DE112005000773T5 - Heat exchanger tube, heat exchanger and method of making the same - Google Patents

Abstract

A method of manufacturing an aluminum heat exchanger tube, the method comprising the steps of:
Forming a thermally sprayed layer on the surface of an aluminum flat tube by thermal spattering Al-Si alloy thermal spatter particles, wherein the thermally sprayed thermal spatter particles are quenched in the molten state to cause them to adhere to the tube core, and
Smooth the surface of the thermally sprayed layer to form a solder layer.

Description

These Application claimed according to 35 U.S.C. § 119 the priority of Japanese Patent Application filed on Apr. 8, 2004 No. 2004-113784 and filed April 14, 2004 preliminary US application number 60 / 561,903, the entire disclosures are incorporated herein by reference in their entirety.

cross-reference on related applications

These Registration is one according to 35 U.S.C. Section 111 (a) filed application filed in accordance with 35 U.S.C. Section 119 (e) (1) the benefit of the filing date of the US provisional application with the No. 60 / 561,903, which issued April 14, 2004 to 35 U.S.C. Section 111 (b) was submitted.

technical area

The The invention relates to an aluminum heat exchanger which, for example for one Cooling circuit used for car air conditioners will, a pipe for such heat exchangers and a method for producing the same.

In this disclosure, the claims and the term "aluminum" refers to aluminum and its alloy.

background knowledge

The The following description shows the knowledge of the inventor concerning related ones Subjects and problems in it should and should not be considered a recording of knowledge in the art.

As an aluminum heat exchanger for use in a refrigeration cycle for car air conditioners is the so-called multi-flow or parallel-flow type heat exchanger 51 , as in 5 shown, well known. In this heat exchanger is a plurality of flat tubes 52 with a corrugated fin interposed therebetween 53 arranged in the thickness direction, and hollow headboards 54 are with the ends of the pipes 52 connected in fluid communication.

When manufacturing such a heat exchanger 51 For example, the heat exchanger components are usually fabricated in a temporary assembly, and then the assembly is integrally brazed in a furnace. As a method of forming a solder layer, as disclosed by Patent Document 1 (Japanese Unexamined Laid-Open Patent Publication No. 559-10467), it is well known that a solder alloy is thermally sprayed onto the surface of an aluminum heat exchanger tube becomes.

In cases where a braze alloy thermally strikes the surface of a heat exchanger tube 52 however, the unevenness of the solder layer is large, and therefore the solder layer contracts after soldering. As a result, as in 5 exaggerated, some provided connecting portions between the heat exchanger tube 52 and the Finn 53 continuously along the longitudinal direction of the tube 52 which can cause a bad soldering section, such as the so-called fin detachment.

Around to solve the problem, became conventional various techniques proposed. For example, this discloses Patent Document 2 (JP, H11-33709, A) discloses a technique in which a solder alloy thermal on a striped surface of a heat exchanger tube (tube core) is sprayed to thereby form a solder layer. Patent document 3 (JP, H06-200344, A) discloses a technique in which at the time the thermal spraying of the solder alloy powder the solder powder in a state in which an unmelted structure without a complete Melting of the alloy powder partially remains, thermally on the Surface of a Heat exchanger tube is injected.

at the technique in which striped irregularities on the surface of the Pipe core are formed, however, a capillary force along the striped unevenness section generates what during of soldering easily causes a flow of melted solder material on the pipe surface. This in turn produces erosion of the tube by the brazing material, what a bad soldering leads.

at the technique in which the solder alloy powder in a state where partially an unmelted structure remains, Thermal spraying is used in cases where the thermal spray particle size is for example is great a cavity between particles which are thermally sprayed onto the pipe surface are, shaped. This causes a worse volume fraction (Filling rate) of the actual soldering material (pure thermally sprayed layer) throughout the thermally sprayed Layer (apparently thermally sprayed layer) comprising the cavity. As a result, the actual amount of soldering tends to decrease. Consequently, there is room for Improvements.

The Description herein of the advantages and disadvantages of the various Features, embodiments, Methods and devices used in other publications are in no way intended to embody the invention narrow. In fact you can certain features of the invention may be suitable to certain disadvantages to manage something, while Nevertheless, some or all of the features, embodiments, methods and Devices disclosed therein are retained.

Further Objects and advantages of the invention will be apparent from the following embodiments seen.

epiphany the invention

The preferred embodiments The invention has been made in light of the above and / or others Problems in related fields developed. The preferred ones embodiments of the invention significantly improve existing methods and / or devices.

The Invention has been in view of the aforementioned conventional Technology is made and aims to provide a heat exchanger tube which is suitable is the occurrence of a bad soldering due to a fining or an erosion of the pipe by soldering material to avoid and a good soldering to achieve a heat exchanger and to provide a method of making the same.

Around To achieve the above objectives, the structure of the invention summarized as follows.

[1] A method of manufacturing an aluminum heat exchanger tube, the method comprising the steps of:
Forming a thermally sprayed layer on the surface of an aluminum flat tube by thermal spattering Al-Si alloy thermal spatter particles, wherein the thermally sprayed thermal spatter particles are quenched in the molten state to cause them to adhere to the tube core, and
Smooth the surface of the thermally sprayed layer to form a solder layer.

The Aluminum heat exchanger tube, which is obtained by the production method of this invention is, for example, connected to an aluminum fin and soldered. At this time can be a good soldering performance be ensured.

The is called, at the heat exchanger tube, which is obtained by the manufacturing method of the invention, is the surface the thermally sprayed layer, which by thermal spraying an alloy is formed, smoothed, to a solder layer to obtain. Therefore, a fin in a balanced way on the entire surface the solder layer be attached, causing a bad connection, such as a Finnish detachment, safely prevented.

It also increases with this Invention, since the thermally sprayed layer is smoothed around the solder layer shape, smoothing the solder filler content the solder layer, resulting in a sufficient amount of solder material as a solder layer leads, what a bad soldering due to a lack of soldering material can safely prevent.

In addition, in this invention, since the molten thermal spray particles are quenched, the brittle layer can be given an adequate brittleness as compared with the case where the thermal spraying is performed in a state where the thermal spray particles are partly in a non-molten state , And in which the thermal spray particles are not quenched, but gradually cooled. For this reason, when the thermally sprayed layer is formed into the solder layer by means of smoothing the thermally sprayed layer, only the ther mixed sprayed layer can be safely molded into a desired state. Following hole can be effectively prevented, for example, the deformation of the tube core, resulting in a high quality.

In This invention may involve the "melting" of the thermal spray particles carried out by increasing the thermal spray temperature to 3000 ° C or more, preferably 3500 ° C or more, more preferably 4000 ° C or more, more preferably 4500 ° C or more. In cases where an arc spraying process can be applied, the "melting" of the thermal spray particles performed safer become. In this invention, especially in cases where the thermal spray temperature is set to a high temperature, it is noted that smoothing the thermally sprayed layer can be carried out effectively. That is, in the Case of high-temperature thermal spraying is noted that the To decrease the size of thermal spray particles, the cooling rate rises and the quickly cooled small thermal spray particles accumulate on the pipe surface to produce a desired brittle structure as a thermally sprayed layer, resulting in an effective smoothing of the thermally sprayed layer allows.

