DE19731969A1 - Manufacturing method e.g. for electrical component having conductive structure on thermoplastic carrier substrate, such as chipcard-transponder - Google Patents

Manufacturing method e.g. for electrical component having conductive structure on thermoplastic carrier substrate, such as chipcard-transponder

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Publication number
DE19731969A1
DE19731969A1 DE1997131969 DE19731969A DE19731969A1 DE 19731969 A1 DE19731969 A1 DE 19731969A1 DE 1997131969 DE1997131969 DE 1997131969 DE 19731969 A DE19731969 A DE 19731969A DE 19731969 A1 DE19731969 A1 DE 19731969A1
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DE
Grant status
Application
Patent type
Prior art keywords
electrical component
carrier substrate
aluminum
layer
chipcard
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE1997131969
Other languages
German (de)
Inventor
Josef Mundigl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/40Removing material taking account of the properties of the material involved
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041Printed circuit coils
    • H01F41/042Printed circuit coils by thin film techniques
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00Coils
    • H01F5/003Printed circuit coils
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/36Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha, beta particles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2203/00Materials to be soldered, welded or cut
    • B23K2203/50Inorganic material, e.g. metals, not provided for in B23K2203/02 – B23K2203/26

Abstract

The method manufactures an electric component through providing an electrically insulating carrier substrate, providing at least one aluminium layer (2) on at least one part of one surface of the carrier substrate, and dividing the aluminium layer into electrically mutually separated zones (3,5) by means of laser cutting. An electrical component has at least one electrically insulating carrier substrate and at least one aluminum layer (2), on which are specifically provided conductor paths (3) in the form of a planar coil. The conductor paths have connection zones or lands (6) which have a greater width than the conductor paths (3). More specifically, the thickness of the aluminium layer (2) is 20 mu m up to 50 mu m. The carrier layer used is specifically a thermoplastic plastics material.

Description

Die Erfindung betrifft ein Verfahren zum Herstellen eines elektrischen Bauteils, insbesondere einer leitenden Struktur auf einem vornehmlich thermoplastischen Trägersubstrat, vor zugsweise für die Verwendung bei kontaktlosen Chipkarten- Transpondern. The invention relates to a method for manufacturing an electrical component, in particular a conducting structure on a predominantly thermoplastic backing substrate, preferably before for use in the contactless smart card transponders.

Bei kontaktlosen Chipkarten-Transpondern ist ein integrierter Schaltkreis elektrisch leitend mit einer spulenförmigen An tenne verbunden. With contactless IC cards transponders, an integrated circuit is electrically connected to a coil-shaped antenna At. Es gibt verschiedene Verfahren, um solche Spulen für die Anwendung von kontaktlosen Chipkarten herzu stellen. There are various methods to provide near, for the application of contactless smart cards such coils. Man kennt Additivverfahren, bei denen auf einem iso lierenden Substratträger leitende Pasten über Siebdrucktech nik oder nach MID-Verfahren abgelagert werden. Known additive method in which deposited on a substrate support iso lierenden conductive pastes on Siebdrucktech nik or after MID method. Siebdruckver fahren sind für großtechnische Massenfertigungen zwar kosten günstig, erfüllen jedoch in den meisten Anwendungen nicht die Anforderungen an eine ausreichende Leitfähigkeit bei entspre chendem Druckquerschnitt. go Siebdruckver are for industrial mass production, although inexpensive, but do not meet the requirements for a sufficient conductivity at entspre chendem pressure section in most applications. MID-Verfahren sind anlagen- und verfahrenstechnisch sehr aufwendig und somit für eine Massen fertigung zu teuer. MID process plant and process are technically very complicated and therefore for mass production too expensive.

