DE102018205552A1 - Method for producing a sensor device, method for arranging a sensor device and chassis component with a sensor device - Google Patents

Method for producing a sensor device, method for arranging a sensor device and chassis component with a sensor device Download PDF

Info

Publication number
DE102018205552A1
DE102018205552A1 DE102018205552.1A DE102018205552A DE102018205552A1 DE 102018205552 A1 DE102018205552 A1 DE 102018205552A1 DE 102018205552 A DE102018205552 A DE 102018205552A DE 102018205552 A1 DE102018205552 A1 DE 102018205552A1
Authority
DE
Germany
Prior art keywords
sensor
layer
chassis component
transfer
carrier film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102018205552.1A
Other languages
German (de)
Inventor
Hermann Frye
Alexander Lundberg
Stefan Krahn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZF Friedrichshafen AG
Original Assignee
ZF Friedrichshafen AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZF Friedrichshafen AG filed Critical ZF Friedrichshafen AG
Priority to DE102018205552.1A priority Critical patent/DE102018205552A1/en
Publication of DE102018205552A1 publication Critical patent/DE102018205552A1/en
Ceased legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic means
    • G01B7/16Measuring arrangements characterised by the use of electric or magnetic means for measuring deformation in a solid, e.g. by resistance strain gauge
    • G01B7/18Measuring arrangements characterised by the use of electric or magnetic means for measuring deformation in a solid, e.g. by resistance strain gauge using change in resistance

Abstract

The invention relates to a method for producing a sensor device (1) for a chassis component (9), wherein the sensor device (1) is designed to detect a change in state of the chassis component (9). In order to simplify the arrangement of the sensor device (1) on the chassis component (9) and / or the production of the sensor device (1), the method is characterized in that the sensor device (1) is mounted on a transfer and / or carrier film (2). is arranged.

