DE102016105616A1 - Polymer hybrid material, its use in a splitting process, and method of making the polymer hybrid material - Google Patents

Abstract

The invention which comprises a polymer hybrid material, a film comprising the polymer hybrid material, the use of the polymer hybrid material, a splitting method using the polymer hybrid material and a method for producing the polymer As regards hybrid materials, it is an object to provide a means of increasing the overall yield, i. H. the efficiency in terms of raw materials used and other resources, such as energy and labor, of a splitting process. This is specified according to the invention by a polymer hybrid material for use in a splitting method, in which at least two solid sections are produced from a solid starting material. The polymer hybrid material according to the invention comprises a polymer matrix and at least one first filler embedded therein.

Description

The invention relates to a polymer hybrid material, a film comprising the polymer hybrid material, the use of the polymer hybrid material, a splitting method using the polymer hybrid material and a method for producing the polymer hybrid -Materials.

Especially in microelectronics and photovoltaics wafers, d. H. thin discs or plates, made of materials such as silicon, germanium or sapphire. These are currently usually obtained from a columnar or block-shaped solid, which is also referred to as ingot.

From such ingots, for example, by means of a sawing or tearing process, cylinder-shaped or disk-shaped sections are produced. These sections may already represent a wafer or the resulting sections are further subdivided until they have the desired thickness of a wafer to be produced.

Wire or diamond wire saws are usually used in the sawing or tearing process, whereby a part of up to 50% of the original solid in the form of chips is lost as so-called "kerf loss", which is disadvantageous especially with expensive starting materials.

For example, with the currently customary methods, almost 50% of the material used is lost as "kerf loss" alone in the production of silicon wafers for solar cells. Worldwide, this represents an annual loss of over 2 billion euros. Since the cost of the wafer accounts for the largest share of the cost of the finished solar cell (over 40%), the cost of solar cells could be significantly reduced through improvements in wafer manufacturing.

In addition, the sawing process often causes damage to the wafer surface, which must be eliminated by means of additional process steps for surface treatment, such as lapping or polishing process steps.

Particularly attractive for such a wafer production without kerf-loss ("kerf-free wafering") appear methods that can do without conventional sawing and, for example, by using temperature-induced voltages directly split thin wafers from a thicker workpiece Procedures, such as those in WO 2009/061353 A2 and WO 2010/072675 A2 where a polymer layer applied to the workpiece is used to generate these stresses.

The polymer layer has in the mentioned method a compared to the workpiece by about two orders of magnitude higher thermal expansion coefficient. In addition, by utilizing a glass transition, a relatively high modulus of elasticity in the polymer layer can be achieved, so that sufficiently high voltages can be induced in the layer system polymer layer workpiece by cooling in order to enable the removal of wafers from the workpiece. Such a method is hereinafter referred to as "splitting method".

When a wafer is split off from the workpiece, polymer still adheres to one side of the wafer in each of the methods mentioned. The wafer bends very strongly in the direction of this polymer layer, which makes controlled separation difficult, and z. B. can lead to thickness variations of the split-wafer. In addition, the high curvature makes further processing difficult and may even break the wafer.

When using the methods of the prior art, the wafers produced usually each have larger variations in thickness, wherein the spatial thickness distribution often shows a pattern with multiple symmetry. The total thickness variation (TTV) seen over the entire wafer is often more than 100% of the average wafer thickness (eg, a wafer of, for example, 100 μm in average thickness, for example, at its thinnest 50 μm thick and 170 μm thick at its thickest point, has a TTV of 170-50 = 120 μm, which corresponds to a total thickness variation of 120% relative to its mean thickness).

Wafers with such large thickness variations are not suitable for many applications. In addition, in the most common fourfold thickness distribution patterns, the regions of greatest variability unfortunately lie in the middle of the wafer where they are most disturbing.

In addition, in the method according to the current state of the art during the fracture propagation during the splitting off, undesired oscillations in the layer systems involved occur, which unfavorably influence the course of the fracture front and in particular can lead to significant thickness fluctuations of the split-off wafer.

Furthermore, from the DE 10 2012 001 620 A1 a method is known in which for the production of wafers on the solid body, a polymer film is applied by means of adhesive. After curing of the adhesive, the solid is thermally stressed together with the polymer film. By different thermal properties of solid and polymer breaks the solid into two thinner cuts. On one side of the two sections now still adheres the polymer film, which must be removed from the surface in a subsequent step.

The method described can also be used to divide a thick wafer into two thin wafers by adhering polymer foils to both opposite sides of the thick wafer and splitting the same into two thin wafers by a corresponding thermal treatment.

The effectiveness of such a process depends in particular on the choice of a polymer with a suitable glass transition temperature (T _g ), the thermal diffusivity of the polymer and its mechanical properties such as brittleness, tensile strength and elasticity.

Furthermore, in the DE 10 2012 001 620 A1 describes the use of an additional sacrificial layer between solid and polymer film, which serves for the improved removal of the polymer film after the splitting step, for example by decomposing or dissolving the sacrificial layer chemically by addition of suitable reactants.

A disadvantage of this method, however, is the long period of time, which can last up to several hours, which elapses until complete removal of the polymer layer. This severely restricts industrial use.

To accelerate the process of polymer removal, it is possible to introduce additional driving forces in the form of suitable tensile stresses, which also act at room temperature, by means of an appropriate pretreatment. These lead to an increase in the area of attack for the reactants or the solvent and promote decomposition or dissolution and dissolution.

Due to the introduced additional stresses, however, it may also after the removal of the polymer to damage the cleaved solid, so z. As the wafer, come by this breaks, for example. This is associated with a deterioration of the overall yield, which reduces the cost advantage of the splitting method.

Furthermore, from the WO 2010/072675 A2 It is known to provide fillers in the polymer in order to be able to locally influence the thermal expansion coefficient or the modulus of elasticity.

However, it has been found that such fillers often worsen the adhesion of the polymer to the surface of the solid to be divided, so that sufficient power transmission is no longer possible.

In addition, the prior art requires a long cooling time due to the poor thermal conductivity of the polymer in order to induce the necessary stresses.

In addition, it is difficult in the previous methods to ensure a reproducibly good thermal contact over the entire surface of the polymer layer. Due to the low thermal conductivity of the polymers used, locally insufficient thermal contact can lead to unwanted, significant local temperature deviations in the layer system, which in turn adversely affects the controllability of the generated stress fields and thus the quality of the produced wafers.

Furthermore, from the document DE 196 40 594 A1 a method of separating semiconductor materials by means of light-induced interfacial decomposition and devices made therewith, such as patterned and freestanding semiconductor layers and devices.

The method according to the DE 196 40 594 A1 involves the illumination of interfaces between substrate and semiconductor layer or between semiconductor layers, whereby the light absorption at the interface or in an intended absorption layer for material decomposition leads. The selection of the interface or semiconductor layer, which is brought to decomposition, takes place by the choice of the wavelength of light and light intensity, the direction of irradiation or the incorporation of a thin sacrificial layer during material production.

This method has the disadvantage that high energy doses must be used to destroy entire layers, whereby the energy requirements and thus the cost of the process are very high.

Object of the present invention is therefore to provide a way to increase the overall yield, d. H. the efficiency in terms of raw materials used and other resources, such as energy and labor, of a splitting process.

In particular, the cooling time and the time course of the polymer removal should be influenced in a targeted manner after the division of the solid.

Preferably, the polymer should be quickly, residue-free and without damage to the divided starting material of this separable.

In addition, the process stability should be increased by minimizing the number of process steps.

The achievement of this object is achieved by a polymer hybrid material according to the features of claim 1, by a film according to claim 14 and by a splitting method according to claim 15. The dependent claims reflect advantageous embodiments of the inventive solutions.

Investigations showed that the removal of the polymer layer by decomposition, dissolution or dissolution is a diffusion-controlled reaction of the participating reactants and solvents. As the time progresses, the supply and removal of the reactants in the forming gap between solid and polymer becomes more and more difficult and very much slowed down. Thus, the supply and removal of the reaction products and educts and the solvent and the dissolved constituents of the diffusion-controlled rate-determining step.

According to the invention, therefore, a polymer hybrid material is specified for use in a splitting method in which at least two solid sections are produced from a solid starting material.

The polymer hybrid material according to the invention comprises a polymer matrix and at least one first filler embedded therein. Insofar as in the following of one or the filler is mentioned, should also be included the possibility of multiple fillers. For example, the filler may comprise a mixture of different materials, e.g. As metal particles and inorganic fibers.

As polymer matrix, it is possible to use any polymer or a mixture of different polymers, with the aid of which it is possible to generate the voltages necessary for a division of the solid starting material. For example, the polymer matrix may be formed as an elastomer matrix, preferably as a polydiorganosiloxane matrix, particularly preferably as a polydimethylsiloxane matrix.

Such polymer materials are particularly easy to use as a matrix material in combination with fillers, since the properties can be flexibly adjusted due to the variable degree of crosslinking and adapted to the respective filler and the solid-state starting material to be divided.

According to one embodiment, the mass fraction of the polymer matrix on the polymer-hybrid material is 80% to 99%, preferably 90% to 99%.

The first filler may be of organic or inorganic nature and consist of both a chemical element and a chemical compound or a mixture of substances, for example an alloy.

The first filler is designed to act as a reactant, initiator, catalyst or promoter during debonding of the polymer hybrid material from the solid section after division and thereby faster dissolution of the polymer as compared to a polymeric material without a first filler Hybrid material from the solid-state section leads after division.

The specific chemical composition and configuration of the first filler and its mass fraction is dependent in particular on the specific material of the polymer matrix, which is to be detached, the solvent used for this and the reactants used. Furthermore, the material of the solid state starting material and the dimensions of the solid state starting material to be divided also play a role.

The concrete proportion of the first filler in the polymer matrix is highly dependent on the material of the filler and its mode of action. On the one hand, despite its filler, the polymer matrix must be able to do justice to its task of generating stresses. On the other hand, the proportion of the first filler must be high enough to achieve the desired effect on the polymer removal. The respective optimum mass fraction of the first filler can be determined by the person skilled in the art within the scope of simple experiments carried out in a concentration-dependent manner.

To improve the mechanical properties may additionally a further filler, such. As fumed silica contribute in the form of an inorganic network in the polymer. In addition to these strong interactions in the form of the network, less strong interactions can contribute to the improvement through purely hydrodynamic enhancements.

By way of example, a targeted increase in viscosity should be mentioned, which enables improved processing in the splitting method and thus can contribute to improved manufacturing tolerances. Furthermore, this interaction reduces the internal degrees of freedom a structural reorientation with increasing reinforcement more difficult.

This leads to a desired lowering of the glass transition temperature of the polymer used in the polymer hybrid material, which allows the advantage of a lower temperature in the splitting process.

According to the invention, the first filler in a polymer hybrid material for accelerating the detachment of the polymer hybrid material from a solid section, which is divided by division by means of a splitting process, in which a solid starting material is divided into at least two solid sections, is used.

The first filler may be distributed in the polymer matrix such that the mass fraction of the first filler from the outer interface of the polymer hybrid material bonded to the solid state starting material during the splitting process is parallel to the lower interface arranged further interface of the polymer hybrid material decreases. This means that the mass fraction of the filler near the solid state starting material or section is greater than in the other regions of the polymer hybrid material.

This distribution of the first filler allows a particularly effective removal of the polymer-hybrid material after the separation, since the first filler is close to the interface to the solid section and can exert its effect there. Gelichzeitig have the remaining areas of the polymer-hybrid material less or no shares of the first filler, so that the function of the polymer is influenced as little as possible.

In one embodiment, the polymer hybrid material is layered, wherein only one of the solid state starting material facing layer has the first filler, while the remaining polymer hybrid material is free of the first filler.

Further, a lower portion of the polymer hybrid material adjacent to its lower interface may be free of the first filler. Thus, an area sequence may result as follows: Adjacent to the solid state starting material is first an area without first filler, followed by an area with a high proportion of first filler and then an area with low or no first filler.

These and all ranges described below may be in the form of layers, i. H. the region extends predominantly parallel to the interface of the solid state starting material to which the polymer hybrid material is applied and has a longitudinal and transverse extent at least in the region of this interface.

A lower region without a first filler may be provided in particular in the event that the first filler deteriorates the adhesion of the polymer hybrid material to the solid state starting material. To avoid this, an area without a first filler is first arranged, followed by an area with a high proportion of the first filler, so that the first filler can fulfill its function. A lower layer without a first filler may, for example, have a thickness between 10 .mu.m and 500 .mu.m, for example 100 .mu.m.

Furthermore, an upper portion of the polymer hybrid material adjacent to its upper interface may be free of the first filler. By the upper interface is meant the interface which confines the polymer-hybrid material opposite the lower interface and the solid state starting material to the environment. Lower and upper interfaces can be arranged parallel to each other.

Such an upper region without a first filler can be provided in particular if the first filler adversely affects the heat transfer between the environment and the polymer hybrid material, for example if the cooling of the polymer hybrid material were to be delayed.

The first filler may comprise or consist of a material capable of reacting with a reactant, preferably an oxidant, to release a gaseous product.

As a result, cavities can be generated in the polymer matrix, which allow a faster access of the reactants and solvents to the polymer matrix and any sacrificial layer present and, moreover, effect a faster removal of the educts and dissolved constituents.

By generating gaseous reaction products, additional driving forces can be introduced to further assist in the removal of the polymer hybrid material.

The formation of additional cavities and the formation of gaseous reaction products accelerate the polymer removal and therefore contributes to an increase in the overall yield of the splitting process. By varying the proportion of the first Filler, the cavity density in the boundary region between the solid section and polymer hybrid material or between sacrificial layer and polymer hybrid material can be selectively influenced.

The first filler may comprise a metal, in particular aluminum, iron, zinc and / or copper or consist of a metal, in particular the aforementioned metals. "Consisting of" includes all materials referred to above, that technologically caused impurities or technologically caused admixtures, the z. B. the preparation of the fillers and their distribution or attachment to the polymer matrix are useful, may be included.

Metallic fillers can with oxidizing agents such as. For example, hydrochloric acid, nitric acid, citric acid, formic acid or sulfamic acid react to release a gaseous product and thereby be removed from the polymer-hybrid material.

For example, aluminum reacts with concentrated hydrochloric acid to form solvated metal ions and hydrogen according to the following equation: 6HCl + 2Al + 12H ₂ O → 2 [AlCl ₃ .6H ₂ O] + 3H ₂

Similarly, the reaction of zinc as a filler by reaction with concentrated hydrochloric acid results in the formation of additional cavities: Zn + 2HCl → ZnCl ₂ + H ₂

In the examples mentioned, the generation of hydrogen introduces additional driving forces which further promote the removal of the polymer hybrid material.

Another advantage in the case where the first filler comprises a metal is the improved thermal conductivity within the polymer hybrid material. As a result, the voltages generated by the cooling for the division of the solid state starting material are more effective, i. H. faster and with lower consumption of coolant, can be generated. This increases the overall yield of the splitting method.

Furthermore, a second filler can be provided in the polymer hybrid material, which increases the adhesion of the polymer hybrid material to the solid state starting material in comparison to a polymer hybrid material without a second filler. Preferably, the adhesion is increased compared to a polymer material without filler.

For example, the second filler may be a filler that can be activated by plasma. Plasma activation results in new surface species that can be made to interact more strongly with the surface of the solid starting material and, as a result, improve the adhesion of the polymer hybrid material.

The type of surface species achievable by the plasma treatment is primarily dependent on the process control of the plasma process. For example, during the plasma treatment, gases such as nitrogen, permanent substance, silanes or chlorosilanes may be added, so that, for example, polar groups are formed which can interact more strongly with the surface of the solid starting material.

The second filler may be distributed in the polymer matrix such that the mass fraction of the second filler increases toward the lower interface. For example, the polymer-hybrid material may contain the second filler only in a region adjacent to the lower interface, which region may also be formed as a layer in the sense of the above definition.

This allows the placement of the second filler preferably near the interface between polymer hybrid material and solid state starting material, thereby improving adhesion and thus enabling greater force transfer into the solid state starting material to be divided.

For example, the second filler may comprise core-shell polymer particles or core-shell polymer particles. In this case, preference is given to particles whose polymer composition differs from the polymer matrix of the polymer hybrid material in that in particular the surface, i. H. the shell, the core-shell particles is more activated, z. B. by means of low temperature plasma. Examples of these are core-shell particles comprising a polysiloxane core with an acrylate shell or comprising a nanoscale silicate core with an epoxy shell or comprising a rubber particle core with an epoxy shell or comprising a nitrile rubber particle core with an epoxy -Bowl.

The second filler can by means of low temperature plasma, z. As cold plasma, be activated. For example, the plasma can be generated by means of dielectric barrier discharge (DBE). The average temperature of the non-thermal plasma generated by DBE is about 70 ° C at ambient pressure.

In the case of DBE treatment, for example, the surface is subjected to uni- or bipolar pulses with pulse durations from a few microseconds to a few tens of nanoseconds and amplitudes in the single-digit to double-digit kilovolt range. In this case, no metallic electrodes in the discharge space and thus no metallic impurities or electrode wear are to be expected.

In addition, a high efficiency is advantageous because no charge carriers have to leave or enter the electrodes. Dielectric surfaces can be modified at low temperatures and chemically activated. The surface modification can be carried out, for example, by an interaction and reaction of the surface species by ion bombardment.

Furthermore, specifically process gases, such. As nitrogen, oxygen, hydrogen, silanes or chlorosilanes, z. B. Si _x H _y E _z with E = F, Cl, Br, I, O, H and x = 0 to 10, z = 0 to 10, SiH ₄ , Si (EtO) ₄ or Me ₃ SiOSiMe ₃ , at be added to a plasma treatment, for example, to produce certain chemical groups on the surface.

The second filler may further be activated by means of corona treatment, flame treatment, fluorination, ozonation or UV treatment or eximer irradiation.

By such activation, for example, polar groups are generated on the surface of the second filler which can interact with the surface of the solid state starting material to improve adhesion.

The polymer hybrid material may further comprise a third filler as compared to a polymer hybrid material having a first or to a polymer hybrid material having a first and a second filler.

This third filler has a higher thermal conductivity and / or a higher modulus of elasticity compared to the polymer of the polymer matrix.

For example, the modulus of elasticity of the polymer at low temperature conditions is in the lower single-digit gigapascal range (about 1-3 GPa), while, for example, metallic fillers have an E-modulus in the two-digit to three-digit gigapascal range. With a corresponding high filler content, a percolating filler network is possible, allowing for improved "force coupling" into the solid state starting material.

The percolation is significantly influenced by the volume filling level of the respective fillers (eg 0.1% by volume, 1% by volume to 10% by volume depending on the aspect ratio). With increasing introduction of force, the viscoelastic layer structure of the polymer structure can be submerged and several percolation paths become effective. Here, improved heat transfer can be made possible because it can lead to improved contact of the fillers with the surface of the solid state starting material.

The mechanical stability of the polymer hybrid material is achieved faster even at low temperatures. In sum, there is a lower standard deviation of the corresponding structural property profiles such. B. breaking stress and elongation at break of the polymer-hybrid material and thus to an increase in the overall yield of the splitting process. The spatially resolved property profile changes (stress peaks in the polymer hybrid material) and thus in the solid state are smaller, which leads to a higher overall yield of the splitting process and a better quality of the solid sections produced.

The third filler can provide improved heat transfer between the environment and polymer hybrid material and faster heat conduction within the polymer hybrid material, so that the polymer hybrid material can be cooled faster and the splitting process performed faster overall and thus more effectively can be.

By increasing the modulus of elasticity, higher voltages can be generated for the division of the solid state starting material, so that it is also possible to split solid starting materials for which a particularly high voltage is required.

In addition, the third filler can also be used to influence the thermal expansion coefficient. The aim is to maximize the difference between the coefficients of thermal expansion of the polymer hybrid material and the solid state starting material to be divided in order to generate additional stresses necessary for the division. Preferably, the third filler has a high thermal expansion coefficient, d. H. an expansion coefficient higher than that of the polymer matrix. For example, the thermal expansion coefficient of the third filler may be more than 300 ppm / K.

The third filler may be distributed in the polymer matrix such that the mass fraction of the third filler increases toward the upper interface to allow faster heat transfer, particularly at the interface to the environment.

The third filler may comprise a metal, in particular aluminum, iron, zinc and / or copper, or consist of one of the metals mentioned. Metals are generally characterized by high thermal conductivity and thermal conductivity.

The fillers described may be distributed in particulate form in the polymer matrix, wherein the particle size in the micron and nm range, based on at least one dimension of the particle, may be. In addition to a spherical shape, the filler particles can also assume other configurations, for example a rod-shaped or disc-shaped form.

The filler particles can have all particle size distributions, for example monomodal or bimodal, narrow, in particular monodisperse, or broad. The fillers can be attached to the polymer matrix both physically, e.g. B. by embedding in the polymer network, as well as be chemically attached.

Furthermore, one or more of the fillers described may comprise or consist of inorganic or organic fibers, for example carbon, glass, basalt or aramid fibers, provided that the functions described above are compatible therewith. Optionally, another filler may be added comprising or consisting of said fibers.

Fibers usually have strongly anisotropic properties. By a direction-dependent positioning of the filler in the polymer-hybrid material, there is the possibility of a targeted influencing the necessary for the division of the solid state starting material voltages. This can help increase the overall yield of the splitting process.

An additional advantage, in the case where an organic or inorganic filler is used as a pulp having a highly anisotropic structure, is that it can achieve an improvement in mechanical properties within the polymer hybrid material.

