DE102017007198A1 - Contaminationsfei coolable, enclosed, in operation heat-releasing, electrical and / or electronic components and devices - Google Patents

Contaminationsfei coolable, enclosed, in operation heat-releasing, electrical and / or electronic components and devices

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Publication number
DE102017007198A1
DE102017007198A1 DE102017007198.5A DE102017007198A DE102017007198A1 DE 102017007198 A1 DE102017007198 A1 DE 102017007198A1 DE 102017007198 A DE102017007198 A DE 102017007198A DE 102017007198 A1 DE102017007198 A1 DE 102017007198A1
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Prior art keywords
heat
electrical
device
conducting
devices
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Pending
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DE102017007198.5A
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German (de)
Inventor
Gregor Luthe
Silke Schäfers
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Smartbee GbR (vertretungsberechtigte Gesellschafter Wind Plus Sonne 48599 Gronau Smart Material Printing BV Enschede Nl Newline Soft Gmbh 48599 Gronau Mb Beteiligungen Unternehmergesellschaft (haftungsbeschrankt) 48683 Ahaus) GmbH
Smartbee GbR Vertretungsberechtigte Gesellschafter Wind Plus Sonne 48599 Gronau Smart Mat Print GmbH
Original Assignee
Smartbee GbR (vertretungsberechtigte Gesellschafter Wind Plus Sonne 48599 Gronau Smart Material Printing BV Enschede Nl Newline Soft Gmbh 48599 Gronau Mb Beteiligungen Unternehmergesellschaft (haftungsbeschrankt) 48683 Ahaus) GmbH
Smartbee GbR Vertretungsberechtigte Gesellschafter Wind Plus Sonne 48599 Gronau Smart Mat Print GmbH
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Priority to DE102017007198.5A priority Critical patent/DE102017007198A1/en
Publication of DE102017007198A1 publication Critical patent/DE102017007198A1/en
Application status is Pending legal-status Critical

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/202Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT-PUMP SYSTEMS
    • F25B21/00Machines, plant, or systems, using electric or magnetic effects
    • F25B21/02Machines, plant, or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT-PUMP SYSTEMS
    • F25B2321/00Details of machines, plants, or systems, using electric or magnetic effects
    • F25B2321/02Details of machines, plants, or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025Removal of heat
    • F25B2321/0251Removal of heat by a gas

Abstract

1, each comprising a closed housing (2) with an inner side (2.1) and an outer side (2.2), which is a component and / or device (1) encloses, - a Peltier element (3), the cold side (3.1) of the component and / or device (1) is facing at a distance or in a direct heat-conducting, electrically insulating contact with the component and / or device (1) and whose hot side (3.2) is in heat-conducting contact with the outside (2.2), - a device (4) for directing the heat released to the not in a direct heat-conducting, electrically insulating contact with the Component and / or the device (1) standing cold side (3.1) of the Peltier element (3) and at least device (5) for dissipating the heat from the hot side (3.2) of the Peltier element (3) to the outside ( 2.2) and to one Heat sink (6) in the environment (2.4),

Description

  • Field of the invention
  • The present invention relates to contamination-free, cooled, enclosed in operation heat-releasing, electrical and electronic components and devices.
  • Moreover, the present invention relates to a method for the contamination-free cooling of enclosed, heat-dissipating, electrical and electronic components and devices without contamination of the interior of the components and the devices.
  • Last but not least, the present invention relates to the use of the contamination-free coolable, enclosed, heat-dissipating during operation, electrical and electronic components and devices in clean rooms, clean rooms, operating theaters, intensive care units, isolation stations and microbiological, biological, analytical, medical, pharmacological, nanotechnological or electrical engineering, Research facilities and production facilities as well as in research facilities and production facilities for wafers, data carriers, microchips, smartphones and computers as well as in aviation and aerospace technical research facilities and production facilities.
  • State of the art
  • The prior art cited in the present application is incorporated by reference into the present application.
  • Enclosed enclosures, electrical and electronic components and devices can generate significant amounts of heat during operation. This must be dissipated so that the heat does not damage the components and the devices themselves, their environment and / or the operating personnel and / or other persons such as patients and / or other living beings. Usually, the cooling is done by ventilation, in which an air flow is blown or sucked through the housing on or by the heat-emitting electrical or electronic components and devices. However, this requires air intakes and air outlets in the housings. However, such a method involves a high risk of contamination, in particular by microorganisms such as bacteria, fungi, viruses, protozoa, microalgae and archaea, spores, pollen, particulate matter, particulate matter, suspended solids, aerosols, chemical contaminants and / or nanoparticles, the electric and electronic components and devices. In the worst case, even small animals and micro animals can penetrate.
  • Thermoelectric elements (TEE) or Thermoelectric Coolers (TEC), also known as Peltier elements, are electrothermal transducers that produce a temperature difference when current flows, or a current flow at temperature difference. Basically, a TEC includes two legs made of different thermoelectric materials having different Seebeck coefficients, which are electrically conductively connected to each other at a pad or in a contact region. An elevated temperature in the contact area compared to the temperature of the other ends of the legs causes an electrical voltage (thermal voltage) between the two thermoelectric materials due to the thermoelectric effect. When the circuit is closed then flows an electric current. A TEC may be constructed of several such Peltier elements, which may be connected in series and / or in parallel to achieve a higher temperature or higher current. In most cases, a combination of both interconnections is used. When connected in series, there is a contact area on both sides of the legs, which must be electrically isolated from the other legs.
  • Peltier elements are used, for example, for cooling coolers for camping and for cooling processors.
  • An electric current of current intensity I sets the amount of heat at the interface between two different conductors A and B with the Peltier coefficients PiA and PiB (Equation 1) W ˙ = Π FROM I = ( Π A - Π B ) I
    Figure DE102017007198A1_0001
    free. The sign of Ẇ depends on the current direction. A negative sign of Ẇ means that heat is removed from the contact between the two conductors. It is, in contrast to the generation of Joule heat, a reversible process.
  • The Peltier effect is due to the fact that in a homogeneous conductor of constant temperature with an electric current also flows a heat flow at the same time. Its size is given by π • I. The Peltier heat (Equation 1) represents the excess or deficit between the heat flowing in and out at the contact point. This isothermal heat flow is caused by the fact that not all conduction electrons have the same flow velocity in an electric current. The latter depends on the energy of the electrons. For example, if the conduction electrons with a higher energy than their chemical potential (see below) receive a higher velocity than those with lower energy, the electric charge current is associated with an oppositely directed heat flow because of the negative sign of the electron charge. The Peltier coefficient is then negative. The same is true for a doped semiconductor in which the electric current of electrons is carried in conduction band states.
