DE102014225249A1 - A method Z and apparatus for cutting a ribbon during ultrasonic ribbon bonding - Google Patents

A method Z and apparatus for cutting a ribbon during ultrasonic ribbon bonding

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Publication number
DE102014225249A1
DE102014225249A1 DE201410225249 DE102014225249A DE102014225249A1 DE 102014225249 A1 DE102014225249 A1 DE 102014225249A1 DE 201410225249 DE201410225249 DE 201410225249 DE 102014225249 A DE102014225249 A DE 102014225249A DE 102014225249 A1 DE102014225249 A1 DE 102014225249A1
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Prior art keywords
cutting
ribbon
knife
method
bonding
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DE201410225249
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German (de)
Inventor
Alexander Kabakchiev
Manfred Reinold
Rico BAUER
Jonas Seib
Fabian Doerfler
Andreas Fix
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Robert Bosch GmbH
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Robert Bosch GmbH
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0207Driving circuits
    • B06B1/0223Driving circuits for generating signals continuous in time
    • B06B1/0238Driving circuits for generating signals continuous in time of a single frequency, e.g. a sine-wave
    • B06B1/0246Driving circuits for generating signals continuous in time of a single frequency, e.g. a sine-wave with a feedback signal
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B3/00Methods or apparatus specially adapted for transmitting mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106Features related to sonotrodes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08Means for treating work or cutting member to facilitate cutting
    • B26D7/086Means for treating work or cutting member to facilitate cutting by vibrating, e.g. ultrasonically
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/40Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups with testing, calibrating, safety devices, built-in protection, construction details
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/50Application to a particular transducer type
    • B06B2201/55Piezoelectric transducer
    • HELECTRICITY
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    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/4501Shape
    • H01L2224/45012Cross-sectional shape
    • H01L2224/45014Ribbon connectors, e.g. rectangular cross-section
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124Aluminium (Al) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147Copper (Cu) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7855Mechanical means, e.g. for severing, pressing, stamping
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/789Means for monitoring the connection process
    • H01L2224/78925Vibration adjusting means, e.g. sensors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852Applying energy for connecting
    • H01L2224/85201Compression bonding
    • H01L2224/85205Ultrasonic bonding
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909Post-treatment of the connector or wire bonding area
    • H01L2224/8593Reshaping, e.g. for severing the wire, modifying the wedge or ball or the loop shape
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector

Abstract

Die Erfindung betrifft ein Verfahren zum Schneiden eines Bändchens beim Ultraschall-Bändchenbonden. The invention relates to a method for cutting a ribbon during ultrasonic ribbon bonding. Hierbei wird das Messer beim Schneidvorgang in hochfrequente Schwingungen versetzt, die mittels der Schneidkraft über die Schneide des Messers in das zu schneidende Bändchenmaterial übertragen werden. In this case, the knife is displaced during the cutting process into high-frequency vibrations, which are transmitted by means of the cutting force on the cutting edge of the knife in the strip material to be cut.
Die Vorrichtung ermöglicht es, das Bändchen zu trennen, ohne dass bei Halbleiterbauelementen als Schneidunterlage eine Schädigung der Halbleiterbauelemente auftritt. The device makes it possible to separate the strips without in semiconductor devices occurs as a cutting base, damage to the semiconductor devices.

Description

  • Die Erfindung betrifft ein Verfahren zum Schneiden eines Bändchenbonds hinter einer Bondverbindung beim Ultraschall-Bändchenbonden, sowie für dieses Verfahren ausgelegte Komponenten, die in einem entsprechenden Bondapparat zu integrieren sind. The invention relates to a method for cutting a ribbon bond behind a bonded connection in ultrasonic ribbon bonding, and designed for this procedure components which are to be integrated in a corresponding bonding apparatus.
  • Das Ultraschall-Bändchenbonden ist eine etablierte Technologie zur dauerhaften Verbindung eines Bändchenbonds, dh eines Metallbändchens bzw. Bondrahts mit rechteckigem Querschnitt, aus Al, Cu oder einer Sandwichstruktur aus Al und Cu mit einer entsprechend metallisierten Substrat- oder Bauteiloberfläche. The ultrasonic ribbon bonding is an established technology for the permanent connection of a ribbon bond, ie, a metal ribbon or Bondrahts with a rectangular cross-section, of Al, Cu, or a sandwich structure of Al and Cu with an appropriately metallized substrate or component surface. Die Breite des Metallbändchens kann im Bereich von ca. 1 mm bis ca. 2 mm und das Verhältnis von Breite zu Dicke kann im Bereich von ca. 4:1 bis ca. 10:1 liegen. The width of the metal ribbon may range from about 1 mm to about 2 mm and the ratio of width to thickness may range from about 4: 1 to about 10: 1. Mittels Ultraschall-Bändchenbonden kann ein elektrischer Kontakt beispielsweise zwischen einem Halbleiterbauteil und einem stromführenden Bereich auf einem Substrat hergestellt werden. By ultrasonic ribbon bonding, electrical contact can be produced for example between a semiconductor device and a current-carrying area on a substrate.
  • Zum Stand der Technik des Ultraschall-Bändchenbondens gehört ein Schneidverfahren, mit dem das Bändchen hinter der letzten zur Kontaktierung notwendigen Bondverbindung getrennt werden kann. The prior art of ultrasonic Bändchenbondens include a cutting method by which the ribbon behind the last necessary for contacting bond can be separated. Dieses Schneidverfahren beruht darauf, daß ein in Schneid- bzw. Zustellrichtung verschiebbares und entsprechend geführtes Messer von einer Messerantriebseinheit mit einer gewissen Schneidkraft bis zu einer gewissen Schnitttiefe ins Bändchen getrieben wird, wodurch dessen Trennung erfolgt bzw. wodurch dessen Trennung durch Abreißen ermöglicht wird. This cutting method is based on that a sliding in the cutting or feed direction and accordingly run knife of a knife drive unit is driven into strips with a certain cutting force up to a certain depth of cut, whereby the separation is carried out and whereby the separation is made possible by tearing. Die von der Messerantriebseinheit aufgebrachte Schneidkraft ist dabei der Materialsteifigkeit bzw. Härte des zu schneidenden Bändchens angepaßt und führt zu einem entsprechenden Schneiddruck auf das Bauteil oder das Substrat, bzw. die Schneidunterlage. The force applied by the knife drive unit cutting force is the material stiffness or hardness of the ribbon to be cut and adapted to lead to a corresponding cutting pressure on the component or the substrate, or the cutting surface.
  • Bei dem oben als Stand der Technik skizzierten Verfahren können folgende Problemstellungen auftreten: The outlined above as prior art, the following problems may occur:
    • a. a. Geringe Standzeiten des Messers aufgrund hoher Härte des Bändchenmaterials Short service life of the knife due to high hardness of the ribbon material
    • b. b. Bei Halbleiterbauelementen als Schneidunterlage Schädigung der Halbleiterbauelemente durch Schneiddruck In semiconductor devices as a cutting base damage of the semiconductor devices by cutting pressure
    • c. c. Einprägen von Unebenheiten bzw. Oberflächenrauhigkeiten der Schneidunterlage in die Bändchenunterseite durch Schneiddruck. Impressing unevenness or surface roughness of the cutting support in the bottom ribbon by cutting pressure. Hierdurch negative Beeinflussung nachfolgender Bondvorgänge. Thereby negatively affecting subsequent bonding operations.
  • Allzu geringe Standzeiten des Messers könnten durch eine entsprechende Vergrößerung des Keilwinkels α des Messers verhindert werden. Too short service life of the knife could be prevented α of the knife by a corresponding increase of the wedge angle. Dies bedingt jedoch erstens eine entsprechende Erhöhung der Schneidkraft und zweitens können daraus Limitationen erwachsen bezüglich des Mindestabstandes einer Bondverbindung zu einem benachbarten Bauteil bzw. einer benachbarten aufragenden Struktur. This, however, first, a corresponding increase in the cutting force, and secondly it can limitations arise with respect to the minimum distance of a bond connection to an adjacent component or an adjacent upstanding structure.
  • Der Erfindung liegt die Aufgabenstellung zugrunde, das als Stand der Technik skizzierte konventionelle Schneidverfahren dahingehend zu erweitern, daß die aufgeführten Problemstellungen durch eine entsprechende Reduzierung der aufzuwendenden Schneidkraft und somit des Schneiddruckes auf die Schneidunterlage vermieden werden können. The invention is based on the task that as prior art outlined conventional cutting methods to expand to the extent that the problems listed by a corresponding reduction of the allocation cutting force and thus the cutting pressure can be avoided in the cutting base.