Description

  • The invention relates to a method for producing a sensor device for a chassis component, wherein the sensor device is designed to detect a change in state of the chassis component. Furthermore, the invention relates to a method for arranging a sensor device on a chassis component as well as a chassis component with such a sensor device.
  • Such a chassis component with a sensor device for detecting a change in state of the chassis component is known from DE 10 2014 223 657 A1 known. In this case, the sensor device has a layer of carbon nanotubes (CNT) or carbon nanotubes. This layer is formed as a adhering to a surface of the chassis component paint layer. In this case, it is disadvantageous that the application of such a lacquer layer is complicated. Particularly in the case of three-dimensional contours, application of a liquid medium to form a sensor device is complicated. Furthermore, in order to form the sensor device, an additional electrical contact has to be produced. In particular, it is disadvantageous that the sensor device is produced only on the surface of the chassis component.
  • Furthermore, the use of strain gauges is known. However, this has the disadvantage that the arrangement of such strain gauges on a chassis component is expensive. In addition, strain gauges are relatively expensive to purchase.
  • It is the object underlying the invention, a method, a sensor device and / or a chassis component of the type mentioned further such that the arrangement of the sensor device on the chassis component and / or the manufacture of the sensor device is simplified. In particular, an alternative embodiment is to be provided.
  • The object underlying the invention is achieved by a method according to claim 1, a sensor device according to claim 10, a method according to claim 11 and a chassis component according to claim 15. Preferred developments of the invention can be found in the subclaims and in the following description.
  • The method is designed for producing a sensor device for a chassis component. The sensor device may be a sensor or a sensor element. In particular, the sensor device can interact with a further sensor device or a further sensor element to form a sensor. Alternatively, the sensor device can be designed as a fully functional sensor. The sensor device is further designed to detect a change in state of the chassis component.
  • A change of state of the chassis component can be understood to mean a change in position and / or a change in position of the chassis component, in particular in relation to a vehicle body or vehicle frame. The detection of a force acting on the chassis component is preferably to be understood as detecting a change in state of the chassis component. For example, a deformation of the chassis component can be detected by means of the sensor device.
  • According to the present invention, the sensor device is arranged and / or produced on a transfer and / or carrier film.
  • It is advantageous that due to the arrangement of the sensor device on a transfer and / or carrier film, the sensor device can be arranged or applied in a simple manner on a surface of a chassis component. In particular, the sensor device can be formed at least partially or completely even before the sensor device is arranged on the chassis component. Preferably, the sensor device is produced on the transfer and / or carrier film. This allows prefabrication of the sensor device, in particular independently of the chassis component. Preferably, the transfer and / or carrier film is formed from a flexible plastic material and / or polymer. The transfer and / or carrier film can serve as a kind of carrier material for the sensor device. In particular, in the training as a transfer film, this, preferably exclusively, serve for transferring and / or applying the sensor device to a surface of the chassis component. In this case, the transfer film can be removed after the transfer and / or application of the sensor device. In training as a carrier film, this can serve to carry the sensor device. After the sensor device has been arranged on the chassis component, the carrier film preferably remains on the sensor device and / or on the chassis component.
  • According to a development, the sensor device is applied with a multilayer structure to the transfer and / or carrier film and / or produced on the transfer and / or carrier film. Thus, the sensor device can have at least two or more layers. In particular, several layers of the sensor device are applied successively. In this case, initially a first layer can be applied directly to the transfer and / or carrier film. Then at least one more Layer are applied to the first layer. Depending on requirements, further layers, in particular in the form of stacks or layers, can be applied to the transfer and / or carrier film and / or the first layer in a similar manner. In particular, the use of a transfer and / or carrier film makes it possible to apply the individual layers and / or the sensor device on a plane of the transfer and / or carrier film. Preferably, the multiple layers are deposited in individual layers on the transfer and / or carrier film and / or on each other. This makes it possible to manufacture the sensor device with high accuracy and low manufacturing tolerances.
  • According to a further embodiment, in a multilayer structure of the sensor device, the multiple layers are applied in reverse order to the transfer and / or carrier film and / or one another. In particular, an outermost layer of the sensor device is applied as a first layer to the transfer and / or carrier film. In this case, the position specification as the outermost layer refers to an intended arrangement of the sensor device on a chassis component. In particular, the outermost layer of the sensor device is remote from a surface of the chassis component in an arrangement of the sensor device on a chassis component. In that regard, an application of the plurality of layers in reverse order is to be understood that, in relation to an arrangement of the sensor device on a chassis component, not the lowermost layer or directly resting on the surface of the chassis component is first applied to the transfer and / or carrier film, Instead, the outermost and from the surface of the chassis component facing away layer is first applied to the transfer and / or carrier film. Subsequently, the desired layer-like structure of the sensor device can take place. In particular, at least one further layer is applied to the first layer and / or the transfer and / or carrier film.
  • The first layer and / or the outermost layer may be formed as a protective layer. After the arrangement of the sensor device on the chassis component, the protective layer can serve to protect the sensor device against environmental influences and / or damage. In particular, the protective layer is formed from a plastic material and / or polymer.
  • Alternatively, the transfer and / or carrier film form an innermost layer on which subsequently at least one or further layers are applied. Here, the last applied layer may be formed as an outermost layer. In this embodiment, the transfer and / or carrier film can be arranged directly or directly on the surface of the chassis component.
