DE202008016722U1 - Device with a substrate and at least one bonding pad - Google Patents

Device with a substrate and at least one bonding pad Download PDF

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Publication number
DE202008016722U1
DE202008016722U1 DE202008016722U DE202008016722U DE202008016722U1 DE 202008016722 U1 DE202008016722 U1 DE 202008016722U1 DE 202008016722 U DE202008016722 U DE 202008016722U DE 202008016722 U DE202008016722 U DE 202008016722U DE 202008016722 U1 DE202008016722 U1 DE 202008016722U1
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Prior art keywords
substrate
coating
bondpad
bonding
bonding pad
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Expired - Lifetime
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DE202008016722U
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German (de)
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Robert Bosch GmbH
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Robert Bosch GmbH
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Priority to DE202008016722U priority Critical patent/DE202008016722U1/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

Vorrichtung mit einem Substrat (10) und zumindest einem Bondpad (11) auf dem Substrat (10), wobei eine Beschichtung (13) auf dem Substrat (10) angeordnet ist, wobei die Beschichtung (13) einen Rand (15) des Bondpads (11) überlappt, wobei ein Bonddraht (19) mittels einer Schweißverbindung (22) auf dem Bondpad (11) befestigt ist, dadurch gekennzeichnet, dass die Beschichtung dazu geeignet ist, auf das Bondpad (11) einwirkende Schwingungen eines Bondwerkzeugs zu dämpfen.contraption with a substrate (10) and at least one bonding pad (11) on the Substrate (10), wherein a coating (13) on the substrate (10) is arranged, wherein the coating (13) has an edge (15) of the Bonding pads (11) overlaps, wherein a bonding wire (19) by means of a welded joint (22) on the bonding pad (11) attached is, characterized in that the coating suitable is, on the bondpad (11) acting vibrations of a bonding tool to dampen.

Figure 00000001
Figure 00000001

Description

Stand der TechnikState of the art

Aus der US-amerikanischen Veröffentlichung US 2002/0074667 A1 ist eine Vorrichtung mit einem Substrat bekannt, auf dem mehrere Bondpads angeordnet sind. Ein Schutzfilm überlagert die Bondpads und auf den Bondpads sind Bonddrähte bzw. Drahtbonds befestigt. Es wurde festgestellt, dass durch das Befestigen der Drahtbonds mittels Ultraschallschwinger (Ultraschallschweißen) diese auf die Bondpads derart einwirken, dass die Metallisierungen bzw. Bondpads mitschwingen. Nachteilig ist hierbei, dass durch dieses Mitschwingen die Verbindung zwischen dem Bonddraht und dem Bondpad beeinträchtigt wird.From the US publication US 2002/0074667 A1 a device with a substrate is known, on which a plurality of bond pads are arranged. A protective film overlays the bond pads and bonding wires or wire bonds are attached to the bond pads. It has been found that by attaching the wire bonds by means of ultrasonic vibration (ultrasonic welding), these act on the bond pads in such a way that the metallizations or bond pads resonate. The disadvantage here is that the connection between the bonding wire and the bonding pad is affected by this resonant.

Offenbarung der ErfindungDisclosure of the invention

Durch die Merkmale des Anspruchs 1 ist eine Vorrichtung geschaffen, bei der die in der Metallisierung erzeugten Schwingungen gedämpft werden und demzufolge die elektrische Verbindung zwischen dem Bonddraht und der Metallisierung verbessert ist. Während bei bisherigem herkömmlichem Prozess zur Verminderung der Schwingungseinwirkung die Fläche der Bondpads verhältnismäßig groß gewählt wurde, kann durch die neue Technik die Metallisierung der Bondpads kleiner gewählt werden, ohne dass der Bondprozess beeinträchtigt wird. Es können höhere Scherwerte und breitere Bondfenster erzielt werden.By the features of claim 1, a device is provided in which dampens the vibrations generated in the metallization and consequently the electrical connection between the bonding wire and the metallization is improved. While in previous conventional process for reducing the vibration effect the area of bond pads relatively Great has been chosen, through the new technology the metallization of the bond pads are chosen smaller, without affecting the bonding process. It can be higher Shear values and wider bond windows can be achieved.

Kurze Beschreibung der ZeichnungShort description of the drawing

Die Erfindung wird anhand der Figur erläutert.The Invention will be explained with reference to the figure.

