DE2349545A1 - Halbleiterdiode - Google Patents

Halbleiterdiode

Info

Publication number
DE2349545A1
DE2349545A1 DE19732349545 DE2349545A DE2349545A1 DE 2349545 A1 DE2349545 A1 DE 2349545A1 DE 19732349545 DE19732349545 DE 19732349545 DE 2349545 A DE2349545 A DE 2349545A DE 2349545 A1 DE2349545 A1 DE 2349545A1
Authority
DE
Germany
Prior art keywords
diode
stack
anode
cathode
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19732349545
Other languages
German (de)
English (en)
Inventor
Isamu Kimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE2349545A1 publication Critical patent/DE2349545A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE19732349545 1972-10-04 1973-10-02 Halbleiterdiode Pending DE2349545A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1972114649U JPS4970858U (https=) 1972-10-04 1972-10-04

Publications (1)

Publication Number Publication Date
DE2349545A1 true DE2349545A1 (de) 1974-04-18

Family

ID=28345472

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19732349545 Pending DE2349545A1 (de) 1972-10-04 1973-10-02 Halbleiterdiode

Country Status (2)

Country Link
JP (1) JPS4970858U (https=)
DE (1) DE2349545A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2321192A1 (fr) * 1975-08-14 1977-03-11 Gen Instrument Corp Semiconducteur passive et en capsule et procede pour le former
DE3415446A1 (de) * 1983-04-25 1984-10-25 Mitsubishi Denki K.K., Tokio/Tokyo Gegossene harz-halbleitervorrichtung

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2321192A1 (fr) * 1975-08-14 1977-03-11 Gen Instrument Corp Semiconducteur passive et en capsule et procede pour le former
DE3415446A1 (de) * 1983-04-25 1984-10-25 Mitsubishi Denki K.K., Tokio/Tokyo Gegossene harz-halbleitervorrichtung
US4849803A (en) * 1983-04-25 1989-07-18 Mitsubishi Denki Kabushiki Kaisha Molded resin semiconductor device

Also Published As

Publication number Publication date
JPS4970858U (https=) 1974-06-20

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