  • According to a development, at least one contact layer is applied for forming the sensor device. Preferably, the contact layer serves to provide an electrical contacting of a sensor layer. By means of the contact layer, the sensor layer can be connected to an evaluation device. The contact layer may have electrical conduction regions and / or electrically non-conductive isolation regions. Due to a suitable arrangement of the nonconductive isolation regions and the electrical conduction regions, suitably designed electrical contact points and / or electrical interconnects can be realized in the contact layer for the contacting of the sensor layer. Preferably, the electrical conductive regions are formed and / or manufactured by means of a conductive medium or a conductive ink. The contact layer can be applied as a first layer, inner layer and / or outermost layer directly on the transfer and / or carrier film. Preferably, the contact layer is applied to a protective layer after the protective layer has been applied to the transfer and / or carrier film as a first layer, inner layer and / or outermost layer. After the application of the contact layer, a sensor layer can be applied to the contact layer. If the chassis component or at least a portion of the surface of the chassis component is made of an electrically non-conductive material, in particular of a plastic material and / or a fiber-plastic composite, the sensor device can be arranged on the surface of the chassis component such that the sensor layer directly on the surface of the chassis component rests. In this case, a fiber-reinforced plastic composite must therefore be an electrically non-conductive fiber-plastic composite, for example a fiber-reinforced plastic composite (GFRP). However, in the case of a chassis component or a surface of the chassis component made of an electrically conductive fiber-reinforced plastic composite, for example a carbon fiber plastic composite (CFRP), this is not possible. Preferably, in the latter case, an insulating layer is provided, which rests directly on the surface of the chassis component, when the sensor device is arranged on the surface of the chassis component.
  • In particular, at least one sensor layer is applied to form the sensor device. The sensor layer can be applied directly to the transfer and / or carrier film as a first layer, inner layer or as an outermost layer. Alternatively, the sensor layer can be applied to a protective layer previously applied to the transfer and / or carrier film be applied. In particular, the sensor layer is produced as a last layer, an outermost layer or as an innermost layer. Preferably, the sensor layer is applied to a previously prepared contact layer. The sensor layer may have force-sensitive components. Preferably, the force sensitive components are formed as carbon nanotubes. Such carbon nanotubes are also referred to as so-called carbon nanotubes (CNT). In particular, these are microscopic tubular structures made of carbon. Carbon nanotubes are electrically conductive and also have the property that they change their electrical resistance under mechanical stress, such as an expansion or compression due to a force. This effect can be used to use carbon nanotubes as force-sensitive components of the sensor device. In particular, the carbon nanotubes are part of a plastic matrix. In this case, even small amounts of carbon nanotubes in the plastic matrix may suffice, so that the plastic matrix realizes the mentioned sensory properties of the carbon nanotubes. Preferably, the sensor layer is formed as a plastic matrix with carbon nanotubes. Alternatively, the force sensitive components may be formed as graphene, graphene oxide, carbon black or nanowires. In this case, the sensor layer can be arranged directly or indirectly on the surface of the chassis component. An elongation or compression of the claimed chassis component can be transmitted to the sensor layer. This results in a precise force measurement. In particular, the sensor layer is formed from a plastic material and / or a polymer, wherein the plastic material and / or the polymer is mixed with the force-sensitive components.
  • According to a further embodiment, at least one insulating layer is applied to form the sensor device. In particular, the insulating layer is applied as a last layer. After an arrangement of the sensor device on the surface of the chassis component, the last layer can also be regarded as an outermost layer or innermost layer. Preferably, the insulating layer is applied to a sensor layer during manufacture of the sensor device. Thus, after arranging the sensor device on the chassis component between the sensor layer and the surface of the chassis component, the insulating layer can be arranged, which isolates the electrically conductive sensor layer relative to an electrically conductive chassis component. Is the chassis component or the surface for arranging the sensor device made of an electrically non-conductive material can be dispensed with the insulating layer. Alternatively, the insulation layer can be applied directly to the surface of the chassis component. In this case, the insulating layer may be formed as an adhesive layer. Subsequently, at least the sensor layer is applied by means of the transfer and / or carrier film on the already arranged on the chassis component insulation layer. According to a further alternative embodiment, the insulating layer may be formed as an outermost layer, which faces away from the surface of the chassis component in an arrangement of the sensor device on the chassis component and for example, the sensor layer is isolated from the environment and / or protects
  • According to a development, the sensor device is applied to the transfer and / or carrier film by means of a printing method, a screen printing method or a digital printing method, in particular in layers. This makes it possible to realize a high degree of automation for the production of the sensor device on the transfer and / or carrier film. In particular, the sensor device can be produced independently of the provision of the chassis component. The sensor device can be completely prefabricated and provided for the arrangement on a chassis component. As a result, the sensor device can be manufactured inexpensively with high accuracy, low manufacturing tolerances and / or mass production.
  • Preferably, the sensor device is dried and / or cured after application to the transfer and / or carrier film. In particular, in a multilayer structure of the sensor device after the application of a layer, the applied layer is dried and / or cured. Thus, in the case of a multilayer structure of the sensor device, after the application of a single layer in each case, drying and / or curing can be carried out. Only after the last applied layer has been dried and / or cured is the subsequent layer applied. As a result, a high-quality construction of the sensor device can be ensured.
  • Of particular advantage is a sensor device and / or a method for arranging the sensor device according to the invention on a chassis component. In this case, the sensor device is applied to the chassis component by means of the transfer and / or carrier film. The sensor device on the transfer and / or carrier film can be completely formed and / or prefabricated. This considerably reduces the outlay for arranging the sensor device on the chassis component.