Furthermore can in this invention by adjusting the temperature difference between the thermal spray particles in the molten state and the thermal spray particles in the cooled state, which the pipe core have reached 2500 ° C or more, preferably 3000 ° C or more, more preferably 3500 ° C or more, and / or by performing the thermal spraying at a thermal spray distance of 30 to 150 mm by means of a Lichtbogenthermalspritzverfahrens a "quenching" of the thermal spray particles are carried out.

[2] A method of manufacturing an aluminum heat exchanger tube as recited in the aforementioned Item 1, wherein the surface roughness _(Ry) of the tube core is adjusted to less than 10 microns.

at of this invention, since the surface of the tube core to a smooth surface is shaped, the solder layer stable on a wide surface area be attached to the tube core. Consequently, it is possible to have one unexpected flow of molten solder material on the surface of the Pipe core during of soldering effectively prevent what defects, such as erosion of the tube core by the soldering material, can safely prevent.

[3] A method of manufacturing an aluminum heat exchanger tube as recited in the aforementioned Item 1 or 2, wherein the surface roughness _(Ry) of the brazing layer is adjusted to less than 50 microns.

at of this invention, since the surface of the solder layer is smoothed, a fin safely to the solder layer soldered become what the occurrence of soldering defects, such as a fining, safer prevented.

[4] Method for producing an aluminum heat exchanger tube according to any one of the aforementioned points 1 to 3, wherein the thermal spray temperature the thermal spray particle is set to 3000 ° C or more.

at This invention may include melting the thermal spray particles in the thermal spray process can be achieved safely.

[5] Method for producing an aluminum heat exchanger tube according to one of the aforementioned points 1 to 4, wherein the thermal spray particles After reaching the tube core to be cooled to 800 ° C or less.

at This invention can quench the thermal spray particles be carried out easily at the time of thermal spraying.

[6] Method for producing an aluminum heat exchanger tube to one of the aforementioned points 1 to 5, wherein the thermal Spraying the thermal spray particles the temperature difference between the thermal spray particles in the molten state and the thermal spray particles, which have reached the tube core, when cooled to 2500 ° C or more is set.

at This invention can quench the thermal spray particles be performed safely at the time of thermal spraying.

[7] A method of manufacturing an aluminum heat exchanger tube according to any one of the above ten points 1 to 6, wherein the thermal spraying of the thermal spray particles, the thermal spray particles, which have reached the tube core, are cooled by discharging heat to the tube core.

at This invention can quench the thermal spray particles be performed even more smoothly at the time of the thermal spraying.

[8th] Method for producing an aluminum heat exchanger tube according to any one of the aforementioned items 1 to 7, wherein the average equivalent diameter the Si crystallization particle in the thermally sprayed layer to 1 μm or less.

at This invention involves the melting and quenching of the thermal spray particles safely performed at the time of the thermal spraying.

[9] Method for producing an aluminum heat exchanger tube according to any one of the aforementioned items 1 to 8, wherein the apparent Volume fraction (filling fraction) of the soldering material in the solder layer set to 40% or more.

at This invention can be used in the solder layer a sufficient amount of solder material be ensured, which in turn the occurrence of soldering defects due to a lack of soldering material can safely prevent.

[10] Method for producing an aluminum heat exchanger tube to one of the aforementioned points 1 to 9, wherein the thermal Spraying the thermal spray particles of the thermal spraying distance from the Injection position of the thermal spray particles to the adhesion position the tube core is set to 30 to 150 mm.

at this invention can quenching etc. of the thermal spray particles performed safer become.

[11] Method for producing an aluminum heat exchanger tube according to one of the aforementioned points 1 to 10, wherein the thermal Spraying the thermal spray particles by means of an arc spraying process carried out becomes.

at This invention may include melting, etc. of the thermal spray particles performed safer become.

[12] Method for producing an aluminum heat exchanger tube according to any one of the aforementioned items 1 to 11, wherein the Si content in the thermally sprayed layer is adjusted to 6 to 15 mass%.

at This invention may be a solder layer be formed, the re the soldering performance is further improved.

[13] Method for producing an aluminum heat exchanger tube according to one of the aforementioned items 1 to 12, wherein the average Thickness of the solder layer to 3 to 50 μm is set.

at According to this invention, a stable solder layer can be formed.

[14] Method for producing an aluminum heat exchanger tube according to any one of the aforementioned items 1 to 13, wherein the surface of the thermally sprayed layer is pressed with reduction rolls, around the surface to smooth.

at This invention can be smoothing the thermally sprayed layer are continuously carried out, whereby the work efficiency is improved.

[15] Method for producing an aluminum heat exchanger tube according to one of the aforementioned items 1 to 14, wherein in the thermal sprayed layer Zn is included.

at This invention can provide a sacrificial protective layer on the tube surface be formed.

[16] A method of manufacturing an aluminum heat exchanger tube according to any one of the above ten points 1 to 15, wherein in the thermally sprayed layer Zn and Cu are included.

at This invention can provide a sacrificial protective layer on the tube surface can be formed, and also the potential of the tube surface can be set.

[17] Method for producing an aluminum heat exchanger tube according to any one of the aforementioned items 1 to 16, wherein the tube core is formed by extrusion, and wherein the thermal spray particles thermally sprayed onto the tube core immediately after the extrusion become.

at This invention may be a desired one thermally sprayed layer safely molded in an effective way which in turn makes a desired solder layer safe and efficient can be shaped.

[18] Method for producing an aluminum heat exchanger tube according to any one of the aforementioned items 1 to 17, wherein each of the Thermal spray particles in a flat state on the surface of the tube core adheres.

at This invention can quench the thermal spray particles performed efficiently become.

[19] Method for producing an aluminum heat exchanger tube according to one of the aforementioned points 1 to 18, wherein the thermal spray particles be thermally sprayed under a non-oxidizing atmosphere.

at This invention may involve the formation of an oxide film on the thermal spray particles What prevents the molding of a stable thermally sprayed Layer allows.

[20] A method of manufacturing an aluminum heat exchanger tube, the method comprising the steps of:
Forming a thermally sprayed layer on the surface of an aluminum flat tube by thermal spattering Al-Si alloy thermal spatter particles, the thermal spatter particles being thermally sprayed onto the tube core by an arc spray method, and quenching the thermally sprayed thermal spatter particles to 800 ° C or less be, and
Smooth the surface of the thermally sprayed layer to form a solder layer.

at the heat exchanger tube, which is obtained by the production method of this invention, becomes the solder layer in the same way as mentioned above by means of smoothing the surface the thermally sprayed layer, which by the thermal spraying a solder alloy obtained. A fin can safely attach to the solder layer soldered become what the occurrence of soldering defects, such as. a Finn detachment, safer prevented.

In addition, can in this invention, since the solder layer by means of smoothing the thermally sprayed layer is shaped smoothing the Brazing material filling the solder layer increase, with a sufficient amount of solder material in the solder layer can be ensured what solder defects due to a lack of Solders can safely prevent.

In addition, will in this invention, melted thermal spray particles by means of an arc spraying thermally sprayed onto the tube core and the sprayed thermal spray particles are at a predetermined Temperature quenched or underneath. Therefore, the thermal sprayed layer, compared with the case where the thermal spraying performed in one state is in which the thermal spray particles partially in one not molten state, and in which the thermal spray particles not be deterred, but gradually cooled, a reasonable brittleness be lent. For this reason, when the thermally sprayed Layer by means of smoothing the thermally sprayed layer is formed into the solder layer, only the thermally sprayed layer safely into a desired Condition are shaped. Consequently, for example, the deformation of the tube core can be effectively prevented, resulting in a high quality.

