DE102014208499A1 - Cooling circuit with bypass flow path for cooling an inverter interior - Google Patents

Cooling circuit with bypass flow path for cooling an inverter interior

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Publication number
DE102014208499A1
DE102014208499A1 DE102014208499.7A DE102014208499A DE102014208499A1 DE 102014208499 A1 DE102014208499 A1 DE 102014208499A1 DE 102014208499 A DE102014208499 A DE 102014208499A DE 102014208499 A1 DE102014208499 A1 DE 102014208499A1
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Germany
Prior art keywords
interior
inverter
converter
cooling
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102014208499.7A
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German (de)
Inventor
Marco Bohlländer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Siemens eAutomotive Germany GmbH
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE102014208499.7A priority Critical patent/DE102014208499A1/en
Publication of DE102014208499A1 publication Critical patent/DE102014208499A1/en
Application status is Pending legal-status Critical

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927Liquid coolant without phase change
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60KARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K11/00Arrangement in connection with cooling of propulsion units
    • B60K11/02Arrangement in connection with cooling of propulsion units with liquid cooling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60KARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OF TRANSMISSIONS IN VEHICLES; ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS IN VEHICLES; AUXILIARY DRIVES FOR VEHICLES; INSTRUMENTATION OR DASHBOARDS FOR VEHICLES; ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GAS EXHAUST OR FUEL SUPPLY OF PROPULSION UNITS IN VEHICLES
    • B60K1/00Arrangement or mounting of electrical propulsion units
    • B60K2001/003Arrangement or mounting of electrical propulsion units with means for cooling the electrical propulsion units
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60YINDEXING SCHEME RELATING TO ASPECTS CROSS-CUTTING VEHICLE TECHNOLOGY
    • B60Y2400/00Special features of vehicle units
    • B60Y2400/61Arrangements of controllers for electric machines, e.g. inverters

Abstract

The invention relates to an inverter module (1) having at least one power semiconductor module (2) and at least one cooler (3) for cooling the power semiconductor module (2), wherein the cooler (3) has at least one first terminal (7) and at least one second terminal (8 ) for connection to a cooling circuit (4) and an inverter interior (15) which is provided by means of at least one first spatial opening (10) and at least one second spatial opening (11) for connection to the cooling circuit (4). Furthermore, a drive system (24) with at least one such converter module (1) and with at least one electric machine (26) fed by the converter module (1) for use in an electric or hybrid vehicle (25) is provided.

