DE19850838C2 - Verfahren zum Verbessern der Ätzgleichförmigkeit während eines Naßätzens und Naßätzverfahren - Google Patents
Verfahren zum Verbessern der Ätzgleichförmigkeit während eines Naßätzens und NaßätzverfahrenInfo
- Publication number
- DE19850838C2 DE19850838C2 DE19850838A DE19850838A DE19850838C2 DE 19850838 C2 DE19850838 C2 DE 19850838C2 DE 19850838 A DE19850838 A DE 19850838A DE 19850838 A DE19850838 A DE 19850838A DE 19850838 C2 DE19850838 C2 DE 19850838C2
- Authority
- DE
- Germany
- Prior art keywords
- layer
- wafer
- etching
- speed
- wet etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 46
- 238000001039 wet etching Methods 0.000 title claims description 19
- 238000005530 etching Methods 0.000 claims description 42
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 23
- 239000004065 semiconductor Substances 0.000 claims description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 8
- 239000005388 borosilicate glass Substances 0.000 claims description 8
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000005368 silicate glass Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical compound [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 claims 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- GDFCWFBWQUEQIJ-UHFFFAOYSA-N [B].[P] Chemical compound [B].[P] GDFCWFBWQUEQIJ-UHFFFAOYSA-N 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000004323 potassium nitrate Substances 0.000 claims 1
- 235000010333 potassium nitrate Nutrition 0.000 claims 1
- 239000011435 rock Substances 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 24
- 239000010410 layer Substances 0.000 description 10
- 239000007921 spray Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000005380 borophosphosilicate glass Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 206010001497 Agitation Diseases 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 230000009189 diving Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 210000002381 plasma Anatomy 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Weting (AREA)
Description
Claims (11)
Vorsehen eines Halbleiterwafers (10), der eine darauf aus gebildete Schicht aufweist; und
Ausbilden eines Wasserfilms über der Waferoberfläche vor dem Ätzen der Schicht mit einer Säurelösung, wobei zur Ausbildung des Wasserfilms der Wafer (10) mit einer ersten Geschwindigkeit gedreht wird und deionisiertes Wasser zu dem Wafer zugeführt wird,
gekennzeichnet durch
Drehen des Wafers (10) mit einer zweiten Geschwindigkeit, die größer als die erste Geschwindigkeit ist, zur Verdün nung des Wasserfilms zu einem gleichmäßigen Film vor dem Ätzen.
- a) Drehen eines Halbleiterwafers, der eine darauf ausge bildete Schicht aufweist, mit einer ersten Geschwin digkeit;
- b) Zuführen von deionisiertem Wasser zu dem Wafer zur Ausbildung eines Wasserfilms über der Waferoberfläche; gekennzeichnet durch
- c) Drehen des Wafers (10) mit einer zweiten Geschwindig keit, die größer als die erste Geschwindigkeit ist, zur Verdünnung des Wasserfilms zu einem gleichmäßigen Film;
- d) Zuführen einer Säurelösung zu dem Wafer zum Ätzen der Schicht, bevor die Wasserschicht getrocknet ist.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW087115022A TW380284B (en) | 1998-09-09 | 1998-09-09 | Method for improving etching uniformity during a wet etching process |
AT0197098A AT409806B (de) | 1998-09-09 | 1998-11-24 | Verfahren zum verbessern der ätzgleichförmigkeit während eines nassätzens |
Publications (2)
Publication Number | Publication Date |
---|---|
DE19850838A1 DE19850838A1 (de) | 2000-03-23 |
DE19850838C2 true DE19850838C2 (de) | 2002-10-24 |
Family
ID=25597308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19850838A Expired - Lifetime DE19850838C2 (de) | 1998-09-09 | 1998-11-04 | Verfahren zum Verbessern der Ätzgleichförmigkeit während eines Naßätzens und Naßätzverfahren |
Country Status (4)
Country | Link |
---|---|
US (1) | US6123865A (de) |
AT (1) | AT409806B (de) |
DE (1) | DE19850838C2 (de) |
TW (1) | TW380284B (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004037007B4 (de) * | 2003-07-31 | 2010-02-11 | Samsung Electronics Co., Ltd., Suwon | Ätzverfahren zur Herstellung einer Halbleitervorrichtung |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7402467B1 (en) | 1999-03-26 | 2008-07-22 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device |