[21] A method of manufacturing an aluminum heat exchanger tube, the method comprising the steps of:
Forming a thermally sprayed layer on the surface of a flat aluminum tube by means of thermal spraying of Al-Si alloy thermal spray particles, wherein the thermal spraying is carried out by means of an arc spraying method in which the thermal spraying distance from the injection position of Ther malspritzpartikel to the sticking position on the tube core is set to 30 to 150 mm, and
Smooth the surface of the thermally sprayed layer to form a solder layer.

at the heat exchanger tube, which is obtained by the production method of this invention, can be a good soldering performance in the same way as mentioned above be ensured.

In addition, will in this invention, melted thermal spray particles by means of an arc spraying process thermally sprayed onto the tube core, and the thermal spray particles become high in kinetic energy sprayed on the tube core, thereby in a flat state to be deformed and quenched. Therefore, can on the same Kind as in the above mentioned Case a heat exchanger tube of high quality be ensured.

[22] A method of manufacturing an aluminum heat exchanger tube, the method comprising the steps of:
Forming a thermally sprayed layer on the surface of an aluminum flat tube by thermal spattering Al-Si alloy thermal spatter particles, wherein the thermal spatter particles are thermally sprayed at a thermal spray temperature of 3000 ° C or more and cooled to 800 ° C or less to cause them to adhere to the tube core, and
Smooth the surface of the thermally sprayed layer to form a solder layer.

at the heat exchanger tube, which is obtained by the production method of this invention, can be a good soldering performance in the same way as mentioned above be ensured.

In addition, will in this invention melted thermal spray particles in a high temperature sprayed on the tube core, and the sprayed Thermal spray particles are at a temperature below one quenched predetermined temperature. Therefore, in the same way as mentioned above a high quality heat exchanger tube to be provided.

[23] A method of manufacturing an aluminum heat exchanger tube, the method comprising the steps of:
Forming a thermally sprayed layer on the surface of an aluminum flat tube by thermal spattering Al-Si alloy thermal spatter particles, wherein the thermal spatter particles are thermally sprayed in the molten state and cooled to cause them to adhere to the tube core; the temperature difference between the thermal spray particles in the molten state and the thermal spray particles after cooling is set to 2500 ° C or more, and
Smooth the surface of the thermally sprayed layer to form a solder layer.

at the heat exchanger tube, which is obtained by the production method of this invention, can be a good soldering performance in the same way as mentioned above be ensured.

In addition, can in this invention, since melted thermal spray particles on the pipe core are sprayed and the sprayed thermal spray particles quenched, in the same way as mentioned above High quality heat exchanger tube provided become.

[24] Aluminum heat exchanger tube, which by the method according to a the aforementioned items 1 to 23 is produced.

The Heat exchanger tube This invention is achieved by the aforementioned manufacturing method obtained in this invention, and therefore can in the same way as mentioned above a good soldering performance and a high quality be ensured.

[25] Aluminum heat exchanger tube, comprising:
an aluminum flat tube core and
a thermally sprayed layer formed by thermal spraying thermal spray particles of a molten Al-Si alloy on the surface of the tube core,
wherein the surface of the thermally sprayed layer is smoothed to form a solder layer, and
wherein the average equivalent diameter of the Si crystallization particles in the thermally sprayed layer is set to 1 μm or less.

In the heat exchanger tube of this invention, since the solder layer can be thermally straightened by means of smoothing sprayed layer is formed, in the same way as above, a good soldering performance can be ensured.

Furthermore Is it possible, since Si crystallization in the thermally sprayed layer is low is the melting and quenching of the thermal spray particles at the time of the thermal spraying confirm, and therefore can be a heat exchanger tube of high quality to be obtained.

[26] Aluminum heat exchanger tube after the aforementioned item 25, wherein the apparent volume part (Filling rate) of the soldering material in the solder layer set to 40% or more.

at the heat exchanger tube This invention can, since the filling of the soldering material in the solder layer is high, ensuring a sufficient amount of solder material, and further, improved soldering performance can be ensured.

[27] Aluminum heat exchangers, comprising aluminum heat exchanger tubes and aluminum fins, which in an assembled state soldered the pipes are, with the heat exchanger tubes by the method according to one the aforementioned items 1 to 23 are produced.

There this is a heat exchanger specified with a heat exchanger tube is equipped as a main component, which by means of the previously mentioned method of the invention can be obtained the same kind as mentioned above the same functions and results are ensured.

[28] Aluminum heat exchangers, comprising a pair of aluminum head parts and a plurality of heat exchanger tubes, which with a fin arranged therebetween is arranged in the longitudinal direction of the head part are, wherein the end portions of the heat exchanger tubes with the head parts are connected, wherein the heat exchanger tubes by the method according to one the aforementioned items 1 to 23 are produced.

These Invention specifies the so-called parallel current or multistromic heat exchanger, the one with the heat exchanger tubes is equipped as main components, which by means of the aforementioned Manufacturing process of the invention can be obtained. Therefore, you can the same kind as mentioned above the same functions and results are ensured.

[29] A method of manufacturing an aluminum heat exchanger, the method comprising:
the step of providing an aluminum heat exchanger tube made by the method according to any one of the aforementioned items 1 to 23,
the step of providing an aluminum fin and
the step of soldering the heat exchanger tube and the fin in an assembled state.

at of this invention, because of the heat exchanger made using the heat exchanger tube which is obtained by the aforementioned manufacturing method of Invention is the same in the same manner as mentioned above Functions and results are ensured.

[30] A method of manufacturing an aluminum heat exchanger, the method comprising:
the step of providing a plurality of aluminum heat exchanger tubes manufactured by the method according to any of the above-mentioned items 1 to 23,
the step of providing a plurality of aluminum fins,
the step of providing a pair of headers,
the step of obtaining a provisional assemblage in which the plurality of heat exchanger tubes arranged with the fin interposed therebetween in the longitudinal direction of the header are assembled with the headers, the end portions of each heat exchanger tube being connected to the headers;
the step of integrally bracing adjacent heat exchanger tubes and fins by simultaneously soldering the temporary assembly.

at This invention is called the parallel-flow or multi-flow Heat exchanger under Use of heat exchanger tubes produced by the aforementioned manufacturing method of the invention. Therefore, in the same way as mentioned above the same functions and results are ensured.

[31] Cooling circuit in which a coolant, which was compressed by means of a compressor, with a condenser is condensed, wherein the condensed refrigerant is decompressed, by flowing through a decompressor, and being the decompressed coolant vaporized with an evaporator and returned to the compressor, the condenser through the aluminum heat exchanger according to point 28 is formed.

at the cooling circuit of this invention the same effects are detected

Effects of invention

As mentioned above, can according to the invention soldering defects due to a fin-replacement, an erosion of the pipe by soldering material etc., and therefore can be a good soldering performance be ensured.

The above and / or other aspects, features and / or advantages of various Become embodiments with a view to the following description in conjunction with the attached drawings better understood. Various embodiments may possibly different aspects, features and / or benefits include and / or exclude. About that can out different embodiments one or more aspects or features of other embodiments if necessary combine. The descriptions of aspects, characteristics and / or Advantages of certain embodiments should not be construed as limiting other embodiments or the claims become.

