DE202004020315U1 - Cooling device, especially for electronic microprocessor, has second cooling body part for reversible connection to first part for lower thermal transfer resistance and passing heat to cooling medium - Google Patents

Cooling device, especially for electronic microprocessor, has second cooling body part for reversible connection to first part for lower thermal transfer resistance and passing heat to cooling medium Download PDF

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Publication number
DE202004020315U1
DE202004020315U1 DE202004020315U DE202004020315U DE202004020315U1 DE 202004020315 U1 DE202004020315 U1 DE 202004020315U1 DE 202004020315 U DE202004020315 U DE 202004020315U DE 202004020315 U DE202004020315 U DE 202004020315U DE 202004020315 U1 DE202004020315 U1 DE 202004020315U1
Authority
DE
Germany
Prior art keywords
cooling
thermal transfer
transfer resistance
lower thermal
cooling body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE202004020315U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vertiv Corp
Original Assignee
Kermi GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kermi GmbH filed Critical Kermi GmbH
Priority to DE202004020315U priority Critical patent/DE202004020315U1/en
Priority claimed from PCT/DE2004/001361 external-priority patent/WO2005015970A2/en
Publication of DE202004020315U1 publication Critical patent/DE202004020315U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20809—Liquid cooling with phase change within server blades for removing heat from heat source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • F28F7/02—Blocks traversed by passages for heat-exchange media
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00—Fastening; Joining
    • F28F2275/14—Fastening; Joining by using form fitting connection, e.g. with tongue and groove
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The device has a cooling body (7,9) for connection to the component (3) to be cooled so that the heat loss from the component passes via a thermal interface of the component and is transported to the cooling body. The cooling body has a first part (7) for connection to the component and a second part (9) for reversible connection to the fist part to give a lower thermal transfer resistance, whereby at least the major part of the heat loss is given off to a cooling medium by the second part. An independent claim is also included for the following: (A) a rack for accommodating several electronic components, e.g. servers for data processing systems.
DE202004020315U 2004-06-28 2004-06-28 Cooling device, especially for electronic microprocessor, has second cooling body part for reversible connection to first part for lower thermal transfer resistance and passing heat to cooling medium Expired - Lifetime DE202004020315U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE202004020315U DE202004020315U1 (en) 2004-06-28 2004-06-28 Cooling device, especially for electronic microprocessor, has second cooling body part for reversible connection to first part for lower thermal transfer resistance and passing heat to cooling medium

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202004020315U DE202004020315U1 (en) 2004-06-28 2004-06-28 Cooling device, especially for electronic microprocessor, has second cooling body part for reversible connection to first part for lower thermal transfer resistance and passing heat to cooling medium
PCT/DE2004/001361 WO2005015970A2 (en) 2003-07-30 2004-06-28 Cooling device for an electronic component, especially for a microprocessor

Publications (1)

Publication Number Publication Date
DE202004020315U1 true DE202004020315U1 (en) 2005-04-07

Family

ID=34436489

Family Applications (1)

Application Number Title Priority Date Filing Date
DE202004020315U Expired - Lifetime DE202004020315U1 (en) 2004-06-28 2004-06-28 Cooling device, especially for electronic microprocessor, has second cooling body part for reversible connection to first part for lower thermal transfer resistance and passing heat to cooling medium

Country Status (1)

