DE1811837A1 - Anordnung fuer ein elektrisches oder elektronisches Bauelement,insbesondere fuer einen Tantalkondensator - Google Patents
Anordnung fuer ein elektrisches oder elektronisches Bauelement,insbesondere fuer einen TantalkondensatorInfo
- Publication number
- DE1811837A1 DE1811837A1 DE19681811837 DE1811837A DE1811837A1 DE 1811837 A1 DE1811837 A1 DE 1811837A1 DE 19681811837 DE19681811837 DE 19681811837 DE 1811837 A DE1811837 A DE 1811837A DE 1811837 A1 DE1811837 A1 DE 1811837A1
- Authority
- DE
- Germany
- Prior art keywords
- component
- strip
- electrical
- capacitor
- platelets
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title description 35
- 229910052715 tantalum Inorganic materials 0.000 title description 5
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 title description 5
- 210000002105 tongue Anatomy 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims 1
- 238000010276 construction Methods 0.000 claims 1
- 239000013013 elastic material Substances 0.000 claims 1
- 238000002955 isolation Methods 0.000 claims 1
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- POIUWJQBRNEFGX-XAMSXPGMSA-N cathelicidin Chemical compound C([C@@H](C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CO)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H]([C@@H](C)CC)C(=O)NCC(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](CCC(N)=O)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CC(N)=O)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](C(C)C)C(=O)N1[C@@H](CCC1)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)O)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CO)C(O)=O)NC(=O)[C@H](CC=1C=CC=CC=1)NC(=O)[C@H](CC(O)=O)NC(=O)CNC(=O)[C@H](CC(C)C)NC(=O)[C@@H](N)CC(C)C)C1=CC=CC=C1 POIUWJQBRNEFGX-XAMSXPGMSA-N 0.000 description 2
- 230000000994 depressogenic effect Effects 0.000 description 2
- 231100000518 lethal Toxicity 0.000 description 2
- 230000001665 lethal effect Effects 0.000 description 2
- 241001147665 Foraminifera Species 0.000 description 1
- 241000797947 Paria Species 0.000 description 1
- 241000158147 Sator Species 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09045—Locally raised area or protrusion of insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/42—Piezoelectric device making
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49087—Resistor making with envelope or housing
- Y10T29/49098—Applying terminal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49101—Applying terminal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
- Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR130093 | 1967-11-29 | ||
| FR78003486 | 1968-03-29 | ||
| FR78003493A FR94659E (fr) | 1967-11-29 | 1968-04-16 | Procédé de fabrication de composants électriques ou électroniques, notamment de condensateurs au tantale. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1811837A1 true DE1811837A1 (de) | 1969-07-10 |
Family
ID=27244694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19681811837 Pending DE1811837A1 (de) | 1967-11-29 | 1968-11-29 | Anordnung fuer ein elektrisches oder elektronisches Bauelement,insbesondere fuer einen Tantalkondensator |
Country Status (6)
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3134617A1 (de) * | 1981-09-01 | 1983-03-17 | Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut | Folien-kondensator in chip-bauweise und verfahren zu seiner herstellung |
| DE3329886A1 (de) * | 1982-08-20 | 1984-02-23 | Matsuo Electric Co., Ltd., Toyonaka, Osaka | Verfahren zum herstellen von trocken-elektrolyt-kondensatoren |