JP2001033938A (ja) * | 1999-07-22 | 2001-02-09 | Oki Electric Ind Co Ltd | ハーフトーン位相シフトマスクの特性補正方法 |
WO2001024244A1 (en) * | 1999-09-24 | 2001-04-05 | Infineon Technologies North America Corp. | High etch selectivity etchant for doped silicate glass |
US6307240B1 (en) | 2000-12-22 | 2001-10-23 | Visteon Global Technologies, Inc. | Pulsed etching manufacturing method and system |
US6893578B1 (en) * | 2001-12-05 | 2005-05-17 | Sandia Corporation | Selective etchant for oxide sacrificial material in semiconductor device fabrication |
US6787056B2 (en) * | 2002-02-07 | 2004-09-07 | Macronix International Co., Ltd. | Planarization method using anisotropic wet etching |
KR100466297B1 (ko) * | 2002-10-17 | 2005-01-13 | 한국디엔에스 주식회사 | 반도체 제조 장치 |
EP1575089B1 (de) * | 2004-03-09 | 2007-11-14 | Infineon Technologies AG | Hochzuverlässige, kostengünstige und thermisch verbesserte Halbleiterchip-Befestigungstechnologie mit AuSn |
JP4393260B2 (ja) * | 2004-04-20 | 2010-01-06 | 株式会社東芝 | エッチング液管理方法 |
TWI283442B (en) * | 2004-09-09 | 2007-07-01 | Sez Ag | Method for selective etching |
JP5122731B2 (ja) * | 2005-06-01 | 2013-01-16 | 信越半導体株式会社 | 貼り合わせウェーハの製造方法 |
KR20090038972A (ko) * | 2007-10-17 | 2009-04-22 | 삼성전자주식회사 | 콘택홀 형성방법 및 그를 이용한 반도체 메모리소자의제조방법 |
US8153523B2 (en) * | 2008-09-12 | 2012-04-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of etching a layer of a semiconductor device using an etchant layer |
KR101837226B1 (ko) | 2010-12-10 | 2018-03-09 | 티이엘 에프에스아이, 인코포레이티드 | 기판으로부터 질화물을 선택적으로 제거하는 방법 |
US8894877B2 (en) | 2011-10-19 | 2014-11-25 | Lam Research Ag | Method, apparatus and composition for wet etching |
US9017568B2 (en) | 2013-01-22 | 2015-04-28 | Tel Fsi, Inc. | Process for increasing the hydrophilicity of silicon surfaces following HF treatment |
US9698062B2 (en) * | 2013-02-28 | 2017-07-04 | Veeco Precision Surface Processing Llc | System and method for performing a wet etching process |
US10269591B2 (en) * | 2013-10-23 | 2019-04-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of selectively removing silicon nitride and single wafer etching apparatus thereof |
US9562291B2 (en) | 2014-01-14 | 2017-02-07 | Mei, Llc | Metal etch system |
US9870928B2 (en) | 2014-10-31 | 2018-01-16 | Veeco Precision Surface Processing Llc | System and method for updating an arm scan profile through a graphical user interface |
CN107258011A (zh) | 2014-10-31 | 2017-10-17 | 维克精密表面处理有限责任公司 | 执行湿蚀刻工艺的系统和方法 |
TWI738757B (zh) | 2016-04-05 | 2021-09-11 | 美商維克儀器公司 | 經由化學的適應性峰化來控制蝕刻速率的裝置和方法 |
DK3229262T3 (en) | 2016-04-05 | 2018-12-03 | Siltronic Ag | PROCEDURE FOR STEAM PHASE Etching of a Semiconductor Wafer for Trace Metal Analysis |
US10541180B2 (en) | 2017-03-03 | 2020-01-21 | Veeco Precision Surface Processing Llc | Apparatus and method for wafer thinning in advanced packaging applications |
CN109780293A (zh) * | 2018-12-29 | 2019-05-21 | 江苏日托光伏科技股份有限公司 | 一种具有防呆功能的水膜滴液装置 |
US11282739B2 (en) | 2019-12-13 | 2022-03-22 | Globalwafers Co., Ltd. | Methods for removing an oxide film from a SOI structure and methods for preparing a SOI structure |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0444714A1 (de) * | 1987-11-09 | 1991-09-04 | SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung Gesellschaft m.b.H. | Vorrichtung zum Behandeln scheibenförmiger Gegenstände |
US5078832A (en) * | 1989-05-06 | 1992-01-07 | Dainippon Screen Mfg. Co., Ltd. | Method of treating wafer surface |
JPH0476918A (ja) * | 1990-07-18 | 1992-03-11 | Victor Co Of Japan Ltd | ウェハ表面のエピタキシャル成長層のエッチング方法 |
US5633111A (en) * | 1991-11-01 | 1997-05-27 | Fuji Photo Film Co., Ltd. | Photoresist composition and article containing 1,2-quinonediazide and an organic phosphorous acid compound |
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US3630804A (en) * | 1968-08-19 | 1971-12-28 | Chemcut Corp | Etching apparatus |
US3813311A (en) * | 1973-01-24 | 1974-05-28 | Gen Motors Corp | Process for etching silicon wafers |
DE3027934A1 (de) * | 1980-07-23 | 1982-02-25 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur einseitigen aetzung von halbleiterscheiben |
JPS62150350A (ja) * | 1985-12-25 | 1987-07-04 | Hoya Corp | パタ−ン形成方法 |
