DE2315714A1 - Mikrominiaturisierte schaltungsanordnung - Google Patents

Mikrominiaturisierte schaltungsanordnung

Info

Publication number
DE2315714A1
DE2315714A1 DE2315714A DE2315714A DE2315714A1 DE 2315714 A1 DE2315714 A1 DE 2315714A1 DE 2315714 A DE2315714 A DE 2315714A DE 2315714 A DE2315714 A DE 2315714A DE 2315714 A1 DE2315714 A1 DE 2315714A1
Authority
DE
Germany
Prior art keywords
binder
circuit arrangement
parts
arrangement according
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE2315714A
Other languages
German (de)
English (en)
Inventor
Orest Bilous
Henry Hirsch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of DE2315714A1 publication Critical patent/DE2315714A1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Adhesives Or Adhesive Processes (AREA)
  • Epoxy Resins (AREA)
  • Die Bonding (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE2315714A 1972-05-31 1973-03-29 Mikrominiaturisierte schaltungsanordnung Pending DE2315714A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25816772A 1972-05-31 1972-05-31

Publications (1)

Publication Number Publication Date
DE2315714A1 true DE2315714A1 (de) 1973-12-20

Family

ID=22979383

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2315714A Pending DE2315714A1 (de) 1972-05-31 1973-03-29 Mikrominiaturisierte schaltungsanordnung

Country Status (5)

Country Link
JP (1) JPS521738B2 (https=)
DE (1) DE2315714A1 (https=)
FR (1) FR2186732A1 (https=)
GB (1) GB1419163A (https=)
IT (1) IT981202B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS584842B2 (ja) * 1975-01-06 1983-01-28 日本電信電話株式会社 機械「ろ」波器用変換子の製造方法
JPS5321771A (en) * 1976-08-11 1978-02-28 Sharp Kk Electronic parts mounting structure
JPS5491178A (en) * 1977-12-28 1979-07-19 Fujitsu Ltd Mounting method of semiconductor device
JPS5491180A (en) * 1977-12-28 1979-07-19 Fujitsu Ltd Mounting method of semiconductor device
JPS54121673A (en) * 1978-03-15 1979-09-20 Hitachi Ltd Insulator coating material and semiconductor device using the said material
JPS5582125A (en) * 1978-12-19 1980-06-20 Dainippon Toryo Co Ltd Preparation of resin particle
GB2097998B (en) * 1981-05-06 1985-05-30 Standard Telephones Cables Ltd Mounting of integrated circuits
US4630172A (en) * 1983-03-09 1986-12-16 Printed Circuits International Semiconductor chip carrier package with a heat sink

Also Published As

Publication number Publication date
FR2186732A1 (https=) 1974-01-11
IT981202B (it) 1974-10-10
JPS4931747A (https=) 1974-03-22
GB1419163A (en) 1975-12-24
JPS521738B2 (https=) 1977-01-18

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Legal Events

Date Code Title Description
OHJ Non-payment of the annual fee