Die Figur zeigt einen Querschnitt durch ein Substrat mit einer Metallisierung.The Figure shows a cross section through a substrate with a metallization.

Ausführungsform der ErfindungEmbodiment of invention

In der Figur ist der Querschnitt durch ein Substrat 10 gezeigt, auf dem zumindest ein Bondpad 11 aufgebracht und damit befestigt ist. Auf dem Substrat 10 ist des Weiteren eine Beschichtung 13 aufgebracht und angeordnet, die einen Rand 15 des Bondpads 11 überlappt. Zwischen den Bereichen, in denen die Beschichtung 13 das Bondpad 11 überlappt, ist ein Freiraum ausgespart, so dass eine Oberfläche 16 des Bondpads 11 für eine Verbindung mit einem Bonddraht 19 zur Verfügung steht. Dieser Bonddraht 19 ist mittels eins Schweißverbindung 22 auf dem Bondpad 11 befestigt. Der Bonddraht 19 ist mittels einer Ultraschallschweißverbindung auf den Bondpad 11 angebracht. Diese Ultraschallschwingungen, die somit auch auf das Bondpad 11 übertragen werden, werden durch die Beschichtung 13 gedämpft. Es ist vorgesehen, dass die Beschichtung 13 ein Lötstoppmittel ist. Das Substrat kann beispielsweise als Leiterplatte ausgeführt sein.In the figure, the cross section is through a substrate 10 shown on the at least one bondpad 11 applied and thus secured. On the substrate 10 is further a coating 13 applied and arranged, the one edge 15 of the bondpad 11 overlaps. Between the areas where the coating 13 the bondpad 11 overlaps, a space is recessed, leaving a surface 16 of the bondpad 11 for a connection with a bonding wire 19 is available. This bonding wire 19 is by means of a welded joint 22 on the bondpad 11 attached. The bonding wire 19 is by means of an ultrasonic welding connection on the bondpad 11 appropriate. These ultrasonic vibrations, which also affect the bondpad 11 Be transferred through the coating 13 attenuated. It is envisaged that the coating 13 is a solder stopper. The substrate may be designed, for example, as a printed circuit board.

ZITATE ENTHALTEN IN DER BESCHREIBUNGQUOTES INCLUDE IN THE DESCRIPTION

Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Zitierte PatentliteraturCited patent literature

  • - US 2002/0074667 A1 [0001] US 2002/0074667 A1 [0001]

Claims (2)

Vorrichtung mit einem Substrat (10) und zumindest einem Bondpad (11) auf dem Substrat (10), wobei eine Beschichtung (13) auf dem Substrat (10) angeordnet ist, wobei die Beschichtung (13) einen Rand (15) des Bondpads (11) überlappt, wobei ein Bonddraht (19) mittels einer Schweißverbindung (22) auf dem Bondpad (11) befestigt ist, dadurch gekennzeichnet, dass die Beschichtung dazu geeignet ist, auf das Bondpad (11) einwirkende Schwingungen eines Bondwerkzeugs zu dämpfen.Device with a substrate ( 10 ) and at least one bondpad ( 11 ) on the substrate ( 10 ), wherein a coating ( 13 ) on the substrate ( 10 ), the coating ( 13 ) a border ( 15 ) of the bondpad ( 11 ), whereby a bonding wire ( 19 ) by means of a welded connection ( 22 ) on the bondpad ( 11 ), characterized in that the coating is suitable for applying to the bonding pad ( 11 ) dampening acting vibrations of a bonding tool. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, dass die Beschichtung (13) ein Lötstoppmittel ist.Device according to claim 1, characterized in that the coating ( 13 ) is a solder stop agent.
DE202008016722U 2008-12-18 2008-12-18 Device with a substrate and at least one bonding pad Expired - Lifetime DE202008016722U1 (en)

Priority Applications (1)

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DE202008016722U DE202008016722U1 (en) 2008-12-18 2008-12-18 Device with a substrate and at least one bonding pad

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DE202008016722U DE202008016722U1 (en) 2008-12-18 2008-12-18 Device with a substrate and at least one bonding pad

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020074667A1 (en) 2000-12-19 2002-06-20 Hitachi Cable, Ltd. Wiring board, semiconductor device, and process for production of wiring board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020074667A1 (en) 2000-12-19 2002-06-20 Hitachi Cable, Ltd. Wiring board, semiconductor device, and process for production of wiring board

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