DE2641500A1 - Halbleiteranordnung - Google Patents

Halbleiteranordnung

Info

Publication number
DE2641500A1
DE2641500A1 DE19762641500 DE2641500A DE2641500A1 DE 2641500 A1 DE2641500 A1 DE 2641500A1 DE 19762641500 DE19762641500 DE 19762641500 DE 2641500 A DE2641500 A DE 2641500A DE 2641500 A1 DE2641500 A1 DE 2641500A1
Authority
DE
Germany
Prior art keywords
frame
cooling plates
connecting conductors
semiconductor
arrangement according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19762641500
Other languages
German (de)
English (en)
Inventor
Walter Bahlinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DE19762641500 priority Critical patent/DE2641500A1/de
Priority to FR7726203A priority patent/FR2365210A1/fr
Priority to GB3616277A priority patent/GB1545650A/en
Priority to IT2730577A priority patent/IT1086076B/it
Priority to JP11150677A priority patent/JPS5336477A/ja
Publication of DE2641500A1 publication Critical patent/DE2641500A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/074Stacked arrangements of non-apertured devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/117Stacked arrangements of devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
DE19762641500 1976-09-15 1976-09-15 Halbleiteranordnung Withdrawn DE2641500A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE19762641500 DE2641500A1 (de) 1976-09-15 1976-09-15 Halbleiteranordnung
FR7726203A FR2365210A1 (fr) 1976-09-15 1977-08-29 Dispositif semiconducteur
GB3616277A GB1545650A (en) 1976-09-15 1977-08-30 Electrical connection arrangements
IT2730577A IT1086076B (it) 1976-09-15 1977-09-07 Dispositivo a semiconduttori
JP11150677A JPS5336477A (en) 1976-09-15 1977-09-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19762641500 DE2641500A1 (de) 1976-09-15 1976-09-15 Halbleiteranordnung

Publications (1)

Publication Number Publication Date
DE2641500A1 true DE2641500A1 (de) 1978-03-16

Family

ID=5987968

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19762641500 Withdrawn DE2641500A1 (de) 1976-09-15 1976-09-15 Halbleiteranordnung

Country Status (5)

Country Link
JP (1) JPS5336477A (enrdf_load_stackoverflow)
DE (1) DE2641500A1 (enrdf_load_stackoverflow)
FR (1) FR2365210A1 (enrdf_load_stackoverflow)
GB (1) GB1545650A (enrdf_load_stackoverflow)
IT (1) IT1086076B (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL1625150T3 (pl) 2003-05-08 2007-05-31 Dsm Ip Assets Bv Tripeptydy i ich pochodne do stosowania w kosmetyce w celu poprawy struktury skóry

Also Published As

Publication number Publication date
GB1545650A (en) 1979-05-10
FR2365210A1 (fr) 1978-04-14
JPS5649457B2 (enrdf_load_stackoverflow) 1981-11-21
FR2365210B3 (enrdf_load_stackoverflow) 1980-07-11
IT1086076B (it) 1985-05-28
JPS5336477A (en) 1978-04-04

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee