DE102014216069A1 - Sensor arrangement for a throttle valve - Google Patents

Abstract

A sensor arrangement (10) for a throttle valve valve is proposed which has an ASIC (16) with a magnetic sensor (18), a sensor shaft (14) and a punched grid (20). The punched grid (20) has a plug tongue (24) for electrically contacting the stamped grid (20) and a contact structure (22) on which the ASIC (16) is arranged. The magnetic sensor (18) is designed to detect a position of a magnetic element (34) and to generate therefrom a signal determining an angular position of the throttle valve. The sensor arrangement (10) is distinguished, in particular, by the fact that the magnetic sensor (18) is arranged directly on the stamped grid (20) and electrically conductively connected thereto, and that the stamped grid (20) has an encapsulation (28) which surrounds the plug tongue (24) completely encloses and is formed cooperating with a receiving region (26) of the sensor shaft (14) such that an outer circumference of the encapsulation (28) bears against an inner circumference of the receiving region (26). Thus, advantageously, a circuit board and a leadframe for the ASIC (16) as well as a further sealing element can be dispensed with.

Description

Field of the invention

The invention relates to an angle sensor for determining an angular position of a rotatably mounted component. In particular, the invention relates to a sensor arrangement for determining an angular position of a throttle valve of an internal combustion engine.

Background of the invention

In a motor vehicle having an internal combustion engine such as a car, a truck, a bus, a motorcycle, a train or a ship, an output of the internal combustion engine may be regulated by an amount of supplied air and / or fuel. For this purpose, a throttle valve rotatably mounted by a certain angular range is usually used in a suction pipe of the internal combustion engine. Depending on an angular position of the throttle valve so an air supply into a combustion chamber and thus the output of the internal combustion engine can be regulated.

In modern motor vehicles, the angular position of the throttle valve is increasingly controlled electrically and / or electronically via a control unit and / or regulated. In order to regulate the angular position as precisely as possible, this is usually determined by means of a sensor arrangement.

Particularly due to occurring vibrations, impurities and / or a usually limited available space in an engine compartment can be made of such a sensor arrangement high demands in terms of tightness, robustness and a component size. Often, components of the sensor array are therefore in the form of an application-specific integrated circuit, or an application-specific integrated circuit, i. a so-called ASIC realized. Most of the ASIC is soldered to a circuit board, which can be connected to a stamped from a metal band stamped grid to a connector, for example, for contacting with a controller and / or power to the ASIC. To protect against contamination and aggressive media in the engine compartment, the stamped grid with board and ASIC is often included in a sealed housing, with a housing cover can be mounted with a seal. Also components of the ASIC can be accommodated in a separate housing and mounted on the stamped grid.

A device with a punched grid stamped from a metal strip and an ASIC arranged on the stamped grid is known, for example, from US Pat DE 44 30 798 A1 known.

Disclosure of the invention

Embodiments of the present invention may advantageously enable to provide a robust and inexpensive sensor arrangement for a throttle valve. However, the sensor arrangement according to the invention is not limited to use on a throttle valve, but can be used in an advantageous manner versatile for determining an angular position of a rotatably mounted component.

According to one aspect of the invention, a sensor arrangement for a throttle valve is provided which has an ASIC with a magnetic sensor, a sensor shaft for receiving the ASIC and an electrically conductive stamped grid. The stamped grid has a connector tongue for electrical contacting of the stamped grid and a contact structure on which the ASIC is arranged. The magnetic sensor is designed to detect a position, such as an angular position, of a magnetic element and to generate therefrom a signal determining an angular position of the throttle valve. The sensor arrangement according to the invention is characterized in particular by the fact that the magnetic sensor of the ASIC is arranged directly on the stamped grid and electrically conductively connected thereto, and that the stamped grid has an encapsulation, which completely surrounds the connector tongue in a partial area, wherein the encapsulation so cooperates with a receiving region of the sensor shaft is formed such that an outer circumference of the encapsulation abuts against an inner circumference of the receiving region.

In other words, components of the ASIC, such as the magnetic sensor, capacitors and other components, in a so-called "bare die method" can be installed directly on the contact structure of the stamped grid and electrically contacted. For example, the components may be welded and / or soldered to the stamped grid. The stamped grid itself can thus advantageously provide pathways or a leadframe for contacting the components of the ASIC. Thus, variances in the sensor arrangement as an electronic component can be kept low. Furthermore, for example suppression capacitors can be mounted relatively close to the magnetic sensor or a Die or a chip, which allow a good interference suppression and can advantageously affect a size of the sensor assembly and production costs.