  • In particular, for arranging the sensor device on the chassis component one of the transfer and / or carrier film facing away from the sensor device placed on a surface of the chassis component. This side of the sensor device, which is remote from the transfer and / or carrier film, has preferably been produced as a last layer during the production of the sensor device. The side remote from the transfer and / or carrier film side of the sensor device may be formed as an insulating layer or as a sensor layer. In particular, when arranging the sensor device on the chassis component, the sensor device is arranged between the surface of the chassis component and the transfer and / or carrier film. Thus, the transfer and / or carrier film may be facing away from the surface of the chassis component in arranging the sensor device on the chassis component. By means of the transfer and / or carrier film and / or due to a flexible design of the transfer and / or carrier film and the sensor device, the sensor device can be arranged and / or applied both on a flat or three-dimensionally contoured or curved surface of the chassis component.
  • In particular, after the arrangement and / or setting of the sensor device on the surface of the chassis component, the transfer and / or carrier film is removed and / or detached from the sensor device. Thus, the transfer and / or carrier film can serve or be formed as a carrier material for applying the sensor device on the surface of the chassis component. Alternatively, the transfer and / or carrier film, in particular as one or another protective layer, remain on the sensor device. In this case, it is possible to dispense with the arrangement of a separate protective layer on the transfer and / or carrier film, since the transfer and / or carrier film itself at the same time also assumes the function of a protective layer. In particular, the sensor device is designed to be flexible. This allows the sensor device to adapt to the contour of the surface of the chassis component.
  • According to an alternative embodiment which is also conceivable independently of the present application, the transfer and / or carrier film is placed directly on a surface of the chassis component for arranging the sensor device on the chassis component. Thus, the transfer and / or carrier film can be arranged directly on the surface of the chassis component. In particular, the transfer and / or carrier film is bonded to the surface, preferably by means of an adhesive bond. Thus, the transfer and / or carrier film remains in this case permanently and together with the sensor device on the chassis component. In particular, when arranging the sensor device on the chassis component, the transfer and / or carrier film is arranged between the surface of the chassis component and the sensor device. On a protective layer between the transfer and / or carrier film and the contact layer and / or the sensor layer can be omitted here. The transfer and / or carrier film can also take over the function of an insulating layer in this case.
  • According to a development, the sensor device is arranged and / or fixed on the surface of the chassis component by means of pressure and / or under the action of heat. In particular, the sensor device is arranged, applied and / or fixed by means of a hot transfer pressure on the surface of the chassis component. For this purpose, a hot stamp can be used. The hot stamp can act directly on the transfer and / or carrier film for arranging the sensor device on the chassis component or contact the transfer and / or carrier film directly. By means of the hot stamp, pressure and heat can simultaneously act on the sensor device through the transfer and / or carrier film. In this way, a cohesive, adhesive and / or adhesive connection can be established between the sensor device and the surface of the chassis component.
  • Furthermore, a chassis component with a sensor device is advantageous, which is produced according to a method according to the invention and / or arranged on the chassis component according to a method according to the invention. The sensor device can be connected to an evaluation device, in particular by means of electrical conductors. Preferably, the sensor device and / or the evaluation device is connected to a power source. By means of the evaluation device, an electrical signal and / or a voltage signal, in particular of the sensor device and / or the sensor layer, can be converted into a signal which is representative of a measured change in state and / or load of the chassis component. The chassis component can be designed as a structural part, handlebar, wheel carrier, joint, a tie rod or a pendulum support.
  • In particular, the sensor device produced or arranged in accordance with the method according to the invention is a previously described sensor device. Preferably, the methods are developed in accordance with all the embodiments explained in connection with the sensor device described here and / or the suspension component described here. Furthermore, the sensor device described here and / or the suspension component described here can be further developed according to all embodiments explained in connection with the method.
  • The invention will be explained in more detail with reference to the figures. Here, the same reference numerals refer to the same, similar or functionally identical components or elements. Show it:
    • 1 a sectional side view of a sensor device according to the invention,
    • 2 a plan view of a sensor device according to the invention according to 1 .
    • 3 a partially sectioned side view of a chassis component according to the invention with the sensor device according to 1 and 2 , and
    • 4 a schematic flow diagram for a method according to the invention.
  • 1 shows a sectional side view of a sensor device according to the invention 1 , The sensor device 1 is designed to detect a change in state of a chassis component, not shown here. For arranging the sensor device on the chassis component, the sensor device 1 on a transfer and / or carrier film 2 arranged. In this embodiment, the transfer and / or carrier film is 2 made of a flexible plastic material or polymer. Also the sensor device 1 is flexible, resulting in the sensor device 1 can adapt to a contour or surface of the chassis component.
  • The sensor device 1 is directly on the transfer and / or carrier film 2 produced. In this case, the sensor device 1 a layered structure of several layers 3 . 4 . 5 . 6 on. In this embodiment, thus, the sensor device is set 1 out of a total of four layers 3 . 4 . 5 . 6 together.
  • The layer 3 is formed in this embodiment as a protective layer. The protective layer 3 is directly on the transfer and / or carrier film 2 arranged or applied. In the manufacture of the sensor device 1 becomes the protective layer 3 as a first layer on the transfer and / or carrier film 2 applied. When the sensor device 1 is arranged on the chassis component, provides the protective layer 3 an outermost layer of the sensor device 1 dar. The protective layer 3 serves to protect the other layers 4 . 5 and or 6 against environmental influences or minimizes the risk of damage.
