DE2512400C2 - Verfahren und Vorrichtung zum zeitweiligen Befestigen eines oder mehrerer Gegenstände auf einem Träger durch Unterdruck - Google Patents

Verfahren und Vorrichtung zum zeitweiligen Befestigen eines oder mehrerer Gegenstände auf einem Träger durch Unterdruck

Info

Publication number
DE2512400C2
DE2512400C2 DE2512400A DE2512400A DE2512400C2 DE 2512400 C2 DE2512400 C2 DE 2512400C2 DE 2512400 A DE2512400 A DE 2512400A DE 2512400 A DE2512400 A DE 2512400A DE 2512400 C2 DE2512400 C2 DE 2512400C2
Authority
DE
Germany
Prior art keywords
carrier
negative pressure
recess
objects
recesses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2512400A
Other languages
German (de)
English (en)
Other versions
DE2512400A1 (de
Inventor
Antonius Johannes Mathijs Nijmegen Uijen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE2512400A1 publication Critical patent/DE2512400A1/de
Application granted granted Critical
Publication of DE2512400C2 publication Critical patent/DE2512400C2/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Jigs For Machine Tools (AREA)
DE2512400A 1974-04-01 1975-03-21 Verfahren und Vorrichtung zum zeitweiligen Befestigen eines oder mehrerer Gegenstände auf einem Träger durch Unterdruck Expired DE2512400C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL7404364A NL7404364A (nl) 1974-04-01 1974-04-01 Werkwijze en inrichting voor het bewerken van vlakke voorwerpen.

Publications (2)

Publication Number Publication Date
DE2512400A1 DE2512400A1 (de) 1975-10-02
DE2512400C2 true DE2512400C2 (de) 1982-03-18

Family

ID=19821089

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2512400A Expired DE2512400C2 (de) 1974-04-01 1975-03-21 Verfahren und Vorrichtung zum zeitweiligen Befestigen eines oder mehrerer Gegenstände auf einem Träger durch Unterdruck

Country Status (11)

Country Link
US (1) US4009540A (https=)
JP (1) JPS50134574A (https=)
BE (1) BE827435A (https=)
CA (1) CA1010159A (https=)
CH (1) CH583969A5 (https=)
DE (1) DE2512400C2 (https=)
FR (1) FR2266304B1 (https=)
GB (1) GB1491938A (https=)
IT (1) IT1049391B (https=)
NL (1) NL7404364A (https=)
SE (1) SE7503558L (https=)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5364463A (en) * 1976-11-22 1978-06-08 Nippon Telegr & Teleph Corp <Ntt> Fixing tray of semiconductor wafers
US4132037A (en) * 1977-02-28 1979-01-02 Siltec Corporation Apparatus for polishing semiconductor wafers
EP0013684A1 (de) * 1979-01-26 1980-08-06 Heinrich Wagner Maschinenfabrik GmbH &amp; Co Form- oder Rüttelformmaschine
US4519168A (en) * 1979-09-18 1985-05-28 Speedfam Corporation Liquid waxless fixturing of microsize wafers
US4707201A (en) * 1986-08-20 1987-11-17 Canadian Instrumentation And Research Limited Method of producing polished block type, single mode, evanscent wave directional couplers by means of mass production of the coupler halves
JPH04180650A (ja) * 1990-11-15 1992-06-26 Nec Kyushu Ltd フルカットダイシング用テープ
JPH0828086B2 (ja) * 1991-06-04 1996-03-21 富士通株式会社 磁気ヘッドスライダの製造装置及び製造方法
US5220754A (en) * 1992-03-02 1993-06-22 Amad Tayebi Recovered compact disk and a method and an apparatus for recovery thereof
US5267418A (en) * 1992-05-27 1993-12-07 International Business Machines Corporation Confined water fixture for holding wafers undergoing chemical-mechanical polishing
EP0599299B1 (en) * 1992-11-27 1998-02-04 Kabushiki Kaisha Toshiba Method and apparatus for polishing a workpiece
FR2715503B1 (fr) * 1994-01-26 1996-04-05 Commissariat Energie Atomique Substrat pour composants intégrés comportant une couche mince et son procédé de réalisation.
US5733175A (en) * 1994-04-25 1998-03-31 Leach; Michael A. Polishing a workpiece using equal velocity at all points overlapping a polisher
US5607341A (en) * 1994-08-08 1997-03-04 Leach; Michael A. Method and structure for polishing a wafer during manufacture of integrated circuits
US5632667A (en) * 1995-06-29 1997-05-27 Delco Electronics Corporation No coat backside wafer grinding process
US6159824A (en) 1997-05-12 2000-12-12 Silicon Genesis Corporation Silicon-on-silicon wafer bonding process using a thin film blister-separation method
US6033974A (en) 1997-05-12 2000-03-07 Silicon Genesis Corporation Method for controlled cleaving process
US6291313B1 (en) 1997-05-12 2001-09-18 Silicon Genesis Corporation Method and device for controlled cleaving process
US6548382B1 (en) 1997-07-18 2003-04-15 Silicon Genesis Corporation Gettering technique for wafers made using a controlled cleaving process
US6291326B1 (en) 1998-06-23 2001-09-18 Silicon Genesis Corporation Pre-semiconductor process implant and post-process film separation
US6263941B1 (en) 1999-08-10 2001-07-24 Silicon Genesis Corporation Nozzle for cleaving substrates
US6500732B1 (en) 1999-08-10 2002-12-31 Silicon Genesis Corporation Cleaving process to fabricate multilayered substrates using low implantation doses
FR2828579B1 (fr) * 2001-08-13 2004-01-30 St Microelectronics Sa Procede de manipulation d'une plaquette de silicium mince
US7018268B2 (en) * 2002-04-09 2006-03-28 Strasbaugh Protection of work piece during surface processing
US9362439B2 (en) 2008-05-07 2016-06-07 Silicon Genesis Corporation Layer transfer of films utilizing controlled shear region
US8993410B2 (en) 2006-09-08 2015-03-31 Silicon Genesis Corporation Substrate cleaving under controlled stress conditions
US8329557B2 (en) 2009-05-13 2012-12-11 Silicon Genesis Corporation Techniques for forming thin films by implantation with reduced channeling
DE102009052744B4 (de) * 2009-11-11 2013-08-29 Siltronic Ag Verfahren zur Politur einer Halbleiterscheibe
CN103258764B (zh) * 2012-02-21 2016-06-15 欣兴电子股份有限公司 用于晶片薄化的载具及其制法
FR3012257A1 (fr) * 2013-10-21 2015-04-24 Soitec Silicon On Insulator Procede de prehension d'un substrat
CN115709413B (zh) * 2022-09-30 2025-02-11 深圳长盛高精密五金有限公司 一种精密轴的加工磨削设备及方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2353066A (en) * 1943-11-03 1944-07-04 Walter W Phillips Safety razor blade sharpener
US2443987A (en) * 1945-10-13 1948-06-22 O H Calhoun Work holder
US2855653A (en) * 1955-10-07 1958-10-14 Tile Council Of America Apparatus for making tile panels
US3004766A (en) * 1959-11-02 1961-10-17 Andrew J Bryant Vacuum chuck
US3330714A (en) * 1962-03-08 1967-07-11 Vari Products Co Method of adhering adhesive backed light reflector unit to a mounting surface
US3131476A (en) * 1963-03-21 1964-05-05 Philco Corp Production of semiconductor blanks
DE1982787U (de) * 1968-01-13 1968-04-04 Albert Fezer Vorrichtung zum halten von insbesondere duennwandigen werkstuecken, z. b. duennen blechen, folien od. dgl.
US3681139A (en) * 1969-10-16 1972-08-01 Western Electric Co Method for handling and maintaining the orientation of a matrix of miniature electrical devices
US3740900A (en) * 1970-07-01 1973-06-26 Signetics Corp Vacuum chuck assembly for semiconductor manufacture
US3809050A (en) * 1971-01-13 1974-05-07 Cogar Corp Mounting block for semiconductor wafers

Also Published As

Publication number Publication date
GB1491938A (en) 1977-11-16
NL7404364A (nl) 1975-10-03
JPS50134574A (https=) 1975-10-24
IT1049391B (it) 1981-01-20
FR2266304A1 (https=) 1975-10-24
BE827435A (fr) 1975-10-01
CA1010159A (en) 1977-05-10
CH583969A5 (https=) 1977-01-14
SE7503558L (https=) 1975-10-02
US4009540A (en) 1977-03-01
DE2512400A1 (de) 1975-10-02
FR2266304B1 (https=) 1978-07-13

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Legal Events

Date Code Title Description
D2 Grant after examination
8339 Ceased/non-payment of the annual fee