DE112014005358A5 - Gehäuse für einen Halbleiterchip, Gehäuseverbund, Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements - Google Patents

Gehäuse für einen Halbleiterchip, Gehäuseverbund, Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements Download PDF

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Publication number
DE112014005358A5
DE112014005358A5 DE112014005358.9T DE112014005358T DE112014005358A5 DE 112014005358 A5 DE112014005358 A5 DE 112014005358A5 DE 112014005358 T DE112014005358 T DE 112014005358T DE 112014005358 A5 DE112014005358 A5 DE 112014005358A5
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Germany
Prior art keywords
housing
semiconductor device
producing
semiconductor
composite
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Granted
Application number
DE112014005358.9T
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English (en)
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DE112014005358B4 (de
Inventor
Martin Haushalter
Stephan Haslbeck
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
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Publication of DE112014005358A5 publication Critical patent/DE112014005358A5/de
Application granted granted Critical
Publication of DE112014005358B4 publication Critical patent/DE112014005358B4/de
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Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Light Receiving Elements (AREA)
DE112014005358.9T 2013-11-25 2014-11-13 Halbleiterbauelement umfassend ein Gehäuse und einen optoelektronischen Halbleiterchip, eine Bauelementanordnung und ein Verfahren zur Herstellung eines Halbleiterbauelements Active DE112014005358B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013113009.7A DE102013113009A1 (de) 2013-11-25 2013-11-25 Gehäuse für einen Halbleiterchip, Gehäuseverbund, Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
DE102013113009.7 2013-11-25
PCT/EP2014/074516 WO2015074951A1 (de) 2013-11-25 2014-11-13 Gehäuse für einen halbleiterchip, gehäuseverbund, halbleiterbauelement und verfahren zur herstellung eines halbleiterbauelements

Publications (2)

Publication Number Publication Date
DE112014005358A5 true DE112014005358A5 (de) 2016-08-04
DE112014005358B4 DE112014005358B4 (de) 2021-08-05

Family

ID=51894067

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102013113009.7A Withdrawn DE102013113009A1 (de) 2013-11-25 2013-11-25 Gehäuse für einen Halbleiterchip, Gehäuseverbund, Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
DE112014005358.9T Active DE112014005358B4 (de) 2013-11-25 2014-11-13 Halbleiterbauelement umfassend ein Gehäuse und einen optoelektronischen Halbleiterchip, eine Bauelementanordnung und ein Verfahren zur Herstellung eines Halbleiterbauelements

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102013113009.7A Withdrawn DE102013113009A1 (de) 2013-11-25 2013-11-25 Gehäuse für einen Halbleiterchip, Gehäuseverbund, Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements

Country Status (4)

Country Link
US (1) US9685593B2 (de)
CN (1) CN105793980B (de)
DE (2) DE102013113009A1 (de)
WO (1) WO2015074951A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017100165A1 (de) 2017-01-05 2018-07-05 Jabil Optics Germany GmbH Lichtemittierende Anordnung und lichtemittierendes System
WO2020247187A1 (en) * 2019-06-07 2020-12-10 Carrier Corporation Monitoring devices with surface mount technology
US11978838B2 (en) * 2020-12-11 2024-05-07 DOMINANT Opto Technologies Sdn Bhd. Surface mountable light emitting diode package with inclined light emitting surface

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2530157A1 (de) 1975-07-05 1977-02-03 Bosch Gmbh Robert Elektronisches steuergeraet
US5866818A (en) * 1995-11-30 1999-02-02 Matsushita Electric Works, Ltd. Acceleration sensor device
US6115261A (en) * 1999-06-14 2000-09-05 Honeywell Inc. Wedge mount for integrated circuit sensors
KR100492498B1 (ko) 2001-05-21 2005-05-30 마츠시다 덴코 가부시키가이샤 프린트 배선판의 제조 방법
DE10153259A1 (de) * 2001-10-31 2003-05-22 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US7495322B2 (en) 2003-05-26 2009-02-24 Panasonic Electric Works Co., Ltd. Light-emitting device
AT500892B1 (de) * 2004-09-01 2008-01-15 Pollmann Austria Ohg Lichtquellen-trageinheit
JP5122062B2 (ja) * 2004-09-22 2013-01-16 株式会社光波 発光装置
DE102004050371A1 (de) * 2004-09-30 2006-04-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement mit einer drahtlosen Kontaktierung
CN100530714C (zh) * 2004-09-30 2009-08-19 奥斯兰姆奥普托半导体有限责任公司 具有无线接触的光电子器件
US7821023B2 (en) * 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
WO2008099784A1 (ja) 2007-02-15 2008-08-21 Panasonic Electric Works Co., Ltd. Ｌｅｄパッケージおよび立体回路部品の取付構造
US8337029B2 (en) * 2008-01-17 2012-12-25 Intematix Corporation Light emitting device with phosphor wavelength conversion
JP2012119403A (ja) * 2010-11-30 2012-06-21 Kyocera Corp 半導体装置
US8658961B2 (en) 2011-08-05 2014-02-25 True Light Corporation Inputting module and submount thereof and manufacturing method of the submount

Also Published As

Publication number Publication date
DE102013113009A1 (de) 2015-05-28
US9685593B2 (en) 2017-06-20
US20160293804A1 (en) 2016-10-06
WO2015074951A1 (de) 2015-05-28
DE112014005358B4 (de) 2021-08-05
CN105793980A (zh) 2016-07-20
CN105793980B (zh) 2018-06-15

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