| DE2167079C2 (de) * | 1970-02-25 | 1985-09-26 | Union Carbide Corp., New York, N.Y. | Verfahren zum Herstellen von mit Kunststoff vergossenen elektrischen Bauelementen |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1805174A1 (de) * | 1968-10-25 | 1970-05-14 | Telefunken Patent | Verfahren zum Aufbringen von Einzelkoerpern auf einen Grundkoerper |
| JPS5121454B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1971-05-24 | 1976-07-02 | ||
| JPS4857652U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1971-11-02 | 1973-07-23 | ||
| US3783348A (en) * | 1972-10-30 | 1974-01-01 | Rca Corp | Encapsulated semiconductor device assembly |
| US3828227A (en) * | 1973-04-09 | 1974-08-06 | Sprague Electric Co | Solid tantalum capacitor with end cap terminals |
| US4173062A (en) * | 1976-08-16 | 1979-11-06 | Corning Glass Works | Method of forming a quadriplanar component |
| US4097915A (en) * | 1976-08-16 | 1978-06-27 | Corning Glass Works | Quadriplanar capacitor |
| US4282645A (en) * | 1978-07-31 | 1981-08-11 | Sprague Electric Company | Method of assembling an encapsulated chip capacitor |
| US4288842A (en) * | 1979-06-11 | 1981-09-08 | Emhart Industries, Inc. | Solid chip capacitor and method of manufacture |
| JPS58196829U (ja) * | 1982-06-24 | 1983-12-27 | 松尾電機株式会社 | 固体電解コンデンサ |
| US4463407A (en) * | 1982-09-27 | 1984-07-31 | Northern Telecom Limited | Surface mounted electronic components having pre-applied solder |
| GB2141583A (en) * | 1983-06-17 | 1984-12-19 | Standard Telephones Cables Ltd | Leadless capacitors |
| US4511951A (en) * | 1983-11-14 | 1985-04-16 | Rogers Corporation | Multilayer decoupling capacitor and method of manufacture thereof |
| US4491895A (en) * | 1983-11-14 | 1985-01-01 | Rogers Corporation | Decoupling capacitor and method of manufacture thereof |
| US4497012A (en) * | 1983-11-14 | 1985-01-29 | Rogers Corporation | Decoupling capacitor and method of manufacture thereof |
| US4578736A (en) * | 1984-08-28 | 1986-03-25 | At&T Technologies, Inc. | Surface mounted electrical components and method of fabrication |
| US4648006A (en) * | 1985-03-26 | 1987-03-03 | Illinois Tool Works Inc. | Plastic chip capacitor for surface mounting |
| US4757610A (en) * | 1986-02-21 | 1988-07-19 | American Precision Industries, Inc. | Surface mount network and method of making |
| EP0242149B1 (en) * | 1986-04-16 | 1992-02-12 | Micropore International Limited | Method of enclosing an object within a homogeneous block (2) |
| US4725806A (en) * | 1987-05-21 | 1988-02-16 | Standex International Corporation | Contact elements for miniature inductor |
| EP0359856B1 (de) * | 1988-04-09 | 1993-12-22 | Georg Sillner | Verfahren sowie Vorrichtung zum Umformen von Zylindrischen elektrischen Bauteilen |
| US4926542A (en) * | 1988-08-26 | 1990-05-22 | Dale Electronic, Inc. | Method of making a surface mount wirewound resistor |
| DE3927690C2 (de) * | 1988-08-26 | 2001-12-13 | Dale Electronics | Oberflächenmontierbarer Widerstand |
| FR2640825B1 (fr) * | 1988-12-20 | 1991-01-25 | Europ Composants Electron | Composant electrique a report direct |
| JPH04273112A (ja) * | 1991-02-28 | 1992-09-29 | Murata Mfg Co Ltd | モールド型チップ電子部品 |
| TWM250321U (en) * | 2004-01-14 | 2004-11-11 | Optimum Care Int Tech Inc | Lead frame unit structure of chip with hidden position |
| ITPC20050004U1 (it) * | 2005-03-10 | 2006-09-11 | Electrica Srl | Rele' voltmetrico con aggancio migliorato dei terminali |
