DE1521441B - A method for producing metallic conductive surfaces in recesses of articles, especially electrical components - Google Patents

A method for producing metallic conductive surfaces in recesses of articles, especially electrical components

Info

Publication number
DE1521441B
DE1521441B DE19651521441D DE1521441DA DE1521441B DE 1521441 B DE1521441 B DE 1521441B DE 19651521441 D DE19651521441 D DE 19651521441D DE 1521441D A DE1521441D A DE 1521441DA DE 1521441 B DE1521441 B DE 1521441B
Authority
DE
Grant status
Application
Patent type
Prior art keywords
recesses
articles
method
electrical components
conductive surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19651521441D
Other languages
German (de)
Inventor
Joseph Polichette
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Photocircuits Corp
Original Assignee
Photocircuits Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections or via connections
    • H05K3/4053Through-connections or via connections by thick-film techniques
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Other shape and layout details not provided for in H05K2201/09009 - H05K2201/09209; Shape and layout details covering several of these groups
    • H05K2201/09827Tapered, e.g. tapered hole, via or groove
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Other shape and layout details not provided for in H05K2201/09009 - H05K2201/09209; Shape and layout details covering several of these groups
    • H05K2201/09981Metallised walls
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0195Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03Metal processing
    • H05K2203/0338Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0763Treating individual holes or single row of holes, e.g. by nozzle
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42Plated through-holes or plated via connections
    • H05K3/422Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
DE19651521441D 1965-07-19 1965-07-19 A method for producing metallic conductive surfaces in recesses of articles, especially electrical components Pending DE1521441B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DEP0037276 1965-07-19

Publications (1)

Publication Number Publication Date
DE1521441B true true DE1521441B (en) 1970-04-30

Family

ID=7375206

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19651521441D Pending DE1521441B (en) 1965-07-19 1965-07-19 A method for producing metallic conductive surfaces in recesses of articles, especially electrical components

Country Status (1)

Country Link
DE (1) DE1521441B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0079602A2 (en) * 1981-11-17 1983-05-25 Robert Bosch Gmbh Process for manufacturing printed conductors
WO1983001886A1 (en) * 1981-11-17 1983-05-26 Grünwald, Werner Method for making through connections in a printed circuit

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB910709A (en) *
AT227055B *
DE1167726B (en) * 1961-06-05 1964-04-09 Hughes Aircraft Co A process for the preparation of copper plating on limited Flaechenbereichen ceramic body

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB910709A (en) *
AT227055B *
DE1167726B (en) * 1961-06-05 1964-04-09 Hughes Aircraft Co A process for the preparation of copper plating on limited Flaechenbereichen ceramic body

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0079602A2 (en) * 1981-11-17 1983-05-25 Robert Bosch Gmbh Process for manufacturing printed conductors
WO1983001886A1 (en) * 1981-11-17 1983-05-26 Grünwald, Werner Method for making through connections in a printed circuit
EP0079602A3 (en) * 1981-11-17 1984-05-09 Robert Bosch Gmbh Process for manufacturing printed conductors

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