Short description the drawing

The preferred embodiments of the invention are given as an example and not as a limitation in the attached Drawing shown in which:

1 is a front view showing an aluminum heat exchanger according to an embodiment of this invention,

2 is an enlarged perspective view showing connected portions of the tubes and fins in the heat exchanger of the aforementioned embodiment,

3A is an enlarged cross-sectional view showing the tube core immediately after the thermal spraying during the manufacturing process of the heat exchanger tube according to the embodiment, and 3B is an enlarged cross-sectional view showing the tube core immediately after smoothing the thermally sprayed solder material,

4A is an enlarged cross-sectional view showing the tube core immediately after the thermal spraying in a manufacturing process of the heat exchanger tube, which is an example outside the scope of the invention, and 4B is an enlarged cross-sectional view showing the tube core immediately after the smoothing of the tube core, and

5 Fig. 13 is a front view showing a conventional heat exchanger in which a fin detachment occurred due to soldering.

Best kind to perform the invention

In the following paragraphs will be some preferred embodiments the invention described as an example and not as a limitation. Based This revelation should make it clear that based on the illustrated embodiments various other modifications made by the skilled person can be.

1 is a front view showing an aluminum heat exchanger 1 which is an embodiment of this invention. As shown in this figure, this heat exchanger becomes 1 used as a condenser for use in a refrigeration cycle of an automotive air conditioner and is a multi-flow type heat exchanger.

In this heat exchanger 1 is a plurality of horizontally disposed flat heat exchanger tubes 2 between a pair of vertical hollow headboards 4 and 4 arranged, which are parallel are arranged to each other, wherein the ends of the tubes with the hollow head parts 4 and 4 are connected. Between the neighboring pipes 2 and outside the outermost tubes is a corrugated fin 3 arranged, and a side plate 10 is outside the outermost corrugated fin 3 arranged.

In this heat exchanger 1 is called the pipe 2 uses a tube made of aluminum (including its alloy, hereinafter referred to simply as "aluminum") with predetermined portions of each component covered with brazing material 2 , Finns 3 , Headboards 4 and side plates 10 are provisionally assembled into a provisional heat exchanger assembly, and the assembly is integrally brazed in a furnace, thereby integrally brazing the entire assembly.

As in 2 shown points the tube 2 a pipe core 2a , which is an extruded aluminum element, and a solder layer 20 of Al-Si alloy as a solder alloy formed on at least one surface of the tube core.

As the core 2a of the pipe 2 For example, an Al-Mn alloy having high compression strength (high strength) and high heat resistance such as JIS3003 alloy may preferably be used.

In this embodiment, the tube core 2a formed by extruding this alloy.

It is preferable that the surface roughness R _{y of} the tube core 2a is set to less than 10 microns. That is, when the surface roughness R _y exceeds 10 μm, it occurs on the surface of the tube core 2a Capillary attraction, resulting in a slight flow of solder material, which in turn causes erosion of the tube by the solder material. Consequently, there is a possibility that soldering defects occur.

In this embodiment, the solder layer becomes 20 on the tube core 2a Shaped by a thermally sprayed layer 21 is formed by causing the Al-Si alloy to adhere to the tube core by a thermal spraying method, as in FIG 3a and then the surface of the thermally sprayed layer 21 is smoothed by squeezing the surface, as in 3B shown.

In this embodiment, although the method of performing the thermal spraying of the Al-Si alloy as a solder alloy on the surface of the tube core, although the method 2a is not limited to a specific one, when performing the thermal spraying the thermal spray particles on the tube core 2a sprayed and quenched. In other words, the thermal spraying method of this invention is not particularly limited as long as the aforementioned quenching can be performed.

In this embodiment For example, to melt the thermal spray particles, the thermal spray temperature may be used at 3000 ° C or higher or any other known means, including an agent, which uses arc spraying applied.

As a means for quenching the thermal spray particles, for example, it is preferable to adopt a method in which the thermal spray temperature of the solder alloy is set high at the time of the thermal spray, the hot thermal spray particles on the tube core 2a be injected and causes the heat of the thermal spray particles immediately after the thermal spray particles, the core element 2a have reached the tube core 2a is radiated, thereby rapidly the thermal spray particles to the temperature of the tube core element 2a cool. For example, a means for cooling the thermal spray particles whose thermal spray temperature is 3000 ° C or more to 800 ° C or less by causing them to be at the tube core 2a attach, be applied.

Concrete it is in this embodiment preferably, means for quenching the thermally sprayed Particles whose thermal spray temperature is high (4500 to 5500 ° C), on the Tube core temperature (400 to 500 ° C) immediately after the extrusion by using an arc spray method apply. Because in cases of flame spraying or high-speed flame spraying, the thermal spraying temperature compared with the arc spraying is low (2000 to 3000 ° C), exist the possibilities, that the melting of the thermal spray particles are not completed can or an increase the cooling rate is difficult and therefore the quenching is not completed can. Furthermore it is possible, that the filling proportion can degrade as they use solder alloy powder, and therefore it is not always suitable.

however Any type of thermal spray method can be used in this invention when quenching regardless of the thermal spray temperature and / or the tube core temperature can be performed. For example the quenching of the thermal spray particles by controlling the Thermalspritzabstands performed will be explained below becomes.

In this embodiment, when performing the thermal spraying, it is preferable to set the thermal spraying distance from the spraying section (spraying position) of the thermal spray gun to the tube core surface (sticking position) to 30 to 150 mm. That is, in cases where the thermal spray distance is within the aforementioned specified range, the speed of the thermal spray particles is high, and therefore, the kinetic energy of the thermal spray articles is high. For this reason, since the thermal spray particles change to a flat shape and adhere to the tube core surface when the thermal spray particles are sprayed onto the tube core surface, the filling ratio becomes high and the heat dissipation performance of the thermal spray particles onto the tube core 2a is also improved, allowing for sufficient quenching. In addition, the thermal spray distance is relatively short, that is 30 to 150 mm, resulting in a shorter arrival time of the thermal spray particles on the tube core 2a or a shorter time from the thermal spraying of the thermal spray particles until the start of cooling, which in turn enables the quenching to be performed more safely. In other words, in cases where the thermal spray distance is less than 30 mm or exceeds 150 mm, the speed of the thermal spray particles becomes lower, and therefore, sufficient kinetic energy can not be ensured, causing a lower degree of deformation of the thermal spray particles the thermal spray particles adhere to the tube core, resulting in a low filling ratio. In addition, the heat dissipation performance of the thermal spray particles on the tube core deteriorates, resulting in failure of quenching. Especially in cases where the thermal spray distance exceeds 150 mm, the thermal spray particles having a different airspeed may aggregate during the flight of the thermal spray particles. For example, large particles and small particles will aggregate to become large particles that are deposited. As a result, the thermally sprayed layer becomes 21 Hard and adequate brittleness can not be guaranteed. Consequently, as described in detail below, there is a possibility that straightening of the thermally sprayed layer 21 can not be effectively achieved, and therefore it is not preferred.

In cases where a brazing alloy is sprayed by an arc spraying method, for example, a method of scanning a thermal spray gun of an arc spraying machine with respect to the tube core may be employed 2a or a method of performing the thermal spraying while the core member 2a , which is rolled into a winding form, is unwound. In addition, in cases where the tube core 2a an extruded element, a method in which the extrusion and the thermal spraying are continuously performed while placing a thermal spray gun located immediately after the extrusion die is employed. Especially in cases where the extrusion and the thermal spraying are carried out continuously, the performance can be improved.