Weiterhin sind derzeit Drahtwickeltechniken bekannt, nach de nen eine gewickelte Spule auf einem Träger plaziert und dort fixiert wird. Furthermore, wire wrapping techniques are currently known, according to de NEN a wound coil is placed on a support and is fixed there. Dieses Verfahren ist sehr kostengünstig, jedoch ist später die elektrische Verbindung der Spulenenden mit ei nem integrierten Schaltkreis sehr aufwendig. This method is very inexpensive, but the electrical connection of the coil ends with egg nem integrated circuit is very costly later. Der bei der Wicklung der Spule verwendete Lackdraht ist vor der eigentli chen Kontaktierung nämlich abzuisolieren und ggf. zu verzin nen oder mittels spezieller Kontaktierverfahren zu kontaktie ren, wie beispielsweise durch Thermokompression, bei dem ein Isolierlack des Lackdrahts erweicht wird, wobei anschließend Silber und Zinn angeschmolzen wird. The magnet wire used in the winding of the coil is in fact the need to strip off the eigentli surfaces contacting and possibly nen to verzin or by means of special contacting method to PLEASE CONTACT acids, such as, for example, by thermo compression, in which an insulating varnish of the enamel wire is softened, and then fused silver and tin becomes. Dieses Verfahren ist ge prägt durch hohen Verschleiß der zum Löten verwendeten Elek troden und einer schlechten Prozeßstabilität durch die in der Dicke stark schwankenden Lacküberzüge des verwendeten Lack drahts. This method is impressed ge trodes and a poor process stability in the thickness fluctuating surface coatings of the paint used wire by high wear of the Elek used for soldering.

Außerdem werden Subtraktionsverfahren verwendet, wie bei spielsweise die naßchemische, ätztechnische Herstellung von Leiterstrukturen auf einem Substratträger über maskentechni sche oder fotolithographische Prozesses. In addition, subtraction are used as game, the wet chemical, etching technology production of conductor structures on a substrate support via maskentechni specific or photolithographic process. Diese Verfahren sind sehr aufwendig, so daß eine kostengünstige Herstellung von Spulen nicht möglich ist. These processes are very expensive, so that cost-effective production of the coils is not possible. Die weiterhin bekannten Verfahren wie Stanzen oder Prägen von kaschierten Trägersubstraten ge nügen den Anforderungen an die erforderlichen feinen Struk turausbildungen hinsichtlich der jeweiligen Windungsbreite und deren Abstände mit den entsprechenden Toleranzen nicht. The further known methods such as punching or stamping from clad carrier substrates ge nügen the requirements of the required fine structural turausbildungen not with respect to the respective coil width and the distances with the appropriate tolerances.

Es ist daher Aufgabe der Erfindung, ein Verfahren zum Her stellen eines elektrischen Bauteils bereitzustellen, mit dem sich kostengünstig und mit hoher Genauigkeit insbesondere ei ne Spulenantenne für kontaktlose Chipkarten bereitstellen läßt. It is therefore an object of the invention to provide a method for Her provide an electrical component, which can be inexpensively and with high accuracy, in particular egg ne coil antenna for contactless IC cards provide.

Das erfindungsgemäße Verfahren weist hierzu die folgenden Schritte auf: To this end the method of the invention comprises the following steps:

  • - Vorsehen eines elektrisch isolierenden Trägerssubstrats - providing an electrically insulating carrier substrate
  • - Vorsehen wenigstens einer Aluminiumschicht auf wenigstens einem Teil einer Oberfläche des Trägersubstrats, - providing at least one aluminum layer on at least a portion of a surface of the carrier substrate,
  • - Aufteilen der Aluminiumschicht in elektrisch voneinander getrennte Bereiche mittels Laserschneiden. - dividing the aluminum layer into electrically separate areas by means of laser cutting.

Mit dem erfindungsgemäßen Verfahren lassen sich besonders feine Leiterplattenstrukturen herstellen, wobei sich heraus gestellt hat, daß gerade die Verwendung von aluminium kaschiertem Leiterplattenmaterial im Zusammenhang mit der nachfolgenden Bearbeitung durch einen Laser besonders vor teilhaft verwendbar ist. With the inventive method, particularly fine wiring board structures can be prepared, where has been found that precisely the use of aluminum-laminated printed circuit board material in connection with the subsequent processing by a laser is especially before geous usable. So kann beispielsweise auf eine Be schichtung des Leitermaterials vor dem Laserschneiden ver zichtet werden, ohne daß sich Nachteile beim Ausbilden der Leiterbahnen ergeben. So can be dispensed ver for example, a coating loading of the conductor material before the laser cutting, without any disadvantages in forming the conductor tracks result. Weiterhin kann ein Bauteil mit einer Aluminiumleiterbahn einfach durch eine Lötung verbunden wer den, da Aluminium gegenüber den bekannten Leitermaterialien Kupfer, Silber, Nickel, Platin und Zinn eine geringe volumen bezogene Schmelzwärme hat. Furthermore, a component with an aluminum conductor track can be easily connected by soldering who has, as compared to the known aluminum conductor materials copper, silver, nickel, platinum and tin, a low volumetric heat of fusion. Es können auch leitende Klebever bindungen eingesetzt werden. It can also be used conducting Klebever bonds.