  • Between the absolute thermo power Q and the Peltier coefficient π of a conductor, the relation already found by Kelvin (equation 2 ) Π = T · Q .
    Figure DE102017007198A1_0002
    however, this could only be validly justified within the framework of the kinetic theory for the conduction electrons or the theory of irreversible thermodynamics. The Kelvin relation (2) combines the material constants for two very different physical effects, one of which (Peltier effect) has the simple explanation given above.
  • A heat pipe is a gas-tight, sealed component that can be used to transport thermal energy and / or heat very efficiently from one location to another. It can transport 100 to 1,000 times higher thermal energy than a component of the same geometric dimensions made of solid copper. The heat pipe uses the physical effect of converting very large amounts of energy when vaporizing and condensing a liquid. Furthermore, the heat pipe is hollow from the inside and filled with a small amount of liquid, the "working" liquid. This is under its vapor pressure, which can be well below the atmospheric pressure at low temperatures. The inner wall of the heat pipe can be covered with a capillary structure - comparable to a wick. This capillary structure is saturated with a liquid heat transport medium, the "working" liquid.
  • If energy is supplied at one point of the heat pipe, the "working" liquid from the capillary structure evaporates there. The steam flows in the direction of the temperature gradient and condenses everywhere, releasing the heat of vaporization, where energy is dissipated. The condensate, the liquefied heat transfer agent, is absorbed by the capillary structure and flows back to re-evaporate. It closes a cycle that quickly circulates and very effectively transports thermal energy. The temperature difference between the evaporation and condensation zone in the heat pipe is very low.
  • Depending on which temperature range is used, different "working" liquids are used, such as water in the temperature range of about 170 to 600 ° K, ammonia in the temperature range of about 150 to 170 ° K, mercury in the temperature range of 400 to 800 ° K. or lithium or silver in a temperature range above 1000 ° K.
  • Heat pipes can be used for example in TEC / heat pipe cooling systems.
  • From German patent application DE 10 2011 056 877 A1 a device for the conversion of thermal energy into electrical energy is known. This comprises at least one source of thermal energy, at least one heat pipe, at least one thermoelectric element and at least one heat dissipating device, wherein the heat pipe with its one end in thermally conductive contact with the source of thermal energy and with its other end in electrically insulating, thermally conductive contact with is the hot side of the thermoelectric element and wherein the hot side opposite cold side of the thermoelectric element is in electrically insulating, thermally conductive contact with the heat dissipating device. As heat sources or sources of thermal energy are flat collectors, vacuum tube collectors, photovoltaic cells, solar cells, radiators, components of stoves and underfloor heating, current transformers, the underside of automobiles, engine blocks, exhaust systems, flue pipes, exhaust stacks, containers with materials that generate thermal energy during the phase transformation , electrical resistors, hot water bags, biogas plants, human and animal bodies or solar concentrators. The heat-dissipating device are inorganic and organic gases, inorganic and organic liquids, inorganic and organic sublimable solids, cooling fins, heat exchangers, tube cooling bodies, motors, turbines, devices for carrying out the Rankine method. Cycle and large surface heating called. From the hot side of the thermoelectric element, the thermal energy can be transported through heat pipes to the heat-dissipating devices.
  • In the above publication, there are no suggestions or indications as to whether the known device is suitable for cooling systems of closed electrical and electronic components and devices without contamination of the interior of the components and devices.
  • From the American patent application US 2017/0199554 A1 For example, a device for cooling a graphics processor (GPU) and a central processor (CPU) is known in which a TEC is located at a distance from the processors. The cold side of the TEC is thermally bonded to the processors with a thermally conductive plate of iron, aluminum or an iron / aluminum alloy. The heat is conducted from the hot side of the TEC via a heat pipe to a heat sink. The heat sink comprises a plurality of fans each having an air inlet and an air outlet. There is still the danger of contamination of the electrical and electronic components inside the computer.
  • Object of the invention
  • It is an object of the present invention to provide electrical, electronic and / or electronic components and / or devices which are free of contamination, can be cooled and are enclosed during operation.
  • In addition, the object of the present invention was to provide a method for the contamination-free cooling of enclosed, heat-releasing, electrical and / or electronic components and / or devices.
  • Last but not least, the present invention was based on the object, advantageous applications for the contamination free coolable, enclosed, heat dissipating in operation, electrical and / or electronic components and / or devices in clean rooms, clean rooms, operating theaters, intensive care units, isolation stations and microbiological, biological, analytical, medical, pharmacological, nanotechnological or electrical engineering, research facilities and production facilities, as well as in research facilities and production facilities for wafers, data carriers, microchips, smartphones and computers, as well as in aviation and aerospace research facilities and manufacturing facilities.
  • Inventive solution
  • Accordingly, the new contamination free coolable, enclosed, heat dissipating in operation, electrical and / or electronic components and devices were found, respectively
    • - at least one closed housing with an inner side and an outer side, which surrounds at least one electrical and / or electronic component and / or device which releases heat during operation,
    • - At least one Peltier element, the cold side of the at least one heat-emitting during operation, electrical and / or electronic component and / or device is at a distance or in a direct heat-conducting, electrically insulating contact with the electrical and / or electronic component and / or device stands and whose hot side is in heat-conducting contact with the outside,
    • - At least one device for directing the heat emitted to the not in a direct heat-conducting, electrically insulating contact with the at least one electrical and / or electronic component and / or the at least one device cold side of the at least one Peltier element and
    • at least device for dissipating the heat from the hot side ( 3.2 ) of the at least one Peltier element to a heat sink in the environment
    and hereinafter referred to as "components and devices according to the invention".
  • In addition, a method for contamination-free cooling of enclosed, heat-dissipating, electrical and / or electronic components and devices has been found, wherein at least one contamination free coolable, enclosed, heat-dissipating during operation, electrical and / or electronic component and / or device , full
    • at least one closed housing having an inner side and an outer side enclosing at least one electrical and / or electronic component and / or device emitting heat during operation,
    • - At least one Peltier element, the cold side of the at least one heat-emitting during operation, electrical and / or electronic component and / or device is at a distance or in a direct heat-conducting, electrically insulating contact with the electrical and / or electronic component and / or device stands and whose hot side is in heat-conducting contact with the outside,
    • - At least one device for directing the heat emitted to the not in a direct heat-conducting, electrically insulating contact with the at least one electrical and / or electronic component and / or the at least one device cold side of the at least one Peltier element and
    • at least means for dissipating the heat from the hot side of the at least one Peltier element to a heat sink in the environment,
    puts into operation, applies a controllable electrical voltage to the at least one Peltier element and feeds the heat emitted via the at least one device for conducting the heat given off or directly to the cold side of the at least one Peltier element and at least one device from the hot Derive side to outside.
  • In the following, this process is referred to as "cooling method according to the invention".
  • Last but not least, the use of contamination-free coolable, enclosed, heat-dissipating, electrical and / or electronic components and devices in clean rooms, clean rooms, operating theaters, intensive care units, isolation stations and microbiological, biological, analytical, medical, pharmacological, nanotechnological or electrical research facilities and production facilities as well as in research facilities and production facilities for wafers, data carriers, microchips, smartphones and computers as well as in aviation and aerospace technical research facilities and production facilities found, which is hereinafter referred to as "inventive use".
  • Advantages of the invention
  • In view of the prior art, it was surprising and unforeseeable for the skilled person that the object underlying the present invention could be achieved by means of the components and devices according to the invention, the cooling method according to the invention and the use according to the invention.
  • In particular, it was surprising that the components and devices according to the invention, the cooling method according to the invention and the use according to the invention prevent the spread of contaminants, e.g. in hospitals, medical practices, solariums, saunas, public buildings, schools, shopping malls, theaters, cinemas, airports, airplanes, train stations, trains, buses, cruise liners, research facilities or production facilities could be effectively contained or prevented from the outset.
  • Another important advantage of the invention was that it was now possible to separate the encapsulated electronic heart with TEC cooling from the periphery of the device according to the invention. Thereafter, the two components could be cleaned separately, so that they could be sterilized particularly easily and the water protection of electronic devices could be significantly increased.
  • Detailed description of the invention
  • The components and devices according to the invention can be cooled without contamination. "Contamination-free" means that the components and devices of the present invention can be effectively cooled using the cooling method of the present invention without causing contaminants such as small animals such as mice, small animals such as arthropods such as insects, centipedes, crustaceans, spiders, mites and scorpions, microorganisms such as bacteria, fungi , Viruses, protozoa and archaea, pollen, dust, particulate matter, particulate matter, particulate matter, aerosols, chemical contaminants such as water, solvents, oils, acids, bases and other organic and inorganic solids in the form of nanoparticles and microparticles in the at least one closed housing , which is part of the components and devices according to the invention, can penetrate.
  • The at least one closed housing has an inner side and an outer side and encloses at least one electrical and / or electronic component and / or device which releases heat during operation. As a result, the components and devices according to the invention are very well protected against harmful effects from the outside, but at the same time they can be perfectly cooled using the cooling method according to the invention.
  • The at least one closed housing is made of a thermally and mechanically stable material. The material may be transparent or opaque or substantially opaque with transparent viewing windows for testing the closed interior of the at least one housing. Preferably, it is made of glass, metal, plastic, wood and / or composites of at least two of these materials.
  • Furthermore, the closed housing may be electrically insulating and / or shielding against electromagnetic radiation and / or against magnetic fields, at least one opening which is gas-permeable but impermeable to microorganisms, particulate matter, particulate matter, suspended solids and aerosols, at least one pressure relief valve with non-return valve and / or have at least one pressure-compensating membrane, and / or its interior may be filled with air, inert gas such as carbon dioxide, nitrogen and / or sulfur hexafluoride and / or a nonpolar and / or non-flammable or liquid, such as halogenated oils.
  • The components according to the invention may be active electrical and electronic components. Examples of active devices include semiconductor devices, diodes, transistors, integrated circuits, processors, and electric motors. In addition, it may be passive components according to the invention such as resistors, capacitors and coils.
  • The devices according to the invention are preferably devices for use in clean rooms, clean rooms, operating theaters, intensive care units, isolation stations as well as microbiological, biological, analytical, medical, pharmacological, nanotechnological or electrotechnical research facilities and production facilities as well as in research facilities and production facilities for wafers, data carriers, Microchips, processors, smartphones, and computers, as well as aviation and aerospace engineering research facilities and manufacturing facilities.
  • Examples of such devices according to the invention are data processing systems, computers, notebooks, iPads, smartphones, intercoms and other communication systems, microscopes, electron microscopes, AFM devices, air conditioners and in particular medical devices such as anesthesia equipment, respirators, radiation equipment, defibrillators, dialysis machines, contact lens cleaners, cleaning disinfection machines diagnostic imaging equipment such as x-ray equipment, CT, MR, PET, nuclear radiation and ultrasound equipment, radiotherapy equipment, patient monitoring and life support equipment, in vitro diagnostic and dental laboratory equipment, endoscopes and accessories such as insufflators, Pumps, suction devices and flushing devices, drives for motorized instruments with accessories, sterile water filter systems, disinfection machines, gas humidifying devices, dental equipment for diagnostics and therapy, sterilizers, instrument disinfection and cleaning systems, hearing aids, audiometers, optometry devices, injectors, neurological diagnostic equipment, cardiac diagnostic equipment, incubators, neonatal thermal therapy, surgical and intensive care equipment, electric hospital beds, medical archiving and database systems Purposes, ceiling and patient care equipment, hospital communication systems and call systems, ergometers, examination chairs and couches, examination lights, patient handling equipment such as patient lifts and bath and shower systems, endoscopic video systems with power supplies and accessories such as video endoscopes, endocameras, monitors, Light sources, processors and control computers, image processing apparatus, recording apparatus, and archiving and storage systems, therapeutic and diagnostic light sources with accessories, tissue resection and coagulation systems, electrosurgical apparatus with Accessories such as electrosurgical units for HF surgery, electrocautery, ultrasound machines, water jet systems and laser systems, surgical control systems such as device networking systems, voice control systems and logistics systems, assistance and robotic systems, navigation systems, surgical and dental devices with accessories such as propulsion and irrigation equipment, therapeutic lithotripsy devices such as laser illuminators for intracorporeal use, electrosurgical pneumatics and ultrasound, and accessories such as sonotrodes and transducers, extracorporeal shockwave lithotripsy, shockwave therapy devices and systems and accessories, therapeutic stimulation devices, training simulators for endoscopic applications, AED (automatic electrical defibrillator) pulse and sphygmomanometers, electric clinical thermometers , Blood glucose meters, blood clotting gauges, electric wheelchairs, red light bulbs and apnea devices.
  • However, the components and devices according to the invention can also be used excellently in aviation and space technology.