  • The layer 4 is formed in this embodiment as a contact layer. After making the protective layer 3 becomes the contact layer 4 on one of the transfer and / or carrier film 2 opposite side of the protective layer 3 applied. The contact layer 4 has electrical conduction areas 7 on. Furthermore, the contact layer 4 electrically non-conductive insulation areas 8th on. The electrical control areas 7 are by means of non-conductive isolation areas 8th separated from each other or decoupled from each other in electrical terms. In this embodiment, the electrical conductive areas 7 formed by means of an electrically conductive ink. The non-conductive isolation areas 8th For example, they may be formed from a plastic material or polymer.
  • The contact layer 4 serves to realize an electrical contacting of the layer 5 , which is formed in this embodiment as a sensor layer. After making the contact layer 4 is the sensor layer 5 on one of the protective layer 3 or the transfer and / or carrier film 2 opposite side of the contact layer 4 been applied. The sensor layer 5 has not shown here force-sensitive components. In this embodiment, these force sensitive components are formed as carbon nanotubes. The carbon nanotubes are located in a plastic material or polymer of the sensor layer 5 ,
  • The layer 6 is formed in this embodiment as an insulating layer. After making the sensor layer 5 is the insulation layer 6 on one of the contact layer 4 , the protective layer 3 or the transfer and / or carrier film 2 remote side of the sensor layer 5 been applied. The insulation layer 6 is electrically non-conductive. For example, the insulation layer 6 made of a plastic material or polymer. In this embodiment, the sensor layer 5 also on the side of the insulation layer 6 border. This is the sensor layer 5 completely between the insulation layer 6 and the contact layer 4 capsuled. By means of the insulation layer 6 is the electrically conductive sensor layer 5 insulated with respect to the surface of an electrically conductive chassis component. When arranging the sensor device 1 on the chassis component is the insulation layer 6 arranged directly on the surface of the chassis component.
  • In the manufacture of the sensor device 1 become the individual layers 3 . 4 . 5 . 6 in each case by means of a printing process, for example a screen printing process or a digital printing process, onto the transfer and / or carrier film 2 applied. After applying the layers 3 . 4 . 5 . 6 Drying and / or curing of the layers takes place 3 . 4 . 5 . 6 , This drying and / or curing can after the manufacture or application of a single layer 3 . 4 . 5 or 6 respectively.
  • 2 shows a plan view of the sensor device according to the invention 1 according to 1 , Here you look according to 1 from above on the sensor device 1 , Furthermore, for a better illustration of the structure of the sensor layer 5 and the contact layer 4 the insulation layer 6 omitted in this illustration. In this embodiment, a total of four electrical conduction areas 7 educated. The electrical control areas 7 realize an electrical contact with the sensor layer 5 , In this embodiment, in each case two electrical conductive areas on two opposite sides of the sensor layer 5 arranged. By means of non-conductive isolation areas 8th are the electrical conductive areas 7 electrically isolated from each other. Thus, the electrical conductive areas are 7 only via the sensor layer 5 electrically in contact with each other.
  • The electrical control areas 7 are connected by means not shown here electrical conductors or conductors with an evaluation device also not shown here. Furthermore, by means of the electrical conductive areas 7 the connection with a power source not shown here realized.
  • 3 shows a partially sectioned side view of a chassis component according to the invention 9 with the sensor device according to the invention 1 , Here is the transfer and / or carrier film 2 after arranging the sensor device 1 on a surface 10 of the chassis component 9 removed or deducted. The location and positioning of the sensor device 1 is just an example here. Depending on requirements, the sensor device 1 also at a location other than shown here or in a different orientation than shown here on the chassis component 9 be arranged.
  • In case of mechanical stress or deformation of the chassis component 1 the electrical conductivity or the resistance of the sensor layer changes 5 , This change in resistance can be used to detect a change in state or deformation of the chassis component 1 be used.
  • In this embodiment, the chassis component 9 designed as a tie rod. Accordingly, the chassis component 9 formed substantially rod-shaped or rod-like. Here, the chassis component 9 in the area of a first end a thread 11 on. The thread 11 serves for connecting the chassis component 9 for example, a further link section or to a connection component. At one of the thread 11 facing away from the chassis component 9 a ball joint 12 on. The ball joint 12 has a joint ball 13 in a joint housing 14 with a connecting thread 15 is included.
  • 4 shows a schematic flow diagram for a method according to the invention. After the start according to step S10 will according to step S11 a transfer and / or carrier film 2 provided. Then, according to step S12 the sensor device 1 on the transfer and / or carrier film 2 arranged or manufactured. For this the layers become 3 . 4 . 5 . 6 consecutive to the transfer and / or carrier film 2 applied. In this embodiment, the application of the individual layers takes place 3 . 4 . 5 . 6 by means of a screen printing process or a digital printing process. In alternative embodiments, it is possible to produce the layers 3 and or 6 be waived.
  • After completing the sensor device 1 the sensor device according to step S13 by means of the transfer and / or carrier film 2 on the chassis component 9 applied. For this purpose, according to one embodiment, one of the transfer and / or carrier film 2 opposite side or the insulation layer 6 on the surface 10 of the chassis component 9 hung up. Thus, the sensor device 1 when arranging the sensor device 1 on the chassis component 9 between the surface 10 of the chassis component 9 and the transfer and / or carrier film 2 arranged.
  • Then, by means of pressure and / or under the action of heat, the sensor device 1 on the surface 10 of the chassis component 9 set. In this embodiment, the application of the sensor device takes place 1 from the transfer and / or carrier film 2 on the surface 10 by means of a hot transfer pressure. Subsequently, the transfer and / or carrier film 2 from the sensor device 1 removed or detached. Thus, only the sensor device remains 1 even on the surface 10 of the chassis component 9 , whereby the method according to step S10 finished.
  • In an alternative embodiment, the transfer and / or carrier film 2 even directly or directly on the surface 10 of the chassis component 9 be applied. In this case, the transfer and / or carrier film 2 cohesively with the surface 10 get connected. In this case, the transfer and / or carrier film remains 2 thus permanently on the chassis component 9 ,
  • LIST OF REFERENCE NUMBERS
  • 1
    sensor device
    2
    Transfer and / or carrier film
    3
    protective layer
    4
    contact layer
    5
    sensor layer
    6
    insulation layer
    7
    electrical control area
    8th
    non-conductive insulation area
    9
    chassis component
    10
    surface
    11
    thread
    12
    ball joint
    13
    joint ball
    14
    joint housing
    15
    connecting thread
  • QUOTES INCLUDE IN THE DESCRIPTION
  • This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
  • Cited patent literature
    • DE 102014223657 A1 [0002]

Claims (16)

  1. Method for producing a sensor device (1) for a chassis component (9), wherein the sensor device (1) is designed to detect a state change of the chassis component (9), characterized in that the sensor device (1) is mounted on a transfer and / or carrier film (2) is arranged.
  2. Method according to Claim 1 , characterized in that the sensor device (1) with a multilayer structure on the transfer and / or carrier film (2) is applied, in particular a plurality of layers (3, 4, 5, 6) of the sensor device (1) are applied successively.
  3. Method according to Claim 1 or 2 , characterized in that in a multilayer structure of the sensor device (1), the plurality of layers (3, 4, 5, 6) are applied in reverse order on the transfer and / or carrier film (2) and / or each other, wherein an outermost Layer (3) of the sensor device (1) is applied as a first layer on the transfer and / or carrier film (2), in particular at least one further layer (4, 5, 6) on the first layer (3) and / or the transfer and / or carrier film (2) applied.
  4. Method according to Claim 3 , characterized in that the first layer (3) is formed as a protective layer.
  5. Method according to one of the preceding claims, characterized in that for forming the sensor device (1) at least one contact layer (4) is applied, in particular, the contact layer (4) electrical conduction regions (7) and / or non-conductive isolation regions (8), preferably the electrical conductive areas (7) are formed by means of a conductive medium or a conductive ink.
  6. Method according to one of the preceding claims, characterized in that for forming the sensor device (1) at least one sensor layer (5) is applied, in particular the sensor layer (5) comprises force-sensitive components, preferably the force-sensitive components are carbon nanotubes, graphene, Graphene oxide, carbon black or nanowires formed.
  7. Method according to one of the preceding claims, characterized in that for forming the sensor device (1) at least one insulating layer (6) is applied, in particular the insulating layer (6) is applied as the last layer.
  8. Method according to one of the preceding claims, characterized in that the sensor device (1) by means of a printing method, a screen printing method or a digital printing method, in particular layers, is applied to the transfer and / or carrier film (2).
  9. Method according to one of the preceding claims, characterized in that the sensor device (1) after application to the transfer and / or carrier film (2) is dried and / or cured, in particular in a multilayer structure of the sensor device (1) after Applying a layer (3, 4, 5, 6), the applied layer (3, 4, 5, 6) dried and / or cured.
  10. Sensor device which is produced by a method according to one of the preceding claims and arranged on a transfer and / or carrier film (2).
  11. Method for arranging a sensor device (1), in particular produced according to one of the Claims 1 to 9 on a chassis component (9), characterized in that the sensor device (1) is applied to the chassis component (9) by means of a transfer and / or carrier film (2).
  12. Method according to Claim 11 , characterized in that for arranging the sensor device (1) on the chassis component (9) facing away from the transfer and / or carrier film (2) side of the sensor device (1) on a surface (10) of the chassis component (9) is placed In particular, when the sensor device (1) is arranged on the chassis component (9), the sensor device (1) is arranged between the surface (10) of the chassis component (9) and the transfer and / or carrier film (2).
  13. Method according to Claim 11 or 12 , characterized in that the transfer and / or carrier film (2) after arranging and / or setting the sensor device (1) on a surface (10) of the chassis component (9) from the sensor device (1) removed and / or detached ,
  14. Method according to Claim 11 , characterized in that for arranging the sensor device (1) on the chassis component (9) the transfer and / or carrier film (2) is placed directly on a surface (10) of the chassis component (9), in particular the transfer and / or or carrier film (2) when arranging the sensor device (1) on the chassis component (9) between the surface (10) of the chassis component (9) and the sensor device (1).
  15. Method according to one of Claim 11 to 14 , characterized in that the sensor device (1) by means of pressure and / or under the action of heat on the surface (10) of the chassis component (9) is arranged and / or fixed, in particular the sensor device (1) by means of a hot transfer pressure, preferably by means of a hot stamp , arranged on the surface (10) of the chassis component (9) and / or fixed.
  16. Chassis component with a sensor device (1), which according to a method according to one of Claims 1 to 9 is manufactured and / or according to a method according to one of Claims 11 to 15 is arranged on the chassis component (9).
DE102018205552.1A 2018-04-12 2018-04-12 Method for producing a sensor device, method for arranging a sensor device and chassis component with a sensor device Ceased DE102018205552A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE102018205552.1A DE102018205552A1 (en) 2018-04-12 2018-04-12 Method for producing a sensor device, method for arranging a sensor device and chassis component with a sensor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018205552.1A DE102018205552A1 (en) 2018-04-12 2018-04-12 Method for producing a sensor device, method for arranging a sensor device and chassis component with a sensor device
PCT/EP2019/056095 WO2019197102A1 (en) 2018-04-12 2019-03-12 Method for producing a sensor device, method for arranging a sensor device, and chassis component having a sensor device

Publications (1)

Publication Number Publication Date
DE102018205552A1 true DE102018205552A1 (en) 2019-10-17

Family

ID=65763459

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102018205552.1A Ceased DE102018205552A1 (en) 2018-04-12 2018-04-12 Method for producing a sensor device, method for arranging a sensor device and chassis component with a sensor device

Country Status (2)

Country Link
DE (1) DE102018205552A1 (en)
WO (1) WO2019197102A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020193025A1 (en) 2019-03-26 2020-10-01 Zf Friedrichshafen Ag Sensor device for measuring an instantaneous load on a component, and component and/or chassis component having such a sensor device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4050976A (en) * 1976-01-27 1977-09-27 Bofors America, Inc. Strain gage application
DE4024128A1 (en) * 1990-07-30 1992-02-13 Hottinger Messtechnik Baldwin METHOD FOR PRODUCING AND APPLYING A STRETCH MEASURING STRIP
DE4236985C1 (en) * 1992-11-04 1994-02-24 Hottinger Messtechnik Baldwin Strain gauges
DE102006061798A1 (en) * 2006-12-21 2008-06-26 Simons, Gisela Method for applying characteristic of substrate surfaces with the help of transfer method, involves imprinting of release carrier foil and transfer layer has radio-frequency identification kit
US20090205443A1 (en) * 2006-03-30 2009-08-20 Jtekt Corporation Strain Gauge Manufacturing Method
US20120092182A1 (en) * 2010-10-19 2012-04-19 Palo Alto Research Center Incorporated Method For Event Sensing Employing A Printed Event Sensor
DE102014223657A1 (en) 2014-11-20 2016-05-25 Zf Friedrichshafen Ag Mechanical component with a force sensor

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT507855A1 (en) * 2009-01-20 2010-08-15 Lang Leonh bioelectrode
DE102010054970B4 (en) * 2010-12-09 2015-06-11 Hydac Electronic Gmbh Device for converting an expansion and / or compression into an electrical signal, in particular a strain gauge film
DE102014200443B4 (en) * 2014-01-13 2019-10-10 Technische Universität Dresden Sensor element for determining strains
DE102016204557A1 (en) * 2016-03-18 2017-09-21 Zf Friedrichshafen Ag Sensor device, measuring device, motor vehicle and method for detecting a current deformation of a component

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4050976A (en) * 1976-01-27 1977-09-27 Bofors America, Inc. Strain gage application
DE4024128A1 (en) * 1990-07-30 1992-02-13 Hottinger Messtechnik Baldwin METHOD FOR PRODUCING AND APPLYING A STRETCH MEASURING STRIP
DE4236985C1 (en) * 1992-11-04 1994-02-24 Hottinger Messtechnik Baldwin Strain gauges
US20090205443A1 (en) * 2006-03-30 2009-08-20 Jtekt Corporation Strain Gauge Manufacturing Method
DE102006061798A1 (en) * 2006-12-21 2008-06-26 Simons, Gisela Method for applying characteristic of substrate surfaces with the help of transfer method, involves imprinting of release carrier foil and transfer layer has radio-frequency identification kit
US20120092182A1 (en) * 2010-10-19 2012-04-19 Palo Alto Research Center Incorporated Method For Event Sensing Employing A Printed Event Sensor
DE102014223657A1 (en) 2014-11-20 2016-05-25 Zf Friedrichshafen Ag Mechanical component with a force sensor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020193025A1 (en) 2019-03-26 2020-10-01 Zf Friedrichshafen Ag Sensor device for measuring an instantaneous load on a component, and component and/or chassis component having such a sensor device
DE102019204177A1 (en) * 2019-03-26 2020-10-01 Zf Friedrichshafen Ag Sensor device for measuring a momentary load on a component as well as component and / or chassis component with such a sensor device

Also Published As

Publication number Publication date
WO2019197102A1 (en) 2019-10-17

Similar Documents

Publication Publication Date Title
US10524362B2 (en) Circuitized structure with 3-dimensional configuration
Wan et al. Graphene oxide as high-performance dielectric materials for capacitive pressure sensors
Wang et al. Silk‐molded flexible, ultrasensitive, and highly stable electronic skin for monitoring human physiological signals
Valentine et al. Hybrid 3D printing of soft electronics
Kim et al. Highly sensitive and multimodal all‐carbon skin sensors capable of simultaneously detecting tactile and biological stimuli
Park et al. Flexible piezoresistive pressure sensor using wrinkled carbon nanotube thin films for human physiological signals
Yao et al. A flexible and highly pressure‐sensitive graphene–polyurethane sponge based on fractured microstructure design
Slobodian et al. A highly-deformable composite composed of an entangled network of electrically-conductive carbon-nanotubes embedded in elastic polyurethane
Bae et al. Pressure/temperature sensing bimodal electronic skin with stimulus discriminability and linear sensitivity
Ding et al. Flexible and compressible PEDOT: PSS@ Melamine conductive sponge prepared via one-step dip coating as piezoresistive pressure sensor for human motion detection
You et al. A wearable piezocapacitive pressure sensor with a single layer of silver nanowire-based elastomeric composite electrodes
US8127623B2 (en) Capacitive tactile tile sensor
JP6352394B2 (en) Brake element with integrated sensor, and more particularly a method of manufacturing a brake pad, a brake pad with integrated sensor, a vehicle brake system, and related methods
Yang et al. Gauge factor and stretchability of silicon-on-polymer strain gauges
US20160349134A1 (en) Flexible pressure sensor using amorphous metal and flexible bimodal sensor for simultaneously sensing pressure and temperature
Loh et al. Tailoring piezoresistive sensitivity of multilayer carbon nanotube composite strain sensors
EP1605528B1 (en) Piezoelectric ceramic fibers having metallic cores
DE60224844T2 (en) Dielectric actuator or sensor structure and manufacturing method
US7127948B2 (en) Piezoelectric sensor, sensor array, and associated method for measuring pressure
KR102081892B1 (en) Resistive pressure sensor including piezo-resistive electrode
US8943897B2 (en) Carbon nanotubes based sensing elements and system for monitoring and mapping force, strain and stress
US6951143B1 (en) Three-axis sensor assembly for use in an elastomeric material
CN106197772B (en) Flexible pressure sensor and preparation method thereof
Choi et al. Ultra-sensitive pressure sensor based on guided straight mechanical cracks
Dong et al. A linear and large-range pressure sensor based on a graphene/silver nanowires nanobiocomposites network and a hierarchical structural sponge

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R016 Response to examination communication
R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final