Darüber hinaus bietet Aluminium im Vergleich zu den bisher verwendeten Leiterbahnmaterialien auch Vorteile bei eutekti schen Verbindungen oder Schmelzverbindungen wie beispielswei se bei Schweißverfahren, da dessen Schmelztemperatur um Grö ßenordnungen geringer ist. It also provides aluminum compared to the previously used interconnect materials and advantages in eutekti rule connections or melting compounds such beispielswei se for welding process because its melting temperature ßenordnungen to large is lower. Gerade auch bei partiellen thermi schen Verbindungstechniken bietet Aluminium Vorteile gegen über anderen Leiterbahnmaterialien, da es eine geringere Wär meleitfähigkeit hat. Especially in partial thermi rule bonding techniques provides aluminum advantages over other interconnect materials, since it has a lower meleitfähigkeit Were. Dadurch wird Wärme nicht so schnell auf möglicherweise temperaturempfindliche Nachbarbereiche abge leitet. This heat is derived not so fast abge to possibly temperature sensitive neighboring areas.

Außerdem hat sich als besonderer Vorteil herausgestellt, daß sich bei bestimmten Trägermaterialien wie beispielsweise PVC eine geringere Kartenwölbung ergibt, da Aluminium einen Wär meausdehnungskoeffizienten aufweist, der näher an dem ent sprechenden Wert des Trägermaterials liegt, als derjenige der bekannten Leiterbahnmaterialien. In addition, has been found to be particularly advantageous that a lower card vault results in certain carrier materials such as PVC, since aluminum has meausdehnungskoeffizienten a Wär, which is closer to the ent speaking value of the support material, than that of the known conductor materials.

Die vorstehenden Vorteile waren nicht zu erwarten, da sich die Erfindung gegen zahlreiche Vorurteile durchsetzten mußte. The above advantages were not expected, as the invention itself against numerous prejudices had prevailed. Der Fachmann konnte aufgrund der zahlreichen bekannten Nach teile von Aluminium als Leitermaterial nicht davon ausgehen, daß sich Leiterbahnstrukturen und insbesondere Spulen für kontaktlose Chipkarten mit dem erfindungsgemäßen Verfahren erfolgreich herstellen lassen. The expert was able to share not assume that conductor structures and, in particular coils for contactless smart cards can be produced successfully with the inventive method of aluminum as a conductor material due to numerous known after. Der größte Nachteil von Alumi nium besteht nämlich darin, daß sein größerer elektrischer Widerstand eine größere Leiterbahnbreite erforderlich macht, um die erforderlichen Strukturen bereit zustellen. The main disadvantage of Alumi nium is in fact to be that higher electrical resistance makes a greater conductor width required to determine the necessary structures prepared. Der Fach mann konnte deshalb davon ausgehen, daß sich mit dem erfin dungsgemäßen Verfahren lediglich kontaktlose Chipkartenspulen von minderer Qualität herstellen lassen können. The skilled man could therefore be assumed that can be produced only contactless smart cards coils of inferior quality with the OF INVENTION to the invention process. Weiterhin weist Aluminium stets eine Oxidschicht auf, wodurch Nachteile im Hinblick auf die Verarbeitung des Leiterplattenmaterials bei der Herstellung der Spule und beim Einbau und Anschluß in einer Chipkarte erwarten ließen. Furthermore, aluminum is always an oxide layer, whereby disadvantages with regard to the processing of the circuit board material could be expected in the production of the coil and the mounting and connection in a smart card. Schließlich hat Aluminium einen wesentlich geringeren E-Modul als die bekannten Leiter materialien, so daß gerade bei einem Aufbau einer Chipkarte mit einer Antennenspule außerhalb der neutralen Zone die Ge fahr der Kartenwölbung zu erwarten war. Finally, aluminum has been expected a substantially lower modulus of elasticity than the known conductor materials, so that even in a structure of a smart card with an antenna coil outside the neutral zone, the Ge moving the card curvature.