  • An essential part of the components and devices according to the invention is at least one Peltier element (TEC, thermolectric cooler). Its principle of operation is described in detail in the beginning and therefore does not need to be repeated here. Peltier elements are commercially available in a wide variety of embodiments so that the most suitable TECs for the particular application can be readily selected by those skilled in the art, with the aid of their general knowledge. However, newer developments such as thin printed TEC, TEC films and flexible TEC are also possible. The material for the TEC may be made of ground and pressed material to produce magnons as the collective excited state of a magnetic system having bosonic quasiparticle characteristics. The cooling capacity of the Peltier element is controlled by the applied electrical voltage and current. The regulation can be done manually or by means of a data processing system.
  • In a first embodiment, the at least one Peltier element, with its cold side, emits at least one component or device according to the invention at a distance away from the heat given off during operation.
  • In a further embodiment, the cold side of the at least one Peltier element is in a direct heat-conducting, electrically insulating contact with the at least one component and / or device according to the invention.
  • In both embodiments, the hot side of the at least one Peltier element is in heat-conducting contact with the outside of the closed housing.
  • Another essential component of the at least one component and / or device according to the invention is at least one device for conducting the heat given off to the cold side of the at least one Peltier which is not in direct heat-conducting, electrically insulating contact with the at least one component and / or device according to the invention element.
  • Preferably, the at least one device for conducting the heat released to the not in a direct heat-conducting, electrically insulating contact with the at least one electrical and / or electronic component and / or the at least one device cold side of the at least one Peltier element comprises inorganic and / or organic gases, inorganic and / or organic liquids, inorganic and / or organic fusible and / or sublimable solids, fans, blowers, turbines, dysons, venturi nozzles, heat pipes, with the cold side in direct and / or indirect heat-conducting, electrically insulating Contact standing layers of thermally conductive metals, metal alloys and / or ceramics, cooling fins, heat exchangers, thermal compounds and / or tube heat sink.
  • Examples of suitable organic and inorganic gases are air, nitrogen, oxygen, noble gases, carbon dioxide, gaseous ammonia, gaseous amines sulfur hexafluoride, hydrocarbons and fluorinated, chlorinated and / or brominated hydrocarbons.
  • Examples of suitable inorganic and organic liquids are water, salt solutions, molten salts, ionic liquids, liquid ammonia, liquid metals and metal alloys, liquid hydrocarbons or liquid, fluorinated, chlorinated and / or brominated hydrocarbons.
  • Examples of suitable inorganic and organic sublimable solids are sublimate, solid carbon dioxide, para-dichlorobenzene, naphthalene or camphor.
  • Examples of suitable materials are metals such as titanium, zirconium, hafnium, vanadium, niobium, tantalum, chromium, molybdenum, tungsten, manganese, rhenium, iron, osmium, cobalt, rhodium, iridium, nickel, palladium, platinum, copper, silver, gold, Zinc, cadmium, aluminum, gallium, indium, silicon, germanium, tin and lead, and their alloys with each other and / or with other metals and / or non-metals.
  • Examples of heat-conducting ceramics and special applications as well as their sources of supply are Dreyer System GmbH: HITHERM® Interface materials, such as gap fillers, thermal tapes and phase change materials; Dr. D. Müller, Ahlhorn: thermal compound Thermigrease®, thermal adhesive Thermiglue® and thermal pads Thermipads®; Ceram Tec: aluminum nitride ceramics; or Aavid Kunze: highly heat-conductive Soft silicone, thermo-silicone, thermally conductive silicone-free films, silicone-free phase change films Crayotherm® (polyimide films). As further materials are mica or slices of alumina-beryllium oxide ceramic into consideration.
  • The operation and the structure of the heat pipes are already explained at the beginning. It should be explained in more detail that the materials of which the heat pipes are constructed must be gas-tight, chemically stable, mechanically and thermally stable, as well as resistant to deformation, vis-à-vis both the "working" liquid and the external atmosphere. In addition, the heat pipes should preferably have a high thermal conductivity, at least in those areas in which the thermal energy is absorbed and / or emitted. The other areas of the heat pipes need not be thermally conductive.
  • The heat pipes can have a wide variety of lengths, which are directed in particular to their intended use and the dimensions of the components and devices according to the invention.
  • Furthermore, the heat pipes may have different cross sections such as squares, rectangles and triangles, which may have rounded corners and / or sides, ellipses, ovals and / or circles. The size of the cross sections may vary widely and also depends on the intended use of the heat pipes and the dimensions of the components and devices according to the invention.
  • The heat pipes may have different shapes in the longitudinal direction. So they can straight, in the plane bent once or several times, spatially multiple curved, meandering or spiral.
  • In addition, the heat pipe heat conductors can be coated after shaping to protect them from mechanical, chemical and / or thermal impact. Examples of suitable coating materials are thermal and / or actinic radiation, e.g. UV radiation or electron beam curable, pigmented and / or non-pigmented powder coatings and / or water-based and / or organic solvent-based fluids.
  • The capillary structure with wicking on the inside of the walls of the heat pipes can also be made of different materials. The person skilled in the art can therefore select the materials on the basis of the property profiles known to him. The capillary structure can be constructed of nanoparticles, fiber materials and / or nano- and / or microporous materials with appropriately sized pore sizes. In addition, the wicking may be by wire mesh, such as copper wire mesh or electrically non-conductive wire mesh and fiber bundles, e.g. made of ceramic, glass and / or high temperature resistant plastics, are produced inside the heat pipes. Furthermore, the wicking effect may also be due to surface structures of protrusions and pits such as e.g. Grooves, columns, balls and / or wells are generated on the inner walls of the heat pipes. The capillary structure with wicking can also be introduced later. Examples of suitable methods are the crystallization or precipitation of mesoporous materials such as zeolites.
  • The end of the heat pipes, which is in heat-conducting contact with the component or device according to the invention, is preferably electrically insulated therefrom. For example, the heat-conducting contact between the end of the heat pipe and the component or device according to the invention by solder contacts, welding contacts, flange contacts, electrical and thermally conductive. Adhesive layers containing metal particles, screwed, plugged and clamped contacts, in which the end of the heat pipe is screwed into the source or the source of thermal energy and / or screwed in, plugged in and / or clamped on, pressure contacts, in which the End of the heat pipe is pressed by suitable means to the source of thermal energy produced. The thermally conductive contact can be improved, for example, by the above-described electrically insulating thermally conductive ceramics and thermal compounds.
  • Heat pipes can be obtained, for example, from the companies Situs Technical GmbH, Wuppertal, Adeo Heatpipe, Switzerland, or Cool Tec Electronic GmbH.
