DE2311736A1 - Verfahren zur herstellung bedruckter leiterplatten - Google Patents
Verfahren zur herstellung bedruckter leiterplattenInfo
- Publication number
- DE2311736A1 DE2311736A1 DE19732311736 DE2311736A DE2311736A1 DE 2311736 A1 DE2311736 A1 DE 2311736A1 DE 19732311736 DE19732311736 DE 19732311736 DE 2311736 A DE2311736 A DE 2311736A DE 2311736 A1 DE2311736 A1 DE 2311736A1
- Authority
- DE
- Germany
- Prior art keywords
- holes
- conductive
- circuit boards
- printed circuit
- carrier plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000000034 method Methods 0.000 claims description 28
- 239000004020 conductor Substances 0.000 claims description 21
- 230000008569 process Effects 0.000 claims description 17
- 239000000126 substance Substances 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 7
- 239000011888 foil Substances 0.000 claims description 7
- 238000001465 metallisation Methods 0.000 claims description 3
- 239000007858 starting material Substances 0.000 claims description 3
- 230000009471 action Effects 0.000 claims description 2
- 238000009826 distribution Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 7
- 238000007639 printing Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000005234 chemical deposition Methods 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000010019 resist printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19732311736 DE2311736A1 (de) | 1973-03-06 | 1973-03-06 | Verfahren zur herstellung bedruckter leiterplatten |
| HUBE001192 HU168595B (enrdf_load_stackoverflow) | 1973-03-06 | 1974-02-28 | |
| FR7407121A FR2220964B3 (enrdf_load_stackoverflow) | 1973-03-06 | 1974-03-01 | |
| DD17691774A DD110142A1 (enrdf_load_stackoverflow) | 1973-03-06 | 1974-03-04 | |
| GB990474A GB1441526A (en) | 1973-03-06 | 1974-03-05 | Printed circuit plates |
| JP2612574A JPS5026067A (enrdf_load_stackoverflow) | 1973-03-06 | 1974-03-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19732311736 DE2311736A1 (de) | 1973-03-06 | 1973-03-06 | Verfahren zur herstellung bedruckter leiterplatten |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE2311736A1 true DE2311736A1 (de) | 1975-03-27 |
Family
ID=5874285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19732311736 Pending DE2311736A1 (de) | 1973-03-06 | 1973-03-06 | Verfahren zur herstellung bedruckter leiterplatten |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS5026067A (enrdf_load_stackoverflow) |
| DD (1) | DD110142A1 (enrdf_load_stackoverflow) |
| DE (1) | DE2311736A1 (enrdf_load_stackoverflow) |
| FR (1) | FR2220964B3 (enrdf_load_stackoverflow) |
| GB (1) | GB1441526A (enrdf_load_stackoverflow) |
| HU (1) | HU168595B (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5354775A (en) * | 1976-10-28 | 1978-05-18 | Seiko Instr & Electronics | Through hole processing method of circuit plate |
| US4313262A (en) * | 1979-12-17 | 1982-02-02 | General Electric Company | Molybdenum substrate thick film circuit |
| JPS57120398A (en) * | 1981-01-19 | 1982-07-27 | Sanyo Electric Co | Method of connecting both-side printed foil of both-side printed circuit board |
| DE3429236A1 (de) * | 1984-08-08 | 1986-02-13 | Krone Gmbh, 1000 Berlin | Folie mit beidseitig aufgedruckten elektrischen leiterbahnen |
| JP2636537B2 (ja) * | 1991-04-08 | 1997-07-30 | 日本電気株式会社 | プリント配線板の製造方法 |
-
1973
- 1973-03-06 DE DE19732311736 patent/DE2311736A1/de active Pending
-
1974
- 1974-02-28 HU HUBE001192 patent/HU168595B/hu unknown
- 1974-03-01 FR FR7407121A patent/FR2220964B3/fr not_active Expired
- 1974-03-04 DD DD17691774A patent/DD110142A1/xx unknown
- 1974-03-05 GB GB990474A patent/GB1441526A/en not_active Expired
- 1974-03-06 JP JP2612574A patent/JPS5026067A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| FR2220964A1 (enrdf_load_stackoverflow) | 1974-10-04 |
| HU168595B (enrdf_load_stackoverflow) | 1976-06-28 |
| FR2220964B3 (enrdf_load_stackoverflow) | 1976-03-12 |
| DD110142A1 (enrdf_load_stackoverflow) | 1974-12-05 |
| GB1441526A (en) | 1976-07-07 |
| JPS5026067A (enrdf_load_stackoverflow) | 1975-03-18 |
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