Überraschenderweise überwiegen die eingangs dargelegten Vor teile die vorstehenden Nachteile. Surprisingly outweigh the described at the outset before the above share drawbacks. Die mit dem erfindungsgemä ßen Verfahren hergestellte Spule für eine kontaktlose Chip karte läßt sich auf einfache Weise und besonders genau her stellen. The coil produced with the inventive method SEN for a contactless chip card can be set easily and very accurate ago.

Hierbei können über entsprechende Umlenkeinheiten durch eine einzige Lasereinheit Mehrfachstrukturen erzeugt werden, so daß sich mit einem einzigen Laser mehrere elektrische erfin dungsgemäße Bauteile "parallel" auf einmal herstellen lassen. Here, multiple structures can be produced by corresponding deflection units by a single laser unit, so that can be manufactured at once with a single laser plurality of electrical components OF INVENTION dung proper "parallel". Dadurch wird der Durchsatz in der Produktion erhöht. This increases throughput in production.

Für Bereiche mit feineren Strukturen kann die Intensität des Lasers, sein Focus und/oder die Bewegungsgeschwindigkeit des Lasers modifiziert werden. For areas with finer structures, the intensity of the laser, its focus and / or the movement speed of the laser may be modified.

Von besonderem Vorteil ist eine partielle Aufbringung der Leiterstruktur in denjenigen Bereichen, in denen Leiterbahnen ausgebildet werden müssen. Of particular advantage is a partial application of the conductor structure in those areas where conductor paths need to be trained. Nach dem Laserschneiden entstehen de, nicht benötigte Strukturflächen wie beispielsweise die Spulenmitte brauchen von den elektrisch aktiven Strukturen nur entsprechend isoliert zuwerden, ohne sie komplett zu ent fernen. After laser cutting arise de unneeded structural areas such as the coil center need from the electrically active structures only according isolated zuwerden without completely distant to ent. Eine solche Isolierung kann mit Laserschneiden beson ders einfach erreicht werden, indem die nicht benötigten Be reiche von den benötigten Bereichen abgetrennt werden. Such isolation can easily be achieved with laser cutting special idem, by the loading unneeded rich are separated from the required areas.

Aluminium weist günstige Eigenschaften auf, wie beispielswei se Duktilität, Leiteigenschaften, für die Chipkartenherstel lung maßgebliche Faktoren der Oberfläche usw. und hat zudem den wesentlichen Vorteil gegenüber Kupfer oder Silber, daß das Oberflächenabsorptionsverhalten auch über ein bestimmtes Korrosionsverhalten sehr stabil und homogen ist. Aluminum has favorable properties, such beispielswei se ductility, conduction properties, for Chipkartenherstel development relevant factors of the surface, etc., and also has the significant advantage over copper or silver, that the surface absorption behavior is very stable and homogeneous even on a particular corrosion behavior. Ein Laser schneiden funktioniert mit Kupfer oder Silber ohne eine zu sätzliche homogene Beschichtung mit einem dunklen Lack nicht ausreichend gut. cutting a laser does not work sufficiently well with copper or silver, without an additional to homogeneous coating with a dark coating.

Das erfindungsgemäße elektrische Bauteil hat ein elektrisch isolierendes Trägersubstrat sowie wie wenigstens eine Alumi niumschicht auf wenigstens einem Teil einer Oberfläche des Trägersubstrats, wobei das elektrische Bauteil mit dem erfin dungsgemäßen Verfahren hergestellt ist. The electrical component according to the invention has an electrically insulating carrier substrate as well as at least one Alumi niumschicht on at least a portion of a surface of the carrier substrate, wherein the electrical component is produced by the method to the invention OF INVENTION.