In addition, the surface of the thermal spray particles hardens when an oxide film is formed on the thermal spray particles at the time of the thermal spray process, resulting in a reduced deformation of the thermal spray particles due to the impact against the tube core 2a is to be caused, which may cause a deterioration of the filling content. For this reason, it is preferable to perform the thermal spattering process in a non-oxidizing atmosphere, such as a nitrogen atmosphere or an argon atmosphere, to prevent the formation of an oxide film on the thermal spatter particles. From the economical point of view it is preferred to carry out the thermal spraying in a nitrogen atmosphere.

The thermally sprayed layer 21 can only on a surface of the tube core 2a can be molded and can also be molded on both surfaces. Of course it is in cases where the thermally sprayed layer 21 is formed on both surfaces of the tube core, preferably, on the upper side and the lower side of the tube core 2a To arrange thermal spray guns.

In this embodiment, it is preferable to adjust the Si content to 6 to 15 mass% to ensure a good soldering performance, although the Si content in the thermally sprayed layer 21 is not specifically limited.

It is preferred that the thermally sprayed layer 21 Zn contains to form a sacrificial protective layer on the surface of the tube. The Zn content in the thermally sprayed layer 21 is preferably adjusted to 1 to 30 masses.

In addition, it is preferable that the thermally sprayed layer 21 For the purpose of potential adjustment, etc., Cu is contained within the range of 0.1 to 1 mass%.

In addition, the thermally sprayed layer 21 in this embodiment, other elements such as Fe, Mn, In, Sn, Ni, Ti and Cr, as long as it is within the range that does not affect the soldering performance or the corrosion resistance.

In this embodiment, after molding the thermally sprayed layer 21 on the tube core 2a , as in 3A shown the surface of the thermally sprayed layer 21 smoothed to a solder layer 20 to shape, as in 3B shown. Consequently, a heat exchanger tube 2 receive.

Although the method of smoothing the surface of the thermally sprayed layer 2 is not particularly limited, a pressing method using reduction rolls and a cutting method such as peeling (trimming) can be exemplified. Among others, the method of smoothing using reduction rolls is preferably used because the method can improve the productivity by continuous operation.

This smoothing process is preferably performed at the pipe correcting step. That is, as described above, in cases where the extrusion step of extruding the tube core 2a and the thermal spraying step of thermally spraying the brazing material on the extruded pipe member (pipe core) is performed continuously, it is usually carried out that the extruded pipe member is rolled into a winding form after the brazing thermal spraying, and then the thermally sprayed pipe is cut to a predetermined size while being unwound in the subsequent tube correction step to thereby heat exchanger tubes 2 manufacture. In the pipe correcting step, by performing the smoothening process using reduction rolls, the smoothing process can be performed simultaneously with the pipe correcting process.

In this embodiment, the surface roughness R _{y of} the smoothed solder layer 20 preferably set to 50 μm or less, more preferably to 40 μm or less. That is, in cases where the surface roughness falls within the specified range, the fin may 3 in a balanced way to the solder layer 20 be soldered, which can prevent the occurrence of soldering defects, such as a fin-detachment.

In this embodiment, the thermally sprayed layer 21 moderate brittleness are given, since the thermal spray particles are sprayed in the aforementioned thermal spraying process in the molten state and then quenched. Therefore, as in 3B shown crushing the brittle tip portions of the thermally sprayed layer 21 with rollers, etc. evenly over the entire area. Consequently, the surface of the thermally sprayed layer 21 (Surface of the solder layer) are molded securely to have a desired smooth surface. In addition, since the compression set of only the thermally sprayed layer 21 can be suitably carried out, the volume fraction (filling portion) of the solder material in the entire solder layer (apparent solder layer), which contains voids, can be improved, resulting in a sufficient amount of solder material on the pipe, which is required to perform the soldering.

In this embodiment, the filling ratio of the soldering material in the soldering layer becomes 20 preferably set at 40% or more, more preferably at 60% or more. The securing of the filling portion within the aforementioned range ensures a sufficient amount of the soldering material, which effectively prevents the occurrence of soldering defects such as a fin-peeling.

In cases where the quenching of the thermal spatter particles is deficient or a part of the thermal spatter particles (thermal spatter powder) is in a non-molten state at the time of the thermal spattering process, the rigidity of the thermally sprayed layer becomes 121 overly high, as in 4A shown. As a result, even if the pipe core 2a with the thermally sprayed layer 121 rolled by high rigidity with reduction rolls, the tube core 2a without causing any deformation of the thermally sprayed layer 121 deformed, as in this 4B shown what can cause a worse quality. In addition, since the thermally sprayed layer 121 is not densified, the filling content of the solder material in the thermally sprayed layer 121 can not be improved, which can make it difficult to ensure the necessary amount of solder material needed for soldering.

In this embodiment, it is preferable to set the average equivalent diameter of the Si crystallization in the solder layer 20 to 1 μm or less. That is, in cases where the dispersibility of Si in the solder layer 20 is good and the soldering performance is good, the Si crystallization is small. Even in cases where the brazing alloy is completely melted in the thermal spraying step and the quenching is completed, and therefore the thermal spray particles have an adequate brittleness, the crystallization of Si becomes small. Consequently, the particle diameter of Si crystallization is preferably small in this embodiment. Concretely, it is preferable to set the average equivalent diameter of Si crystallization to 1 μm or less.

Although the thickness (average thickness) of the solder layer 20 is not particularly limited, it is preferable to set the thickness to 3 to 50 μm. More preferably, the lower limit is set to 5 μm or more and the upper limit is set to 30 μm or less. That is, in cases where the thickness of the solder layer 20 is set within the aforementioned range, can connect the pipe 2 and the Finn 3 can be carried out safely, and a fin detachment etc. can be effectively prevented.

The heat exchanger tube 2 This embodiment is used with other heat exchanger components, such as hollow headers 4 and 4 , corrugated fins 3 and side plates 10 , is used and assembled to a provisional heat exchanger assembly. Thereafter, a flux is applied to this arrangement and dried. Then, the assembly is heated in a nitrogen gas atmosphere furnace to thereby integrally braze the components. In this way, the heat exchanger 1 produced.

The obtained heat exchanger 1 is free of soldering defects, such as a fin replacement, and has excellent bond strength.

That is, in the heat exchanger tube 2 this embodiment, the solder layer 20 obtained by the surface of the thermally sprayed layer 21 , which is formed by the thermal spraying of a solder alloy, is smoothed, the fin 3 in a balanced manner with the entire surface of the solder layer 20 be connected, which in turn can reliably prevent soldering defects, such as a fin-detachment.

Especially in this embodiment, the solder layer 20 when the surface roughness R _{y of} the tube core 2a is set to less than 10 μm, in a stable manner on the entire surface of the tube core 2a attached. Therefore, an unexpected flow of the molten soldering material during soldering can be effectively prevented, which can surely prevent the occurrence of defects such as erosion of the pipe by the soldering material.

Moreover, in this embodiment, the solder filling portion of the solder layer 20 be improved because the solder layer 20 by compacting the thermally sprayed layer 21 is shaped. Therefore, a sufficient amount of solder material for the solder layer 20 be ensured, which can reliably prevent the occurrence of soldering defects due to a lack of soldering material.

