DE2304412A1 - Feuchtedichte umhuellung fuer elektrische bauelemente oder bauelementekombinationen - Google Patents
Feuchtedichte umhuellung fuer elektrische bauelemente oder bauelementekombinationenInfo
- Publication number
- DE2304412A1 DE2304412A1 DE2304412A DE2304412A DE2304412A1 DE 2304412 A1 DE2304412 A1 DE 2304412A1 DE 2304412 A DE2304412 A DE 2304412A DE 2304412 A DE2304412 A DE 2304412A DE 2304412 A1 DE2304412 A1 DE 2304412A1
- Authority
- DE
- Germany
- Prior art keywords
- components
- component combinations
- moisture
- plastic film
- potting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004382 potting Methods 0.000 claims description 23
- 239000002985 plastic film Substances 0.000 claims description 18
- 229920006255 plastic film Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 8
- 238000005266 casting Methods 0.000 claims description 5
- 229920001169 thermoplastic Polymers 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 125000006850 spacer group Chemical group 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims 1
- -1 polyethylene Polymers 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3157—Partial encapsulation or coating
- H01L23/3164—Partial encapsulation or coating the coating being a foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1311—Foil encapsulation, e.g. of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1322—Encapsulation comprising more than one layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Casings For Electric Apparatus (AREA)
- Details Of Resistors (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Installation Of Indoor Wiring (AREA)
- Cable Accessories (AREA)
Priority Applications (20)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2304412A DE2304412A1 (de) | 1973-01-30 | 1973-01-30 | Feuchtedichte umhuellung fuer elektrische bauelemente oder bauelementekombinationen |
LU68391A LU68391A1 (ja) | 1973-01-30 | 1973-09-10 | |
AT869073A AT327345B (de) | 1973-01-30 | 1973-10-11 | Verfahren zur herstellung einer feuchtedichten umhullung fur elektrische bauelemente oder bauelementekombinationen |
GB5554773A GB1418949A (en) | 1973-01-30 | 1973-11-30 | Electrical component assemblies |
AU63520/73A AU6352073A (en) | 1973-01-30 | 1973-12-12 | Electrical component assemblies |
NL7317195A NL7317195A (ja) | 1973-01-30 | 1973-12-14 | |
BR9911/73A BR7309911D0 (pt) | 1973-01-30 | 1973-12-18 | Envoltorio a prova de unidade para elementos de construcacao eletricos ou combinacoes dos mesmos e pprocesso para sua fabricacao |
SE7400046A SE385757B (sv) | 1973-01-30 | 1974-01-03 | Fukttett holje for elektriska komponenter samt forfarande for framstellning av ett dylikt fukttett holje |
ZA740310A ZA74310B (en) | 1973-01-30 | 1974-01-16 | Improvements in or relating to electrical component assemblies |
CH85774A CH562512A5 (ja) | 1973-01-30 | 1974-01-22 | |
DD176196A DD109475A5 (ja) | 1973-01-30 | 1974-01-25 | |
IT19802/74A IT1006156B (it) | 1973-01-30 | 1974-01-25 | Involucro a tenuta di umidita per componenti elettrici o combinazioni di componenti elettrici |
SU1997125A SU528892A3 (ru) | 1973-01-30 | 1974-01-29 | Способ герметизации электрических деталей с однонаправленными выводами |
ES422705A ES422705A1 (es) | 1973-01-30 | 1974-01-29 | Perfeccionamientos en envueltas estancas a la humedad para componentes electricos. |
ES422706A ES422706A1 (es) | 1973-01-30 | 1974-01-29 | Procedimiento para la fabricacion de una envuelta estanca ala humedad para componentes electricos. |
FR7402874A FR2215780B1 (ja) | 1973-01-30 | 1974-01-29 | |
JP49011926A JPS49105161A (ja) | 1973-01-30 | 1974-01-30 | |
CS632A CS170484B2 (ja) | 1973-01-30 | 1974-01-30 | |
BE140354A BE810374A (fr) | 1973-01-30 | 1974-01-30 | Enveloppe etanche a l'humidite pour composants ou combinaisons de composants electriques |
DE19752535173 DE2535173A1 (de) | 1973-01-30 | 1975-08-06 | Verfahren zum herstellen einer feuchtedichten umhuellung fuer elektrische bauelemente oder bauelementekombinationen |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2304412A DE2304412A1 (de) | 1973-01-30 | 1973-01-30 | Feuchtedichte umhuellung fuer elektrische bauelemente oder bauelementekombinationen |
Publications (1)
Publication Number | Publication Date |
---|---|
DE2304412A1 true DE2304412A1 (de) | 1974-08-01 |
Family
ID=5870335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2304412A Pending DE2304412A1 (de) | 1973-01-30 | 1973-01-30 | Feuchtedichte umhuellung fuer elektrische bauelemente oder bauelementekombinationen |
Country Status (18)
Country | Link |
---|---|
JP (1) | JPS49105161A (ja) |
AT (1) | AT327345B (ja) |