Description

  • The invention relates to an inverter module having at least one power semiconductor module and a converter inside, wherein for cooling the power semiconductor module, a cooler for connection to a cooling circuit is provided and wherein for the cooling of the inverter interior, a connection of this inverter interior is provided with the cooling circuit. The invention further relates to a drive system for an electric or hybrid vehicle with at least one such converter module and with at least one electric machine fed by this converter module. The invention further relates to an electric or hybrid vehicle having at least one such converter module or at least one such drive system.
  • An inverter requires power semiconductors for switching electrical energy, often in the form of power semiconductor modules equipped with corresponding semiconductor switches, e.g. IGBTs or MOSFETs are used. In addition to the power electronics, converter controllers, specially designed control and protection electronics as well as other supply circuits are required for their efficient and safe operation. These electronic components, which are also referred to as control electronics of the converter, are often arranged in close proximity to the power semiconductors or the power semiconductor module, in particular when using inverters in electric or hybrid vehicles, for technical reasons (for example space-saving, compact design of the converter). The distance can be only a few cm here. In the case of such converters, all of these electronic and power electronic components are located inside a hermetically sealed housing, usually an aluminum die-cast housing. During operation, the power semiconductors heat up by the occurring power losses (e.g., switching losses) in the current state of the art to typically about 125 ° C, with temperatures in the near future between 150 ° C-175 ° C is expected. Even higher temperature ranges (175 ° C-200 ° C, 200 ° C-225 ° C) for the heating of these power semiconductors can not be ruled out in the medium term. Although the power semiconductors are cooled by a direct connection to one or more heatsinks, a part of the heat is also released into the inverter interior. In addition, there are the losses in the already mentioned electronic components as well as in electrical conductors, such as busbars, which also heat the inverter interior. As a result, depending on the operating status of the inverter, the inverter interior reaches temperatures of over 100 ° C. All components of the inverter interior, regardless of which functional or structural tasks they meet, are thus exposed in principle to these temperatures.
  • For the designers of such a converter, therefore, there are challenges, which brings in particular the technical efficiency with a cost factor in connection:
    • • In the described conditions, components are required in the converter interior which are designed for a high design temperature and whose use is often associated with relatively high costs and a limited selection of suppliers.
    • • Relatively large free spaces for the convective heat dissipation of the critical hot spots for operation must be provided in the inverter interior, which has a particularly disadvantageous effect on the rather limited space available when using inverters in electric or hybrid vehicles.
    • • It may be necessary to provide additional design measures for cooling the electrical tracks for the load connections of the electrical machine, which requires an increased space requirement and the additional use of suitable components (eg heatsink).
  • Such challenges are currently being addressed with more conventional but sometimes very complex constructive means. Thus, for example, for converters or converter modules in the industrial sector fans are used, which circulate the heated air of the inverter interior to prevent at least one heat accumulation at the critical heat sources. The operation of these fans, however, reduces the overall efficiency of the inverter sometimes considerably. Also, complex solutions are often provided to control the critical heat sources with the large area cooling elements of the inverter, e.g. with the housing wall, to connect. However, these solutions require additional components such as e.g. Screws, fasteners and material to increase the cooling surface, which can generally be introduced only by accepting a corresponding increase in weight and space requirements. If, however, a correspondingly high temperature is accepted in the inverter interior, the components provided for this purpose (electrical as well as non-electrical components) must be designed for the maximum permissible temperatures then applicable. However, a further increase in the operating temperatures of the converter which can already be detected in the near future leaves open whether and how the design of the components required in particular for the converter interior can follow such a temperature increase.
  • The invention is based on the object, an inverter interior of a converter module, which is particularly suitable for use in a drive system of an electric or hybrid vehicle, efficiently, with space-saving means and thereby cost-effective to cool.
  • This object is achieved by an inverter module having the features specified in claim 1.
  • This object is further achieved by a drive system with the features specified in claim 7 and as by an electric or hybrid vehicle according to claim 10.