Furthermore, by the encapsulation of the stamped grid according to the invention and the positively receiving them in the receiving area of the sensor shaft, which can be regarded as an opening of the sensor shaft, be sure that the ASIC is accommodated with all electronic components in a closed space. This can provide comprehensive protection of the ASIC from potentially aggressive media and contaminants in an engine compartment. The components of the ASIC or the ASIC itself can also be mounted without additional housings for individual components, such as the magnetic sensor and / or chips of the ASIC. However, the ASIC can also be mounted in a conventional housing on the stamped grid. Also can be omitted by the encapsulation according to the invention, an additional seal, since the ASIC and the connector tongue can be sealed on the one hand by encapsulation in conjunction with the receiving area and on the other by a plugged into the connector tongue in the receiving area connector counter-element. Overall, this can have an advantageous effect on manufacturing costs, robustness and size.

Also in production terms, the inventive design of the stamped grid with ASIC and encapsulation may be advantageous. Thus, for example, in a first manufacturing step, the stamped grid can be stamped from a metal strip, wherein the contact structure can be short-circuited for better handling by connecting webs. In a second step, the stamped grid can for example be over-molded over the entire area except for a portion of the connector tongue, so that a stable and easy-to-handle component is formed and can be dispensed as a holding device for the stamped grid. In a further step, the contact structure can be punched free, which can then be equipped with the components of the ASIC.

According to one embodiment of the invention, the encapsulation is formed with an outer contour complementary to an inner contour of the receiving area. As a result, the encapsulation may advantageously be accommodated at least partially positively in the receiving area, and the ASIC may be reliably sealed against an environment of the sensor arrangement.

According to one embodiment of the invention, the encapsulation has a sealing area and a closing area, wherein the sealing area is designed smaller than the closing area with respect to an outer circumference. The termination area can thus form a kind of plug base, which can additionally protect the ASIC and from which the connector tongue can protrude outward.

According to one embodiment of the invention, at least one circumferential sealing lip which is integrally formed with the encapsulation and which engages in a recess of the receiving region is arranged in the sealing region.

According to one embodiment of the invention, the encapsulation forms a carrier unit at least in a partial area, the contact structure of the stamped grid with the ASIC being arranged on one side of the carrier unit. The encapsulation can thus advantageously replace a board for the stamped grid. This can have an advantageous effect on production costs and a size of the sensor arrangement.

According to one embodiment of the invention, the encapsulation is made of an electrically insulating material, so that unwanted short circuits in the sensor arrangement can be avoided.

According to one embodiment of the invention, the magnetic sensor has at least one Hall sensor. The Hall sensor may for example be designed to detect a dependent on a position or angular position of the magnetic element caused magnetic field, a magnetic field strength, a magnetic flux, a magnetic flux density and / or a change in one of the magnetic quantities and from this the Angular position of the throttle valve determining signal to generate. The sensor arrangement may also have a plurality of Hall sensors and / or other suitable magnetic sensors.

According to one embodiment of the invention, the magnetic sensor of the ASIC is electrically connected by means of bonding to the contact structure of the stamped grid.

According to one embodiment of the invention, the magnetic sensor is electrically connected to contact paths of the contact structure.

According to one embodiment of the invention, the bonding connections are welded to the contact structure and / or soldered. In this case, the bond connections can have conductor tracks, for example made of copper or a suitable conductive alloy, which can electrically connect electrical contacts or terminals of the magnetic sensor to corresponding contact paths of the contact structure.

It should be understood that some of the possible features and advantages of the invention are described herein with reference to different embodiments. A person skilled in the art will recognize that the features can be suitably combined, adapted or replaced in order to arrive at further embodiments of the invention.

Brief description of the drawings

Embodiments of the invention will now be described with reference to the accompanying drawings, in which neither the drawings nor the description are to be construed as limiting the invention.

1 shows a sectional view of a sensor arrangement according to an embodiment of the invention.

2 and 3 show a punched grid with an ASIC and an encapsulation for a sensor arrangement according to embodiments of the invention.

The figures are only schematic and not to scale. Like reference numerals designate the same or equivalent features in the figures.

Embodiments of the invention

1 shows a sectional view of a sensor arrangement 10 according to an embodiment of the invention.

The sensor arrangement 10 has a housing 12 with a sensor shaft 14 on which an ASIC 16 with a magnetic sensor 18 is included. The magnetic sensor 18 may include a Hall sensor or other suitable sensor device for detecting a magnetic field and / or a magnetic field change. The ASIC 16 may denote about the Hall sensor and its electrical contacts, for example on silicon level. The magnetic sensor 18 can in addition to the ASIC 16 have further elements.