Vorteilhafterweise weist die Aluminiumschicht Leiterbahnen auf, die insbesondere die Form einer planaren Spule haben. Advantageously, the aluminum layer on printed conductors, in particular in the form of a planar coil. Für eine spätere Verbindung der Spule mit weiteren Bauteilen ist es von Vorteil, wenn die Leiterbahnen insbesondere in ih ren Endbereichen Anschlußbereiche aufweisen, die eine größere Breite haben als die Leiterbahnen selbst. For later connection of the coil with other components, it is of advantage if the conductor tracks in particular in the end regions ih ren terminal portions which have a greater width than the conductor tracks themselves.

Die Dicke der Aluminiumschicht beträgt typischerweise 20 Mikrometer bis 50 Mikrometer, wobei auch dünnere und ins besondere dickere Aluminiumschichten denkbar sind. The thickness of the aluminum layer is typically 20 microns to 50 microns, wherein thinner and thicker in particular aluminum layers are also conceivable.

Das Trägersubstrat und insbesondere ein Grundsubstrat kann eine mit einer Aluminiumfolie voll- oder teilflächig kaschierte Trägerfolie aus PVC, PC, ABS, PET, PEN, Polyimid oder FR4 sein. The carrier substrate, in particular a base substrate can be a complete with an aluminum foil or part of the surface laminated carrier film of PVC, PC, ABS, PET, PEN, polyimide or FR4.

Die Erfindung ist in der Zeichnung anhand eines Ausführungs beispiels näher dargestellt. The invention is illustrated example in more detail in the drawing by way of execution.

Fig. 1 zeigt eine erfindungsgemäße Chipkartenspule in der Draufsicht, Fig. 1 shows a chip card coil according to the invention in plan view,

Fig. 2 zeigt ein Detail der Chipkartenspule aus Fig. 1 in vergrößerter Ansicht. Fig. 2 shows a detail of the smart card coil of FIG. 1 in an enlarged view.

Fig. 1 zeigt eine Chipkartenspule 1 in der Draufsicht. Fig. 1 shows a chip card coil 1 in plan view. Wie man in dieser Ansicht besonders gut sieht, hat die Chipkar tenspule 1 eine im wesentlichen rechteckige Außenform. As can be seen particularly well in this view, has the Chipkar tenspule 1 a substantially rectangular outer shape. Die Chipkartenspule 1 hat eine in dieser Ansicht nicht sichtbare Trägerschicht aus PVC, auf die eine dünne Aluminiumschicht 2 in der Stärke von 20 Mikrometern bis 50 Mikrometern aufge bracht ist. The chip card has a coil 1 is not visible in this view, support layer of PVC, is placed up on a thin aluminum layer 2 in the thickness of 20 microns to 50 microns.

Mittels Laserschneiden ist die Aluminiumschicht 2 in zwei elektrisch voneinander getrennte Bereiche aufgeteilt. By laser cutting the aluminum layer is divided into two electrically separate regions. 2 Dabei wird ein Bereich von einer am Rand der Chipkartenspule 1 spi ralenförmig umlaufenden Leiterbahn 3 gebildet, die am besten in Fig. 2 zu sehen ist. Here, a range of a spi ralenförmig circumferential at the edge of the chip card 1 coil conductor 3 is formed, which is best seen in Fig. 2. Die Leiterbahn 3 ist durch die im Verlauf des Laserschneidens entstandenen Schnitte 4 von einem verbleibenden Bereich 5 elektrisch getrennt. The conductor 3 is electrically separated by the incurred in the course of laser cutting sections 4 of a remaining portion. 5 Wie man am be sten in Fig. 2 sieht, weist die Leiterbahn 3 zwei Leiterbah nenden 6 auf, die derartig vergrößert ausgebildet sind, daß ihre Breite in der Draufsicht größer ist als diejenige der Leiterbahnen 3 . As seen in Fig. 2 at the most be, includes the conductor 3 nenden two PCB tracks 6 which are formed is increased such that its width in plan view is larger than that of the conductor tracks 3.

Claims (7)

  1. 1. Verfahren zum Herstellen eines elektrischen Bauteils, das die folgenden Schritte aufweist: 1. A method for manufacturing an electrical component, comprising the steps of:
    • - Vorsehen eines elektrisch isolierenden Trägersubstrats, - providing an electrically insulating carrier substrate,
    • - Vorsehen wenigstens einer Aluminiumschicht ( 2 ) auf we nigstens einem Teil einer Oberfläche des Träger substrats, - providing at least one aluminum layer (2) we nigstens part of a surface of the carrier substrate,
    • - Aufteilen der Aluminiumschicht in elektrisch voneinan der getrennte Bereiche ( 3 , 5 ) mittels Laserschneiden. - dividing the aluminum film in the electrically voneinan separate areas (3, 5) by means of laser cutting.
  2. 2. Elektrisches Bauteil mit einem elektrisch isolierenden Trägersubstrat, mit wenigstens einer Aluminiumschicht ( 2 ) auf wenigstens einem Teil einer Oberfläche des Träger substrats, wobei das elektrische Bauteil mit dem Verfah ren nach Anspruch 1 hergestellt ist. 2. Electrical component is made with an electrically insulating carrier substrate, with at least one aluminum layer (2) on at least a portion of a surface of the carrier substrate, wherein the electrical component with the procedure laid down according to Claim. 1
  3. 3. Elektrisches Bauteil nach Anspruch 2, dadurch gekennzeichnet, daß die Aluminiumschicht ( 2 ) Leiterbahnen ( 3 ) aufweist. 3. Electrical component according to claim 2, characterized in that the aluminum layer (2) conductor tracks (3).
  4. 4. Elektrisches Bauteil nach Anspruch 3, dadurch gekennzeichnet, daß die Leiterbahnen ( 3 ) die Form einer planaren Spule auf weisen. 4. Electrical component according to claim 3, characterized in that the conductor tracks (3) have the form of a planar coil.
  5. 5. Elektrisches Bauteil nach Anspruch 3 oder Anspruch 4, dadurch gekennzeichnet, daß die Leiterbahnen ( 3 ) Anschlußbereiche ( 6 ) aufweisen, die eine größere Breite aufweisen, als die Leiterbahnen ( 3 ). 5. Electrical component according to claim 3 or claim 4, characterized in that the conductor tracks (3) have terminal portions (6) having a greater width than the conductor tracks (3).
  6. 6. Elektrisches Bauteil nach einem der Ansprüche 2 bis 5, dadurch gekennzeichnet, daß die Dicke der Aluminiumschicht ( 2 ) 20 µm bis 50 µm be trägt. 6. Electrical component according to one of claims 2 to 5, characterized in that the thickness of the aluminum layer (2) carries 20 microns to 50 microns be.
  7. 7. Elektrisches Bauteil nach einem der Ansprüche 2 bis 6, dadurch gekennzeichnet, daß die Trägerschicht thermoplastischen Kunststoff aufweist. 7. Electrical component according to one of claims 2 to 6, characterized in that the carrier layer comprises thermoplastic.
DE1997131969 1997-07-24 1997-07-24 Manufacturing method e.g. for electrical component having conductive structure on thermoplastic carrier substrate, such as chipcard-transponder Withdrawn DE19731969A1 (en)

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Cited By (10)

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EP1172760A1 (en) * 2000-06-23 2002-01-16 Toyo Aluminium Kabushiki Kaisha Antenna coil for IC card and manufacturing method thereof
WO2003023705A1 (en) * 2001-09-13 2003-03-20 Alcoa Closure Systems International, Inc. Method of making interactive information closure
EP1308969A1 (en) * 2001-11-06 2003-05-07 Asulab S.A. Inductive microsensor flat formed on a substrate
DE10229168A1 (en) * 2002-06-28 2004-01-29 Infineon Technologies Ag Laminate having a structure formed as an antenna electrically conductive layer
DE10246953A1 (en) * 2002-10-08 2004-04-29 Leopold Kostal Gmbh & Co. Kg Electronic circuitry
US6782601B2 (en) 2001-09-13 2004-08-31 Alcoa Closure Systems International Method of making interactive information closure
EP1628245A1 (en) * 2004-08-17 2006-02-22 Sony DADC Austria AG Package, method for producing a package and a device for producing a package
EP2171797A1 (en) * 2007-07-18 2010-04-07 Times-7 Holdings Limited A panel antenna and method of forming a panel antenna
DE102010011504A1 (en) 2010-03-16 2012-06-14 Mühlbauer Ag Method for manufacturing transponder antenna for radio frequency identification tag for, e.g. debit card, involves fixing metal foil on antenna support layer, contouring antenna structure, and removing residual structure surrounding foil
DE102012010560A1 (en) 2012-05-29 2013-12-05 Mühlbauer Ag Transponder for valuable and security documents such as debit card, has chip module comprising conductor strips that are electrically and/or mechanically contacted with connection pads of antenna at respective contact points