In addition, in this embodiment, the thermally sprayed layer 21 Since quenched, completely melted thermal spray particles are given an appropriate brittleness. Therefore, at the time of smoothing the thermally sprayed layer 21 with reduction rolls etc. only the thermally sprayed layer 21 be compacted into a desired compacted form. Consequently, crushing deformation of the tube core 2a be effectively prevented, resulting in a high quality.

In addition, in this embodiment, in cases where the surface roughness R _{y of} the solder layer 20 is set below the specific value, the fin 3 with the solder layer 20 soldered in a balanced manner, which can safely prevent the occurrence of soldering defects, such as a fin-detachment.

example

below Examples relating to the present invention and comparative examples for verifying the effects of the invention explained.

<Example 1>

As shown in Table 1, using an extrusion material of an Al alloy (Cu: 0.4 mass%, Mn: 0.21 mass%, Al: balance) with an extruder, a flat multi-hole extruded tube was prepared (Pipe core) having a width of 16 mm, a height of 3 mm and a wall thickness of 0.5 mm extruded. The surface roughness R _{y of} the obtained tube core was 10 μm.

A Al-Si alloy was produced by thermal spray guns of an arc spray machine, which at the top and the bottom of the outlet of the extruder are arranged thermally on the upper and lower surfaces of the Extruded tube sprayed to thereby a thermally sprayed Shaping layer. In this thermal spraying process, the thermal spraying distance became in the atmosphere set to 120 mm.

The melted thermal spray particles to be sprayed against the tube core Adhere to the tube core by taking off from the thermal spray temperature cooled to the temperature of the tube core by passing their heat through the pipe core was absorbed when they reached the pipe core.

In Table 1, what the degree of cooling the thermal spray particle concerns, in cases where the difference between the thermal spray temperature of the thermal spray particles and the temperature of the tube core 2500 ° C or was more, he was called "quenching", and in cases, where it was less than 2500 ° C, was he referred to as "not quenching". By doing Case of Example 1 was the thermal spray temperature of the thermal spray particles 5000 ° C, the temperature of the tube core was 400 ° C, and the temperature difference was 4600 ° C. Consequently, the degree of cooling in the Example quenching.

To performing of the thermal spraying was the aforementioned extruded tube with the thermally sprayed layer immersed in a cooling bath to cool it, and subsequently rolled continuously to a winding form.

Thereafter, the coil-shaped tube was pressed during unwinding with reduction rolls to densify the thermally sprayed layer to smoothen the surface, thereby providing a solder layer with 50% pure filling portion of the solder material (apparent filling ratio of the solder material to the solder layer), 20 μm thick and 40 microns surface roughness (R _y ) was formed, and then cut into a predetermined length to obtain heat exchanger tubes. In these tubes, the average equivalent diameter of Si crystallization was 0.7 μm.

Then the so-called multi-flow aluminum heat exchanger (see 1 ) are provisionally assembled using the aforementioned heat exchanger tubes. A slurry in which a corrosion-resistant flux was suspended in water was sprayed on the temporary heat exchanger assembly and then dried. Then, the assembly was heated at 600 ° C for 10 minutes in a nitrogen gas-atmosphere furnace to integrally braze the components to thereby obtain the heat exchanger in Example 1.

<Example 2>

As shown in Table 1, thermal spraying was performed on the extruded tube having a surface roughness R _y of 8 μm in a nitrogen atmosphere at a thermal spraying temperature of 5500 ° C and a thermal spraying distance of 60 mm by an arc spraying method. The pipe member having the thermally sprayed layer was pressed with reduction rolls to form a solder layer having 50% solder filler portion, 15 μm thick and 37 μm surface roughness R _y . Consequently, the heat exchanger tube was manufactured in the same manner as mentioned above. In this tube, the average equivalent diameter of Si crystallization was 0.1 μm.

Then was using the heat exchanger tubes in the same way as in the aforementioned example, a heat exchanger produced.

<Example 3>

As shown in Table 1, thermal spraying was performed on the extruded tube having a surface roughness R _y of 7 μm in a nitrogen atmosphere at a thermal spraying temperature of 4800 ° C and a thermal spraying distance of 60 mm by an arc spraying method. The tube The thermally sprayed layer was pressed with reduction rolls to form a solder layer having 60% solder fill, 20 μm, and 35 μm surface roughness R _y . Consequently, the heat exchanger tube was manufactured in the same manner as mentioned above. In this tube, the average equivalent diameter of Si crystallization was 0.5 μm.

Then was using the heat exchanger tubes in the same way as in the aforementioned example, a heat exchanger produced.

<Example 4>

As shown in Table 1, thermal spraying was performed on the extruded tube having 8 μm surface roughness _Ry in the atmosphere at a thermal spraying temperature of 5000 ° C and a thermal spraying distance of 80 mm by an arc spraying method. The tube member with the thermally sprayed layer was pressed with reduction rolls to form a solder layer having 50% solder filling portion, 30 μm thick and 40 μm surface roughness R _y . Consequently, the heat exchanger tube was manufactured in the same manner as mentioned above. In this tube, the average equivalent diameter of Si crystallization was 0.4 μm.

Then was using the heat exchanger tubes in the same way as in the aforementioned example, a heat exchanger produced.

<Example 5>

As shown in Table 1, thermal spattering was performed on the extruded tube having 8 μm surface roughness R _y in a nitrogen atmosphere at a thermal spray temperature of 4800 ° C. and a thermal spray distance of 120 mm by means of an arc spray method. The tubular member having the thermally sprayed layer was pressed with reduction rolls to form a solder layer having 40% solder filler portion, 20 μm thick and 40 μm surface roughness R _y . Consequently, the heat exchanger tube was manufactured in the same manner as mentioned above. In this tube, the average equivalent diameter of Si crystallization was 0.8 μm.

Then was using the heat exchanger tubes in the same way as in the aforementioned example, a heat exchanger produced.

<Example 6>

As shown in Table 1, thermal spraying was performed on the extruded tube having a surface roughness R _y of 8 μm in a nitrogen atmosphere at a thermal spraying temperature of 5000 ° C and a thermal spraying distance of 100 mm by an arc spraying method. The tube member having the thermally sprayed layer was pressed with reduction rolls to form a solder layer having 50% solder filling portion, 25 μm thick and 42 μm surface roughness R _y . Consequently, the heat exchanger tube was manufactured in the same manner as mentioned above. In this tube, the average equivalent diameter of Si crystallization was 0.6 μm.

Then was using the heat exchanger tubes in the same way as in the aforementioned example, a heat exchanger produced.

<Comparative Example 1>

As shown in Table 1, thermal spraying was performed on the extruded tube having 8 μm surface roughness _Ry in the atmosphere at a thermal spraying temperature of 5000 ° C and a thermal spraying distance of 150 mm by an arc spraying method. The solder layer having 30% solder filling portion, 60 μm thick and 60 μm surface roughness R _y was formed without performing the smoothing of the thermally sprayed layer. Thus, the heat exchanger tube was manufactured in the same manner as mentioned above. In this tube, the average equivalent diameter of Si crystallization was 0.9 μm.

Then was using the heat exchanger tubes in the same way as in the aforementioned example, a heat exchanger produced.

