DE202005019706U1 - Picture sensor module including substrate, on whose top and bottom surface are fitted two kinds of interconnected electrodes, with chip containing sensor region and several bonding spots on top surface - Google Patents

Picture sensor module including substrate, on whose top and bottom surface are fitted two kinds of interconnected electrodes, with chip containing sensor region and several bonding spots on top surface Download PDF

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Publication number
DE202005019706U1
DE202005019706U1 DE202005019706U DE202005019706U DE202005019706U1 DE 202005019706 U1 DE202005019706 U1 DE 202005019706U1 DE 202005019706 U DE202005019706 U DE 202005019706U DE 202005019706 U DE202005019706 U DE 202005019706U DE 202005019706 U1 DE202005019706 U1 DE 202005019706U1
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Prior art keywords
substrate
electrodes
chip
lens holder
sensor module
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DE202005019706U
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German (de)
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Kingpak Technology Inc
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Kingpak Technology Inc
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

Substrate (40) top side locates first electrodes (56) connected to second electrodes (58) on substrate underside (54). On substrate top side is fitted chip (42) with sensor region (60) and several bonding spots (62), coupled to first electrodes of substrate, whose top side carries adhesive film (46).Lens holder (48) has side wall (63), protective layer (65) and inner thread (67), with side wall glued to top side of substrate by adhesive film. Lens cylinder (50) outer thread (66) is screwed into lens holder inner thread.

Description

Die Erfindung betrifft ein Bildsensormodul.The The invention relates to an image sensor module.

Das in der 1 dargestellte bekannte Bildsensormodul verfügt über ein Substrat 10, einen Chip 20, mehrere Drähte 24, eine Klebeschicht 26, einen Linsenhalter 28 und einen Linsenzylinder 32.That in the 1 shown known image sensor module has a substrate 10 , a chip 20 , several wires 24 , an adhesive layer 26 , a lens holder 28 and a lens barrel 32 ,

Das Substrat 10 verfügt über eine Oberseite 12, auf der mehrere erste Elektroden 16 ausgebildet sind, und eine Unterseite, auf der mehrere zweite Elektroden 18 ausgebildet sind, wobei die ersten und zweiten Elektroden einander entsprechend verbunden sind. Der Chip 20 ist auf der Oberseite 12 des Substrats 10 angeordnet, und er ist mit Bondflecken 22 versehen. Jeder Draht 24 ist elektrisch mit einem Bondfleck 22 der ersten Elektroden 1G verbunden. Die Klebeschicht 26 ist auf die Oberseite 12 des Substrats 10 aufgetragen. Der Linsenhalter 28 ist mit einem Innengewinde 30 ausgebildet, und er ist durch die Klebeschicht 26 auf die Oberseite 12 aufgeklebt. Der Linsenzylinder 32 ist mit einem Außengewinde 34 versehen, das in das Innengewinde 30 des Linsenhalters 28 eingeschraubt ist.The substrate 10 has a top 12 , on which several first electrodes 16 are formed, and a bottom, on which a plurality of second electrodes eighteen are formed, wherein the first and second electrodes are connected to each other accordingly. The chip 20 is on the top 12 of the substrate 10 arranged, and he is with bond pads 22 Mistake. Every wire 24 is electric with a bonding spot 22 the first electrodes 1G connected. The adhesive layer 26 is on the top 12 of the substrate 10 applied. The lens holder 28 is with an internal thread 30 trained, and he is through the adhesive layer 26 on top 12 glued. The lens barrel 32 is with an external thread 34 provided in the internal thread 30 of the lens holder 28 is screwed.

Die Klebeschicht 26 kann aus dem Linsenhalter 28 in den Sensorbereich des Chips 20 fließen, wodurch die Zuverlässigkeit des Moduls abnimmt. Außerdem werden seine Abmessungen größer. Wenn eine Reparatur vorzunehmen ist, sind die Herstellkosten erhöht.The adhesive layer 26 can from the lens holder 28 in the sensor area of the chip 20 flow, reducing the reliability of the module. In addition, its dimensions are larger. If a repair is to be made, the manufacturing costs are increased.

Der Erfindung liegt die Aufgabe zugrunde, ein Bildsensormodul zu schaffen, das billig und zuverlässig herstellbar ist.Of the The invention has for its object to provide an image sensor module, that cheap and reliable can be produced.

Diese Aufgabe ist durch das Bildsensormodul gemäß dem beigefügten Anspruch 1 gelöst.These The object is achieved by the image sensor module according to the appended claim 1 solved.

Die Erfindung wird nachfolgend anhand von durch Figuren veranschaulichten Ausführungsformen näher erläutert.The Invention will now be illustrated by figures embodiments explained in more detail.

1 ist eine schematische Schnittdarstellung eines herkömmlichen Bildsensormoduls. 1 is a schematic sectional view of a conventional image sensor module.