  • The invention is based on the finding that established cooling concepts for converters or converter modules, in particular if cooling media such as, for example, Liquids are used, have a suitable for this purpose cooler, which is designed specifically for cooling power semiconductors or power semiconductor modules. The cooler is connected to a cooling circuit in the operable state and during operation of the converter module and has a cooler flow path which is able to dissipate a large part of the heat quantity occurring due to the power loss of the power semiconductors or power semiconductor modules. However, often a lower proportion of the heat generated by this power loss is emitted into the inverter interior of the converter module. The converter interior also contains further heat sources, which are protected by the electronic components arranged there, e.g. Control electronics of the inverter, and the electrical components, such. Busbars and DC link capacitors, caused. While the cooling of the inverter interior has hitherto been largely independent of the cooling of the power semiconductors or power semiconductor modules both functionally and technically, the invention shows how to efficiently, by means of a connection of the converter interior to the cooling circuit for cooling the power semiconductors or power semiconductor modules. With space-saving means feasible and thereby cost-effective cooling of the inverter interior is achieved. The converter interior thus has a bypass flow path, which can be arranged parallel to the radiator flow path. These two flow paths are now traversed by the same cooling medium. Since the converter module, especially when used in drive systems for electric or hybrid vehicle, is usually hermetically sealed with respect to an inverter environment, the production of a liquid or gas-tight state, especially the inverter interior, thus no additional effort. Previously necessary Pressure compensation elements, ie membranes, may possibly even be omitted.
  • With this new cooling concept, which combines functionally and structurally the cooling of the converter interior with the cooling of the power semiconductors or power semiconductor modules in converter modules, a number of advantages result compared to conventional approaches. Thus, at least for all electronic and electrical components in the inverter interior cheaper components can be selected, which are particularly suitable for smaller temperature ranges. Elaborate constructive solutions for cooling of, for example, electrical traces for the load terminals of an electrical machine and capacitors on the DC voltage intermediate circuit of the converter module accounts. The number of potential suppliers for the corresponding components of the inverter interior increases, which simplifies the selection of the most cost-effective supplier products.
  • Advantageous embodiments of the invention are specified in the dependent claims.
  • In an advantageous embodiment of the converter module, the first connection of the cooler is provided for connection to a supply line of the cooling circuit, and the second connection of the cooler is provided for connection to a return of the cooling circuit.
  • In a further advantageous embodiment of the converter module, the first spatial opening of the converter interior for arrangement at the flow of the cooling circuit, in particular at the first port of the radiator, and is the second spatial opening of the inverter interior for arrangement at the return of the cooling circuit, in particular at the second port of the radiator, intended. In order to ensure a compact, spatially narrow structure of the converter module, the arrangement of the spatial openings of the inverter interior directly at the connections of the cooler for connection to the cooling circuit is particularly advantageous. Such an expansion of the cooling circuit requires a relatively small design effort at the terminals of the radiator and can be realized accordingly without additional components. In contrast, it is also possible to provide a more complex design branching to the inverter interior directly on the flow, respectively return of the cooling circuit. This configuration option can be integrated in the converter module or can also be provided outside the converter module. The latter option may require separate connections of the inverter interior to the cooling circuit.
  • In a further advantageous embodiment of the converter module, the cooling circuit has a cooling medium with a cooling circuit flow rate at the flow and at the return and also for the radiator a radiator flow path with a radiator flow rate of the cooling medium and for the inverter interior a bypass flow path with a converter interior Flow rate of the cooling medium. After the converter interior is connected via the spatial openings at the connections of the radiator to the cooling circuit, which has a cooling circuit flow rate at its flow and its return, there are two flow paths between the flow and the return of the cooling circuit. In addition to the radiator flow rate of the cooling medium for the radiator flow path in the radiator of the power semiconductor module, the converter interior is flowed through with an inverter interior flow rate of the same cooling medium by means of the bypass flow path and, if there are no other internal and sealed rooms, this also completely with the cooling medium filled. Such an advantageous embodiment, in particular with respect to the bypass flow path, enables the heat dissipation of the entire converter interior by means of a now coherent cooling concept. A flowing cooling medium in the bypass flow path of the inverter interior, such as e.g. a coolant, is much better than stagnant air, which can only circulate poorly or not at all.
  • In a further advantageous embodiment of the converter module, the converter module in the region of at least one of the spatial openings on a thermostat and / or a valve for controlling the Umrichterinnenraum flow rate of the cooling medium for the bypass flow path of the inverter interior. This advantageous embodiment of the converter module allows a finely granular dissipation of heat generated by electrical losses in the inverter interior. Conversely, the radiator flow rate can now also be made available as needed. Which of the two flow rates in the cooler or in the converter interior, based on the cooling circuit flow rate, due to control increased or reduced, depends primarily on the actual need of heat dissipation in the radiator on the power semiconductor module of the inverter module or in the inverter interior of the converter module. In this case, the need for heat removal through the radiator flow path of the radiator on the power semiconductor module will generally always be greater than the need for heat dissipation through the bypass flow path in the inverter interior.
  • In a further advantageous embodiment of the converter module, a division of the cooling circuit flow rate of the cooling medium in the flow and their merger in the return of the cooling circuit dimensioned as a ratio of the radiator flow rate of the cooling medium for the radiator flow path in the radiator to the inverter interior flow rate of the cooling medium for the bypass flow path in the inverter interior according to a formula D1 / D2 = PV1 / PV2, where:
    • D1 the radiator flow rate of the cooling medium in the radiator,
    • • D2 the converter interior flow rate of the cooling medium in the inverter interior,
    • PV1 a first electrical power loss in the power semiconductor module, which is delivered as heat to the radiator on the power semiconductor module, and
    • • PV2 a second electrical power loss of electrical, electronic and power electronic components in the inverter interior, which is delivered as heat to the inverter interior, is.
  • The dependencies of the first electrical power loss in the power semiconductor module, which is delivered as heat to the radiator on the power semiconductor module, and radiator flow rate and second electrical power loss of electrical, electronic and power electronic components in the inverter interior, which is delivered as heat to the inverter interior, and inverter interior flow rate , as well as their resulting according to the formula shown conditions, are particularly advantageous in the structural design of the entire cooling concept, in particular in the design of the spatial openings of the cooling circuit to the inverter interior, usable. An exact structural design of the cooling circuit with its cooling circuit flow rate and the two flow paths with radiator flow rate and inverter interior flow rate, each aligned to a possibly maximum need for heat dissipation, thus guaranteed.
  • In an advantageous embodiment of the drive system, the drive system has at least one pump for conveying the cooling medium in the flow and in the return of the cooling circuit and in the radiator flow path of the radiator and in the bypass flow path of the inverter interior. A sole circulation of the cooling medium in the cooling circuit, including the radiator flow path and the bypass flow path, is usually not possible by means of gravity, in particular when using converter modules in drive systems for electric or hybrid vehicles. A forced-guided operation of the circulation of the cooling medium is therefore very advantageous by means of a pump whose drive can again be both electrical and mechanical origin.
  • In a further advantageous embodiment of the drive system, the cooling circuit, including the cooler flow path of the cooler and the bypass flow path of the inverter interior, as the cooling medium, an electrically insulating liquid, in particular MIDEL 7131 or MIDEL eN on. The inverter compartment of the converter module is equipped with electronic and electrotechnical components, which are often not electrically isolated from their environment. A now completely the converter interior or even partially flowing through cooling medium, such as a liquid but also a gas, is therefore advantageously equipped with dielectric, ie electrically non-conductive properties. Particularly suitable for electrically insulating fluids are prepared Esterbasis dielectric insulating fluids MIDEL 7131 and MIDEL eN the trademark MIDEL ® by M & I Materials Limited. While MIDEL 7131 uses a synthetic ester as the base, MIDEL eN has a natural ester. Both dielectric insulating fluids are used because of a number of special properties, such as temperature resistance, increased fire safety, moisture tolerance and environmental compatibility, in transformer construction or for electrical components with comparable requirements.
  • The above-described characteristics, features, and advantages of this invention, as well as the manner in which they are achieved, will become clearer and more clearly understood in connection with the following description of the embodiments, which will be described in connection with the figures. Show it:
  • 1 a first embodiment of an inverter module whose inverter interior are connected by means of spatial openings and via terminals for a radiator of a power semiconductor module with a cooling circuit,
  • 2 a second embodiment of an inverter module after 1 wherein a refrigeration cycle flow rate of the refrigeration cycle is divided into a radiator flow rate of the radiator flow path and an inverter interior flow rate of the bypass flow path,
  • 3 a third embodiment of an inverter module after 1 or 2 , Wherein the spatial openings to the inverter interior each have a thermostat and / or a filter for controlling an inverter interior space flow and
  • 4 a schematic representation of an electric or hybrid vehicle, said electric or hybrid vehicle, a drive system with an inverter module according to one of 1 . 2 or 3 contains and has an electric machine powered by this inverter module.
  • The embodiment in 1 indicates an inverter environment 16 encapsulated inverter module 1 , which has a converter interior 15 , a power semiconductor module 2 , a cooler 3 to dissipate the by the electrical losses during operation of the power semiconductor module 2 occurring amounts of heat, a first connection 7 and a second connection 8th to connect the radiator 3 with a cooling circuit 4 as well as a first spatial opening 10 and a second spatial opening 11 for connecting the inverter interior 15 with a cooling circuit 4 via the connections 7 . 8th the radiator 4 having. The cooler 3 has a cooler flow path 13 and is through the first port 7 with a lead 5 of the cooling circuit 4 and through the second port 8th with a return 6 of the cooling circuit 4 connected. About one at the first connection 7 the radiator 3 attached first spatial opening 10 and one at the second port 8th attached second spatial opening 11 is the inverter interior 15 including a bypass flow path 14 also with the cooling circuit 4 connected. The cooling circuit 4 is at his fore 5 and his return 6 with a pump 9 connected, which is a cooling medium 12 in the cooling circuit 4 as well as in the cooler flow path 13 and in the bypass flow path 14 forced to flow. Although the cooling medium 12 in the bypass flow path 14 of the inverter interior 15 usually has to cover a larger volume than in the radiator flow path 13 the radiator 3 , this is not a disadvantage for a constructive design of an entire cooling concept, as in the inverter interior 15 an expected amount of heat, which is dissipated, tends to be lower than in the cooler 3 on the power semiconductor module 2 ,
  • The embodiment in 2 shows an inverter module 1 to 1 , where here the distribution of a cooling circuit flow rate 19 , from the flow 5 of the cooling circuit 4 coming in a cooler flow rate 20 the cooler flow path 13 in the cooler 3 and in an inverter room flow rate 21 the bypass flow path 14 in the inverter interior 15 is pictured. The radiator flow rate 20 and the inverter interior flow rate 21 are then returned to the cooling circuit flow rate 19 on the return 6 of the cooling circuit 4 merged. The cooling circuit flow rate 19 therefore corresponds to a sum of radiator flow rate 20 and inverter interior flow rate 21 , The required radiator flow rate 20 for the cooler flow path 13 in the cooler 3 for cooling the power semiconductor module 2 can be proportional to a first electrical power loss 22 in the power semiconductor module 2 , which as heat to the radiator 3 on the power semiconductor module 2 is delivered. Comparable to this may be the required inverter interior flow rate 20 for the bypass flow path 14 for cooling the inverter interior 15 proportional to a second electrical power loss 23 electrical, electronic and power electronic components in the inverter interior 15 , which as heat to the inverter interior 15 is delivered. After the formula D1 / D2 = PV1 / PV2 is now, with knowledge of the expected first electrical power loss 22 in the power semiconductor module 2 (Variable PV1 of the formula), which as heat to the radiator 3 on the power semiconductor module 2 is discharged, and the expected second electrical power loss 23 electrical, electronic and power electronic components in the inverter interior 15 (Variable PV2 of the formula), which as the amount of heat to the inverter interior 15 is discharged, the ratio of the radiator flow rate 20 (Variable D1 of the formula) to the inverter interior flow rate 21 (Variable D2 of the formula), and thus in principle also the respective surface of the spatial openings 10 . 11 to the inverter interior 15 certainly.
  • The embodiment in 3 shows a supplement of an inverter module 1 to 1 or 2 , being here in the spatial openings 10 . 11 for connecting the bypass flow path 14 with the cooling circuit 4 thermostats 17 and / or valves 18 are introduced, which a targeted control of the heat dissipation through the bypass flow path 14 of the inverter interior 15 required converter interior flow rate 21 of the cooling medium 12 allow per defined time unit. Indirectly also the regulation of the heat removal by the cooler flow path takes place 14 the radiator 3 required radiator flow rate 20 of the cooling medium 12 , In extension of the embodiment 3 there is still the possibility, either in the first spatial opening 10 or in the second spatial opening 11 on a thermostat 17 or a valve 18 to dispense and thus at least one permanent opening to the inverter interior 15 maintain. At this point, a targeted control of the inverter interior flow rate 21 also be possible because an effective for the cooling flow of the cooling medium 12 through the bypass flow path 14 of the inverter interior 15 only when opening the at least one remaining thermostat 17 or valve 18 is activated.
  • In 4 is the schematic representation of an electric or hybrid vehicle 25 shown what a drive system 24 with a converter module 1 after one of the 1 . 2 or 3 and one of this inverter module 1 powered electric machine 26 contains.