The ASIC 16 is directly on a contact structure 22 a punched grid 20 arranged and electrically conductively connected thereto. In this context, the stamped grid 20 or the contact structure 22 a leadframe for the ASIC 16 or the magnetic sensor 18 form. Thus, the stamped grid 20 or the contact structure 22 also as a component of the ASIC 16 be considered.

Next, the stamped grid 20 the sensor arrangement 10 a connector tongue 24 for electrical contacting of the stamped grid 20 on. The plug tongue 24 can be about the power and voltage of the ASIC 16 and serve for signal transmission, for example, from and / or to a control unit. In other words, a portion of the stamped grid 20 the connector tongue 24 form.

The plug tongue 24 protrudes inside in the housing 12 plug-like in a receiving area 26 the sensor arrangement 10 , In the recording area 26 can be about a connector counter element for contacting the connector tongue 24 be pushed, leaving an inside of the case 12 , in particular the sensor shaft 14 , the ASIC 16 , the connector tongue 24 as well as the punched grid 20 to an environment of the sensor array 10 be sealed and protected. The housing 12 can be configured as a pure plastic part without injection, wherein an outer contour of the plastic part or the housing 12 in the area of the recording area 26 define or form a connector contour.

The punched grid 20 also has an encapsulation 28 of an electrically insulating material, which in a partial area a carrier unit 30 forms. On one side 25 or outside of the carrier unit 30 is the contact structure 22 with the ASIC 16 arranged so that the ASIC 16 essentially centrally in the sensor well 14 recorded or arranged. One of the page 25 opposite side 27 the carrier unit 30 can be on an inner wall 29 of the sensor shaft 14 be addressed or at least addressed to this.

Next, the encapsulation 28 a sealing area 32 on which the connector tongue 24 along a circumference of the connector tongue 24 in a partial region of a longitudinal extent of the connector tongue 24 completely encloses and one to an inner contour of the receiving area 26 Complementarily configured outer contour, so that an outer circumference of the sealing area 32 on an inner circumference of the receiving area 26 can be present. The encapsulation 28 of the stamped grid 20 can thus simultaneously serve as a stop and closure.

The encapsulation 28 also has a locking lance 33 with an undercut on. The locking lance 33 is complementary to a ramp-like catch 35 of the housing 12 designed. When inserting the encapsulation 28 in the case 12 can the locking lance 33 over the ramp-like catch 35 be pushed, the locking lance 33 in the direction of a center of the sensor shaft 14 can be pressed. Is the locking lance 33 over the catch 35 pushed, so can the undercut of the locking lance 33 on a complementarily designed undercut of the detent 35 abut, so that the encapsulation 28 against a direction of insertion in the sensor shaft 14 can be fixed.

Next, the sensor arrangement 10 a the magnetic sensor 18 opposite magnetic element 34 on, which by means of a storage device 36 or by means of a locking part, at least in a certain angular range, rotatable in a shaft 38 of the housing 12 can be stored. A longitudinal extension direction of the shaft 38 can essentially orthogonal to a Longitudinal direction of the sensor shaft 14 run.

The storage device 36 and the magnetic element 34 can be indirectly or directly coupled to a throttle valve of an internal combustion engine, wherein an angular position or position of the magnetic element 34 can be changed depending on an angular position of the throttle valve. The magnetic sensor 18 can do that through the magnetic element 34 caused magnetic field and / or by changing the angular position of the magnetic element 34 detect caused change in the magnetic field and generate therefrom a determining the angular position of the throttle valve signal, which, for example, a control unit via the connector tongue 24 can be supplied and processed by this.

2 and 3 each show a punched grid 20 with an ASIC 16 and an encapsulation 28 for a sensor arrangement 10 according to embodiments of the invention. 2 shows a plan view and 3 a perspective view.

In the 2 and 3 is the punched grid 20 with the plug tongues 24 and the contact structure 22 which with one side on the side 25 the carrier unit 30 rests and / or partially in the encapsulation 28 embedded, easily recognizable. On one of the on the carrier unit 30 resting side opposite side of the contact structure 22 are components or components of the ASIC 16 on contact tracks 42 or contact lugs of the contact structure 22 arranged. For example, two contact paths each 42 with a capacitor 40 of the ASIC 16 be connected.

