DE1952789C3 - Luftdichte Kapselung für elektronische Bauelemente - Google Patents

Luftdichte Kapselung für elektronische Bauelemente

Info

Publication number
DE1952789C3
DE1952789C3 DE1952789A DE1952789A DE1952789C3 DE 1952789 C3 DE1952789 C3 DE 1952789C3 DE 1952789 A DE1952789 A DE 1952789A DE 1952789 A DE1952789 A DE 1952789A DE 1952789 C3 DE1952789 C3 DE 1952789C3
Authority
DE
Germany
Prior art keywords
openings
ceramic
encapsulation
electronic component
ceramic plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE1952789A
Other languages
German (de)
English (en)
Other versions
DE1952789A1 (de
DE1952789B2 (de
Inventor
Takahiko Kodaira Ihochi (Japan)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of DE1952789A1 publication Critical patent/DE1952789A1/de
Publication of DE1952789B2 publication Critical patent/DE1952789B2/de
Application granted granted Critical
Publication of DE1952789C3 publication Critical patent/DE1952789C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/654—Top-view layouts
    • H10W70/655—Fan-out layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Thermistors And Varistors (AREA)
  • Connections Arranged To Contact A Plurality Of Conductors (AREA)
DE1952789A 1968-10-21 1969-10-20 Luftdichte Kapselung für elektronische Bauelemente Expired DE1952789C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP43076079A JPS5128829B1 (https=) 1968-10-21 1968-10-21

Publications (3)

Publication Number Publication Date
DE1952789A1 DE1952789A1 (de) 1970-04-30
DE1952789B2 DE1952789B2 (de) 1971-09-30
DE1952789C3 true DE1952789C3 (de) 1974-04-18

Family

ID=13594790

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1952789A Expired DE1952789C3 (de) 1968-10-21 1969-10-20 Luftdichte Kapselung für elektronische Bauelemente

Country Status (4)

Country Link
JP (1) JPS5128829B1 (https=)
DE (1) DE1952789C3 (https=)
FR (1) FR2023323A1 (https=)
GB (1) GB1277254A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3703280A1 (de) * 1987-02-04 1988-08-18 Licentia Gmbh Schaltungsanordnung mit einem oder mehreren integrierten schaltkreisen

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5615059U (https=) * 1979-07-11 1981-02-09
JPS5651846A (en) * 1979-10-04 1981-05-09 Fujitsu Ltd Ic package
US4320438A (en) 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
DE3125360A1 (de) * 1981-06-27 1983-01-13 Robert Bosch Gmbh, 7000 Stuttgart "elektronisches bauelement"
DE3147790A1 (de) * 1981-12-03 1983-06-09 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungsmodul und verfahren zu seiner herstellung
DE3147789A1 (de) * 1981-12-03 1983-06-09 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungsmodul und verfahren zu seiner herstellung
JPS5987893A (ja) * 1982-11-12 1984-05-21 株式会社日立製作所 配線基板とその製造方法およびそれを用いた半導体装置
US4750092A (en) * 1985-11-20 1988-06-07 Kollmorgen Technologies Corporation Interconnection package suitable for electronic devices and methods for producing same
GB2209867B (en) * 1987-09-16 1990-12-19 Advanced Semiconductor Package Method of forming an integrated circuit chip carrier
US5702985A (en) * 1992-06-26 1997-12-30 Staktek Corporation Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method
DE19548050A1 (de) * 1995-12-21 1997-06-26 Siemens Matsushita Components Elektronisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement -
CN113937067A (zh) * 2021-09-23 2022-01-14 中国电子科技集团公司第十三研究所 磁电阻随机存储器及其封装外壳和制备方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3703280A1 (de) * 1987-02-04 1988-08-18 Licentia Gmbh Schaltungsanordnung mit einem oder mehreren integrierten schaltkreisen

Also Published As

Publication number Publication date
GB1277254A (en) 1972-06-07
JPS5128829B1 (https=) 1976-08-21
DE1952789A1 (de) 1970-04-30
FR2023323A1 (https=) 1970-08-21
DE1952789B2 (de) 1971-09-30

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
E77 Valid patent as to the heymanns-index 1977
EHJ Ceased/non-payment of the annual fee