DE112008000723A5 - Vorrichtung und Verfahren zum Prüfen der Kante eines Halbleiterwafers - Google Patents

Vorrichtung und Verfahren zum Prüfen der Kante eines Halbleiterwafers Download PDF

Info

Publication number
DE112008000723A5
DE112008000723A5 DE112008000723T DE112008000723T DE112008000723A5 DE 112008000723 A5 DE112008000723 A5 DE 112008000723A5 DE 112008000723 T DE112008000723 T DE 112008000723T DE 112008000723 T DE112008000723 T DE 112008000723T DE 112008000723 A5 DE112008000723 A5 DE 112008000723A5
Authority
DE
Germany
Prior art keywords
testing
edge
semiconductor wafer
wafer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE112008000723T
Other languages
English (en)
Other versions
DE112008000723T5 (de
Inventor
Yoshinori Hayashi
Hideki Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2007091343 priority Critical
Priority to JP2007-091343 priority
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to PCT/JP2008/056209 priority patent/WO2008123459A1/ja
Publication of DE112008000723T5 publication Critical patent/DE112008000723T5/de
Publication of DE112008000723A5 publication Critical patent/DE112008000723A5/de
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical means
    • G01B11/24Measuring arrangements characterised by the use of optical means for measuring contours or curvatures
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • G01N21/9503Wafer edge inspection
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10Measuring as part of the manufacturing process
    • H01L22/12Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8841Illumination and detection on two sides of object
DE112008000723T 2007-03-30 2008-03-28 Vorrichtung und Verfahren zum Prüfen der Kante eines Halbleiterwafers Ceased DE112008000723A5 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007091343 2007-03-30
JP2007-091343 2007-03-30
PCT/JP2008/056209 WO2008123459A1 (ja) 2007-03-30 2008-03-28 半導体ウエーハのエッジ検査装置及びエッジ検査方法

Publications (2)

Publication Number Publication Date
DE112008000723T5 DE112008000723T5 (de) 2010-01-21
DE112008000723A5 true DE112008000723A5 (de) 2012-06-14

Family

ID=39830944

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112008000723T Ceased DE112008000723A5 (de) 2007-03-30 2008-03-28 Vorrichtung und Verfahren zum Prüfen der Kante eines Halbleiterwafers

Country Status (5)

Country Link
US (1) US8194241B2 (de)
JP (1) JP5344699B2 (de)
KR (1) KR101099264B1 (de)
DE (1) DE112008000723A5 (de)
WO (1) WO2008123459A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110317003A1 (en) * 2010-06-02 2011-12-29 Porat Roy Method and system for edge inspection using a tilted illumination
DE102010026351B4 (de) * 2010-07-07 2012-04-26 Siltronic Ag Verfahren und Vorrichtung zur Untersuchung einer Halbleiterscheibe
US8768040B2 (en) * 2011-01-14 2014-07-01 Varian Semiconductor Equipment Associates, Inc. Substrate identification and tracking through surface reflectance
DE102012101301B4 (de) 2012-02-17 2014-11-06 Kocos Automation Gmbh Vorrichtung zur berührungslosen Kantenprofilbestimmung an einem dünnen scheibenförmigen Objekt
US9553034B1 (en) * 2012-03-27 2017-01-24 Kla-Tencor Corporation Combined semiconductor metrology system
JP5633537B2 (ja) * 2012-05-07 2014-12-03 信越半導体株式会社 半導体ウエーハの評価方法および半導体ウエーハの評価装置
KR101540569B1 (ko) * 2013-12-24 2015-07-31 주식회사 엘지실트론 웨이퍼의 형상 분석 방법 및 장치
CN108375335B (zh) * 2015-08-24 2020-06-02 江苏理工学院 一种大齿轮检测仪
US10302598B2 (en) 2016-10-24 2019-05-28 General Electric Company Corrosion and crack detection for fastener nuts
CN107228860B (zh) * 2017-06-28 2020-04-24 北京因时机器人科技有限公司 一种基于图像旋转周期特性的齿轮缺陷检测方法
US10957566B2 (en) * 2018-04-12 2021-03-23 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer-level inspection using on-valve inspection detectors