  • The dimensions and constructive details of the at least one device for conducting the heat given off depend primarily on the amount of heat that has to be dissipated. The person skilled in the art can therefore calculate the most suitable construction for each individual case on the basis of his general knowledge and assemble their components.
  • Another essential component of the at least one component and / or device according to the invention is at least one device for dissipating the heat from the hot side of the at least one Peltier element to the outside of the closed housing and to a heat sink in the vicinity of the at least one component according to the invention and / or device.
  • The at least one Peltier element can not stand in a direct heat-conducting, electrically insulating contact with the at least one component and / or device according to the invention. Such a Peltier element can be arranged in the interior of the closed housing on at least one inner side and / or in an opening in the wall of the closed housing, wherein the at least one Peltier element seals the opening in addition to its cooling function
  • Preferably, the at least one device for dissipating the heat from the hot side of the at least one Peltier element comprises the materials and devices described in detail above and / or at least one arrangement of air slots with microfilters covered by a heat-conducting plate on the inside of the closed housing. The heat conductive plate is preferably a ceramic plate or polyimide film. But it can also be used with polyimide coated metal plates.
  • If the at least one Peltier element is in direct heat-conducting, electrically insulating contact with the at least one component and / or device according to the invention, as at least one device for dissipating the heat from the hot side of the at least one Peltier element can be described in detail above Materials and devices are used.
  • In addition, the heat dissipated from the closed housing can be removed in the form of a heated air stream and directed or sucked into central venting systems. For this purpose, suction tubes can be connected to the at least one exit point of the heat.
  • The devices described above for dissipating the heat from the hot side of the at least one Peltier element and the means for directing the heat given off to the cold side of the at least one Peltier element can be combined in any suitable manner, which requires a large number of Degrees of freedom in the construction of the components and devices of the invention opened.
  • All components and electrical connections that lead into and / or out of the closed housing are provided with gas-tight and liquid-tight seals, so that the ingress of contaminants is prevented.
  • Finally, the heat emitted by the at least one component and / or device according to the invention is supplied to a heat sink in the vicinity of the device. This can be an energy harvester, ie a device for converting heat energy into electrical current, such as a thermoelectric element (TEE). In addition, refrigeration units, heat exchangers, tube coolers, or organic and inorganic gases, liquids and phase change materials as mentioned above can be used.
  • The components and / or devices according to the invention can have a customary and known, mechanical, electrical, electronic and / or pneumatic measurement and control peripheral. In addition, they may include controls and audible and / or visual indicators that screens. In all cases it is ensured that no contaminants can penetrate into the closed housing of the components and devices according to the invention.
  • In order to gain an impression of the multitude of possibilities for producing the components and / or devices according to the invention, characteristic examples of combinations of components are listed in the table. The table is not intended to be limiting or conclusive.  Table: 223 Examples of combinations of components for devices for dissipating heat generated by electrical and / or electronic components and / or appliances insidea outsideb centerc fan cooling fins TEC Heatpipe TEC cooling fins fan TEC × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × × a Inside of the housing b Outside of the housing c Middle between inside and outside x Component is present
  • If, for example, up to four different components, which may be arranged in different order, are used both inside and outside the housing, a number of different combinations in the range of 10 5 results. This underpins that the components and devices according to the invention or their cooling devices can be adapted in a particularly advantageous manner to the respective requirements.
  • The components and / or devices according to the invention are used in particular for the cooling method according to the invention. This is a method for contamination-free cooling of enclosed, heat-dissipating, electrical and / or electronic components and devices, in which one is at least one contamination-free coolable, enclosed, heat-emitting during operation, electrical and / or electronic component and / or device comprising
    • - at least one closed housing with an inner side and an outer side, which surrounds at least one electrical and / or electronic component and / or device which releases heat during operation,
    • - At least one Peltier element, the cold side of the at least one heat-emitting during operation, electrical and / or electronic component and / or device is at a distance or in a direct heat-conducting, electrically insulating contact with the electrical and / or electronic component and / or device stands and whose hot side is in heat-conducting contact with the outside,
    • - At least one device for directing the heat emitted to the not in a direct heat-conducting, electrically insulating contact with the at least one electrical and / or electronic component and / or the at least one device cold side of the at least one Peltier element and
    • at least means for dissipating the heat from the hot side of the at least one Peltier element into at least one heat sink in the environment,
    puts into operation, applies a controllable electrical voltage to the at least one Peltier element and feeds the heat emitted via the at least one device or directly to the cold side of the at least one Peltier element and at least one device from the hot side to the outside and a Derives heat sink in the environment.
  • The cooling method according to the invention prevents the penetration of small animals, micro animals, bacteria, fungi, viruses, protozoa, microalgae and archaea, spores, pollen, dust, particulate matter, fine dust, suspended particles, aerosols, chemical contaminants, microparticles and / or nanoparticles into the closed housing.
  • In the following, the component and / or device according to the invention will be described with reference to FIG 1 to 5 exemplified. Both 1 to 5 they are schematic representations intended to illustrate the principle of the invention. The size ratios must therefore not correspond to the size ratios used in practice. It shows in simplified, not to scale representation:
    • 1 a longitudinal section through a contaminated cooled, enclosed electronic device 1 for use in a medical research institution,
    • 2 a longitudinal section through a contaminated cooled, enclosed electronic device 1 for use in an operating room,
    • 3 a longitudinal section through a contaminated cooled, enclosed electronic device 1 for use in a clean room,
    • 4 a longitudinal section through a contaminated cooled, enclosed electronic device 1 for use as a component in a data processing system and
    • 5 a longitudinal section through a section of a housing 2 attached suction device 5.8 ,
  • In the 1 to 5 the reference signs have the following meaning:
  • 1
    electrical and / or electronic component and / or device
    2
    Closed housing
    2.1
    inside
    2.2
    outside
    2.3
    Closed interior
    2.4
    Surroundings
    2.5
    poetry
    2.6
    Pressure relief valve with non-return valve
    2.7
    Pressure compensation membrane
    3
    Peltier element (electrical connections and power source not shown)
    3.1
    Cold side
    3.2
    Hot side
    4
    Apparatus for conducting the heat emitted by 1 to 3.1
    4.1
    Thermally conductive, electrically insulated metal plate
    4.2
    fan
    4.3
    cooling fins
    4.4
    Thermal Compounds
    4.5
    Thermally conductive ceramic plate
    4.6
    Heat pipe (heat pipe)
    5
    Device for dissipating heat from 3.2 to 2.2 and 2.4
    5.1
    Thermally conductive, electrically insulated metal plate
    5.2
    fan
    5.3
    cooling fins
    5.4
    Thermal Compounds
    5.5
    Thermally conductive ceramic plate
    5.6
    Heat pipe (heat pipe)
    5.7
    Louvers with microfilter 5.7.1
    5.7.1
    microfilter
    5.8
    suction
    5.8.1
    suction tube
    5.8.2
    Mounting ring on the outside 2.2 of the housing 2
    5.8.3
    flange
    5.8.4
    mounting screws
    3.8.5
    Part of the central ventilation system
    6
    heat sink
    7
    Heated air flow, inert gas flow or working fluid flow
  • Detailed description of the figures
  • FIG. 1
  • The 1 shows a longitudinal section through a contaminated cooled, enclosed electronic device 1 for use in a medical research facility. In the 1 the electrical connections, lines and bushings are not reproduced for the sake of simplicity.