| US8614880B2 (en) * | 2008-12-29 | 2013-12-24 | Showa Denko K.K. | Solid electrolytic capacitor including positive and negative electrode lead terminals |
| JP6694235B2 (ja) * | 2015-01-29 | 2020-05-13 | Tdk株式会社 | 電子部品 |
-
1968
- 1968-08-06 US US750630A patent/US3550228A/en not_active Expired - Lifetime
- 1968-11-08 BE BE723634D patent/BE723634A/xx unknown
- 1968-11-11 LU LU57287D patent/LU57287A1/xx unknown
- 1968-11-25 NL NL6816790A patent/NL6816790A/xx unknown
- 1968-11-27 GB GB56348/68A patent/GB1212899A/en not_active Expired
- 1968-11-29 DE DE19681811837 patent/DE1811837A1/de active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2167079C2 (de) * | 1970-02-25 | 1985-09-26 | Union Carbide Corp., New York, N.Y. | Verfahren zum Herstellen von mit Kunststoff vergossenen elektrischen Bauelementen |
| DE3134617A1 (de) * | 1981-09-01 | 1983-03-17 | Ernst Roederstein Spezialfabrik für Kondensatoren GmbH, 8300 Landshut | Folien-kondensator in chip-bauweise und verfahren zu seiner herstellung |
| DE3329886A1 (de) * | 1982-08-20 | 1984-02-23 | Matsuo Electric Co., Ltd., Toyonaka, Osaka | Verfahren zum herstellen von trocken-elektrolyt-kondensatoren |
Also Published As
| Publication number | Publication date |
|---|---|
| LU57287A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1969-02-25 |
| GB1212899A (en) | 1970-11-18 |
| NL6816790A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1969-06-02 |
| BE723634A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1969-04-16 |
| US3550228A (en) | 1970-12-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE1811837A1 (de) | Anordnung fuer ein elektrisches oder elektronisches Bauelement,insbesondere fuer einen Tantalkondensator | |
| DE1566981B2 (de) | Anschlusspackung | |
| DE2305883A1 (de) | Leiterplatte | |
| DE2835963A1 (de) | Elektromagnetisches relais | |
| DE3032083A1 (de) | Schmelzsicherung, insbesondere fuer gedruckte schaltungen | |
| EP1434307A1 (de) | Anschluss- und Verbindungsklemme für elektrische Leiter | |
| EP0655169B2 (de) | Bürstenhalter für elektromotoren | |
| DE3134617A1 (de) | Folien-kondensator in chip-bauweise und verfahren zu seiner herstellung | |
| DE1195385B (de) | Festklemmbares Kontaktstueck fuer Fernmelde-, insbesondere Fernsprechanlagen | |
| DE2346072A1 (de) | Anschlussklemme fuer eine elektrische verbindung | |
| DE3544158C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| EP0410119A2 (de) | Temperaturschalter mit Bimetall-Schaltwerk | |
| DE3006934A1 (de) | Anordnung zur verbindung einer, eine gedruckte schaltung tragenden platte mit ihrem rahmen | |
| DE2622766A1 (de) | Verfahren zur herstellung einer leiterplatte | |
| DE69701219T2 (de) | Elektronische baugruppe mit einer an einer spule verbundenen elektronischen einheit | |
| EP3537122B1 (de) | Elektrischer temperaturfühler | |
| DE3149814C1 (de) | Gehäuse aus Isoliermaterial für elektrische Schaltgeräte, insbeondere Relais, sowie Verfahren zur Herstellung eines solchen Gehäuses | |
| DE2757048A1 (de) | Druckschaltungskarte mit einem aeusseren rahmen | |
| DE2806518A1 (de) | Anordnung zum anschluss und verpacken mindestens eines halbleiterkoerpers | |
| DE2134266A1 (de) | Halbleiterbauelement | |
| AT519780B1 (de) | Verfahren zum Herstellen von Bondverbindungen | |
| DE2047382C3 (de) | Anschlußleiste zur elektrischen Kontaktierung von plattenförmigen Baueinheiten | |
| DE2730922A1 (de) | Veraenderlicher widerstand | |
| DE497727C (de) | Lagerfaehiges Trockenelement | |
| DE2812560C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |