DE112022006365T5 - Leiterplatte - Google Patents

Leiterplatte Download PDF

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Publication number
DE112022006365T5
DE112022006365T5 DE112022006365.3T DE112022006365T DE112022006365T5 DE 112022006365 T5 DE112022006365 T5 DE 112022006365T5 DE 112022006365 T DE112022006365 T DE 112022006365T DE 112022006365 T5 DE112022006365 T5 DE 112022006365T5
Authority
DE
Germany
Prior art keywords
point
conductive
signal
conductive trace
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022006365.3T
Other languages
German (de)
English (en)
Inventor
Koji Miyagawa
Tetsu Owada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE112022006365T5 publication Critical patent/DE112022006365T5/de
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00Waveguides; Transmission lines of the waveguide type
    • H01P3/02Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08Microstrips; Strip lines
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P9/00Delay lines of the waveguide type
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01PWAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P9/00Delay lines of the waveguide type
    • H01P9/02Helical lines
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298Multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09263Meander

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structure Of Printed Boards (AREA)
  • Waveguides (AREA)
DE112022006365.3T 2022-03-11 2022-03-11 Leiterplatte Pending DE112022006365T5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/010751 WO2023170895A1 (ja) 2022-03-11 2022-03-11 配線板

Publications (1)

Publication Number Publication Date
DE112022006365T5 true DE112022006365T5 (de) 2024-10-31

Family

ID=86321970

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022006365.3T Pending DE112022006365T5 (de) 2022-03-11 2022-03-11 Leiterplatte

Country Status (6)

Country Link
US (1) US20240397611A1 (https=)
JP (1) JP7274056B1 (https=)
KR (1) KR102730729B1 (https=)
CN (1) CN118830334A (https=)
DE (1) DE112022006365T5 (https=)
WO (1) WO2023170895A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006173401A (ja) 2004-12-16 2006-06-29 Canon Inc プリント配線板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4899436U (https=) * 1972-02-25 1973-11-24
JP3308734B2 (ja) * 1994-10-13 2002-07-29 本田技研工業株式会社 レーダーモジュール
US6828876B1 (en) * 2001-11-02 2004-12-07 Thin Film Technology Corp. Tapered delay line
JP2004063698A (ja) * 2002-07-26 2004-02-26 Murata Mfg Co Ltd 積層インダクタ及びその外部電極端子形成方法
JP2007335811A (ja) * 2006-06-19 2007-12-27 Matsushita Electric Ind Co Ltd プリント配線板及び電子機器
TW201012102A (en) * 2008-09-05 2010-03-16 Asustek Comp Inc Delay line for printed circuit broad
CN204668075U (zh) * 2013-02-19 2015-09-23 株式会社村田制作所 电感电桥及电子设备
JP6620565B2 (ja) * 2016-01-20 2019-12-18 セイコーエプソン株式会社 プリント配線板、情報通信装置、および表示システム
JP2018078495A (ja) * 2016-11-10 2018-05-17 住友電気工業株式会社 増幅回路および光送信装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006173401A (ja) 2004-12-16 2006-06-29 Canon Inc プリント配線板

Also Published As

Publication number Publication date
CN118830334A (zh) 2024-10-22
JPWO2023170895A1 (https=) 2023-09-14
WO2023170895A1 (ja) 2023-09-14
KR20240138118A (ko) 2024-09-20
US20240397611A1 (en) 2024-11-28
JP7274056B1 (ja) 2023-05-15
KR102730729B1 (ko) 2024-11-14

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R084 Declaration of willingness to licence