  • Die diese Aufgabenstellung lösende Idee besteht darin, das Messer beim Schneidvorgang in hochfrequente Schwingungen zu versetzen, die mittels der Schneidkraft über die Schneide des Messers in das zu schneidende Bändchenmaterial übertragen werden. The task solved this idea is to enable the knife during the cutting process into high-frequency vibrations, which are transmitted by means of the cutting force on the cutting edge of the knife in the strip material to be cut. Durch die dabei übertragene Schwingungsenergie wird das Bändchenmaterial in einem Bereich lokal um die Schneide in einen energetisch angeregten Zustand versetzt, in welchem die Materialsteifigkeit bzw. Härte erheblich reduziert ist. By this vibration transmitted energy, the strip material is set in a range locally around the edge in an energetically excited state in which the material stiffness or hardness is considerably reduced. Aufgrund dessen kann die zum Trennen des Materials nötige Schneidkraft und somit der auf die Schneidunterlage wirkende Schneiddruck entsprechend reduziert werden. Because of the necessary for separating the material cutting force and thus the force acting on the cutting base, cutting pressure can be reduced accordingly.
  • Der Frequenzbereich für die Schwingungen ist spezifisch auf das zu schneidende Material abgestimmt und liegt für Metalle wie Al und Cu im Bereich 1–100 kHz, dh im Bereich der Ultraschallschwingungen. The frequency range for the oscillations is specifically matched to the material to be cut and is for metals such as Al and Cu in the range of 1-100 kHz, ie in the region of the ultrasonic vibrations.
  • Die Amplituden der Schwingungen können parallel und/oder orthogonal zur Zustellrichtung gerichtet sein, wobei die zur Zustellrichtung orthogonal gerichteten Amplituden wiederum parallel und/oder orthogonal zur Schneidkante des Messers gerichtet sein können. The amplitudes of the vibrations may be directed in parallel and / or orthogonal to the feed direction, wherein the orthogonally directed to the infeed amplitudes can in turn be directed parallel and / or orthogonal to the cutting edge of the knife.
  • Die The 1 1 zeigt die schematische Darstellung eines Messers, an der die entsprechenden Richtungen der Amplituden der das Messer anregenden Schwingungen erläutert sind. showing the schematic representation of a knife, on which the respective directions of the amplitudes of the blade vibrations are stimulating explained. Das Messer The knife 10 10 weißt eine Schneidkante S zum Schneiden des Bändchens bzw. Bonddrahtes auf. know a cutting edge for cutting the ribbon or S bonding wire. Die Zustellrichtung Z des Messers The infeed direction Z of the blade 10 10 ist die Richtung, in die das Messer is the direction in which the knife 10 10 zum Schneiden des Bändchens bewegt wird. is moved for cutting the ribbon. Mit S1 ist die parallel zur Schneidkante S gerichtete Amplitude der Schwingungen, mit S2 ist die orthogonal zur Schneidkante S sowie parallel zur Zustellrichtung Z gerichtete Amplitude der Schwingungen und mit S3 ist die orthogonal zur Schneidkante S sowie orthogonal zur Zustellrichtung Z gerichtete Amplitude der Schwingungen bezeichnet. With S1 is parallel to the cutting edge S directional amplitude of the oscillations, with S2 is orthogonal to the cutting edge S and directed parallel to the infeed direction Z amplitude of the vibrations and S3 is orthogonal to the cutting edge S and designated orthogonal directed to the infeed direction Z amplitude of the oscillations.
  • Die Schneidkante S des Messers The cutting edge of the knife S 10 10 kann glatt, gebogen, gewellt oder gezahnt ausgebildet sein. may be curved, corrugated or serrated or smooth design. Weiterhin kann die Breite des Messers größer als die Breite des zu schneidenden Bändchens sein, dh die in eine Ebene parallel zur Bändchenoberfläche projizierte Länge der Schneidkante kann über das zu schneidende Bändchen hinausragen. Furthermore, the width of the blade may be greater than the width of the ribbon to be cut, ie, the projected in a plane parallel to the ribbon surface length of the cutting edge may extend beyond the ribbon to be cut.
  • Bei einer Umsetzung der Idee können die genannten Punkte so aufeinander abgestimmt werden, daß ein nicht spanabhebender Schneidprozess gegeben ist. In one implementation of the idea, the points mentioned can be coordinated so that a non-material-removing cutting process is given.
  • Die Umsetzung der Idee bedingt die Integration zusätzlicher Komponenten in einen gemäß des Standes der Technik ausgelegten Bondapparat. The implementation of the idea involves the integration of additional components in a designed according to the prior art bonding apparatus. Diese zusätzlichen Komponenten bzw. die aus ihnen gebildete Wirkkette beschreibt sich wie folgt: These additional components or the active chain formed from them describes as follows:
    • a. a. Generator zur Erzeugung einer elektrischen Ausgangsleistung, nachfolgend Generatorausgangsleistung, für die Erzeugung der Ultraschallschwingungen. Generator for generating an electrical output power, generator output hereinafter, for generating the ultrasonic vibrations.
    • b. b. Transducer zur piezoelektrischen Wandlung der Generatorausgangsleistung in mechanische Schwingungsleistung Transducer for the piezoelectric conversion of the generator output power to mechanical vibration power
    • c. c. Transmitter zur Ankopplung des Messers an den Transducer und zum Transport der mechanischen Schwingungsenergie vom Transducer ins Messer Transmitter for coupling the blade to the transducer and transporting the mechanical vibration energy from the transducer into the meter
    • d. d. Regelungseinheit zur Regelung der Generatorausgangsleistung. Control unit for regulating the generator output.
  • Die The 2 2 beinhaltet die schematische Darstellung der Wirkkette einer Apparatur für ein erfindungsgemäßes Verfahren. includes the schematic representation of the chain of action of an apparatus for a method of the invention. Der Generator G ist dabei über eine elektrische Kopplung K el mit dem Transducer Td verbunden, sodaß die Generatorausgangsleistung P el vom Generator G auf den Transducer Td übertragen werden kann. The generator G is connected via an electrical coupling K el with the transducer Td, so that the generator output power P el from the generator G can be transmitted to the transducer Td.
  • Der Transducer Td wandelt die Generatorausgangsleistung P el in eine mechanische Schwingungsleistung P sw . The transducer Td converts the generator output power P el in a mechanical oscillation power P sw. Der Transmitter Tm ist über mechanische Kopplungen K m einerseits mit dem Transducer Td und andererseits mit dem Messer M verbunden, sodaß die mechanische Schwingungsleistung P sw vom Transducer Td auf das Messer M übertragen und dieses zu Ultraschallschwingungen angeregt werden kann. The transmitter Tm is m the one hand, on the other hand connected by mechanical couplings K with the transducer and with the diameter Td M, so that the mechanical vibration transmitted from the transducer power P sw Td on the knife M and this can be induced to ultrasonic vibrations. Über eine weitere mechanische Kopplung K m ist das Messer M mit einem Messerantrieb MA verbunden, wodurch die Schneidkraft F S auf das Messer M übertragen und dieses in Zustellrichtung Z mit einer Zustell- bzw. Schnittgeschwindigkeit v S bewegt werden kann. Via a further mechanical coupling K m M, the knife is connected to a blade drive MA, whereby the cutting force F S applied to the knife, and this M v S can be moved in the feed direction Z with a feed or cutting speed. Dabei wird das Messer M mittels einer schematisch dargestellten Messerführung MF geführt. The knife M is guided by means of a schematically shown cutter guide MF. Die Generatorausgangsleistung P el wird mittels einer Regelungseinheit GR geregelt. The generator output power P el is regulated by means of a control unit GR. Hierfür wird ein Steuersignal SP el für die elektrische Ausgangsleistung P el von der Regelungseinheit GR zum Generator G sowie ein Diagnosesignal DP el für die elektrische Ausgangsleistung P el vom Generator G auf die Generatorregelung GR übertragen. For this purpose, a control signal SP el for the output electric power P el from the control unit GR to the generator G as well as a diagnostic signal DP el for the output electric power P el from the generator G is transferred to the generator control GR. Der Messerantrieb MA wird von einer Messerantriebsregelung MAR geregelt, wobei das Steuersignal SF S für die Schneidkraft F S sowie das Diagnosesignal DF S für die Schneidkraft F S und/oder das Diagnosesignal Dv S für die Schnittgeschwindigkeit v S zwischen der Messerantriebsregelung MAR und dem Messerantrieb MA ausgetauscht werden. The knife drive MA is regulated by a knife drive control MAR, wherein said control signal SF S for the cutting force F S and the diagnostic signal DF S for the cutting force F S and / or the diagnostic signal Dv S for the cutting speed v S between the knife drive control MAR and the knife drive MA be replaced. Das Messer M wirkt auf das schematisch dargestellte und auf einer Schneidunterlage S aufliegende Bändchen B ein. The knife M acts on the illustrated schematically and on a cutting support S ribbon resting B.