The described fillers may also comprise or consist of core-shell particles. Additionally or alternatively, a further filler may be provided comprising or consisting of core-shell particles in the polymer hybrid material.

 Core-shell particles are characterized by the fact that a generally spherical core of a material is surrounded by a shell of a second material. The shell can either completely encase the core or be permeable.

The materials may be both inorganic materials, such as. As metals, or organic materials such. As polymers act. For example, two different metals can be combined with each other. But it is also possible to surround a core of a polymer with a shell of a metal or a second polymer.

Core-shell particles allow the combination of the properties of the first and second materials. For example, the size and density of the filler particles can be determined via a low-cost polymer core, while the metallic shell can react as described above. Due to their often monodisperse particle size distribution, the properties of the core-shell particles can also be accurately predicted and adjusted.

Furthermore, the fillers may comprise or consist of silica, for example fumed silica. Additionally or alternatively, another filler comprising or consisting of silica may be provided in the polymer hybrid material.

Pyrogenic silica can form a three-dimensional network and thereby contribute to the improvement of mechanical stability. Thus, such a filler can serve to selectively adjust the mechanical properties of the polymer hybrid material.

One or more of the said fillers (first, second, third filler) may be of the same material, as long as this is compatible with the function attributed to them. For example, both the first and the third filler comprise aluminum or consist of aluminum. As described above, aluminum can be used both to generate cavities and thus to accelerate the detachment of the polymer hybrid material from the solid body section and also to increase the thermal conductivity. Such a configuration simplifies the manufacturing process, since it may be sufficient to add only one or two fillers to perform all functions.

First and second and possibly third filler can also consist of different materials. This allows an individual and thus better adaptation of the filler to the desired function.

A film of the invention comprises a polymer hybrid material as above described. The film may have a thickness of, for example, 0.5 to 5 mm.

The polymer hybrid material according to the invention or a film according to the invention can be used in a splitting process for dividing a solid starting material into at least two solid sections.

In particular, the polymer hybrid material can be used in a splitting method in which a plurality of cylindrical, preferably disk-shaped, solid body sections, in particular wafers, are produced from a cylindrical solid state starting material.

Under cylinder is to be understood by one of two parallel, flat, congruent surfaces (top and top surface) and a shell or cylindrical surface of limited body, wherein the lateral surface is formed by parallel straight lines. Preferably, the base and top surfaces are circular and lie congruently one above the other, so that a straight circular cylinder results. Nevertheless, other cylinder designs, eg. B. with n-sided base areas with n = 3, 4, 5 or 6, conceivable, with the base and top surfaces preferably above one another congruent.

As used herein, a solid state starting material is understood to mean a monocrystalline, polycrystalline or amorphous material. Due to the strongly anisotropic atomic bonding forces, monocrystalline materials having a strongly anisotropic structure are preferred. The solid-state starting material preferably comprises or consists of a material or a combination of materials from one of the main groups 3, 4, 5 and / or 12 of the Periodic Table of the Elements, in particular a combination of elements of the 3rd, 5th and 12th main groups such a material, such as. Silicon Si, silicon carbide SiC, SiGe, germanium Ge, gallium arsenide GaAs, indium phosphide InP, gallium nitride GaN, alumina Al ₂ O ₃ (sapphire), aluminum nitride AlN.

In addition, the semiconductor starting material may include, for example, zinc oxide ZnO, gallium (III) oxide Ga ₂ O ₃ , gallium phosphide GaP, indium arsenide InAs, indium nitride InN, aluminum arsenide AlAs or diamond, or consist of such a material.

Furthermore, the solid state starting material may comprise a ceramic (eg Al ₂ O ₃ - alumina) or may consist of a ceramic, preferred ceramics being z. Perovskite ceramics (such as Pb, O, Ti / Zr containing ceramics) in general, and lead magnesium niobates, barium titanate, lithium titanate, yttrium aluminum garnet, especially yttrium aluminum garnet crystals for solid state laser applications, SAW Ceramics (surface acoustic wave), such. As lithium niobate, gallium orthophosphate, quartz, calcium titanate, etc. in particular.

The solid state starting material thus preferably has a semiconductor material or a ceramic material or, particularly preferably, the solid body consists of at least one semiconductor material or a ceramic material. It is also conceivable that the solid has a transparent material or partially made of a transparent material, such. B. sapphire, consists or is made.

Other materials that come here as a solid starting material alone or in combination with another material in question are, for. B. "wide band gap" materials, InAlSb, high temperature superconductors, in particular rare earth cuprates (eg YBa ₂ Cu ₃ O ₇ ). It is additionally or alternatively conceivable that the solid state starting material is a photomask, wherein as photomask material in the present case, preferably any known to the filing date photomask material and more preferably combinations thereof can be used.

A splitting method according to the invention comprises the following steps: First, the solid-state starting material to be divided is provided with an exposed surface. The solid state starting material may be as described above, for example, have a cylindrical shape and consist of one of the listed materials.

An inventive polymer hybrid material or a film according to the invention is applied to at least this surface so that a corresponding composite structure results. The applied polymer-hybrid material or the applied film are also referred to below as recording layer. The thickness of such a receiving layer may be, for example, between 0.5 mm and 5 mm.

Optionally, the polymer hybrid material or the film can also be applied to a plurality of exposed surfaces, in particular to surfaces arranged parallel to one another.

In particular, it may be a cylindrical solid-state starting material. In this case, the polymer hybrid material or the film is applied to an exposed base and / or top surface. This can be done for example by sticking a film consisting of the polymer-hybrid material.

The application of the polymer hybrid material to the exposed surface of the solid starting material may also be accomplished by forming the polymer hybrid material directly on that surface, for example, by the method described below for preparing a polymer hybrid material this surface is performed. Thus, a precursor substance of the liquid phase polymer hybrid material may be applied to the exposed surface of the solid state starting material which undergoes a physical and / or chemical process, such as evaporation and / or crosslinking reactions, to form the actual polymer hybrid material followed.

Subsequently, the composite structure is subjected to a voltage field in such a way that the solid state starting material is split into at least two solid sections along a separation plane within the solid state starting material.

The stress field can be brought about by thermal exposure of the recording layer, for example by sudden cooling or heating, in particular by sudden cooling by liquid nitrogen, the stress field due to the different thermal expansion coefficients of the solid starting material and the polymer-hybrid material and the resulting significant change in the E-module is created.

The thermal exposure preferably means that the receiving layer is cooled below the ambient temperature and preferably below 10 ° C. and more preferably below 0 ° C. and more preferably below -10 ° C.

The cooling of the receiving layer is most preferably such that at least a part of the receiving layer completes a glass transition. The cooling can be a cooling to below -100 ° C, the z. B. by means of liquid nitrogen is effected. This embodiment is advantageous because the receiving layer contracts as a function of the temperature change and / or undergoes a glass transition and the resulting forces are transferred to the solid state starting material, whereby mechanical stresses can be generated in the solid, which trigger a crack and / or or crack propagation, wherein the crack first propagates along the first release plane to cleave the solid layer.

In a further step, the polymer-hybrid material or the film is removed from the solid-state section, for example by a chemical reaction, a physical detachment process and / or mechanical removal.

Optionally, a sacrificial layer may be provided between the solid state starting material and the polymer hybrid material or film to facilitate removal of the polymer hybrid material or film after division by, for example, decomposing the sacrificial layer by a suitable chemical reaction ,

While the polymer matrix is used to generate the stresses necessary to divide the solid starting material, the filler or fillers are responsible for the above-described tasks.