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1001460B1 (de) 1998-10-15 2001-05-02 Wacker Siltronic Gesellschaft für Halbleitermaterialien Aktiengesellschaft Verfahren und Vorrichtung zum Detektieren, Überwachung und Charakterisierung von Kantendefekten in Halbleiterscheiben
JP2001004341A (ja) * 1999-06-16 2001-01-12 Toshiba Ceramics Co Ltd ウェーハ形状測定装置
JP3629244B2 (ja) 2002-02-19 2005-03-16 本多エレクトロン株式会社 ウエーハ用検査装置
US7182349B2 (en) * 2003-07-17 2007-02-27 Mind Wurx, Llc Shopping cart with lowered center of gravity and frame therefor
US7280197B1 (en) * 2004-07-27 2007-10-09 Kla-Tehcor Technologies Corporation Wafer edge inspection apparatus
JP4500157B2 (ja) 2004-11-24 2010-07-14 株式会社神戸製鋼所 形状計測装置用光学系
KR100904007B1 (ko) * 2004-11-30 2009-06-22 시바우라 메카트로닉스 가부시키가이샤 표면 검사 장치 및 표면 검사 방법

Also Published As

Publication number Publication date
JP5344699B2 (ja) 2013-11-20
US8194241B2 (en) 2012-06-05
DE112008000723T5 (de) 2010-01-21
WO2008123459A1 (ja) 2008-10-16
US20100026997A1 (en) 2010-02-04
KR20090109574A (ko) 2009-10-20
JPWO2008123459A1 (ja) 2010-07-15
KR101099264B1 (ko) 2011-12-26

Similar Documents

Publication Publication Date Title
DE112008000723A5 (de) Vorrichtung und Verfahren zum Prüfen der Kante eines Halbleiterwafers
AT529825T (de) Verfahren und vorrichtung zum ermitteln einer kontur und eines mittelpunktes eines objekts
AT511188T (de) Vorrichtung und verfahren zum reparieren eines halbleiterspeichers
DE502005001559D1 (de) Verfahren und Vorrichtung zum Erfassen eines Objekts
AT477010T (de) Verpackung für infusionssatz und verfahren zum anwenden eines infusionssatzes
DE502008000281D1 (de) Vorrichtung und verfahren zum reinigen der core engine eines strahltriebwerks
DE502008002871D1 (de) Vorrichtung und verfahren zum herstellen eines dreidimensionalen objektes
DE602007013361D1 (de) Verfahren und Vorrichtung zum Beschichten von Rohren
DE502006009404D1 (de) Verfahren zum lateralen zertrennen eines halbleiterwafers und optoelektronisches bauelement
DE102007018634B8 (de) Vorrichtung und Verfahren zum Entladen eines Behälters
AT548719T (de) Verfahren und vorrichtung zum detektieren einer kritischen situation eines subjekts
DE602006004671D1 (de) Verfahren und Vorrichtung zum schleifen der Rückseite eines Halbleiterwafers
DE602007006772D1 (de) Substratverarbeitungsvorrichtung und Verfahren zum Platzieren eines Substrats
DE602006015055D1 (de) Vorrichtung und verfahren zum beschichten eines substrats
AT533261T (de) Verfahren zum implementieren eines virtue- wechsels und vorrichtung dafür
DE502008000203D1 (de) Vorrichtung und verfahren zum lackieren von felgen
DE602007011508D1 (de) Verfahren und vorrichtung zum schleifen von reifen
AT492995T (de) Vorrichtung und verfahren zum verbinden eines hörgeräts mit hörgeräte-prüfgeräten
AT516923T (de) Verfahren und vorrichtung zum beidseitigen polieren von halbleiterscheiben
AT514546T (de) Vorrichtung und verfahren zum siegeln von packungen
DE502008003110D1 (de) Verfahren und vorrichtung zum verdampfen eines fluides
DE502007005421D1 (de) Vorrichtung und verfahren zum führen eines bandes
DE602007008997D1 (de) Vorrichtung und Verfahren zum Testen eines Brennstoffflusses
DE602007008548D1 (de) Vorrichtung und Verfahren zum Testen einer Vinifikationsflüssigkeit
DE602005008007D1 (de) Halbleiteranordnung und Verfahren zum Test derselben

Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
R016 Response to examination communication
R016 Response to examination communication
R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final
R003 Refusal decision now final

Effective date: 20140923