE2939266A1 DE2939266A1 DE19792939266 DE2939266A DE2939266A1 DE 2939266 A1 DE2939266 A1 DE 2939266A1 DE 19792939266 DE19792939266 DE 19792939266 DE 2939266 A DE2939266 A DE 2939266A DE 2939266 A1 DE2939266 A1 DE 2939266A1
- Authority
- DE
- Germany
- Prior art keywords
- relay
- circuit
- connections
- circuit board
- connection legs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/58—Electric connections to or between contacts; Terminals
- H01H1/5805—Connections to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H50/00—Details of electromagnetic relays
- H01H50/02—Bases; Casings; Covers
- H01H50/021—Bases; Casings; Covers structurally combining a relay and an electronic component, e.g. varistor, RC circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/096—Vertically aligned vias, holes or stacked vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10053—Switch
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Baueinheit aus einem Relais und einer auf einer Schaltunos-Unit consisting of a relay and one on a switching unit
platte angeordneten Schaltunosanordnunn Die Erfindung bezieht sich auf eine Raueinheit aus einem Relais mit an einer Seite herausgeführten elektrischen Anschlüssen und einer auf einer Schaltungsplatte angeordneten, mit dem Relais zusammenarbeitenden Schaltuncsanordnung. plate arranged Schaltunosanordnunn The invention relates on a Raueinheit from a relay with led out on one side electrical Connections and one arranged on a circuit board, cooperating with the relay Switching arrangement.
Bei elektrischen Schaltunosanordnunqen, in denen Relais verwendet werden, sind oft Schaltungsteile vorgesehen, die an das Relais angeschlossen sind und die direkt auf die elektrischen Eigenschaften des Relais abgestimmt sind.In electrical Schaltunosanordnunqen in which relays are used circuit parts are often provided that are connected to the relay and which are directly matched to the electrical properties of the relay.
So werden oft sogenannte Ansteuerschaltungen verwendet, um elektrische Signale so aufzubereiten, daß sie sich zur Ansteuerung des Relais eignen. Solche Schaltungsanordnunann müssen daher direkt auf die elektrischen Eigenschaften der Relaisspule abgestimmt sein.So-called control circuits are often used to control electrical To prepare signals in such a way that they are suitable for controlling the relay. Such Circuit arrangement must therefore directly affect the electrical properties of the Be matched to the relay coil.
Oft sind aber auch dem Relais bestimmte Schaltungsanordnungen nachgeschaltet, welche an die Relaiskontakte angeschlossen sind und beim Schaltvorgang des Relais bestimmte elektrische Ausgangssignale erzeugen, die in einer weiteren Schaltungsanordnung weiterverarbeitet werden können.Often, however, certain circuit arrangements are also connected downstream of the relay, which are connected to the relay contacts and during the switching process of the relay generate certain electrical output signals in a further circuit arrangement can be further processed.
Der Zusammenbau und die Montage von Schaltungsanordnungen, welche Relais enthalten, läßt sich dadurch wesentlich vereinfachen, daß die speziell an das Relais angepaßten Schaltungsanordnungen mit dem Relais zu einer Baueinheit zusammengefaßt werden.The assembly and installation of circuit arrangements, which Relay included, can be simplified significantly that the special the relay adapted circuit arrangements combined with the relay to form a structural unit will.
Die Ansteuerschaltungen beispielsweise lassen sich infolge der geringen Abmessungen der Relais in diesen nicht unterbringen und es ist auch nicht zweckmäßig, diese als eine Einheit mit einem Relais herzustellen, da einerseits hierbei ganz andere Technologien verwendet werden als bei der Herstellung von Relais und anderseits die beliebige Kombinierbarkeit eines Relais mit einer bestimmten Schaltun#c.-anordnung erhalten bleiben soll.The control circuits, for example, can be due to the low Do not accommodate the dimensions of the relays in these and it is also not expedient to to produce this as a unit with a relay, since on the one hand this is entirely other technologies are used than in the manufacture of relays and on the other hand the ability to combine a relay with a specific circuit arrangement should be preserved.
Aufgabe der Erfindung ist es, eine solche Baueinheit aus einem Relais und der mit ihm direkt verbundenen Schaltungsanordnung zu schaffen.The object of the invention is to provide such a structural unit from a relay and to create the circuit arrangement directly connected to it.
Diese Aufgabe wird durch die im Kennzeichen des Anspruchs 1 genannten Maßnahmen gelöst.This object is achieved by those mentioned in the characterizing part of claim 1 Measures resolved.