In particular, by the first filler, the removal of the polymer-hybrid material or the film can be accelerated by improving the delivery and removal of the solvent and the dissolved constituents or the reaction products and products. As a result, the previously required according to the prior art additional voltages can be reduced to a complete waiver, so that caused damage to the solid sections can be avoided. The result is a shorter process time and an improved overall yield.

In addition, the process stability of the overall process is increased, since fewer process steps are necessary due to the possible omission of the introduction of additional voltages.

If the polymer matrix and / or the fillers are not subject to a chemical reaction, their reuse is also possible.

The removal of the polymer hybrid material or the film can be accelerated so that can be dispensed with an additional sacrificial layer. This contributes to a further simplification and thus to an increase in the process stability of the splitting method.

The polymer hybrid material or film may be applied directly to the exposed surface of the solid state starting material or an intervening sacrificial layer may be provided.

The polymer hybrid material or film may be applied to the surface of the solid state starting material or sacrificial layer by low temperature plasma, e.g. B. cold plasma can be activated. In this case, an activation of the polymer matrix and / or the filler or fillers as described above. Additionally or alternatively, the surface of the solid state Starting material or the sacrificial layer are plasma-treated.

This promotes a more homogeneous and adjustable adhesion to the solid state starting material or the sacrificial layer and enables better power transmission.

For example, a spatially resolved surface morphology can be realized by a targeted plasma treatment. This can lead to desired target profiles such. B. different spatially resolved adhesion or cohesion properties of the surface of the polymer hybrid material and / or the surface of the solid state starting material and / or the subsequent sacrificial layer serve.

A film of the invention can be applied by lamination or gluing directly to the surface of the solid state starting material or to the sacrificial layer. Lamination allows better adhesion, especially in the edge area. As a result, break-off of the solid material in the edge region during the division can be largely avoided, as a result of which the reject rate can be reduced.

Optionally, a release plane within the solid state starting material can be predetermined by means of at least one radiation source, for example by means of a laser. Thus, the position of the release plane can be accurately determined, so that a very small TTV, in particular less than 200 microns or 100 microns or less than 80 microns or less than 60 microns or less than 40 microns or less than 20 microns or less than 10 microns or smaller than 5 μm, in particular smaller than 4, 3, 2, 1 μm is made possible.

The radiation exposure of the solid state starting material thus creates in a first step a kind of perforation in the interior of the solid state starting material along which the crack propagation takes place in a second step or along which the solid state section is separated from the solid state starting material.

At least or one radiation source may be configured to provide the radiation to be introduced into the solid state starting material such that the rays emitted thereby produce the defects at predetermined locations within the solid state starting material. This embodiment is advantageous because defects in the solid state starting material can be generated extremely accurately by means of a radiation source, in particular by means of a laser.

The radiation source can be set in such a way that the rays emitted by it to generate the release plane penetrate to a defined depth, in particular into a depth <100 μm, into the solid state starting material. Preferably, the Ablöseebene is parallel spaced formed to an outer and preferably flat surface of the solid state starting material. Preferably, the release plane is less than 100 microns, and preferably less than 50 microns, and more preferably less than or equal to 20, 10, 5 or 2 microns from the planar surface of the solid state starting material spaced within the solid state starting material formed.

The solid can be acted upon with a predetermined wavelength and / or power, wherein the predetermined wavelength is preferably adapted to the respective material. This embodiment is advantageous because the defect size can be influenced by the wavelength and / or the power.

The solid state starting material may be disposed on a support layer for holding the solid, wherein the support layer is disposed on a first planar surface portion of the solid state starting material, wherein the first planar area portion of the solid state starting material is spaced from a second planar area portion of the solid state starting material , Wherein the receiving layer is arranged on the second planar surface portion and wherein the Ablöseebene compared to the first planar surface portion and / or the second planar area portion is aligned in parallel or is generated in parallel.

This embodiment is advantageous since the solid state starting material is arranged at least in sections and preferably completely between the holding layer and the receiving layer, whereby the stresses for crack generation or crack propagation in the solid body can be introduced by means of one of these layers or by means of both layers.

The holding layer can be arranged on an at least partially planar surface of a stabilizing device, which at least partially consists of at least one metal.

The stabilizing device is preferably a plate, in particular a plate comprising or consisting of aluminum. This embodiment is advantageous because the solid state starting material is defined or held by the stabilizing device and the holding layer, whereby the voltages can be generated very accurately in the solid state starting material.

The stresses may be adjustable in the solid state such that the crack initiation and / or the crack propagation for producing a topography are in the crack plane resulting surface is controllable. The stresses are thus preferably in different areas of the solid preferably at least temporarily differently strong generated. This embodiment is advantageous since the topography of the generated or separated solid-state layer can be advantageously influenced by controlling the crack initiation and / or the crack progression.

A method according to the invention for producing the above-described polymer hybrid material comprises adding one or more fillers to a monomer, a monomer solution or an uncrosslinked polymer, preferably an uncrosslinked polydimethylsiloxane. This mixture is polymerized and / or crosslinked during or after the addition of the filler or fillers.

Alternatively, the filler or fillers may also be added to a polymer melt such that the polymer hybrid material is obtained by cooling to a temperature below the melting temperature.

The distribution of filler (s) in the polymer matrix can be controlled by the rate of polymerization and / or crosslinking or cooling. For this purpose, it is exploited that the viscosity changes as a result of the polymerization, crosslinking or cooling, so that the sedimentation rate of the fillers is reduced.

By a suitable movement of the mixture of filler and polymer matrix during the polymerization, crosslinking or cooling, for example, a uniform filler distribution can be achieved.

On the other hand, slow polymerization, cross-linking or cooling without movement, due to the action of the gravitational force, leads to a filler enrichment in the near-earth region due to sedimentation, provided that the filler has a higher density than the polymer matrix. This can be exploited for enrichment of the filler in the boundary region to the solid state starting material or to the sacrificial layer, for example, to selectively generate there by suitable reactions cavities.

The distribution of the filler or fillers in the polymer matrix can also be controlled by otherwise affecting the sedimentation rate of the filler (s).

In addition to the ratio of the densities of filler and polymer matrix, the particle shape also influences the sedimentation. A strongly anisotropic particle shape, in particular with a high non-rotationally symmetric aspect ratio, such as, for example, fibers, leads, for example, to a delay in sedimentation and to a gradual change in the filler distribution within the polymer matrix.

The aspect ratio is preferably understood as the ratio of length to diameter, length to width or length to thickness.

As a length always the largest extent of a particle is chosen in one of the spatial directions.

Thus, the aspect ratio is always greater than or equal to one. The aspect ratio of one corresponds to a perfect spherical shape. Deviations from a spherical shape are described with aspect ratios greater than one.

For example, fibers typically have a very high aspect ratio (strong anisotropic particle shape).

Depending on the fillers used or the combination of fillers, the aspect ratio of the filler particles may be greater than 100, 1000, 10,000, often even greater than 100,000 (eg, in carbon nanotubes), but the present invention is not intended to be so limited.

In the case of strongly anisotropic filler particles, additional stabilization by superstructures may occur which counteract sedimentation. In the case of nanoscale filler particles, three-dimensional framework structures are also possible which further complicate sedimentation, so that the properties can be specifically influenced, especially in the limit region.

mit

ν_p

Sedimentationsgeschwindigkeit

r

Radius des sinkenden Partikels

g

Erdbeschleunigung

ρ_p

Dichte des Partikels

ρ_f

Dichte des Fluids

η

dynamische Viskosität des Fluids

In addition, because of the Stokes equation, which is based on the law of Stokes, the particle radius is in the square of the sedimentation rate:

With

ν _p

sedimentation

r

Radius of the sinking particle

G

acceleration of gravity

_p

Density of the particle

ρ _f

Density of the fluid

η

dynamic viscosity of the fluid

Thereafter, the sedimentation rate is reduced, especially for submicron and nanoscale particles in the course of the polymer cross-linking reaction.

One or more of the fillers to be added may also act as an inhibitor. Additionally or alternatively, one or more inhibitors may also be added. As a result, for example, an unwanted premature polymerization can be prevented.

It is also possible with silicone matrices, such. As polydimethylsiloxane, which are cured by UV radiation to adjust the necessary crosslinking time subsequently by acting as an inhibitor filler. This is done by reducing the reaction rate by appropriate radical scavengers or stabilizers. Thus, the storage stability of the monomer, the monomer solution or the uncrosslinked polymer is increased accordingly by preventing unwanted premature polymerization or crosslinking.

This is also possible with systems to be thermally crosslinked, z. Example by the addition of sulfur, amine-containing substances, tetramethyltetravinylcyclotetrasiloxane, 2-methylbutyn-3-ol-2 or by the addition of dimethyl fumarate and dimethyl maleate in systems that are vulcanized at room temperature (RTV systems). In addition, with regard to industrial processing, the so-called pot life can be set so that meaningful batch batch sizes can be realized.

With the aid of the processes described, the properties of the polymer hybrid material can be adapted specifically to the particular solid state starting material and the process conditions of the splitting process. For example, it is possible to arrange a filler, which primarily serves to create cavities and thus the improved removal of the polymer hybrid material, in the boundary region to the solid section, while another filler to improve the heat conduction, z. B. the third filler described above, as uniformly distributed in the polymer hybrid material may be present or is located primarily in the boundary region to the environment.

Optionally, the polymer-hybrid material obtained by the process described can be supplemented by a filler-free layer. In this way, for example, a distribution of the filler in the polymer matrix can be obtained, in which a region with a high filler content initially follows a filler-free layer and subsequently the filler fraction decreases again.

This may be advantageous, for example, if the filler negatively affects the adhesion of the polymer hybrid material to the solid state starting material, but nevertheless requires a high filler concentration in the boundary region to the solid state starting material, after the division, the polymer hybrid material faster to be able to detach from the solid body section.

Furthermore, the subject of the German patent application 10 2013 016 666.7 fully incorporated by reference into the subject matter of the present application. Likewise, the objects of all other filed on the filing date of the present patent application by the Applicant also filed and related to the field of producing solid-state layers further patent applications are fully made subject of the present patent application.

Further advantages, objects and characteristics of the present invention will be explained with reference to the following description of attached drawings, in which the wafer production according to the invention is shown by way of example. Components or elements of the wafer production according to the invention, which in the figures at least essentially coincide with respect to their function, may hereby be identified by the same reference symbols, these components or elements not having to be numbered or explained in all figures.

Individual or all representations of the figures described below are preferably to be regarded as construction drawings, d. H. the dimensions, proportions, functional relationships and / or arrangements resulting from the figure or figures preferably correspond exactly or preferably substantially to those of the device according to the invention or of the product according to the invention.

In the drawings show:

1a a schematic representation of a polymer hybrid material with a first filler;

1b a schematic representation of a polymer hybrid material having a first and a second filler;

1c a schematic representation of a polymer hybrid material having a first, second and third filler;

2a a schematic structure for creating defects in a solid body;

2 B a schematic representation of a layer arrangement prior to the separation of a solid layer of a solid;

2c a schematic representation of a layer arrangement after separating a solid layer of a solid:

3a a first schematically illustrated variant for defect generation by means of light waves;

3b a second schematically illustrated variant for defect generation by means of light waves: and

4 a schematic representation of the release plane.

1a shows a polymer hybrid material according to the invention 1 in which in a polymer matrix 2 a first filler 3 is embedded. The polymer matrix 2 in the example consists of PDMS. The first filler 3 acts as a reactant in a splitting process during the debonding of the polymer hybrid material 1 from the solid section 7 after division, thereby enabling faster release of the polymer hybrid material as compared to a polymeric material without a first filler 1 from the solid section 7 after the division.

In the example, there is the first filler 3 made of aluminum or zinc, so that a gaseous product can be formed by reaction with hydrochloric acid.

The first filler 3 is in the polymer matrix 2 distributed along a gradient. The mass fraction of the first filler 3 is in the range of the lower interface 23 highest and increases in the direction of the upper boundary 24 from.

1b shows by way of example a further embodiment of the polymer hybrid material 1 , wherein compared to the embodiment according to 1a another second filler 4 is available.

This second filler 4 improves the adhesion of the polymer hybrid material 1 on the solid starting material 6 compared to a polymer hybrid material 1 without second filler 4 ,

The second filler 4 is in the polymer matrix 2 so distributed that its mass fraction towards the lower interface 23 increases and can be activated preferably by means of cold plasma.

1c shows by way of example a further embodiment of the polymer hybrid material 1 , wherein compared to the embodiment according to 1b another third filler 5 is available.

This third filler 5 comprises a metal and has the polymer matrix compared to the polymer 2 a higher thermal conductivity on. The third filler 5 has the highest proportion in a region adjacent to the upper interface 24 on.

In all three embodiments according to 1a . 1b and 1c is the mass fraction of the polymer matrix 2 on the polymer hybrid material 1 90% or more.

In 2a is a solid starting material 6 shown in the area of a radiation source 13 , in particular a laser, is arranged. The solid state starting material 6 preferably has a first planar surface portion 11 and a second planar area portion 12 on, wherein the first planar surface portion 11 preferably substantially or exactly parallel to the second planar area fraction 12 is aligned.

The first flat area fraction 11 and the second level area percentage 12 preferably limit the solid starting material 6 in a Y-direction, which is preferably oriented vertically or vertically. The flat area proportions 11 and 12 preferably extend in each case in an XZ plane, wherein the XZ plane is preferably oriented horizontally.

Furthermore, it is possible 2a take that the radiation source 13 radiation 14 on the solid state starting material 6 radiates. The radiation 14 Depending on the configuration, penetrates deep into the solid-state starting material 6 and generates at the respective position or at a predetermined position a defect.

In 2 B a multilayer arrangement is shown wherein the solid state starting material 6 the detachment level 9 includes and in the area of the first flat area fraction 11 with a holding layer 10 is provided, which in turn is preferably superimposed by a further layer, wherein the further layer preferably a stabilizing device 15 , in particular a metal plate, is.

At the second planar surface portion 12 of the solid state starting material 6 is a recording layer 8th arranged, which made of polymer hybrid material 1 consists. The solid state starting material 6 has in the example silicon and / or gallium or perovskite and the polymer matrix 2 of the polymer hybrid material 1 and / or the holding layer 10 consist at least partially and preferably completely or more than 75% (mass fraction) of polydimethylsiloxane (PDMS).

In 2c is shown a state after a crack initiation and subsequent cracking. The solid section 7 adheres to the recording layer 8th and is from the remainder of the solid starting material 6 spaced or spaced.

In the 3a and 3b are examples of the in 2a shown generation of a release plane 9 by introducing defects into one Solid-starting material 6 by means of light radiation 14 shown.

By the polymer hybrid material according to the invention 1 are exemplified by means of the method described below solid sections 7 in the form of solid state layers, solid state plates or wafers with a uniform thickness can be produced inexpensively. In particular, a TTV of less than 120 μm is thereby achieved.

• – des Bereitstellens eines Festkörper-Ausgangsmaterials 6 zum Abtrennen mindestens eines Festkörper-Teilstücks 7 in Form einer Festkörperschicht,
• – des Erzeugens von Defekten 19 mittels mindestens einer Strahlungsquelle 13, insbesondere eines Laser, in der inneren Struktur des Festkörper-Ausgangsmaterials 6 zum Vorgeben einer Ablöseebene 9, entlang der das Festkörper-Teilstück 7 vom Festkörper-Ausgangsmaterial 6 abgetrennt wird,
• – des Anordnens einer Aufnahmeschicht 8 bestehend aus dem erfindungsgemäßen Polymer-Hybrid-Material 1,
• – des thermischen Beaufschlagens der Aufnahmeschicht 8 zum, insbesondere mechanischen, Erzeugen von Spannungen in dem Festkörper-Ausgangsmaterial 6, wobei sich durch die Spannungen ein Riss in dem Festkörper-Ausgangsmaterial 6 entlang der Ablöseebene 9 ausbreitet, der das Festkörper-Teilstück 7 von dem Festkörper-Ausgangsmaterial 6 abtrennt;
• – Entfernen des Polymer-Hybrid-Materials 1 vom Festkörper-Teilstück 7.

In the exemplified process, a polymer-hybrid material according to the invention is used 1 as set forth in detail above, wherein the polymer-hybrid material may be in the form of a film. This method preferably comprises at least the steps:

• - Providing a solid starting material 6 for separating at least one solid section 7 in the form of a solid state layer,
• - the creation of defects 19 by means of at least one radiation source 13 , in particular a laser, in the internal structure of the solid state starting material 6 for specifying a detachment level 9 , along which the solid-state section 7 from the solid state starting material 6 is disconnected,
• - Arranging a recording layer 8th consisting of the polymer hybrid material according to the invention 1 .
• - The thermal impact of the recording layer 8th for, in particular mechanical, generating stresses in the solid state starting material 6 , wherein the stresses cause a crack in the solid state starting material 6 along the detachment level 9 spreads out the solid-state section 7 from the solid state starting material 6 separates;
• Removal of the polymer hybrid material 1 from the solid section 7 ,

This solution is advantageous because, due to the radiation source, the release layer or defect layer can be produced in the solid state starting material, through which the crack is guided or guided in the crack propagation, which results in the realization of very small TTVs, in particular less than 200 μm or 100 μm or less than 80 μm or less than 60 μm or less than 40 μm or less than 20 μm or less than 10 μm or less than 5 μm, in particular less than 4, 3, 2, 1 μm.

The thermal exposure preferably means that the receiving layer is cooled below the ambient temperature and preferably below 10 ° C. and more preferably below 0 ° C. and more preferably below -10 ° C.

The cooling of the receiving layer is most preferably such that at least a part of the receiving layer completes a glass transition. The cooling can be a cooling to below -100 ° C, the z. B. by means of liquid nitrogen is effected.

In 3a is thus shown schematically as defects 19 in a solid starting material 6 , in particular for generating a release plane 9 by means of a radiation source 13 , in particular one or more lasers, can be generated.

The radiation source 13 emits radiation 14 with a first radiation component 17 with a first wavelength and with a second radiation component 18 with a second wavelength. The two wavelengths of the first and second radiation components 17 . 18 are coordinated with each other or the distance between the radiation source 13 and the release level to be created 9 is tuned such that the radiation components 17 . 18 essentially or exactly at the release level 9 in the solid state starting material 6 coinciding, whereby at the place of the meeting due to the energies of both radiation components 17 . 18 defects 19 be generated.

The defect production can be achieved by different or combined decomposition mechanisms such. B. sublimation or chemical reaction, wherein the decomposition z. B. can be initiated thermally and / or photochemically.

In 3b is a focused beam of light 14 whose focus is preferably in the release plane 9 lies. It is conceivable here that the light beam 14 by one or more focusing bodies, in particular lens (s) (not shown). The solid state starting material 6 is formed in this embodiment, multi-layered and preferably has a partially transparent or transparent substrate layer 20 preferably made of sapphire or having sapphire. The light radiation 14 passes through the substrate layer 20 to the detachment level 9 passing through an activation layer 16 is formed, wherein the activation layer 16 through the radiation 14 is acted upon in such a way that thermally and / or photochemically a partial or complete destruction of the activation layer 16 is effected in the focal point or in the region of the focal point.

It is also conceivable that the defects 19 to produce the release layer 9 in the area or exactly on an interface between the solid section 7 and the substrate layer 20 be generated. Thus, it is also conceivable that the solid body section 7 on a carrier layer, in particular a substrate layer 20 , is generated and by means of one or more activation layers 16 and / or by the generation of defects 19 in an interface, in particular between the solid section 7 and the backing layer, a release plane 9 for detaching or separating the solid body section 7 can be generated.

In 4 is a detachment level 9 shown the areas with different defect concentrations 21 . 22 . 23 having. It is conceivable that a variety of areas with different defect concentrations 21 . 22 . 23 a detachment level 9 It is also conceivable that the defects 19 in the stripping level 9 are distributed substantially or exactly evenly over the surface.

The different defect concentrations 21 . 22 . 23 can be made equal in size or different in size. Preferably, a first increased defect concentration provides a crack initiation concentration 21 which is preferably generated in the region of the edge or extending towards the edge or adjacent to the edge.

Additionally or alternatively, a crack guidance concentration 22 be formed such that the solid-state portion 7 from the solid state starting material 6 separating crack is controllable or controllable.

Furthermore, additionally or alternatively, a center concentration 23 are preferably formed, a very flat surface in the region of the center of the solid state starting material 6 allows.

The crack guidance concentration is preferred 22 partially or completely formed annular or enclosing and thus preferably encloses sections and particularly preferably completely the center of the solid state starting material 6 or the solid section 7 ,

It is also conceivable that the crack guidance concentration 22 in one starting from the edge of the solid starting material 6 and toward the center of the solid starting material 6 decreases gradually or steadily or fluently. Furthermore, it is conceivable that the crack guidance concentration 22 band-like and homogeneous or substantially or exactly homogeneous.