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US4081653A (en) * 1976-12-27 1978-03-28 Western Electric Co., Inc. Removal of thin films from substrates by laser induced explosion
DE4000372A1 (en) * 1990-01-09 1991-07-11 Aei Gmbh Conductive path prodn. on insulating plate - by selectively cutting away conductive coating on insulating base using scanning laser or sand jet
DE4301570A1 (en) * 1992-01-21 1993-07-22 Dale Electronics
DE4431605A1 (en) * 1994-09-05 1996-03-07 Siemens Ag Chip card module for contactless smart cards and process for its preparation

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US4081653A (en) * 1976-12-27 1978-03-28 Western Electric Co., Inc. Removal of thin films from substrates by laser induced explosion
DE4000372A1 (en) * 1990-01-09 1991-07-11 Aei Gmbh Conductive path prodn. on insulating plate - by selectively cutting away conductive coating on insulating base using scanning laser or sand jet
DE4301570A1 (en) * 1992-01-21 1993-07-22 Dale Electronics
DE4431605A1 (en) * 1994-09-05 1996-03-07 Siemens Ag Chip card module for contactless smart cards and process for its preparation

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1477928A1 (en) * 2000-06-23 2004-11-17 Toyo Aluminium Kabushiki Kaisha Antenna coil for IC card and manufacturing method thereof
US6400323B2 (en) 2000-06-23 2002-06-04 Toyo Aluminium Kabushiki Kaisha Antenna coil for IC card and manufacturing method thereof
EP1172760A1 (en) * 2000-06-23 2002-01-16 Toyo Aluminium Kabushiki Kaisha Antenna coil for IC card and manufacturing method thereof
US6782601B2 (en) 2001-09-13 2004-08-31 Alcoa Closure Systems International Method of making interactive information closure
WO2003023705A1 (en) * 2001-09-13 2003-03-20 Alcoa Closure Systems International, Inc. Method of making interactive information closure
EP1308969A1 (en) * 2001-11-06 2003-05-07 Asulab S.A. Inductive microsensor flat formed on a substrate
DE10229168A1 (en) * 2002-06-28 2004-01-29 Infineon Technologies Ag Laminate having a structure formed as an antenna electrically conductive layer
US7254883B2 (en) 2002-06-28 2007-08-14 Infineon Technologies Ag Method for manufacturing a packaging material in the form of a laminate with an electrically conductive layer formed as an antenna structure
DE10246953A1 (en) * 2002-10-08 2004-04-29 Leopold Kostal Gmbh & Co. Kg Electronic circuitry
EP1628245A1 (en) * 2004-08-17 2006-02-22 Sony DADC Austria AG Package, method for producing a package and a device for producing a package
EP2171797A1 (en) * 2007-07-18 2010-04-07 Times-7 Holdings Limited A panel antenna and method of forming a panel antenna
EP2171797A4 (en) * 2007-07-18 2014-07-09 Times 7 Holdings Ltd A panel antenna and method of forming a panel antenna
DE102010011504A1 (en) 2010-03-16 2012-06-14 Mühlbauer Ag Method for manufacturing transponder antenna for radio frequency identification tag for, e.g. debit card, involves fixing metal foil on antenna support layer, contouring antenna structure, and removing residual structure surrounding foil
DE102012010560A1 (en) 2012-05-29 2013-12-05 Mühlbauer Ag Transponder for valuable and security documents such as debit card, has chip module comprising conductor strips that are electrically and/or mechanically contacted with connection pads of antenna at respective contact points

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