Vorteilhafte Weiterbildunqen der Erfindung gehen aus den Unteransprüchen hervor.Advantageous further developments of the invention emerge from the subclaims emerged.
Die Erfindung soll anhand der Figur näher erläutert werden, in der perspektivisch eine Baueinheit gemäß der Erfindunn dargestellt ist.The invention will be explained in more detail with reference to the figure, in which a unit according to the invention is shown in perspective.
Relais sind meist so ausgeführt, daß alle elektrischen Arschlüsse an einer Seite aus der Umhüllung des Relais herauragen. Die Anschlüsse sind meist als sogenannte Steckanschlüsse ausgebildet, so daß sie in die Löcher einer aedruckten Schaltungsplatte eingesteckt und mit der Schaltunesanordnung verlötet werden können. Die Baueinheit gemäß der Erfindung wird nun in der Weise erhalten, daß die mit den Relais direkt verbundene und an dieses angepaßte Schaltunesanordnung mit den Relaisanschlüssen entsprechenden Löchern versehen wird, durch welche die Relaisanschlüsse hindurchgesteckt werden. Die entsprechenden Relaisanschlüsse werden dann elektrisch mit der Schaltung auf der Schal tunqspl atte verbunden, beispielsweise durch Löten.Relays are usually designed so that all electrical connections protrude from the casing of the relay on one side. The connections are mostly designed as so-called plug connections, so that they aedruckten into the holes of a Circuit board can be plugged in and soldered to the Schaltunesanordnung. The assembly according to the invention is now obtained in such a way that with the relay directly connected and adapted to this circuit arrangement with the relay connections corresponding holes is provided through which the relay connections are inserted will. The appropriate relay connections are then electrically connected to the circuit connected on the scarf tunqspl atte, for example by soldering.
In der Figur ist eine solche Anordnunq perspektivisch dargestellt.Such an arrangement is shown in perspective in the figure.
Das quaderförmige Relaislhat an einer Seite herausgeführte Anschlüsse 2. Die mit dem Relais verbundene Schaltunqsanordnung ist auf einer Schaltunqsplatte 3 angeordnet, welche mit Löchern 4 versehen ist, die der Anordnung der Anschlüsse 2 des Relais 1 entsprechen. Die Relaisanschlüsse 2 werden durch die Löcher 4 hindurchgesteckt und die entsprechenden Anschlüsse dann durch Löten mit der Schaltungsanordnung auf der Schaltungsplatte 3 verbunden. Wenn es sich beispielsweise um eine Ansteuerschaltung für das Relais handelt, werden die Spulenanschlüsse des Relais mit der Schaltungsanordnung verbunden, wenn es sich um eine Ausgangsschaltung handelt, werden die Kontaktanschlüsse des Relais mit der Schaltungsanordnung verbunden. Zweckmäßig hat die Schaltungsplatte noch zwei weitere Schaltunqsanschlüsse 5, die den Relaisanschlüssen entsprechend auscebildet sind, und als Eingangsanschilisse oder Ausganqsanschlüsse für die Schaltungsanordnung auf der Schaltunosplatte 3 dienen. Besonders zweckmäßig ist es, die Schaltungsanordnung auf der Schaltungsplatte 3 als sogenannte Dickschichtschaltung auszuführen, da diese eine sehr geringe Bauhöhe hat.The cuboid relay has connections on one side 2. The circuit arrangement connected to the relay is on a circuit board 3 arranged, which is provided with holes 4, the arrangement of the connections 2 of relay 1 correspond. The relay connections 2 are pushed through the holes 4 and the corresponding connections then by soldering to the circuit arrangement the circuit board 3 connected. For example, if it is a control circuit for the relay acts, the coil connections of the relay with the circuit arrangement connected, if it is an output circuit, the contact terminals will be of the relay connected to the circuit arrangement. Appropriately, the circuit board two more switching connections 5, which correspond to the relay connections are trained, and as input connections or output connections for the circuit arrangement on the Schaltunosplatte 3 serve. It is particularly expedient to use the circuit arrangement on the circuit board 3 as a so-called thick-film circuit, since this has a very low overall height.
Die so erhaltene Baueinheit aus Relais und Schaltungsanordnung kann dann, wie üblich, mit den auf der Psückseite der Schaltungsplatte herausragenden Anschlüssen in eine größere Schaltungsanordnung eingesteckt oder eingelötet werden.The assembly thus obtained comprising relay and circuit arrangement can then, as usual, with those protruding from the back of the circuit board Connections are plugged or soldered into a larger circuit arrangement.
Durch die Verwendung von solchen Baueinheiten gestaltet sich die Montage von Relaisschaltungen einfacher und billiger.The assembly is made possible by the use of such structural units of relay circuits easier and cheaper.
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19792939266 DE2939266A1 (en) | 1979-09-28 | 1979-09-28 | Module with relay mounted on circuit board - has holes for relay connection legs and its own connection legs |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19792939266 DE2939266A1 (en) | 1979-09-28 | 1979-09-28 | Module with relay mounted on circuit board - has holes for relay connection legs and its own connection legs |
Publications (1)
Publication Number | Publication Date |
---|---|
DE2939266A1 true DE2939266A1 (en) | 1981-04-02 |
Family
ID=6082070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19792939266 Withdrawn DE2939266A1 (en) | 1979-09-28 | 1979-09-28 | Module with relay mounted on circuit board - has holes for relay connection legs and its own connection legs |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE2939266A1 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3036404A1 (en) * | 1980-09-26 | 1982-05-19 | Hans 8024 Deisenhofen Sauer | RELAY SOCKET |
DE3113635C1 (en) * | 1981-04-04 | 1982-10-07 | Hermann Stribel KG, 7443 Frickenhausen | Electromagnetic relay |
EP0098361B1 (en) * | 1982-06-04 | 1986-10-22 | Karl Lumberg GmbH & Co. | Relay socket |
EP0327994A2 (en) * | 1988-02-10 | 1989-08-16 | EATON CONTROLS SpA | Modular programmer device with integrated interconnection to organize and transfer output contacts |
DE3840547A1 (en) * | 1988-12-01 | 1990-06-07 | Hengstler Bauelemente | Relay |
DE4323827C1 (en) * | 1993-07-15 | 1994-12-08 | Siemens Ag | Pluggable assembly |
EP0940831A2 (en) * | 1998-03-05 | 1999-09-08 | ABBPATENT GmbH | Thermal-type overload relay. |
WO2000007200A2 (en) * | 1998-07-30 | 2000-02-10 | Siemens Electromechanical Components Gmbh & Co. Kg | Electromagnetic relay |
DE20202278U1 (en) | 2002-02-15 | 2002-04-18 | Tyco Electronics Austria Gmbh, Wien | Arrangement of a relay with an adapter base and relay with adaptable pin design |
-
1979
- 1979-09-28 DE DE19792939266 patent/DE2939266A1/en not_active Withdrawn
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3036404A1 (en) * | 1980-09-26 | 1982-05-19 | Hans 8024 Deisenhofen Sauer | RELAY SOCKET |
DE3113635C1 (en) * | 1981-04-04 | 1982-10-07 | Hermann Stribel KG, 7443 Frickenhausen | Electromagnetic relay |
EP0098361B1 (en) * | 1982-06-04 | 1986-10-22 | Karl Lumberg GmbH & Co. | Relay socket |
EP0327994A2 (en) * | 1988-02-10 | 1989-08-16 | EATON CONTROLS SpA | Modular programmer device with integrated interconnection to organize and transfer output contacts |
EP0327994A3 (en) * | 1988-02-10 | 1990-03-21 | EATON CONTROLS SpA | Modular programmer device with integrated interconnection to organize and transfer output contacts |
DE3840547A1 (en) * | 1988-12-01 | 1990-06-07 | Hengstler Bauelemente | Relay |
DE4323827C1 (en) * | 1993-07-15 | 1994-12-08 | Siemens Ag | Pluggable assembly |
US5446626A (en) * | 1993-07-15 | 1995-08-29 | Siemens Aktiengesellschaft | Pluggable assembly, particularly a relay module for motor vehicles |
EP0940831A2 (en) * | 1998-03-05 | 1999-09-08 | ABBPATENT GmbH | Thermal-type overload relay. |
EP0940831A3 (en) * | 1998-03-05 | 2000-06-28 | ABBPATENT GmbH | Thermal-type overload relay. |
WO2000007200A2 (en) * | 1998-07-30 | 2000-02-10 | Siemens Electromechanical Components Gmbh & Co. Kg | Electromagnetic relay |
WO2000007200A3 (en) * | 1998-07-30 | 2000-08-31 | Siemens Electromech Components | Electromagnetic relay |
DE20202278U1 (en) | 2002-02-15 | 2002-04-18 | Tyco Electronics Austria Gmbh, Wien | Arrangement of a relay with an adapter base and relay with adaptable pin design |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
8131 | Rejection | ||
8165 | Unexamined publication of following application revoked |