Country Link
DE (1) DE202004020315U1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008008085A2 (en) * 2005-09-30 2008-01-17 Intel Corporation Ic coolant microchannel assembly with integrated attachment hardware
WO2008113603A2 (en) * 2007-03-21 2008-09-25 Rittal Gmbh & Co. Kg Switchgear cabinet or rack with a fluid distribution device
DE102007053090A1 (en) * 2007-11-07 2009-05-20 Rohde & Schwarz Gmbh & Co. Kg Cooling element for electronic components, has cooling rib structure suitable for air cooling, and heat conducting body is provided between components and cooling rib structure
EP2271971A2 (en) * 2008-04-21 2011-01-12 Hardcore Computer, Inc. A case and rack system for liquid submersion cooling of electronic devices connected in an array
DE102011117193A1 (en) * 2011-10-28 2013-05-02 Energie-Technik Welfers GmbH Hood for covering e.g. buffer tank in passive home for heating drinking water, has insulator attached to heat exchanger or heat accumulator of opposite side of hood, and another heat exchanger arranged in hood and comprising thermostat
DE102022128173A1 (en) 2022-10-25 2024-04-25 Giorgio Meloni Cooling module and computer case

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008008085A3 (en) * 2005-09-30 2008-04-17 Intel Corp Ic coolant microchannel assembly with integrated attachment hardware
WO2008008085A2 (en) * 2005-09-30 2008-01-17 Intel Corporation Ic coolant microchannel assembly with integrated attachment hardware
WO2008113603A2 (en) * 2007-03-21 2008-09-25 Rittal Gmbh & Co. Kg Switchgear cabinet or rack with a fluid distribution device
WO2008113603A3 (en) * 2007-03-21 2008-12-11 Rittal Gmbh & Co Kg Switchgear cabinet or rack with a fluid distribution device
DE102007053090B4 (en) * 2007-11-07 2011-12-15 Rohde & Schwarz Gmbh & Co. Kg Heat sink and cooling arrangement for electrical components and method for producing a heat sink and a cooling arrangement for electrical components
DE102007053090A1 (en) * 2007-11-07 2009-05-20 Rohde & Schwarz Gmbh & Co. Kg Cooling element for electronic components, has cooling rib structure suitable for air cooling, and heat conducting body is provided between components and cooling rib structure
US9128681B2 (en) 2008-04-21 2015-09-08 Liquidcool Solutions, Inc. Liquid submersion cooled power supply system
EP2271971A4 (en) * 2008-04-21 2012-08-01 Hardcore Computer Inc A case and rack system for liquid submersion cooling of electronic devices connected in an array
US8467189B2 (en) 2008-04-21 2013-06-18 Liquidcool Solutions, Inc. Case and rack system for liquid submersion cooling of electronic devices connected in an array
US8654529B2 (en) 2008-04-21 2014-02-18 Liquidcool Solutions, Inc. Liquid submersion cooled network electronics
US9086859B2 (en) 2008-04-21 2015-07-21 Liquidcool Solutions, Inc. Liquid submersion cooled electronic system
EP2271971A2 (en) * 2008-04-21 2011-01-12 Hardcore Computer, Inc. A case and rack system for liquid submersion cooling of electronic devices connected in an array
US9176547B2 (en) 2008-04-21 2015-11-03 Liquidcool Solutions, Inc. Liquid submersion cooled data storage or memory system
US9223360B2 (en) 2008-04-21 2015-12-29 Liquidcool Solutions, Inc. Rack mounted liquid submersion cooled electronic system
DE102011117193A1 (en) * 2011-10-28 2013-05-02 Energie-Technik Welfers GmbH Hood for covering e.g. buffer tank in passive home for heating drinking water, has insulator attached to heat exchanger or heat accumulator of opposite side of hood, and another heat exchanger arranged in hood and comprising thermostat
DE102022128173A1 (en) 2022-10-25 2024-04-25 Giorgio Meloni Cooling module and computer case

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20050512

R163 Identified publications notified

Effective date: 20050414

R150 Term of protection extended to 6 years

Effective date: 20070709

R081 Change of applicant/patentee

Owner name: LIEBERT CORP., US

Free format text: FORMER OWNER: KERMI GMBH, 94447 PLATTLING, DE

Effective date: 20080527

R151 Term of protection extended to 8 years

Effective date: 20100714

R152 Term of protection extended to 10 years

Effective date: 20120712

R071 Expiry of right
R071 Expiry of right