Claims (10)

  1. Inverter module ( 1 ) with at least one power semiconductor module ( 2 ) and at least one cooler ( 3 ) for cooling the power semiconductor module ( 2 ), whereby the cooler ( 3 ) at least one first connection ( 7 ) and at least one second connection ( 8th ) for connection to a cooling circuit ( 4 ), characterized in that the converter module ( 1 ) further comprises an inverter interior ( 15 ), which by means of at least one first spatial opening ( 10 ) and at least one second spatial opening ( 11 ) for connection to the cooling circuit ( 4 ) is provided.
  2. Inverter module ( 1 ) according to claim 1, wherein the first connection ( 7 ) of the radiator ( 3 ) for connection to a flow ( 5 ) of the cooling circuit ( 4 ) and the second connection ( 8th ) of the radiator ( 3 ) for connection to a reflux ( 6 ) of the cooling circuit ( 4 ) is provided.
  3. Inverter module ( 1 ) according to one of claims 1 or 2, wherein the first spatial opening ( 10 ) of the converter interior ( 15 ) to the arrangement on the flow ( 5 ) of the cooling circuit ( 4 ), in particular at the first connection ( 7 ) of the radiator ( 3 ), and the second spatial opening ( 11 ) of the converter interior ( 15 ) for arrangement on the return ( 6 ) of the cooling circuit ( 4 ), in particular at the second connection ( 8th ) of the radiator ( 3 ), is provided.
  4. Inverter module ( 1 ) according to one of claims 1 to 3, wherein the cooling circuit ( 4 ) a cooling medium ( 12 ) with a cooling circuit flow rate ( 19 ) on the flow ( 5 ) and on the return ( 6 ) and continue for the radiator ( 3 ) a cooler flow path ( 13 ) with a radiator flow rate ( 20 ) of the cooling medium ( 12 ) and for the inverter interior ( 15 ) a bypass flow path ( 14 ) with an inverter interior flow rate ( 21 ) of the cooling medium ( 12 ) having.
  5. Inverter module ( 1 ) according to one of the preceding claims, wherein the converter module ( 1 ) in the region of at least one of the spatial openings ( 10 . 11 ) a thermostat ( 17 ) and / or a valve ( 18 ) for controlling the inverter interior flow rate ( 21 ) of the cooling medium ( 12 ) for the bypass flow path ( 14 ) of the converter interior ( 15 ) having.
  6. Inverter module ( 1 ) according to any one of the preceding claims, wherein a division of the cooling circuit flow rate ( 19 ) of the cooling medium ( 12 ) in the flow ( 5 ) and their combination in the return ( 6 ) of the cooling circuit ( 4 ) as a ratio of the radiator flow rate ( 20 ) of the cooling medium ( 12 ) for the cooler flow path ( 13 ) in the cooler ( 3 ) to the inverter interior flow rate ( 21 ) of the cooling medium ( 12 ) for the bypass flow path ( 14 ) in the converter interior ( 15 ) according to a formula D1 / D2 = PV1 / PV2 dimensioned, where • D1 is the radiator flow rate ( 20 ) of the cooling medium ( 12 ) in the cooler ( 3 ), • D2 is the inverter interior flow rate ( 21 ) of the cooling medium ( 12 ) in the converter interior ( 15 ), PV1 a first electrical power loss ( 22 ) in the power semiconductor module ( 2 ), which as amount of heat to the radiator ( 3 ) on the power semiconductor module ( 2 ), and PV2 a second electrical power loss ( 23 ) electrical, electronic and power electronic components in the converter interior ( 15 ), which as amount of heat to the inverter interior ( 15 ) is delivered.
  7. Drive system ( 24 ) for an electric or hybrid vehicle ( 25 ) with at least one converter module ( 1 ) according to one of claims 1 to 6 and with at least one of the converter module ( 1 ) powered electrical machine ( 26 ).
  8. Drive system ( 24 ) according to claim 7, wherein the drive system ( 24 ) at least one pump ( 9 ) for conveying the cooling medium ( 12 ) in the flow ( 5 ) and in the return ( 6 ) of the cooling circuit ( 4 ) and in the cooler flow path ( 13 ) and in the bypass flow path ( 14 ) of the converter interior ( 15 ) having.
  9. Drive system ( 24 ) according to one of claims 7 or 8, wherein the cooling circuit ( 4 ), including the cooler flow path ( 13 ) of the radiator ( 3 ) and the bypass flow path ( 14 ) of the converter interior ( 15 ), as a cooling medium ( 12 ) comprises an electrically insulating liquid, in particular MIDEL 7131 or MIDEL eN.
  10. Electric or hybrid vehicle ( 25 ) with at least one converter module ( 1 ) according to one of claims 1 to 6 or with at least one drive system ( 24 ) according to any one of claims 7 to 9.
DE102014208499.7A 2014-05-07 2014-05-07 Cooling circuit with bypass flow path for cooling an inverter interior Pending DE102014208499A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE102014208499.7A DE102014208499A1 (en) 2014-05-07 2014-05-07 Cooling circuit with bypass flow path for cooling an inverter interior

