DE112021007682T5 - Elektrodenanschluss, halbleitereinrichtung und verfahren zum herstellen einer halbleitereinrichtung - Google Patents

Elektrodenanschluss, halbleitereinrichtung und verfahren zum herstellen einer halbleitereinrichtung Download PDF

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Publication number
DE112021007682T5
DE112021007682T5 DE112021007682.5T DE112021007682T DE112021007682T5 DE 112021007682 T5 DE112021007682 T5 DE 112021007682T5 DE 112021007682 T DE112021007682 T DE 112021007682T DE 112021007682 T5 DE112021007682 T5 DE 112021007682T5
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DE
Germany
Prior art keywords
ball
electrode
area
contact
electrode connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112021007682.5T
Other languages
German (de)
English (en)
Inventor
Yuki Kawamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE112021007682T5 publication Critical patent/DE112021007682T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2478—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point spherical

Landscapes

  • Connecting Device With Holders (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Measuring Leads Or Probes (AREA)
DE112021007682.5T 2021-05-20 2021-05-20 Elektrodenanschluss, halbleitereinrichtung und verfahren zum herstellen einer halbleitereinrichtung Pending DE112021007682T5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/019177 WO2022244194A1 (ja) 2021-05-20 2021-05-20 電極端子、半導体装置および半導体装置の製造方法

Publications (1)

Publication Number Publication Date
DE112021007682T5 true DE112021007682T5 (de) 2024-02-29

Family

ID=84141552

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021007682.5T Pending DE112021007682T5 (de) 2021-05-20 2021-05-20 Elektrodenanschluss, halbleitereinrichtung und verfahren zum herstellen einer halbleitereinrichtung

Country Status (3)

Country Link
JP (1) JP7515715B2 (https=)
DE (1) DE112021007682T5 (https=)
WO (1) WO2022244194A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013051052A (ja) 2011-08-30 2013-03-14 Denso Corp 脱着接続構造

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0316075U (https=) * 1989-06-29 1991-02-18
JP4154802B2 (ja) * 1999-05-17 2008-09-24 ソニー株式会社 情報記録媒体および情報記録媒体を備える電子機器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013051052A (ja) 2011-08-30 2013-03-14 Denso Corp 脱着接続構造

Also Published As

Publication number Publication date
JPWO2022244194A1 (https=) 2022-11-24
JP7515715B2 (ja) 2024-07-12
WO2022244194A1 (ja) 2022-11-24

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