DE112013002366A5 - Method and device for pretreatment of a coated or uncoated substrate - Google Patents

Method and device for pretreatment of a coated or uncoated substrate Download PDF

Info

Publication number
DE112013002366A5
DE112013002366A5 DE112013002366.0T DE112013002366T DE112013002366A5 DE 112013002366 A5 DE112013002366 A5 DE 112013002366A5 DE 112013002366 T DE112013002366 T DE 112013002366T DE 112013002366 A5 DE112013002366 A5 DE 112013002366A5
Authority
DE
Germany
Prior art keywords
pretreatment
coated
uncoated substrate
uncoated
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112013002366.0T
Other languages
German (de)
Inventor
Markus Berendt
Manfred Schreil
Volker Linss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Von Ardenne Asset GmbH and Co KG
Original Assignee
Von Ardenne GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Von Ardenne GmbH filed Critical Von Ardenne GmbH
Publication of DE112013002366A5 publication Critical patent/DE112013002366A5/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3438—Electrodes other than cathode
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3417—Arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape
DE112013002366.0T 2012-06-22 2013-06-24 Method and device for pretreatment of a coated or uncoated substrate Pending DE112013002366A5 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102012210568 2012-06-22
DE102012210568.9 2012-06-22
DE102012110045 2012-10-22
DE102012110045.4 2012-10-22
PCT/EP2013/063112 WO2013190141A1 (en) 2012-06-22 2013-06-24 Method and device for pretreating a coated or uncoated substrate

Publications (1)

Publication Number Publication Date
DE112013002366A5 true DE112013002366A5 (en) 2015-02-26

Family

ID=48703468

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112013002366.0T Pending DE112013002366A5 (en) 2012-06-22 2013-06-24 Method and device for pretreatment of a coated or uncoated substrate

Country Status (2)

Country Link
DE (1) DE112013002366A5 (en)
WO (1) WO2013190141A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015120723A1 (en) * 2015-11-30 2017-06-01 Von Ardenne Gmbh Coating arrangement, substrate carrier and method
CN114059016A (en) * 2021-11-02 2022-02-18 Oppo广东移动通信有限公司 Coating film pretreatment method and device, appearance part preparation method and electronic equipment

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5073241A (en) * 1986-01-31 1991-12-17 Kabushiki Kaisha Meidenshae Method for carbon film production
US5106474A (en) * 1990-11-21 1992-04-21 Viratec Thin Films, Inc. Anode structures for magnetron sputtering apparatus
TW366367B (en) * 1995-01-26 1999-08-11 Ibm Sputter deposition of hydrogenated amorphous carbon film
DE10347521A1 (en) * 2002-12-04 2004-06-24 Leybold Optics Gmbh Method for producing a multilayer layer and device for carrying out the method
JP4533815B2 (en) * 2005-07-08 2010-09-01 株式会社東芝 Sputtering target and optical thin film manufacturing method using the same
JP4536819B2 (en) * 2008-08-19 2010-09-01 株式会社神戸製鋼所 Nitrogen-containing amorphous carbon film, amorphous carbon film and sliding member

Also Published As

Publication number Publication date
WO2013190141A1 (en) 2013-12-27

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R081 Change of applicant/patentee

Owner name: VON ARDENNE ASSET GMBH & CO. KG, DE

Free format text: FORMER OWNER: VON ARDENNE ANLAGENTECHNIK GMBH, 01324 DRESDEN, DE

R082 Change of representative

Representative=s name: LIPPERT STACHOW PATENTANWAELTE RECHTSANWAELTE , DE

Representative=s name: PATENTANWAELTE LIPPERT, STACHOW & PARTNER, DE

R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: C23C0014000000

Ipc: C23C0014020000

R081 Change of applicant/patentee

Owner name: VON ARDENNE ASSET GMBH & CO. KG, DE

Free format text: FORMER OWNER: VON ARDENNE GMBH, 01324 DRESDEN, DE

R082 Change of representative

Representative=s name: LIPPERT STACHOW PATENTANWAELTE RECHTSANWAELTE , DE

R016 Response to examination communication
R016 Response to examination communication