  • Das Schneidverfahren kann so definiert sein, daß der Schneidvorgang mit einer vorgegebenen Schneidkraft F S und einer über die Generatorleistung P el geregelten Schnittgeschwindigkeit v S durchgeführt wird, wobei die Vorgabe der Schneidkraft F S , die Regelung über der Generatorleistung P el sowie die Regelung der Schnitttiefe nach dem Stand der Technik entsprechenden Verfahren stattfinden können. The cutting method can be defined so that the cutting operation with a predetermined cutting force F S and on the generator power P el controlled average speed v S is performed, the presetting of the cutting force F S, the system of the generator power P el, and the regulation of the depth of cut can take place corresponding method according to the prior art.
  • Ein alternatives Schneidverfahren kann so definiert sein, daß der Schneidvorgang mit vorgegebener Generatorausgangsleistung P el und einer über die Schneidkraft F S geregelten Schnittgeschwindigkeit v S durchgeführt wird, wobei die Vorgabe der Generatorleistung P el , die Regelung über die Schneidkraft F S sowie die Regelung der Schnitttiefe nach dem Stand der Technik entsprechenden Verfahren stattfinden können. An alternative cutting method can be defined so that the cutting operation with a predetermined generator output power P el, and a on the cutting force F S regulated cutting speed v S is performed, the presetting of the generator power P el, control over the cutting force F S and the regulation of the depth of cut can take place corresponding method according to the prior art.
  • Ein anderes alternatives Schneidverfahren kann so definiert sein, daß der Schneidvorgang sowohl mit mir vorgegebener Generatorleistung P el als auch mit vorgegebener Schneidkraft F S und einer sich daraus ergebenden ungeregelten Schnittgeschwindigkeit v S durchgeführt wird, wobei die Vorgabe der Generatorleistung P el und der Schneidkraft F S sowie die Regelung der Schnitttiefe nach dem Stand der Technik entsprechenden Verfahren stattfinden können. Another alternative cutting method can be defined so that the cutting operation is performed with both me predetermined generator power P el and a predetermined cutting force F S and a consequent uncontrolled cutting speed v S, wherein the specification of the generator power P el, and the cutting force F S as well as the control of the cutting depth according to the prior art can take place corresponding method.
  • Die oben genannten Schneidverfahren bedingen eine Abstimmung der Generatorausgangsleistung P el und der Schneidkraft F S bzw. der jeweiligen Steuersignale SP el und SF S aufeinander. The cutting processes mentioned above require a successive tuning of the generator output power P el, and the cutting force F S and the respective control signals SP el and S SF. Hierfür ist, wie in For this purpose, as shown in 2 2 dargestellt, eine Übertragung des Diagnosesignals DP el für die Generatorausgangsleistung P el , des Diagnosesignals DF S für die Schneidkraft F S sowie des Diagnosesignals Dv S für die Schnittgeschwindigkeit v S zwischen der Generatorregelung GR und der Messerantriebsregelung MAR vorgesehen. shown, is provided a transmission of the diagnostic signal DP el for the generator output power P el, the diagnostic signal DF S for the cutting force F S and the diagnostic signal Dv S for the cutting speed v S between the alternator control GR and the knife drive control MAR.

Claims (8)

  1. Bondvorrichtung zum Ultraschall-Bändchenbonden, dadurch gekennzeichnet, daß ein Generator zur Erzeugung einer elektrischen Ausgangsleistung, ein Transducer zur piezoelektrischen Wandlung dieser Ausgangsleistung in mechanische Schwingungsleistung, ein Transmitter zum Transport der mechanischen Schwingungsenergie vom Transducer ins Messer sowie eine Kontrolleinheit zur Regelung der elektrischen Ausgangsleistung des Generators als Wirkkette in die Bondvorrichtung integriert sind. Bond apparatus for ultrasonic ribbon bonding, characterized in that a generator for generating an electrical output power, a transducer for piezoelectric conversion of the output power into mechanical vibration performance, a transmitter for transporting the mechanical vibration energy from the transducer to the knife as well as a control unit for controlling the electrical output of the generator are integrated as active chain in the bonding device.