Also in the 2 and 3 the magnetic sensor 18 clearly recognizable, which by means of bonds 44 with the contact structure 22 or with contact tracks 42 can be electrically connected. For example, electrical contacts or terminals of the magnetic sensor 18 each with a contact track 42 through a bond connection 44 be connected. The bonds 44 can with the terminals of the magnetic sensor 18 and / or with the contact tracks 42 welded and / or soldered.

At the in 2 embodiment shown, the sealing area 32 the encapsulation 28 an integrally formed sealing lip 46 on which form fit into a recess of the receiving area 26 of the housing 12 can intervene, leaving the ASIC 16 tight in the housing 12 can be included. Adjacent to the sealing area 32 , shows the overmolding 28 of the 2 on one of the carrier unit 30 opposite side of the encapsulation 28 a graduation area 48 which is larger than the sealing area with respect to an outer circumference 32 is trained. The graduation area 48 can act as a kind of plug bottom and the sensor shaft 14 additionally seal. Also, the graduation area 48 serve as a stop element.

Overall, the sealing area 32 the encapsulation 28 , and in the case of the embodiment in 2 also the graduation area 48 , integral with the encapsulation 28 designed. The sealing area 32 encloses the plug tongues 24 along a circumference in a partial area completely or are the plug tongues 24 with one end in the sealing area 32 embedded or integrated and protrude with another end free from this.

In addition, it should be noted that terms such as "broad" do not exclude other elements or steps, and terms such as "a" or "an" do not exclude a multitude. It should also be appreciated that features described with reference to any of the above embodiments may also be used in combination with other features of other embodiments described above. Reference signs in the claims are not to be considered as limiting.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 4430798 A1 [0005]

Claims (10)

Sensor arrangement ( 10 ) for a throttle valve, comprising: an ASIC ( 16 ) with a magnetic sensor ( 18 ); a sensor shaft ( 14 ) to include the ASIC ( 16 ); an electrically conductive stamped grid ( 20 ), wherein the punched grid ( 20 ) a connector tongue ( 24 ) for electrical contacting of the stamped grid ( 20 ) and a contact structure ( 22 ) on which the ASIC ( 16 ) is arranged, wherein the magnetic sensor ( 18 ) is adapted to a position of a magnetic element ( 34 ) and to generate therefrom a signal determining an angular position of the throttle valve, characterized in that the magnetic sensor ( 18 ) of the ASIC ( 16 ) directly on the punched grid ( 20 ) is arranged and electrically conductively connected thereto, and that the punched grid ( 20 ) an encapsulation ( 28 ), which the connector tongue ( 24 ) completely encloses in a partial area, wherein the encapsulation ( 28 ) cooperating with a receiving area ( 26 ) of the sensor shaft ( 14 ) is formed such that an outer circumference of the encapsulation ( 28 ) on an inner circumference of the receiving area ( 26 ) is present. Sensor arrangement ( 10 ) according to claim 1, wherein the encapsulation ( 28 ) with an outer contour complementary to an inner contour of the receiving area ( 26 ) is trained. Sensor arrangement ( 10 ) according to claim 1 or 2, wherein the encapsulation ( 28 ) a sealing area ( 32 ) and a graduation area ( 48 ), wherein the sealing area ( 32 ) with respect to an outer circumference smaller than the termination area ( 48 ) is configured. Sensor arrangement ( 10 ) according to claim 3, wherein in the sealing area ( 32 ) at least one circumferential and integrally formed sealing lip ( 46 ) is arranged, which in a recess of the receiving area ( 26 ) intervenes. Sensor arrangement ( 10 ) according to one of the preceding claims, wherein the encapsulation ( 28 ) at least in a partial area a carrier unit ( 30 ), whereby on one side ( 25 ) of the carrier unit ( 30 ) the contact structure ( 22 ) of the stamped grid ( 20 ) is arranged. Sensor arrangement ( 10 ) according to one of the preceding claims, wherein the encapsulation ( 28 ) is made of an electrically insulating material. Sensor arrangement ( 10 ) according to one of the preceding claims, wherein the magnetic sensor ( 18 ) has at least one Hall sensor. Sensor arrangement ( 10 ) according to one of the preceding claims, wherein the magnetic sensor ( 18 ) of the ASIC ( 16 ) by means of bond connections ( 44 ) with the contact structure ( 22 ) of the stamped grid ( 20 ) is electrically connected. Sensor arrangement ( 10 ) according to claim 8, wherein the magnetic sensor ( 18 ) with contact tracks ( 42 ) of the contact structure ( 22 ) is electrically connected. Sensor arrangement ( 10 ) according to one of claims 8 or 9, wherein the bonds ( 44 ) with the contact structure ( 22 ) are welded and / or soldered.

Images