2 und 3 sind schematische Schnittdarstellungen eines jeweiligen Bildsensormoduls gemäß einer ersten bzw. einer zweiten Ausführungsform der Erfindung. 2 and 3 are schematic sectional views of a respective image sensor module according to a first and a second embodiment of the invention.

Die in der 2 dargestellte erste Ausführungsform eines erfindungsgemäßen Bildsensormoduls verfügt über ein Substrat 40, einen Chip 42, Drähte 44, eine Klebeschicht 46, einen Linsenhalter 48 und einen Linsenzylinder 50.The in the 2 illustrated first embodiment of an image sensor module according to the invention has a substrate 40 , a chip 42 , Wires 44 , an adhesive layer 46 , a lens holder 48 and a lens barrel 50 ,

Das Substrat 40 verfügt über eine Oberseite 52, die mit ersten Elektroden 56 versehen ist, und eine Unterseite 54, die mit zweiten Elektroden 58 versehen ist, die entsprechend mit den ersten Elektroden 56 elektrisch verbunden sind.The substrate 40 has a top 52 that with first electrodes 56 is provided, and a bottom 54 that with second electrodes 58 is provided in accordance with the first electrodes 56 are electrically connected.

Der Chip 42 ist auf die Oberseite 52 des Substrats 40 montiert, und er verfügt über einen Sensorbereich 60 und mehrere Bondflecke 62, die auf der Seite des Sensorsbereichs 60 liegen.The chip 42 is on the top 52 of the substrate 40 mounted, and it has a sensor area 60 and several bond spots 62 on the side of the sensor area 60 lie.

Die mehreren Drähte 44 sind elektrisch mit den Bondflecken 62 des Chips 40 und den ersten Elektroden 56 des Substrats 40 verbunden.The multiple wires 44 are electric with the bond pads 62 of the chip 40 and the first electrodes 56 of the substrate 40 connected.

Die Klebeschicht 46 ist auf die Oberseite 52 des Substrats 40 aufgetragen.The adhesive layer 46 is on the top 52 of the substrate 40 applied.

Der Linsenhalter 48 verfügt über eine Seitenwand 63, eine Schutzschicht 65 und ein Innengewinde 67, wobei die Seiten wand 63 durch die Klebeschicht 4G an die Oberseite 52 des Substrats 40 geklebt ist, um den Chip 42 einzuschließen, wobei die Schutzschicht 65 auf dem Sensorbereich 40 des Chips 42 platziert ist, um zu verhindern, dass die Klebeschicht 46 auf den Sensorbereich 60 desselben fließt.The lens holder 48 has a side wall 63 , a protective layer 65 and an internal thread 67 , with the sides wall 63 through the adhesive layer 4G to the top 52 of the substrate 40 is glued to the chip 42 to include, with the protective layer 65 on the sensor area 40 of the chip 42 is placed to prevent the adhesive layer 46 on the sensor area 60 the same flows.

Der Linsenzylinder 50 ist mit einem Außengewinde 66 versehen, das in das Innengewinde 64 des Linsenhalters 48 geschraubt ist.The lens barrel 50 is with an external thread 66 provided in the internal thread 64 of the lens holder 48 screwed.

Die Seitenwand 63 des Linsenhalters 48 und das daran angeklebte Substrat 40 werden abgeschnitten.The side wall 63 of the lens holder 48 and the substrate adhered thereto 40 are cut off.

Die in der 3 dargestellte zweite Ausführungsform eines Bildsensormoduls mit einer Schutzschicht verfügt zusätzlich über eine Rahmenschicht 43, die an der Oberseite 52 des Substrats 40 angebracht ist, wobei zwischen diesem und der Rahmenschicht 43 ein Hohlraum 45 gebildet ist.The in the 3 illustrated second embodiment of an image sensor module with a protective layer additionally has a frame layer 43 at the top 52 of the substrate 40 is attached, between this and the frame layer 43 a cavity 45 is formed.

Der Chip 42 ist an der Oberseite 52 des Substrats 40 montiert, wobei er sich innerhalb des Hohlraums 45 befindet. Der Chip verfügt über einen Sensorbereich 60 und mehrere Bondflecke 62 auf der Seite desselben.The chip 42 is at the top 52 of the substrate 40 mounted, being inside the cavity 45 located. The chip has a sensor area 60 and several bond spots 62 on the same side.

Die mehreren Drähte 44 sind elektrisch mit den Bondflecken 62 des Chips 42 und den ersten Elektroden 56 des Substrats 40 verbunden.The multiple wires 44 are electric with the bond pads 62 of the chip 42 and the first electrodes 56 of the substrate 40 connected.

Im Übrigen gilt das zur ersten Ausführungsform Genannte entsprechend.Otherwise applies that for the first embodiment Named accordingly.