LIST OF REFERENCE NUMBERS

1

Polymer hybrid material

2

polymer matrix

3

first filler

4

second filler

5

third filler

6

Solid-starting material

7

Solid-section

8th

recording layer

9

transfer level

10

holding layer

11

first plane area fraction

12

second plane area fraction

13

radiation source

14

radiation

15

stabilizing device

16

activation layer

17

first radiation component

18

second radiation component

19

malfunction

20

 substrate layer

21

Crack triggering concentration

22

Crack guidance concentration

23

center concentration

24

 lower interface

25

upper interface

X

first direction

Y

second direction

Z

third direction

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• WO 2009/061353 A2 [0007]
• WO 2010/072675 A2 [0007, 0020]
• DE 102012001620 A1 [0013, 0016]
• DE 19640594 A1 [0024, 0025]
• DE 102013016666 [0160]

Claims (26)

Polymer hybrid material ( 1 ) for use in a splitting process for the division of a solid starting material ( 6 ) in at least two solid sections ( 7 ) comprising: a polymer matrix ( 2 ) and - at least one in the polymer matrix ( 2 ) embedded first filler ( 3 ), which acts as a reactant, initiator, catalyst or promoter during the debonding of the polymer-hybrid material ( 1 ) from the solid section ( 7 ) acts after division and thereby compared to a polymer material without a first filler ( 3 ) to a faster detachment of the polymer hybrid material ( 1 ) from the solid section ( 7 ) leads after the division. Polymer hybrid material ( 1 ) according to claim 1, wherein the first filler ( 3 ) in the polymer matrix ( 2 ) is distributed such that the mass fraction of the first filler ( 3 ) starting from an outer interface of the polymer hybrid material ( 1 ) generated during the splitting process with the solid starting material ( 6 ) is connected directly or indirectly via another layer, hereinafter referred to as the lower boundary surface ( 24 ), in the direction of an opposite to the lower interface ( 23 ) arranged further interface of the polymer hybrid material ( 1 ), hereinafter referred to as upper interface ( 25 ), decreases. Polymer hybrid material ( 1 ) according to claim 1 or 2, wherein a lower region of the polymer hybrid material ( 1 ) directly to the lower interface ( 24 ) and / or an upper region of the polymer hybrid material ( 1 ) directly to the upper interface ( 25 ), no first filler ( 3 ) having. Polymer hybrid material ( 1 ) according to any one of the preceding claims, wherein the first filler ( 3 ) can react with a reactant, preferably an oxidant, to release a gaseous product. Polymer hybrid material ( 1 ) according to any one of the preceding claims, further comprising: - a second filler ( 4 ), which determines the adhesion of the polymer hybrid material ( 1 ) on the solid starting material ( 6 ) compared to a polymer hybrid material ( 1 ) without second filler ( 4 ) elevated. Polymer hybrid material ( 1 ) according to claim 5, wherein the second filler ( 4 ) in the polymer matrix ( 2 ) is distributed such that the mass fraction of the second filler ( 4 ) towards the lower interface ( 23 ) increases. Polymer hybrid material ( 1 ) according to claim 5 or 6, wherein the second filler ( 4 ) Is activated by means of low temperature plasma. Polymer hybrid material ( 1 ) according to any one of the preceding claims, further comprising: - a third filler ( 5 ), compared to the polymer of the polymer matrix ( 2 ) has a higher thermal conductivity and / or a higher modulus of elasticity. Polymer hybrid material ( 1 ) according to claim 8, wherein the third filler ( 5 ) in the polymer matrix ( 2 ) is distributed such that the mass fraction of the third filler ( 5 ) towards the upper interface ( 24 ) increases. Polymer hybrid material ( 1 ) according to any one of the preceding claims, wherein the first and / or the third filler ( 3 . 5 ) comprises at least one metal, in particular aluminum, iron, zinc and / or copper. Polymer hybrid material ( 1 ) according to any one of the preceding claims, wherein the polymer matrix ( 2 ) is an elastomeric matrix, preferably a polydiorganosiloxane matrix, more preferably a polydimethylsiloxane matrix. Polymer hybrid material ( 1 ) according to any one of the preceding claims, wherein the mass fraction of the polymer matrix ( 2 ) on the polymer hybrid material ( 1 ) Is 80% to 99%, preferably 90% to 99%. Polymer hybrid material ( 1 ) according to any one of the preceding claims, wherein one or more of the fillers comprises inorganic or organic fibers, core-shell particles or silica and / or wherein the polymer-hybrid material ( 1 ) comprises a further filler comprising inorganic or organic fibers, core-shell particles or silica. Film comprising a polymer hybrid material ( 1 ) according to any one of the preceding claims. Splitting process for the division of a solid starting material ( 6 ) in at least two solid sections ( 7 ), comprising the following steps: a) providing the solid starting material ( 6 ) having at least one exposed surface, b) applying a polymer hybrid material ( 1 ) according to one of claims 1 to 13 or a film according to claim 14, on at least one exposed surface of the solid state starting material ( 6 ), resulting in a composite structure, c) subjecting the composite structure to a stress field such that the solid state starting material ( 6 ) along a release plane ( 9 ) within the solid starting material ( 6 ) in at least two solid sections ( 7 d) removal of the polymer hybrid material ( 1 ) or the film from the solid section ( 7 ). The splitting method according to claim 15, wherein first a sacrificial layer is applied to the exposed surface of the solid state starting material ( 6 ) and then the polymer hybrid material ( 1 ) or the film is applied to the sacrificial layer, so that the composite structure the solid state starting material ( 6 ), the sacrificial layer and the polymer hybrid material ( 1 ) or the film comprises. A splitting method according to claim 15 or 16, wherein the polymer hybrid material ( 1 ) or the film and / or the solid starting material ( 6 ) or the sacrificial layer before application according to step b) are activated by means of low-temperature plasma. A splitting method according to any one of claims 15 to 17, wherein in step b) a film according to claim 14 is laminated or glued to at least one surface of the solid starting material (16). 6 ) or applied to the sacrificial layer. A splitting method according to any one of claims 15 to 18, wherein in the solid state starting material ( 6 ) Defects by means of at least one radiation source ( 13 ) for specifying the decay level ( 9 ) be generated. Use of a polymer hybrid material ( 1 ) according to one of claims 1 to 13 or a film according to claim 14 in a splitting process for the division of a solid starting material ( 6 ) in at least two solid sections ( 7 ). Use of a filler ( 3 ) in a polymer hybrid material according to any one of claims 1 to 13 for accelerating the detachment of the polymer-hybrid material from a solid section, by division by means of a splitting process, wherein a solid starting material in at least two solid sections is shared. Process for the preparation of a polymer hybrid material ( 1 ) according to one of claims 1 to 13, comprising: a) the addition of the first filler ( 3 ) or the first and second filler ( 3 . 4 ) or the first, second and third filler ( 3 . 4 . 5 to a monomer, a monomer solution, an uncrosslinked polymer, preferably an uncrosslinked polydimethylsiloxane, or a polymer melt; and b) the polymerization and / or crosslinking or cooling to a temperature below the melting temperature of the polymer of the mixture obtained in step a) during and / or after the addition of the filler (s) ( 3 . 4 . 5 ). A method according to claim 22, wherein the distribution of the filler or fillers ( 3 . 4 . 5 ) in the polymer matrix ( 2 ) is controlled by the rate of polymerization and / or crosslinking or cooling. A method according to claim 22 or 23, wherein the distribution of the filler or fillers ( 3 . 4 . 5 ) in the polymer matrix ( 2 ) by influencing the sedimentation rate of the filler (s) ( 3 . 4 . 5 ) is controlled. Method according to one of claims 22 to 24, wherein in a further step c) the material obtained in step b) is supplemented by a filler-free layer.  A process according to any one of claims 22 to 25, wherein one or more of the fillers to be added in step a) acts as an inhibitor for the polymerization and / or crosslinking or in step a) one or more inhibitors for the polymerization and / or crosslinking are added.

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