DE3611387A1 (de) * | 1986-04-04 | 1987-10-15 | Semax Gmbh Prozesstechnik | Anlage und verfahren zur herstellung von integrierten schaltkreisen od. dgl. aus si- oder aus gaas-scheiben od. dgl. |
JPS63237527A (ja) * | 1987-03-26 | 1988-10-04 | Hoya Corp | レジスト剥離方法 |
US5181985A (en) * | 1988-06-01 | 1993-01-26 | Wacker-Chemitronic Gesellschaft Fur Elektronik-Grundstoffe Mbh | Process for the wet-chemical surface treatment of semiconductor wafers |
JP2528962B2 (ja) * | 1989-02-27 | 1996-08-28 | 株式会社日立製作所 | 試料処理方法及び装置 |
EP0408216A3 (en) * | 1989-07-11 | 1991-09-18 | Hitachi, Ltd. | Method for processing wafers and producing semiconductor devices and apparatus for producing the same |
US5279704A (en) * | 1991-04-23 | 1994-01-18 | Honda Giken Kogyo Kabushiki Kaisha | Method of fabricating semiconductor device |
US5488964A (en) * | 1991-05-08 | 1996-02-06 | Tokyo Electron Limited | Washing apparatus, and washing method |
US5275695A (en) * | 1992-12-18 | 1994-01-04 | International Business Machines Corporation | Process for generating beveled edges |
JP3341033B2 (ja) * | 1993-06-22 | 2002-11-05 | 忠弘 大見 | 回転薬液洗浄方法及び洗浄装置 |
JPH07142438A (ja) * | 1993-11-22 | 1995-06-02 | Tadahiro Omi | 洗浄装置、半導体製造装置及び半導体製造ライン |
US5620611A (en) * | 1996-06-06 | 1997-04-15 | International Business Machines Corporation | Method to improve uniformity and reduce excess undercuts during chemical etching in the manufacture of solder pads |
JPH1071375A (ja) * | 1996-07-05 | 1998-03-17 | Toshiba Corp | 洗浄方法 |
-
1998
- 1998-09-09 TW TW087115022A patent/TW380284B/zh not_active IP Right Cessation
- 1998-11-04 DE DE19850838A patent/DE19850838C2/de not_active Expired - Lifetime
- 1998-11-24 AT AT0197098A patent/AT409806B/de not_active IP Right Cessation
- 1998-12-07 US US09/206,642 patent/US6123865A/en not_active Expired - Lifetime
Patent Citations (4)
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EP0444714A1 (de) * | 1987-11-09 | 1991-09-04 | SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung Gesellschaft m.b.H. | Vorrichtung zum Behandeln scheibenförmiger Gegenstände |
US5078832A (en) * | 1989-05-06 | 1992-01-07 | Dainippon Screen Mfg. Co., Ltd. | Method of treating wafer surface |
JPH0476918A (ja) * | 1990-07-18 | 1992-03-11 | Victor Co Of Japan Ltd | ウェハ表面のエピタキシャル成長層のエッチング方法 |
US5633111A (en) * | 1991-11-01 | 1997-05-27 | Fuji Photo Film Co., Ltd. | Photoresist composition and article containing 1,2-quinonediazide and an organic phosphorous acid compound |
Non-Patent Citations (1)
Title |
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JP 61-105847 A, In: Patent Abstracts of Japan * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004037007B4 (de) * | 2003-07-31 | 2010-02-11 | Samsung Electronics Co., Ltd., Suwon | Ätzverfahren zur Herstellung einer Halbleitervorrichtung |
Also Published As
Publication number | Publication date |
---|---|
AT409806B (de) | 2002-11-25 |
DE19850838A1 (de) | 2000-03-23 |
US6123865A (en) | 2000-09-26 |
TW380284B (en) | 2000-01-21 |
ATA197098A (de) | 2002-03-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
OP8 | Request for examination as to paragraph 44 patent law | ||
D2 | Grant after examination | ||
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Owner name: PROMOS TECHNOLOGIES, INC., TW Free format text: FORMER OWNER: MOSEL VITELIC INC., PROMOS TECHNOLOGIES, INC., QIMONDA AG, , TW Owner name: MOSEL VITELIC INC., TW Free format text: FORMER OWNER: MOSEL VITELIC INC., PROMOS TECHNOLOGIES, INC., QIMONDA AG, , TW Owner name: INFINEON TECHNOLOGIES AG, DE Free format text: FORMER OWNER: MOSEL VITELIC INC., PROMOS TECHNOLOGIES, INC., QIMONDA AG, , TW Owner name: PROMOS TECHNOLOGIES, INC., TW Free format text: FORMER OWNERS: MOSEL VITELIC INC., HSINCHU, TW; PROMOS TECHNOLOGIES, INC., HSINCHU, TW; QIMONDA AG, 81739 MUENCHEN, DE Owner name: MOSEL VITELIC INC., TW Free format text: FORMER OWNERS: MOSEL VITELIC INC., HSINCHU, TW; PROMOS TECHNOLOGIES, INC., HSINCHU, TW; QIMONDA AG, 81739 MUENCHEN, DE Owner name: INFINEON TECHNOLOGIES AG, DE Free format text: FORMER OWNERS: MOSEL VITELIC INC., HSINCHU, TW; PROMOS TECHNOLOGIES, INC., HSINCHU, TW; QIMONDA AG, 81739 MUENCHEN, DE |
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