<Comparative Example 2>

As shown in Table 1, thermal spraying was performed on the extruded tube having 15 μm surface roughness _Ry in the atmosphere at a thermal spraying temperature of 2800 ° C. and a thermal spraying distance of 150 mm by means of a flame spraying method. The tubular member having the thermally sprayed layer was pressed with reduction rolls to form a solder layer having 30% solder filler portion, 40 μm thick and 40 μm surface roughness R _y . Consequently, the heat exchanger tube was manufactured in the same manner as mentioned above. In this tube, the average equivalent diameter of Si crystallization was 1.5 μm.

Then was using the heat exchanger tubes in the same way as in the aforementioned example, a heat exchanger produced.

<Comparative Example 3>

As shown in Table 1, thermal spraying was performed on the extruded tube having a surface roughness R _y of 10 μm in the atmosphere at a thermal spraying temperature of 2500 ° C and a thermal spraying distance of 200 mm by a flame spraying method. The solder layer with 20% solder filling portion, 40 μm thickness and 60 μm surface roughness R _y was formed without performing the smoothing of the thermally sprayed layer. Thus, the heat exchanger tube was manufactured in the same manner as mentioned above. In this tube, the average equivalent diameter of Si crystallization was 2 μm.

Then was using the heat exchanger tubes in the same way as in the aforementioned example, a heat exchanger produced.

<Comparative Example 4>

As shown in Table 1, thermal spraying was performed on the extruded tube having 40 μm surface roughness _Ry in the atmosphere at a thermal spraying temperature of 5000 ° C and a thermal spraying distance of 120 mm by an arc spraying method. The solder layer with 20% solder filling portion, 40 μm thickness and 60 μm surface roughness R _y was formed without performing the smoothing of the thermally sprayed layer. Consequently, the heat exchanger tube was manufactured in the same manner as mentioned above. In this tube, the average equivalent diameter of Si crystallization was 0.7 μm.

Then was using the heat exchanger tubes in the same way as in the aforementioned example, a heat exchanger produced.

<Comparative Example 5>

As shown in Table 1, thermal spraying was performed on the extruded tube having 30 μm surface roughness _Ry in the atmosphere at a thermal spraying temperature of 3000 ° C and a thermal spraying distance of 250 mm by means of a flame spraying method. The solder layer with 40% solder filler portion, 80 μm thick and 60 μm surface roughness R _y was formed without conducting the smoothing of the thermal sprayed layer. Consequently, the heat exchanger tube was manufactured in the same manner as mentioned above. In this tube, the average equivalent diameter of Si crystallization was 1.8 μm.

Then was using the heat exchanger tubes in the same way as in the aforementioned example, a heat exchanger produced.

<Comparative Example 6>

As shown in Table 1, thermal spraying was performed on the extruded tube having 8 μm surface roughness _Ry in the atmosphere at a thermal spraying temperature of 2600 ° C and a thermal spraying distance of 100 mm by means of a HVOF (high-speed flame) spraying method. The solder layer having 50% solder filling portion, 80 μm thick and 65 μm surface roughness R _y was formed without performing the smoothing of the thermally sprayed layer. Consequently, the heat exchanger tube was manufactured in the same manner as mentioned above. In this tube, the average equivalent diameter of Si crystallization was 2 μm.

Then was using the heat exchanger tubes in the same way as in the aforementioned example, a heat exchanger produced.

<Evaluation>

For each heat exchangers of the aforementioned Examples and Comparative Examples was the Level of connection between the fin and the pipe measured. In the Evaluation shows "⎕" that the connection degree between the fin and the tube was 95% or more, "0" indicates that the connection degree between the fin and the pipe 90% or more but less than 95% was, "Δ" indicates that the However, the degree of connection between the fin and the pipe is 60% or more was less than 90%, "X" indicates that the Connection level between the fin and the pipe less than 60% was or a Finn detachment occurred. The results of the evaluation are together in the following table 2 shown.

Table 2

As from Table 2 were used in Examples 1 to 6, which meet the requirements of this invention, soldering defects, such as a Finnish detachment, prevents and a good soldering performance ensured. Furthermore For example, in Examples 1 to 6, tube deformation due to the smoothing safely prevented, which leads to a high quality.

in the In contrast, in Comparative Examples, which was published by the Requirements of this invention differ, no good performance ensured. For example, in Comparative Examples 1, 3 or 4, in which smoothing the thermally sprayed layer was not performed and the solder fill content was low, a Finn detachment on and a good soldering performance was not ensured. Furthermore was in cases in which the melting of the thermal spray particles at the time of Thermal spraying was deficient, as in the comparative examples 2, 5 and 6, or in cases in which the quenching was deficient, the pipe at the time of smoothing the thermally sprayed layer itself pressed, causing a deterioration of the quality caused.

commercial applicability

These Invention can be applied to an aluminum heat exchanger for use in a car air conditioning refrigeration cycle, a heat exchanger tube, which for such a heat exchanger is used, and a manufacturing method thereof are used.

While the invention may be embodied in many different forms, this is one A number of illustrative embodiments are described with the understanding that the present disclosure is to be considered as providing examples of the principles of the invention and that such examples are not intended to limit the invention to preferred embodiments described herein and / or illustrated herein ,

While in here illustrative embodiments of the invention have been described, the invention is not limited to various preferred embodiments described herein limited, but includes any and all embodiments with equivalents Elements, modifications, omissions, combinations (for example from aspects about different embodiments), Adjustments and / or changes, as judged by those skilled in the art based on the present disclosure would become. The features in the claims are to be interpreted broadly based on the language used in the claims and not to limit to examples which in the description or while the prosecution of the application, the examples are not to be interpreted as exclusive. For example, in the Revelation the term "preferably" is not exclusive and means "preferably, but not limited on "in this Revelation and while The tracking of logon will be medium-plus-feature or step-plus-feature features only applied where for a specific claim feature all of the following conditions present in this feature are: a) "Medium to "or" step to "is explicitly stated, b) a corresponding function is expressly stated and c) Structure, material or actions that support this structure are not listed. In this revelation and while In pursuance of this application, the term "present invention" or "invention" may be read by reference one or more aspects within the present disclosure be used. The language in the present invention or Invention should not be improperly considered as one Kritizitätsidentifikation should not be misinterpreted in such a way that they are for all aspects or embodiments apply (i.e., it should be understood that the invention includes a number aspects and embodiments has), and should not be improperly so be interpreted that they are the scope of the application or claims confines. In this revelation and during the pursuit of this Application, the term "embodiment" can be used about any aspect, trait, process or step, any Combination of it and / or any part of it etc. In some examples, different Embodiments overlapping Have features. In this revelation and during the pursuit of this If you can the following abbreviated ones Terms "for example", which means "for example" and "NB", which means "pay close attention".

Summary

This invention relates to a method of manufacturing an aluminum heat exchanger tube. When molding a thermally sprayed layer 21 On the surface of a flat aluminum tube by thermal spattering of Al-Si alloy thermal spatter particles, the thermally sprayed thermal spatter particles are quenched in the molten state to cause them to stick to the tube core 2a adhere. The surface of the thermally sprayed layer 21 is smoothed, for example, with reduction rolls to form a solder layer 20 to shape. With this method, soldering defects due to fin detachment, erosion of the pipe by the soldering material, etc., can be avoided, resulting in good soldering performance.