  • The electronic device 1 For use in a medical research facility was in the interior 2.3 a closed housing 2 arranged. The walls of the housing 2 consisted of flame retardant and electromagnetic radiation shielding pigments, high temperature resistant, sterilizable plastic (polyether ketone). In each case a wall was an elastic pressure compensation membrane 2.7 and a pressure relief valve 2.6 arranged with non-return valve. To the environment 2.4 towards the non-return valve was still by a microfilter (not shown, cf. 4 . 5 .7.1) protected against the ingress of contaminants. The interior 2.3 of the housing 2 was filled with carbon dioxide as a protective gas. The outside 2.2 of the housing 2 was covered with a metal foil with a dirt-repellent, ultrahydrophobic coating (not shown). The of the electronic device 1 heat generated heated the protective gas, that of a fan 4.2 as heated inert gas stream 7 sucked and on the cooling fins 4.3 was blown out of aluminum. The cooling fins 4.3 were in electrically insulating, thermally conductive contact with the cold side 3.1 of the Peltier element 3 to which a regulated electrical voltage has been applied. The Peltier element 3 was with his hot side 3.2 stuck to the inside 2.1 of the housing 2 electrically isolated connected. The heat conduction to the the outside 2.2 located layer of thermal compound 5.4 was from the layer of thermal grease 4.4 between the hot side 3.2 and the inside 2.2 accepted. The thermal compound 5.4 transferred the heat to the outside 2.2 attached cooling fins 5.3 from where you use the fan 5.2 was sucked off. The resulting heated air flow 7 was from the fan 5.2 in a suction tube 5.8.1 (not shown, cf. 5 ) as a heat sink 6 , which is gas-tight with the outside 2.2 of the housing 2 was connected and the fan 5.2 , the cooling fins 5.3 and thermal grease 5.4 included, blown.
  • The device 1 could through this device 5 be perfectly cooled in this way.
  • After an operating time of the device 1 from a year became the closed housing 2 from the suction tube 5.8 , 1 (cf. 5 ) and its outside 2.2 cleaned and sterilized. Immediately afterwards the case became 2 opened in a glove box under inert gas and its inside 2.1 tested on microorganisms such as bacteria, fungi, viruses, protozoa, microalgae and archaea, spores, pollen, particulate matter, particulate matter, particulate matter, aerosols, chemical contaminants and nanoparticles by conventional and well-known detection methods. However, none of these contaminants were found. This meant that they were not present or only present in a concentration below the detection limit of the respective detection methods. Small animals or micro animals had no access anyway.
  • FIG. 2
  • The 2 shows a longitudinal section through a contaminated cooled, enclosed electronic device 1 for use in an operating room. In the 2 the electrical connections, lines and bushings are not reproduced for the sake of simplicity.
  • The electronic device 1 for use in an operating room was in the interior 2.3 a closed housing 2 arranged. The walls of the housing 2 consisted of flame retardant and electromagnetic radiation shielding pigments, high temperature resistant, sterilizable plastic (polyether ketone). The interior 2.3 of the housing 2 was filled with carbon dioxide as a protective gas. The outside 2.2 of the housing 2 was covered with a metal foil with a dirt-repellent, ultrahydrophobic coating (not shown). On the device 1 were - in this order - a thermally conductive ceramic plate 4.5 , the Peltier element 3 with the cold side 3.1 and another thermally conductive ceramic plate 5.5 on the hot side 3.2 attached. The heat generated by the device was transformed into two heat pipes with copper capillary inside 5.6 with round cross section, walls of copper and water as working fluid (working fluid flow 7 ). The two heat pipes 5.6 were made by circulating gas-tight seals 2.5 from the interior 2.3 of the housing 2 in the nearby areas 2.4 and in a refrigeration unit as a heat sink 6 guided.
  • The cooling was particularly effective, and the entire device 5 was extremely robust, reliable and except for the cooling unit 6 maintenance-free.
  • After an operating time of the device 1 from a year became the closed housing 2 including the heat pipes 5.6 from the cooling unit 6 removed and its outside 2.2 cleaned and sterilized. Immediately afterwards the case became 2 opened in a glove box under inert gas and its inside 2.1 tested on microorganisms such as bacteria, fungi, viruses, protozoa, microalgae and archaea, spores, pollen, particulate matter, particulate matter, particulate matter, aerosols, chemical contaminants and nanoparticles by conventional and well-known detection methods. However, none of these contaminants were found. This meant that they were not present or only present in a concentration below the detection limit of the respective detection methods. Small animals or micro animals had no access anyway.
  • FIG. 3
  • 3 shows a longitudinal section through a contaminated cooled, enclosed electronic device 1 for use in a clean room. In the 3 the electrical connections, lines and bushings are not reproduced for the sake of simplicity.
  • The electronic device 1 for use in a clean dream was in the interior 2.3 a closed housing 2 arranged. The walls of the housing 2 consisted of flame retardant and electromagnetic radiation shielding pigments, high temperature resistant, sterilizable plastic (polyether ketone). The interior 2.3 of the housing 2 was filled with carbon dioxide as a protective gas. The outside 2.2 of the housing 2 was covered with a metal foil with a dirt-repellent, ultrahydrophobic coating covered (not shown). On the device 1 was an aluminum plate 4.1 attached by the device 1 generated heat in four connected thereto, equipped with a capillary structure of copper inside heat pipes 4.6 with round cross section, walls of copper and water as working fluid working fluid flow 7 ). The heat pipes 4.6 led the heat to a thermally conductive ceramic plate 4.5 on the cold side 3.1 of the Peltier element 3 that is in an opening in the wall of the housing 2 firmly inserted and by a circumferential, gas-tight seal 2.5 to the environment 2.6 was sealed off. Part of the Peltier element 3 and the hot side 3.2 were therefore outside the interior 2.3 , On the hot side 3.2 was a thermally conductive ceramic plate 5.5 attached the heat to the outside 2.2 attached cooling fins 5.3 from where you use the fan 5.2 was sucked off, transferred. The resulting heated air flow 7 was from the fan 5.2 in a suction tube 5.8.1 (not shown; 5 ) as a heat sink 6 , which is gas-tight with the outside 2.2 of the housing 2 was connected and the fan 5.2 , the cooling fins 5.3 and the thermally conductive ceramic plate 5.5 included, blown.