AU (1) | AU6352073A (ja) |
BE (1) | BE810374A (ja) |
BR (1) | BR7309911D0 (ja) |
CH (1) | CH562512A5 (ja) |
CS (1) | CS170484B2 (ja) |
DD (1) | DD109475A5 (ja) |
DE (1) | DE2304412A1 (ja) |
ES (2) | ES422705A1 (ja) |
FR (1) | FR2215780B1 (ja) |
GB (1) | GB1418949A (ja) |
IT (1) | IT1006156B (ja) |
LU (1) | LU68391A1 (ja) |
NL (1) | NL7317195A (ja) |
SE (1) | SE385757B (ja) |
SU (1) | SU528892A3 (ja) |
ZA (1) | ZA74310B (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2750357A1 (de) * | 1976-11-09 | 1978-05-11 | Minnesota Mining & Mfg | Material zur herstellung von schutzumhuellungen fuer elektronische bauteile |
DE2830472A1 (de) * | 1978-07-11 | 1980-01-24 | Siemens Ag | Verfahren zum serienmaessigen umhuellen elektrischer bauelemente, insbesondere kondensatoren |
DE3216192A1 (de) * | 1982-04-30 | 1983-11-03 | Siemens AG, 1000 Berlin und 8000 München | Elektrisches bauelement, das zentriert und justiert in einem gehaeuse untergebracht ist |
DE3346896A1 (de) * | 1983-12-23 | 1985-07-11 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum schutz von anzeigeelementen und mit diesen verbundenen schaltungen vor stoerungen durch elektrostatische entladungen |
DE3624852A1 (de) * | 1986-01-10 | 1987-07-16 | Orga Druck Gmbh | Elektronische daten- und/oder programmtraeger und verfahren zu seiner herstellung |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE20011590U1 (de) * | 2000-07-03 | 2000-09-07 | Infineon Technologies AG, 81541 München | Halbleiterchip-Modul mit Schutzfolie |
EP2293657A1 (en) * | 2009-08-24 | 2011-03-09 | Schreiner Group GmbH & Co. KG | Electronic component and method of forming an electronic component |
US10834827B2 (en) | 2017-09-14 | 2020-11-10 | HELLA GmbH & Co. KGaA | System for potting components using a cap |
-
1973
- 1973-01-30 DE DE2304412A patent/DE2304412A1/de active Pending
- 1973-09-10 LU LU68391A patent/LU68391A1/xx unknown
- 1973-10-11 AT AT869073A patent/AT327345B/de not_active IP Right Cessation
- 1973-11-30 GB GB5554773A patent/GB1418949A/en not_active Expired
- 1973-12-12 AU AU63520/73A patent/AU6352073A/en not_active Expired
- 1973-12-14 NL NL7317195A patent/NL7317195A/xx unknown
- 1973-12-18 BR BR9911/73A patent/BR7309911D0/pt unknown
-
1974
- 1974-01-03 SE SE7400046A patent/SE385757B/xx unknown
- 1974-01-16 ZA ZA740310A patent/ZA74310B/xx unknown
- 1974-01-22 CH CH85774A patent/CH562512A5/xx not_active IP Right Cessation
- 1974-01-25 DD DD176196A patent/DD109475A5/xx unknown
- 1974-01-25 IT IT19802/74A patent/IT1006156B/it active
- 1974-01-29 SU SU1997125A patent/SU528892A3/ru active
- 1974-01-29 FR FR7402874A patent/FR2215780B1/fr not_active Expired
- 1974-01-29 ES ES422705A patent/ES422705A1/es not_active Expired
- 1974-01-29 ES ES422706A patent/ES422706A1/es not_active Expired
- 1974-01-30 CS CS632A patent/CS170484B2/cs unknown
- 1974-01-30 JP JP49011926A patent/JPS49105161A/ja active Pending
- 1974-01-30 BE BE140354A patent/BE810374A/xx unknown
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2750357A1 (de) * | 1976-11-09 | 1978-05-11 | Minnesota Mining & Mfg | Material zur herstellung von schutzumhuellungen fuer elektronische bauteile |
DE2830472A1 (de) * | 1978-07-11 | 1980-01-24 | Siemens Ag | Verfahren zum serienmaessigen umhuellen elektrischer bauelemente, insbesondere kondensatoren |
DE3216192A1 (de) * | 1982-04-30 | 1983-11-03 | Siemens AG, 1000 Berlin und 8000 München | Elektrisches bauelement, das zentriert und justiert in einem gehaeuse untergebracht ist |
DE3346896A1 (de) * | 1983-12-23 | 1985-07-11 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum schutz von anzeigeelementen und mit diesen verbundenen schaltungen vor stoerungen durch elektrostatische entladungen |
DE3624852A1 (de) * | 1986-01-10 | 1987-07-16 | Orga Druck Gmbh | Elektronische daten- und/oder programmtraeger und verfahren zu seiner herstellung |
Also Published As
Publication number | Publication date |
---|---|
DD109475A5 (ja) | 1974-11-05 |
ZA74310B (en) | 1974-11-27 |
CH562512A5 (ja) | 1975-05-30 |
IT1006156B (it) | 1976-09-30 |
BE810374A (fr) | 1974-05-16 |
ATA869073A (de) | 1975-04-15 |
GB1418949A (en) | 1975-12-24 |
LU68391A1 (ja) | 1973-11-22 |
SU528892A3 (ru) | 1976-09-15 |
ES422706A1 (es) | 1976-04-16 |
CS170484B2 (ja) | 1976-08-27 |
NL7317195A (ja) | 1974-08-01 |
SE385757B (sv) | 1976-07-19 |
AU6352073A (en) | 1975-06-12 |
BR7309911D0 (pt) | 1974-10-22 |
JPS49105161A (ja) | 1974-10-04 |
AT327345B (de) | 1976-01-26 |
FR2215780A1 (ja) | 1974-08-23 |
ES422705A1 (es) | 1976-04-16 |
FR2215780B1 (ja) | 1977-09-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OHW | Rejection |