Claims (2)

Bildsensormodul mit: – einem Substrat (40) mit einer Oberseite, die mit ersten Elektroden (56) versehen ist, und einer Unterseite (54), die mit zweiten Elektroden (58) versehen ist, die entsprechend mit den ersten Elektroden elektrisch verbunden sind; – einem auf der Oberseite des Substrats montierten Chip (42) mit einem Sensorbereich (60) und mehreren Bondflecken (62), die auf der Seite des Sensorbereichs liegen; – mehreren Drähten (44), die elektrisch mit den Bondflecken des Chips und den ersten Elektroden des Substrats verbunden sind; – einer Klebeschicht (46), die auf die Oberseite des Substrats aufgetragen ist; – einem Linsenhalter (48) mit einer Seitenwand (63), einer Schutzschicht (65) und einem Innengewinde (67), wobei die Seitenwand des Linsenalters durch die Klebeschicht an die Oberseite des Substrats geklebt ist, wodurch der Chip eingeschlossen ist, wobei die Schutzschicht auf dem Sensorbereich des Chips vorhanden ist, um zu verhindern, dass die Klebeschicht auf diesen Sensorbereich fließt; und – einem Linsenzylinder (50) mit einem Außengewinde (66), das in das Innengewinde des Linsenhalters geschraubt ist.Image sensor module comprising: - a substrate ( 40 ) having a top surface connected to first electrodes ( 56 ), and a bottom ( 54 ), which are connected to second electrodes ( 58 ), which correspondingly electrically connected to the first electrodes; A chip mounted on top of the substrate ( 42 ) with a sensor area ( 60 ) and multiple bond pads ( 62 ) located on the side of the sensor area; - several wires ( 44 ) electrically connected to the bond pads of the chip and the first electrodes of the substrate; An adhesive layer ( 46 ) applied to the top of the substrate; A lens holder ( 48 ) with a side wall ( 63 ), a protective layer ( 65 ) and an internal thread ( 67 with the sidewall of the lens age adhered to the top of the substrate by the adhesive layer, thereby enclosing the chip, the protective layer being present on the sensor area of the chip to prevent the adhesive layer from flowing onto that sensor area; and - a lens barrel ( 50 ) with an external thread ( 66 ), which is screwed into the internal thread of the lens holder. Bildsensormodul nach Anspruch 1, dadurch gekennzeichnet, dass die Oberseite des Substrats (40) mit einer Rahmenschicht (43) versehen ist, wobei die Klebeschicht (46) zwischen die Rahmenschicht und den Chip (42) so aufgetragen ist, dass die Seitenwand (63) des Linsenhalters (48) zwischen der Rahmenschicht und dem Chip angeklebt ist, und wobei die Seitenwand des Linsenhalters und das Substrat abgeschnitten sind, um das Modul zu bilden.Image sensor module according to claim 1, characterized in that the top side of the substrate ( 40 ) with a frame layer ( 43 ), the adhesive layer ( 46 ) between the frame layer and the chip ( 42 ) is applied so that the side wall ( 63 ) of the lens holder ( 48 ) is adhered between the frame layer and the chip, and wherein the side wall of the lens holder and the substrate are cut off to form the module.
DE202005019706U 2005-12-16 2005-12-16 Picture sensor module including substrate, on whose top and bottom surface are fitted two kinds of interconnected electrodes, with chip containing sensor region and several bonding spots on top surface Expired - Lifetime DE202005019706U1 (en)

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DE202005019706U DE202005019706U1 (en) 2005-12-16 2005-12-16 Picture sensor module including substrate, on whose top and bottom surface are fitted two kinds of interconnected electrodes, with chip containing sensor region and several bonding spots on top surface

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DE202005019706U DE202005019706U1 (en) 2005-12-16 2005-12-16 Picture sensor module including substrate, on whose top and bottom surface are fitted two kinds of interconnected electrodes, with chip containing sensor region and several bonding spots on top surface

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009014953A1 (en) * 2007-07-24 2009-01-29 Micro Technology, Inc. Thin semiconductor die packages and associated systems and methods
US10074599B2 (en) 2007-07-24 2018-09-11 Micron Technology, Inc. Semiconductor dies with recesses, associated leadframes, and associated systems and methods

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009014953A1 (en) * 2007-07-24 2009-01-29 Micro Technology, Inc. Thin semiconductor die packages and associated systems and methods
US7816750B2 (en) 2007-07-24 2010-10-19 Aptina Imaging Corporation Thin semiconductor die packages and associated systems and methods
US10074599B2 (en) 2007-07-24 2018-09-11 Micron Technology, Inc. Semiconductor dies with recesses, associated leadframes, and associated systems and methods
US10431531B2 (en) 2007-07-24 2019-10-01 Micron Technology, Inc. Semiconductor dies with recesses, associated leadframes, and associated systems and methods

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