DE19723847B4 - Verfahren zur Herstellung einer Chipkarten-Transponderfolie sowie Vorrichtung zur Durchführung des Verfahrens - Google Patents

Verfahren zur Herstellung einer Chipkarten-Transponderfolie sowie Vorrichtung zur Durchführung des Verfahrens Download PDF

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Publication number
DE19723847B4
DE19723847B4 DE19723847A DE19723847A DE19723847B4 DE 19723847 B4 DE19723847 B4 DE 19723847B4 DE 19723847 A DE19723847 A DE 19723847A DE 19723847 A DE19723847 A DE 19723847A DE 19723847 B4 DE19723847 B4 DE 19723847B4
Authority
DE
Germany
Prior art keywords
producing
carrying
chip card
card transponder
transponder film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19723847A
Other languages
English (en)
Other versions
DE19723847A1 (de
Inventor
Katsuhiro Yamaguchi
Thomas Kuhlmann
Harald Schenk
Roger Kochendoerfer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Freudenberg KG
Original Assignee
Carl Freudenberg KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Freudenberg KG filed Critical Carl Freudenberg KG
Priority to DE19723847A priority Critical patent/DE19723847B4/de
Publication of DE19723847A1 publication Critical patent/DE19723847A1/de
Application granted granted Critical
Publication of DE19723847B4 publication Critical patent/DE19723847B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773Antenna details
    • G06K19/07777Antenna details the antenna being of the inductive type
    • G06K19/07779Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • H05K3/064Photoresists
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14Related to the order of processing steps
    • H05K2203/1476Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Credit Cards Or The Like (AREA)
DE19723847A 1996-07-10 1997-06-06 Verfahren zur Herstellung einer Chipkarten-Transponderfolie sowie Vorrichtung zur Durchführung des Verfahrens Expired - Fee Related DE19723847B4 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19723847A DE19723847B4 (de) 1996-07-10 1997-06-06 Verfahren zur Herstellung einer Chipkarten-Transponderfolie sowie Vorrichtung zur Durchführung des Verfahrens

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19627735 1996-07-10
DE19723847A DE19723847B4 (de) 1996-07-10 1997-06-06 Verfahren zur Herstellung einer Chipkarten-Transponderfolie sowie Vorrichtung zur Durchführung des Verfahrens

Publications (2)

Publication Number Publication Date
DE19723847A1 DE19723847A1 (de) 1998-05-20
DE19723847B4 true DE19723847B4 (de) 2005-10-20

Family

ID=7799404

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19723847A Expired - Fee Related DE19723847B4 (de) 1996-07-10 1997-06-06 Verfahren zur Herstellung einer Chipkarten-Transponderfolie sowie Vorrichtung zur Durchführung des Verfahrens

Country Status (1)

Country Link
DE (1) DE19723847B4 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19848716A1 (de) 1998-10-22 2000-04-27 Bielomatik Leuze & Co Vorrichtung und Verfahren zur Bearbeitung einer Bahn, insbesondere eines Transponder-Streifens
FR2802000B1 (fr) * 1999-12-01 2002-03-22 Gemplus Card Int Procede de realisation d'un circuit oscillant accorde et fabrication de dispositifs de radiocommunications de faibles dimensions comprenant un tel circuit
EP1233662A1 (de) * 2001-02-19 2002-08-21 Westvaco Corporation Folie/Tinte-Verbundinduktor
US6782601B2 (en) 2001-09-13 2004-08-31 Alcoa Closure Systems International Method of making interactive information closure
WO2003023705A1 (en) * 2001-09-13 2003-03-20 Alcoa Closure Systems International, Inc. Method of making interactive information closure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1226182B (de) * 1960-11-10 1966-10-06 Siemens Ag Verfahren zur Herstellung von sogenannten gedruckten Schaltungen mit aus Metallfoliebestehenden Leiterzuegen

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1226182B (de) * 1960-11-10 1966-10-06 Siemens Ag Verfahren zur Herstellung von sogenannten gedruckten Schaltungen mit aus Metallfoliebestehenden Leiterzuegen

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Lemme,H., Der Mikrorechner in der Brieftasche, 3.Teil, In: Elektronik 1993, H.26, S.70,71,76-80 *

Also Published As

Publication number Publication date
DE19723847A1 (de) 1998-05-20

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee