DE112021007408T5 - Halbleitervorrichtung - Google Patents

Halbleitervorrichtung Download PDF

Info

Publication number
DE112021007408T5
DE112021007408T5 DE112021007408.3T DE112021007408T DE112021007408T5 DE 112021007408 T5 DE112021007408 T5 DE 112021007408T5 DE 112021007408 T DE112021007408 T DE 112021007408T DE 112021007408 T5 DE112021007408 T5 DE 112021007408T5
Authority
DE
Germany
Prior art keywords
circuit structure
semiconductor device
electrode bonding
pair
bonding part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE112021007408.3T
Other languages
German (de)
English (en)
Inventor
Kenta NAKAHARA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE112021007408T5 publication Critical patent/DE112021007408T5/de
Granted legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE112021007408.3T 2021-03-29 2021-03-29 Halbleitervorrichtung Granted DE112021007408T5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/013259 WO2022208603A1 (ja) 2021-03-29 2021-03-29 半導体装置

Publications (1)

Publication Number Publication Date
DE112021007408T5 true DE112021007408T5 (de) 2024-01-18

Family

ID=83455713

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021007408.3T Granted DE112021007408T5 (de) 2021-03-29 2021-03-29 Halbleitervorrichtung

Country Status (5)

Country Link
US (1) US20240071868A1 (https=)
JP (1) JP7438454B2 (https=)
CN (1) CN117043939A (https=)
DE (1) DE112021007408T5 (https=)
WO (1) WO2022208603A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0277870A (ja) * 1988-06-30 1990-03-16 Mitsubishi Electric Corp 並列計算機システム
JPH0277870U (https=) * 1988-12-02 1990-06-14
JP2850606B2 (ja) * 1991-11-25 1999-01-27 富士電機株式会社 トランジスタモジュール
JP3396566B2 (ja) * 1995-10-25 2003-04-14 三菱電機株式会社 半導体装置
DE102008005547B4 (de) * 2008-01-23 2013-08-29 Infineon Technologies Ag Leistungshalbleitermodul und Schaltungsanordnung mit einem Leistungshalbleitermodul
CN105981167B (zh) * 2014-08-12 2019-05-28 富士电机株式会社 半导体装置
BE1028071B1 (de) * 2020-02-19 2021-09-13 Phoenix Contact Gmbh & Co Elektrisches Kontaktelement

Also Published As

Publication number Publication date
JP7438454B2 (ja) 2024-02-26
JPWO2022208603A1 (https=) 2022-10-06
US20240071868A1 (en) 2024-02-29
WO2022208603A1 (ja) 2022-10-06
CN117043939A (zh) 2023-11-10

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023488000

Ipc: H10W0072000000

R016 Response to examination communication
R084 Declaration of willingness to licence
R018 Grant decision by examination section/examining division