DE112020005168T5 - Bildgebungsvorrichtung - Google Patents

Bildgebungsvorrichtung Download PDF

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Publication number
DE112020005168T5
DE112020005168T5 DE112020005168.4T DE112020005168T DE112020005168T5 DE 112020005168 T5 DE112020005168 T5 DE 112020005168T5 DE 112020005168 T DE112020005168 T DE 112020005168T DE 112020005168 T5 DE112020005168 T5 DE 112020005168T5
Authority
DE
Germany
Prior art keywords
imaging element
imaging
pair
element substrate
exposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112020005168.4T
Other languages
German (de)
English (en)
Inventor
Kenichi Takeuchi
Hidenori Shinohara
Takeshi Haga
Seiichi Katou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Astemo Ltd
Original Assignee
Hitachi Astemo Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Astemo Ltd filed Critical Hitachi Astemo Ltd
Publication of DE112020005168T5 publication Critical patent/DE112020005168T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/809—Constructional details of image sensors of hybrid image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/60—Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Human Computer Interaction (AREA)
  • Studio Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
DE112020005168.4T 2020-01-22 2020-12-15 Bildgebungsvorrichtung Pending DE112020005168T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020007967 2020-01-22
JP2020-007967 2020-01-22
PCT/JP2020/046667 WO2021149404A1 (ja) 2020-01-22 2020-12-15 撮像装置

Publications (1)

Publication Number Publication Date
DE112020005168T5 true DE112020005168T5 (de) 2022-09-01

Family

ID=76992188

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112020005168.4T Pending DE112020005168T5 (de) 2020-01-22 2020-12-15 Bildgebungsvorrichtung

Country Status (4)

Country Link
US (1) US20230005976A1 (https=)
JP (1) JP7262626B2 (https=)
DE (1) DE112020005168T5 (https=)
WO (1) WO2021149404A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024013969A1 (ja) * 2022-07-15 2024-01-18 日立Astemo株式会社 レンズユニットを有するカメラ装置
US12596997B2 (en) 2022-10-18 2026-04-07 Dell Products L.P. Information handling system and peripheral printed circuit board having non-homogeneous substrate material
US12284429B2 (en) * 2022-10-18 2025-04-22 Dell Products L.P. Camera housing structure for enhanced manufacture assembly and repair
US12245372B2 (en) 2022-10-18 2025-03-04 Dell Products L.P. Information handling system and peripheral printed circuit board having non-homogeneous substrate material and integrated thermal solution
US12306677B2 (en) 2022-10-18 2025-05-20 Dell Products L.P. Information handling system with rapid assembly and disassembly to aid recycling
US12306676B2 (en) 2022-10-18 2025-05-20 Dell Products L.P. Information handling system keyboard with rapid assembly and disassembly to aid recycling
US12085993B2 (en) 2022-10-18 2024-09-10 Dell Products L.P. Information handling system coupling device for improved assembly, disassembly and repair
US20240393665A1 (en) * 2023-05-22 2024-11-28 Gopro, Inc. Heat conductor assembly

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016208125A (ja) 2015-04-16 2016-12-08 株式会社デンソー 撮像装置およびそれに用いられるプリント基板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080173792A1 (en) 2007-01-23 2008-07-24 Advanced Chip Engineering Technology Inc. Image sensor module and the method of the same
JP4413956B2 (ja) * 2007-08-21 2010-02-10 新光電気工業株式会社 カメラモジュール及び携帯端末機
KR20120053332A (ko) 2010-11-17 2012-05-25 삼성전자주식회사 반도체 패키지 및 이의 제조 방법
WO2013190748A1 (ja) 2012-06-22 2013-12-27 株式会社ニコン 基板、撮像ユニットおよび撮像装置
JP2016014564A (ja) 2014-07-01 2016-01-28 株式会社リコー 撮像ユニット
US10511754B2 (en) * 2014-08-01 2019-12-17 Nidec Copal Corporation Imaging apparatus, optical device, electronic device, vehicle, and imaging-device manufacturing method
JP6627471B2 (ja) * 2015-03-18 2020-01-08 株式会社リコー 撮像ユニット、車両制御ユニットおよび撮像ユニットの伝熱方法
JP6838262B2 (ja) 2017-01-06 2021-03-03 日立Astemo株式会社 ステレオカメラ
JP2020003236A (ja) * 2018-06-25 2020-01-09 株式会社リコー 測距装置、移動体、測距方法、測距システム
KR102566974B1 (ko) 2018-07-11 2023-08-16 삼성전자주식회사 반도체 패키지

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016208125A (ja) 2015-04-16 2016-12-08 株式会社デンソー 撮像装置およびそれに用いられるプリント基板

Also Published As

Publication number Publication date
US20230005976A1 (en) 2023-01-05
WO2021149404A1 (ja) 2021-07-29
JP7262626B2 (ja) 2023-04-21
JPWO2021149404A1 (https=) 2021-07-29

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H04N0005225000

Ipc: H04N0023000000