  2. Bondvorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß die Schneidkante des Messers glatt oder gebogen oder gewellt oder gezahnt ausgebildet ist. Bonding apparatus according to claim 1, characterized in that the cutting edge of the knife is designed to be smooth or curved or wavy or serrated.
  3. Bondvorrichtung nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß die Breite des Messers größer als, kleiner als oder gleich wie die Breite des zu schneidenden Bändchens ist. Bonding apparatus according to any one of the preceding claims, characterized in that the width of the knife than or is greater than, less than or equal to the width of the ribbon to be cut.
  4. Verfahren zum Schneiden eines Bändchenbonds, dadurch gekennzeichnet, daß das zum Schneiden des Bändchens verwendete Messer zu Schwingungen im Bereich 1–100 kHz angeregt wird mit Amplituden, die parallel und/oder orthogonal zur Zustellrichtung Messers gerichtet sind. A method for cutting a ribbon bond, characterized in that the knife used for cutting the ribbon to vibrate in the range 1-100 kHz is excited with amplitudes that are directed parallel and / or orthogonal to the feed direction diameter.
  5. Verfahren nach Anspruch 4, dadurch gekennzeichnet, daß der Schneidprozess nicht spanabhebend ist. A method according to claim 4, characterized in that the cutting process is not machined.
  6. Verfahren nach Anspruch 4 und/oder 5, dadurch gekennzeichnet, daß die Generatorausgangsleistung vorgegeben ist und die Schnittgeschwindigkeit über die Schneidkraft geregelt wird. A method according to claim 4 and / or 5, characterized in that the generator output is given and the cutting speed is controlled by the cutting force.
  7. Verfahren nach einem der Ansprüche 4 bis 6, dadurch gekennzeichnet, daß die Schneidkraft vorgegeben ist und die Schnittgeschwindigkeit über die Generatorausgangsleistung geregelt wird. A method according to any one of claims 4 to 6, characterized in that the cutting force is predetermined and the cutting speed is controlled by the generator output.
  8. Verfahren nach einem der Ansprüche 4 bis 7, dadurch gekennzeichnet, daß die Generatorausgangsleistung und die Schnittgeschwindigkeit vorgegeben sind und die Schneidkraft ungeregelt ist. Method according to one of claims 4 to 7, characterized in that the generator output power and the cutting speed are predetermined and the cutting force is unregulated.
DE201410225249 2014-12-09 2014-12-09 A method Z and apparatus for cutting a ribbon during ultrasonic ribbon bonding Pending DE102014225249A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69307431T2 (en) * 1992-08-28 1997-05-15 Nestle Sa Ultrasonic cutter
DE29802711U1 (en) * 1998-02-17 1998-04-16 Fetzer Susanne Ultrasound-powered cutting tool
DE19852642C1 (en) * 1998-11-14 2000-03-30 Hielscher Gmbh Ultrasonic cutting device has tool arranged at vibration maximum and end supports at vibration nodes
DE19911683A1 (en) * 1999-03-09 2000-09-21 Hielscher Gmbh Ultrasonic sonotrode, grips tip resiliently for e.g. welding, cutting or spot welding, avoiding conventional clamping screw which causes losses and overheating
DE112011101129T5 (en) * 2010-03-31 2013-01-10 Orthodyne Electronics Corporation Ultrasonic bonding systems and methods for their use

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69307431T2 (en) * 1992-08-28 1997-05-15 Nestle Sa Ultrasonic cutter
DE29802711U1 (en) * 1998-02-17 1998-04-16 Fetzer Susanne Ultrasound-powered cutting tool
DE19852642C1 (en) * 1998-11-14 2000-03-30 Hielscher Gmbh Ultrasonic cutting device has tool arranged at vibration maximum and end supports at vibration nodes
DE19911683A1 (en) * 1999-03-09 2000-09-21 Hielscher Gmbh Ultrasonic sonotrode, grips tip resiliently for e.g. welding, cutting or spot welding, avoiding conventional clamping screw which causes losses and overheating
DE112011101129T5 (en) * 2010-03-31 2013-01-10 Orthodyne Electronics Corporation Ultrasonic bonding systems and methods for their use

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