  • The device 1 could through this device 5 be perfectly cooled in this way.
  • After an operating time of the device 1 from a year became the closed housing 2 from the suction tube 5.8.1 (see. 5 ) and its outside 2.2 cleaned and sterilized. Immediately afterwards the case became 2 opened in a glove box under inert gas and its inside 2.1 tested on microorganisms such as bacteria, fungi, viruses, protozoa, microalgae and archaea, spores, pollen, particulate matter, particulate matter, particulate matter, aerosols, chemical contaminants and nanoparticles by conventional and well-known detection methods. However, none of these contaminants were found. This meant that they were not present or only present in a concentration below the detection limit of the respective detection methods. Small animals or micro animals had no access anyway.
  • FIG. 4
  • 4 shows a longitudinal section through a contaminated cooled, enclosed electronic device 1 for use as a component in a data processing system. In the 4 the electrical connections, lines and bushings are not reproduced for the sake of simplicity.
  • The electronic device 1 for use as a component in a data processing system was in the interior 2.3 a closed housing 2 arranged. The walls of the housing 2 consisted of flame retardant and electromagnetic radiation shielding pigments, high temperature resistant, sterilizable plastic (polyether ketone). The interior 2.3 of the housing 2 was filled with carbon dioxide as a protective gas. The outside 2.2 of the housing 2 was covered with a metal foil with a dirt-repellent, ultrahydrophobic coating (not shown). On the device 1 were two thermally conductive ceramic plates 4.5 attached. At every plate 4.5 was a heat pipe 4.6 made of copper with round cross section and inside with a capillary structure of copper and water as working fluid (working fluid flow 7 ) attached. Every heat pipe 4.6 directed the heat generated by the device through the interior 2.3 to the corresponding thermally conductive ceramic plate 4.5 on the cold side 3.1 of the respective Peltier element 3 , The respective hot side 3.2 the two Peltier elements 3 was on a common aluminum plate 5.1 attached and this was again on the inside 2.2 attached to the wall of the housing and covered the surface of the inside 2.2 the wall, in which louvers 5.7 with microfilters 5.7.1 through which the heat as a heated air flow 7 in the nearby areas 2.4 as a heat sink 6 was delivered. The cooling effect could be further enhanced by the fact that air at the openings of the louvers 5.7 was blown past.
  • The device 1 could through this device 5 be perfectly cooled in this way.
  • After an operating time of the device 1 from one year became the outside 2.2 of the closed housing 2 cleaned and sterilized. Immediately afterwards the case became 2 opened in a glove box under inert gas and its inside 2.1 tested on microorganisms such as bacteria, fungi, viruses, protozoa, microalgae and archaea, spores, pollen, particulate matter, particulate matter, particulate matter, aerosols, chemical contaminants and nanoparticles by conventional and well-known detection methods. However, none of these contaminants were found. This meant that they were not present or only present in a concentration below the detection limit of the respective detection methods.
  • FIG. 5
  • 5 shows a longitudinal section through a section of a housing 2 attached suction device 5.8 , In the 5 the electrical connections, lines and bushings are not reproduced for the sake of simplicity.
  • The suction tube 5.8.1 the suction device 5.8 had a round cross-section and was made of stainless steel sheet with a wall thickness of 1.5 mm. At one end, it was part of the central venting system 3.8.5 welded. At the other end it was with the flange 5.8.3 on the mounting ring 5.8.2 Made of high temperature resistant polyether ketone with stainless steel screws 5.8.4 screwed. The of the device 5 from the interior 2.2 of the housing 2 about the Peltier element 3 derived heat was in the form of a heated air stream 7 into a pipe of a central venting system 5.8.7 aspirated.
  • By using the suction device 5.8 The risk of contamination could be further reduced and the effectiveness of cooling further increased.
  • QUOTES INCLUDE IN THE DESCRIPTION
  • This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
  • Cited patent literature
    • DE 102011056877 A1 [0015]
    • US 2017/0199554 A1 [0017]

Claims (13)

  1. Contaminated, cooled, enclosed in operation, heat-releasing, electrical and / or electronic components and devices (1), each comprising at least one closed housing (2) with an inner side (2.1) and an outer side (2.2) which encloses at least one electrical and / or electronic component and / or device (1) emitting heat during operation, - At least one Peltier element (3), the cold side (3.1) facing the at least one heat-emitting during operation, electrical and / or electronic component and / or device (1) at a distance or in a direct heat-conducting, electrically insulating Contact with the electrical and / or electronic component and / or device (1) is and whose hot side (3.2) is in heat-conducting contact with the outside (2.2), at least one device (4) for conducting the heat given off to the cold side which is not in direct heat-conducting, electrically insulating contact with the at least one electrical and / or electronic component (1) and / or the at least one device (1) 3.1) of the at least one Peltier element (3) and - At least device (5) for dissipating the heat from the hot side (3.2) of the at least one Peltier element (3) to the outside (2.2) and at least one heat sink (6) in the environment (2.4).
  2. Electrical and / or electronic components and devices (1) according to Claim 1 , characterized in that the electrical and / or electronic components (1) are active and passive electrical and electronic components (1) and the electrical and electronic equipment (1) are devices for use in clean rooms, clean rooms, operating theaters, Intensive care units, isolation stations as well as microbiological, biological, analytical, medical, pharmacological, nanotechnological or electrical engineering, research facilities and production facilities as well as in research facilities and production facilities for wafers, data carriers, microchips, processors, smartphones and computers as well as in aviation and aerospace research facilities and production facilities.
  3. Electrical and / or electronic components (1) according to Claim 1 or 2 , characterized in that the active electrical and electronic components (1) are semiconductor components, diodes, transistors, integrated circuits, processors and electric motors, and the passive electrical and electronic components (1) are resistors, capacitors and coils ,
  4. Electric and electronic components and devices (1) according to one of Claims 1 to 3 , characterized in that the at least one closed housing (2) made of glass, metal, plastic, wood and / or composites of at least two of these materials is constructed.