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014208499.7A DE102014208499A1 (en) 2014-05-07 2014-05-07 Cooling circuit with bypass flow path for cooling an inverter interior
CN201510226343.4A CN105097730B (en) 2014-05-07 2015-05-06 A bypass flow path for cooling the converter cooling cycle lumen

Publications (1)

Publication Number Publication Date
DE102014208499A1 true DE102014208499A1 (en) 2015-11-12

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DE (1) DE102014208499A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4209477A1 (en) * 1992-03-24 1993-09-30 Abb Patent Gmbh DC rectifier with forced cooling - has cooling bath and three=way valve with fluid pumped around rectifier components extracting heat for reuse elsewhere
US20070253164A1 (en) * 2006-04-27 2007-11-01 Takeshi Matsuo Power inverter
EP2557907A1 (en) * 2011-08-11 2013-02-13 Siemens Aktiengesellschaft Cooling assembly for cooling a frequency converter module

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7884468B2 (en) * 2007-07-30 2011-02-08 GM Global Technology Operations LLC Cooling systems for power semiconductor devices
DE102011000455A1 (en) * 2011-01-14 2012-07-19 Azur Space Solar Power Gmbh Arranging and method for cooling a wearer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4209477A1 (en) * 1992-03-24 1993-09-30 Abb Patent Gmbh DC rectifier with forced cooling - has cooling bath and three=way valve with fluid pumped around rectifier components extracting heat for reuse elsewhere
US20070253164A1 (en) * 2006-04-27 2007-11-01 Takeshi Matsuo Power inverter
EP2557907A1 (en) * 2011-08-11 2013-02-13 Siemens Aktiengesellschaft Cooling assembly for cooling a frequency converter module

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CN105097730B (en) 2018-05-29
CN105097730A (en) 2015-11-25

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Owner name: VALEO SIEMENS EAUTOMOTIVE GERMANY GMBH, DE

Free format text: FORMER OWNER: SIEMENS AKTIENGESELLSCHAFT, 80333 MUENCHEN, DE

R082 Change of representative

Representative=s name: DR. GASSNER & PARTNER MBB PATENTANWAELTE, DE