DE1072045B - Verfahren und Vorrichtung zur Regelung der Flüssigkeitsströmung beim elektrolytischen Ätzen, oder Galvanisieren - Google Patents

Verfahren und Vorrichtung zur Regelung der Flüssigkeitsströmung beim elektrolytischen Ätzen, oder Galvanisieren

Info

Publication number
DE1072045B
DE1072045B DENDAT1072045D DE1072045DA DE1072045B DE 1072045 B DE1072045 B DE 1072045B DE NDAT1072045 D DENDAT1072045 D DE NDAT1072045D DE 1072045D A DE1072045D A DE 1072045DA DE 1072045 B DE1072045 B DE 1072045B
Authority
DE
Germany
Prior art keywords
workpiece
liquid
flow
impact
electrolyte
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DENDAT1072045D
Other languages
German (de)
English (en)
Inventor
Cheltenham Pa. Robert Thoma Vauighan (V. St. A.)
Original Assignee
Fhilco Corporation, Philadelphia, Pa. (V. St. A.)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication date
Publication of DE1072045B publication Critical patent/DE1072045B/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3063—Electrolytic etching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/12—Etching of semiconducting materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
DENDAT1072045D 1955-06-23 Verfahren und Vorrichtung zur Regelung der Flüssigkeitsströmung beim elektrolytischen Ätzen, oder Galvanisieren Pending DE1072045B (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US51745355A 1955-06-23 1955-06-23
US55969556A 1956-01-17 1956-01-17
US637972A US2937124A (en) 1955-06-23 1957-02-04 Method of fabricating semiconductive devices and the like

Publications (1)

Publication Number Publication Date
DE1072045B true DE1072045B (de) 1959-12-24

Family

ID=27414665

Family Applications (1)

Application Number Title Priority Date Filing Date
DENDAT1072045D Pending DE1072045B (de) 1955-06-23 Verfahren und Vorrichtung zur Regelung der Flüssigkeitsströmung beim elektrolytischen Ätzen, oder Galvanisieren

Country Status (6)

Country Link
US (1) US2937124A (instruction)
BE (1) BE564480A (instruction)
DE (1) DE1072045B (instruction)
FR (1) FR1153749A (instruction)
GB (1) GB834821A (instruction)
NL (2) NL104994C (instruction)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1163118B (de) 1956-12-03 1964-02-13 Centre Nat Rech Scient Vorrichtung zur Oberflaechenbehandlung mit Fluessigkeiten laenglich gestreckter Gegenstaende, insbesondere aus Metall
DE1225017B (de) 1957-06-05 1966-09-15 Westinghouse Electric Corp Vorrichtung zur Behandlung der Oberflaeche von Halbleiteranordnungen mit pn-UEbergang
DE1248169B (de) 1958-06-18 1967-08-24 Siemens Ag Verfahren zur Oberflaechenbehandlung von Halbleiterbauelementen mit einem stroemenden AEtzmittel
DE102005011298A1 (de) * 2005-03-04 2006-09-07 Gebr. Schmid Gmbh & Co. Vorrichtung und Verfahren zum Ätzen von Substraten

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3012921A (en) * 1958-08-20 1961-12-12 Philco Corp Controlled jet etching of semiconductor units
US3058895A (en) * 1958-11-10 1962-10-16 Anocut Eng Co Electrolytic shaping
US3039514A (en) * 1959-01-16 1962-06-19 Philco Corp Fabrication of semiconductor devices
GB919158A (en) * 1959-02-26 1963-02-20 Mullard Ltd Improvements in methods of etching bodies
NL125378C (instruction) * 1959-11-27
US3172831A (en) * 1960-06-15 1965-03-09 Anocut Eng Co Grinding machine
US3384567A (en) * 1965-10-22 1968-05-21 Gen Electric Electrolyte guide member
US3409534A (en) * 1965-12-29 1968-11-05 Gen Electric Electrolytic material removal apparatus
US3630795A (en) * 1969-07-25 1971-12-28 North American Rockwell Process and system for etching metal films using galvanic action
US3793170A (en) * 1971-06-09 1974-02-19 Trw Inc Electrochemical machining method and apparatus
GB1445296A (en) * 1973-04-21 1976-08-11 Inoue Japax Res Electrical discharge machining
GB1464404A (en) * 1974-11-06 1977-02-16 Rolls Royce Electrical leakage control in electrochemical machine tools electrolyte drains systems
US4174261A (en) * 1976-07-16 1979-11-13 Pellegrino Peter P Apparatus for electroplating, deplating or etching
DE2705158C2 (de) * 1977-02-04 1986-02-27 Schering AG, 1000 Berlin und 4709 Bergkamen Verfahren zum Teilgalvanisieren
US4289947A (en) * 1978-03-02 1981-09-15 Inoue-Japax Research Incorporated Fluid jetting system for electrical machining
JPS56102590A (en) * 1979-08-09 1981-08-17 Koichi Shimamura Method and device for plating of microarea
US4344809A (en) * 1980-09-29 1982-08-17 Wensink Ben L Jet etch apparatus for decapsulation of molded devices
US4359360A (en) * 1981-12-10 1982-11-16 The United States Of America As Represented By The Secretary Of The Air Force Apparatus for selectively jet etching a plastic encapsulating an article
US6344106B1 (en) 2000-06-12 2002-02-05 International Business Machines Corporation Apparatus, and corresponding method, for chemically etching substrates
US9645108B2 (en) * 2012-06-01 2017-05-09 California Institute Of Technology Scanning drop sensor
RU2640213C1 (ru) * 2016-12-30 2017-12-27 Федеральное государственное автономное научное учреждение "Центральный научно-исследовательский и опытно-конструкторский институт робототехники и технической кибернетики" (ЦНИИ РТК) Способ струйного электролитно-плазменного полирования металлических изделий сложного профиля и устройство для его реализации

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1114592A (en) * 1914-02-26 1914-10-20 Clinton C De Witt Hydropneumatic window-cleaning apparatus.
US1654727A (en) * 1925-07-13 1928-01-03 Green Edward William Apparatus for removing normally viscous liquid from surfaces
US1814866A (en) * 1926-09-30 1931-07-14 American Laundry Machinery Co Carpet cleaning machine
DE565765C (de) * 1929-07-24 1932-12-08 Vladimir Gusseff Verfahren und Vorrichtung zur elektrolytischen Bearbeitung von Metallen
US1982345A (en) * 1930-06-13 1934-11-27 James B Kirby Window washer
US2523018A (en) * 1946-12-12 1950-09-19 Paper Patents Co Method of cylinder etching and machine therefor
US2568803A (en) * 1949-06-09 1951-09-25 Guenst William Etching machine

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1163118B (de) 1956-12-03 1964-02-13 Centre Nat Rech Scient Vorrichtung zur Oberflaechenbehandlung mit Fluessigkeiten laenglich gestreckter Gegenstaende, insbesondere aus Metall
DE1225017B (de) 1957-06-05 1966-09-15 Westinghouse Electric Corp Vorrichtung zur Behandlung der Oberflaeche von Halbleiteranordnungen mit pn-UEbergang
DE1248169B (de) 1958-06-18 1967-08-24 Siemens Ag Verfahren zur Oberflaechenbehandlung von Halbleiterbauelementen mit einem stroemenden AEtzmittel
DE102005011298A1 (de) * 2005-03-04 2006-09-07 Gebr. Schmid Gmbh & Co. Vorrichtung und Verfahren zum Ätzen von Substraten

Also Published As

Publication number Publication date
GB834821A (en) 1960-05-11
US2937124A (en) 1960-05-17
NL104994C (instruction)
FR1153749A (fr) 1958-03-20
BE564480A (instruction)
NL208297A (instruction)

Similar Documents

Publication Publication Date Title
DE1072045B (de) Verfahren und Vorrichtung zur Regelung der Flüssigkeitsströmung beim elektrolytischen Ätzen, oder Galvanisieren
DE69724269T2 (de) Verfahren für das anisotrope ätzen von strukturen in leitende materialien
DE69823960T2 (de) Verfahren zur Herstellung eines Löcherrasiersystems
DE2750372C2 (de) Verfahren zur elektrostatischen Beschichtung und Vorrichtung dazu
DE69932540T2 (de) Verfahren und vorrichtung zur selektiven plattierung eines metallischen trägers mit mittels eines lasers abgetragenen maskierungsschicht
DE3913463C2 (instruction)
DE2520556A1 (de) Verfahren zum selektiven entfernen von material von der oberflaeche eines werkstueckes
DE1553761A1 (de) Verfahren zum UEberziehen der Schneiden von geschaerften Geraeten
DE1183600B (de) Verfahren und Vorrichtung zum Reinigen von Teilen der Oberflaeche eines Halbleiterkoerpers von Halbleiterbauelementen durch einen Fluessigkeitsstrahl
DE2133173A1 (de) Verfahren und Vorrichtung zum Abbeizen von oxydiertem Blech
DE1565553A1 (de) Elektrolyt-Leitsonde sowie Verfahren und Vorrichtung zu deren Herstellung
DE3119471C2 (instruction)
DE2632887A1 (de) Verfahren zum entfernen von material von elektrischen leitern und vorrichtung zum durchfuehren des verfahrens
EP3215294A1 (de) Verfahren und vorrichtung zur herstellung von kanülen
DE1615102A1 (de) Elektroerosive Bearbeitungselektrode
DE2143085A1 (de) Verfahren und Vorrichtung zum Bohren eines von einem Kanal abzweigenden Seitenkanals
DE2129053A1 (de) Verfahren zur Herstellung von Oberflächen-Dessinierungen
EP0353719A2 (de) Metallkontakt mit überhängenden Kanten und Herstellungsverfahren
EP0292440A1 (de) Verfahren zum elektroerosiven Schneiden
DE102020214344A1 (de) Werkzeugkathode sowie Verfahren zum Herstellen einer Werkzeugkathode zum elektrochemischen Bearbeiten
EP0973027A2 (de) Verfahren zum Herstellen einer Elektrode
DE2455363A1 (de) Verfahren zur herstellung duenner schichten aus halbleitermaterial
DE1044289B (de) Verfahren zur Herstellung einer duennen Halbleiterschicht, z. B. aus Germanium, durchelektrolytische Abaetzung der Oberflaeche eines Halbleiterkoerpers, insbesondere fuer die Herstellung von Transistoren
DE2634156B2 (instruction)
EP1368152B1 (de) Verfahren zur strukturierung einer oberfläche