  5. Electrical and / or electronic components and devices (1) according to one of Claims 1 to 4 , characterized in that the at least one closed housing (2) is electrically insulating and / or shielding against electromagnetic radiation and / or magnetic fields, at least one opening which is gas-permeable but impermeable to microorganisms, particulate matter, particulate matter, suspended solids and aerosols, at least a pressure relief valve (2.6) with non-return valve and / or at least one pressure compensating membrane (2.7) and / or its interior (2.3) is filled with air, inert gas or a non-polar and / or non-flammable liquid.
  6. Electric and electronic components and devices (1) according to one of Claims 1 to 5 , characterized in that the at least one device (4) for conducting the heat released to the not in a direct heat-conducting, electrically insulating contact with the at least one electrical and / or electronic component and / or the at least one device (1) standing cold Page (3.1) of the at least one Peltier element (3) inorganic and / or organic gases, inorganic and / or organic liquids, inorganic and / or organic fusible and / or sublimable solids, fans, blowers, turbines, Dysons, venturi nozzles, heat pipes , with the cold side (3.1) in direct and / or indirect heat-conducting, electrically insulating contact standing layers of thermally conductive metals, metal alloys and / or ceramics, cooling fins, heat exchangers, thermal grease and / or tube heat sink.
  7. Electrical and / or electronic components and devices (1) according to Claim 6 , characterized in that the at least device (5) for dissipating the heat from the hot side (3.2) of the at least one Peltier element (3), not in a direct heat-conducting, electrically insulating contact with the at least one electrical and / or electronic component (1) and / or the at least one device (1) (2.2) inorganic and / or organic gases, inorganic and / or organic liquids, inorganic and / or organic fusible and / or sublimable solids, fans, blowers, turbines, dysons, venturi nozzles, heat pipes, with the cold side ( 3.1) in direct and / or indirect heat-conducting, electrically insulating contact cooling fins, heat exchangers, layers of thermally conductive metals, metal alloys and / or ceramics, thermal compounds on the inside (2.1) covered by a thermally conductive plate arrangement of air slots with microfilters and / or Tubular heat sink includes.
  8. Electric and electronic components and devices (1) according to one of Claims 1 to 7 , characterized in that the at least one Peltier element (3) which is not in direct heat-conducting, electrically insulating contact with the at least one electrical and / or electronic component (1) and / or the at least one device (1), in the interior of the housing (2), on at least one inner side (2.1) and / or in a position of the wall of the housing (2) is arranged, so that the hot side in direct or indirect heat-conducting, electrically insulating contact with the outside (2.2 ) stands.
  9. Electrical and / or electronic components and devices (1) according to one of Claims 1 to 5 , characterized in that the at least device (5) for dissipating the heat from the hot side (3.2) of the at least one Peltier element (3) in a direct heat-conducting, electrically insulating contact with the at least one electrical and / or electronic Component (1) and / or device (1), to the outside (2.2) inorganic and / or organic gases, inorganic and / or organic liquids, inorganic and / or organic fusible and / or sublimable solids, fans, blowers, turbines, Dysons, venturi nozzles, heat pipes, with the cold side (3.1) in direct and / or indirect heat-conducting, electrically insulating contact cooling fins, heat exchangers, layers of thermally conductive metals, metal alloys and / or ceramics, thermal compounds on the inside (2.1) by a thermally conductive plate covered arrangement of air slots with microfilters and / or tube heat sink.
  10. Method for the contamination-free cooling of enclosed, heat-dissipating, electrical and / or electronic components and devices (1), characterized in that at least one contamination free coolable, enclosed, in operation heat-emitting, electrical and / or electronic component and / or Device (1), comprising - at least one closed housing (2) with an inner side (2.1) and an outer side (2.2) enclosing at least one electrical and / or electronic component and / or device (1) emitting heat during operation, at least one Peltier element (3), the cold side (3.1) of which faces the at least one heat-releasing, electrical and / or electronic component and / or device (1) at a distance or in a direct heat-conducting, electrically insulating contact with the electrical and / or electronic component and / or device (1) and whose hot side (3.2) in heat-conducting K is ontakt with the outside (2.2), - at least one device (4) for conducting the heat emitted to the not in a direct heat-conducting, electrically insulating contact with the at least one electrical and / or electronic component and / or the at least one device ( 1) standing cold side (3.1) of the at least one Peltier element (3) and - at least device (5) for dissipating the heat from the hot side (3.2) of the at least one Peltier element (3) to a heat sink (6) in the environment (2.4), puts into operation, applies a controllable electrical voltage to the at least one Peltier element (1) and the heat emitted by (1) via the at least one device (4) or directly the cold side (3.1) the at least one Peltier element (3) feeds and via at least one device (5) from the hot side (3.2) to the outside (2.2) and into the environment (2.4) derived.
  11. Method according to Claim 10 , characterized in that it is free of contamination, cooled, enclosed in operation heat-releasing, electrical and / or electronic components and devices (1) according to one of Claims 1 to 9 used.
  12. Method according to Claim 10 or 11 , characterized in that the entry of small animals, micro-organisms, bacteria, fungi, viruses, protozoa, microalgae and archaea, spores, pollen, dust, particulate matter, particulate matter, suspended solids, aerosols, chemical contaminants, microparticles and / or nanoparticles in the closed housing (2) is prevented.
  13. Use of the contamination-free coolable, enclosed, heat-releasing, electrical and / or electronic components and devices (1) according to one of Claims 1 to 9 in Clean rooms, clean rooms, operating theaters, intensive care units, isolation stations as well as microbiological, biological, analytical, medical, pharmacological, nanotechnological or electrotechnical, research facilities and production facilities as well as in research facilities and production facilities for wafers, data carriers, microchips, smartphones and computers as well as in aviation and aerospace technical research facilities and production.
DE102017007198.5A 2017-08-02 2017-08-02 Contaminationsfei coolable, enclosed, in operation heat-releasing, electrical and / or electronic components and devices Pending DE102017007198A1 (en)

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DE102017007198.5A DE102017007198A1 (en) 2017-08-02 2017-08-02 Contaminationsfei coolable, enclosed, in operation heat-releasing, electrical and / or electronic components and devices
PCT/EP2018/000370 WO2019025021A1 (en) 2017-08-02 2018-07-24 Enclosed electrical and/or electronic components and devices that give off heat during operation and that can be cooled without contamination

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Citations (9)

* Cited by examiner, † Cited by third party
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