Claims (31)

Method for producing an aluminum heat exchanger tube, wherein the Method comprising the following steps: Forms a thermal sprayed layer on the surface of an aluminum flat tube by thermal spraying of Al-Si alloy thermal spray particles, wherein the thermally sprayed thermal spray particles in the molten Condition quenched to cause them to the tube core attach, and Smooth the surface the thermally sprayed layer to form a solder layer. A method of manufacturing an aluminum heat exchanger tube as recited in claim 1, wherein the surface roughness _(Ry) of the tube core of less than 10 microns is adjusted. A method of manufacturing an aluminum heat exchanger tube as claimed in claim 1 or 2, wherein the surface roughness _(Ry) of the solder layer to less than 50 microns is adjusted. Method for producing an aluminum heat exchanger tube according to a the claims 1 to 3, wherein the thermal spray temperature of the thermal spray particles at 3000 ° C or more is set. Method for producing an aluminum heat exchanger tube according to a the claims 1 to 4, wherein the thermal spray particles after reaching the tube core at 800 ° C or less cooled become. Method for producing an aluminum heat exchanger tube according to a the claims 1 to 5, wherein during thermal spraying of the thermal spray particles the temperature difference between the thermal spray particles in the molten Condition and the thermal spray particles, which reaches the tube core have, in the cooled Condition at 2500 ° C or more is set. Method for producing an aluminum heat exchanger tube according to a the claims 1 to 6, wherein during thermal spraying of the thermal spray particles the thermal spray particles, which have reached the tube core through Giving off the heat cooled to the tube core become. Method for producing an aluminum heat exchanger tube according to a the claims 1 to 7, wherein the average equivalent diameter of the Si crystallization particles is set to 1 μm or less in the thermally sprayed layer. Method for producing an aluminum heat exchanger tube according to a the claims 1 to 8, wherein the apparent volume fraction (filling portion) of the solder material in the solder layer set to 40% or more. Method for producing an aluminum heat exchanger tube according to a the claims 1 to 9, wherein during thermal spraying of the thermal spray particles the thermal spraying distance from the injection position of the thermal spray particles set to the sticking position on the tube core to 30 to 150 mm becomes. Method for producing an aluminum heat exchanger tube according to a the claims 1 to 10, wherein the thermal spraying of the thermal spray particles is carried out by means of an arc spraying method. Method for producing an aluminum heat exchanger tube according to a the claims 1 to 11, wherein the Si content in the thermally sprayed layer is set to 6 to 15 mass%. Method for producing an aluminum heat exchanger tube according to a the claims 1 to 12, wherein the average thickness of the solder layer to 3 to 50 μm is set. Method for producing an aluminum heat exchanger tube according to a the claims 1 to 13, the surface the thermally sprayed layer pressed with reduction rolls will be to the surface to smooth. Method for producing an aluminum heat exchanger tube according to a the claims 1 to 14, wherein contained in the thermally sprayed layer Zn is. Method for producing an aluminum heat exchanger tube according to a the claims 1 to 15, wherein contained in the thermally sprayed layer Zn and Cu are. Method for producing an aluminum heat exchanger tube according to a the claims 1 to 16, wherein the tube core is formed by extrusion, and wherein the thermal spray particles thermally immediately after extrusion be sprayed onto the tube core. Method for producing an aluminum heat exchanger tube according to a the claims 1 to 17, wherein each of the thermal spray particles in a shallow Condition on the surface of the tube core adheres. Method for producing an aluminum heat exchanger tube according to a the claims 1 to 18, wherein the thermal spray particles under a non-oxidizing the atmosphere be thermally sprayed. A method of producing an aluminum heat exchanger tube, the method comprising the steps of: forming a thermally sprayed layer on the surface of an aluminum flat tube by thermal spraying Al-Si alloy thermal spray particles, the thermal spray particles thermally by means of an arc spraying method the tube core are sprayed, and wherein the thermally sprayed thermal spray particles are quenched to 800 ° C or less, and Smooth the surface of the thermally sprayed layer to form a solder layer. Method for producing an aluminum heat exchanger tube, wherein the Method comprising the following steps: Forms a thermal sprayed layer on the surface of an aluminum flat tube by thermal spraying of Al-Si alloy thermal spray particles, wherein the thermal spraying is performed by arc spraying, in which the thermal spraying distance from the injection position of the thermal spray particles too the sticking position on the pipe core is set to 30 to 150 mm, and Smooth the surface the thermally sprayed layer to form a solder layer. Method for producing an aluminum heat exchanger tube, wherein the Method comprising the following steps: Forms a thermal sprayed layer on the surface of an aluminum flat tube by thermal spraying of Al-Si alloy thermal spray particles, wherein the thermal spray particles have a thermal spray temperature of 3000 ° C or more thermally sprayed and cooled to 800 ° C or less, to cause them to adhere to the tube core, and Smooth the surface the thermally sprayed layer to form a solder layer. Method for producing an aluminum heat exchanger tube, wherein the Method comprising the following steps: Forms a thermal sprayed layer on the surface of an aluminum flat tube by thermal spraying of Al-Si alloy thermal spray particles, wherein the thermal spray particles in the molten state thermal be sprayed and cooled to cause them to adhere to the tube core, and wherein the temperature difference between the thermal spray particles in the molten Condition and the thermal spray particles after cooling 2500 ° C or more is set, and Smooth the surface of the thermally sprayed layer to form a solder layer. Aluminum heat exchanger tube, which by the method according to a the claims 1 to 23 is made. Aluminum heat exchanger tube, comprising: an aluminum flat tube core and a thermal sprayed layer, which by means of thermal spraying of thermal spray particles a molten Al-Si alloy on the surface of the Pipe core is shaped, the surface of the thermally sprayed Smoothed layer is to a solder layer to shape, and wherein the average equivalent diameter of the Si crystallization particles is set to 1 μm or less in the thermally sprayed layer. Aluminum heat exchanger tube according to claim 25, wherein the apparent volume fraction (filling fraction) of the soldering material in the solder layer set to 40% or more. Aluminum heat exchangers, comprising aluminum heat exchanger tubes and aluminum fins, which in an assembled state soldered the pipes are, with the heat exchanger tubes by the method according to one the claims 1 to 23 are made. Aluminum heat exchangers, comprising a few aluminum head parts and a plurality of heat exchanger tubes, which with a Finn arranged therebetween are arranged in the longitudinal direction of the head part, wherein the end portions of the heat exchanger tubes are connected to the head parts, wherein the heat exchanger tubes by means of Method according to one the claims 1 to 23 are made. Method of manufacturing an aluminum heat exchanger, the method comprising: the step of providing an aluminum heat exchanger tube, which by the method according to a the claims 1 to 23 is made, the step of providing a Aluminum fin and the step of soldering the heat exchanger tube and the fin in an assembled state. A method of manufacturing an aluminum heat exchanger, the method comprising: the step of providing a plurality of aluminum heat exchanger tubes made by the method according to any one of claims 1 to 23, the step of providing a plurality of aluminum fins . the step of providing a pair of head portions, the step of obtaining a provisional assemblage, wherein the plurality of heat exchange tubes arranged with the fin interposed therebetween in the longitudinal direction of the head portion are assembled with the head portions, the end portions of each heat exchanger Tubes are connected to the headers, the step of integrally bracing adjacent heat exchanger tubes and fins by simultaneously soldering the provisional assembly. Cooling circuit in which a coolant, which was compressed by means of a compressor, with a condenser is condensed, wherein the condensed refrigerant is decompressed, by flowing through a decompressor, and being the decompressed coolant vaporized with an evaporator and returned to the compressor, wherein the condenser through the aluminum heat exchanger according to claim 28 is formed.