DE102013109531A1 - Apparatus useful as reinforced package comprises a package component, electrical connections, a device electrically coupled to electrical connections, a molding compound, and a molding underfill between the molding compound and the device - Google Patents

Apparatus useful as reinforced package comprises a package component, electrical connections, a device electrically coupled to electrical connections, a molding compound, and a molding underfill between the molding compound and the device

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Publication number
DE102013109531A1
DE102013109531A1 DE201310109531 DE102013109531A DE102013109531A1 DE 102013109531 A1 DE102013109531 A1 DE 102013109531A1 DE 201310109531 DE201310109531 DE 201310109531 DE 102013109531 A DE102013109531 A DE 102013109531A DE 102013109531 A1 DE102013109531 A1 DE 102013109531A1
Authority
DE
Germany
Prior art keywords
electrical connections
package component
substrate
underfill
plurality
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE201310109531
Other languages
German (de)
Inventor
Hsien-Wei Chen
Tsung-Yuan Yu
Wen-Hsiung LU
Ming-Da Cheng
Hao-Yi Tsai
Mirng-Ji Lii
Chen-Hua Yu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiwan Semiconductor Manufacturing Co TSMC Ltd
Original Assignee
Taiwan Semiconductor Manufacturing Co TSMC Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US201261746687P priority Critical
Priority to US61/746,687 priority
Priority to US13/751,289 priority
Priority to US13/751,289 priority patent/US9263839B2/en
Priority to US61/765,322 priority
Priority to US201361765322P priority
Priority to US61/776,282 priority
Priority to US201361776684P priority
Priority to US201361776714P priority
Priority to US201361776282P priority
Priority to US61/776,714 priority
Priority to US61/776,684 priority
Priority to US61/777,709 priority
Priority to US201361778341P priority
Priority to US201361777709P priority
Priority to US61/778,341 priority
Priority to US13/838,748 priority patent/US9257333B2/en
Priority to US13/838,748 priority
Priority to US13/868,554 priority
Priority to US13/868,554 priority patent/US8987058B2/en
Priority to US13/913,599 priority patent/US10015888B2/en
Priority to US13/913,599 priority
Priority to US13/914,426 priority
Priority to US13/914,426 priority patent/US9589862B2/en
Priority to US13/934,562 priority patent/US9401308B2/en
Priority to US13/934,562 priority
Priority to US13/939,966 priority
Priority to US13/939,966 priority patent/US9287143B2/en
Application filed by Taiwan Semiconductor Manufacturing Co TSMC Ltd filed Critical Taiwan Semiconductor Manufacturing Co TSMC Ltd
Publication of DE102013109531A1 publication Critical patent/DE102013109531A1/en
Application status is Pending legal-status Critical

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Abstract

Apparatus (I) comprises: a package component (110) having a first side and a second side; many electrical connections (112) on the second side of the package component; a device (130) electrically coupled to the electrical connections; a molding compound (114) on the second side of the package component; and a molding underfill (120) between the molding compound and the device. The molding compound has a first height. The electrical connections extend through the molding compound. The molding underfill encapsulates a subset of the electrical connections. Independent claims are also included for: (1) an apparatus (II) comprising: a first substrate having a first side and a second side; many electrical connections formed on the second side of the first substrate; a second substrate electrically coupled to at least one electrical connection; and a molding underfill interposed directly between the first substrate and the second substrate, where the molding underfill encapsulates at least one interconnect formed over the second side of the first substrate; and (2) a package reinforcement method comprising: providing a package component having many electrical connections and a molding compound on a first side, where the molding compound extends to a first height; coupling the package component to a substrate using the electrical connections; and forming a molding underfill to encapsulate a subset of the electrical connections between the package component and the substrate.

Description

  • This application claims the benefit of US Provisional Application No. 61 / 776,282, filed on Mar. 11, 2013, entitled "Apparatus and Method for Package Reinforcement," which application is incorporated by reference in its entirety. This application is a continuation-in-part of U.S. Patent Application No. 13 / 349,405, filed January 12, 2012, entitled "Package to Package Interconnect Structure" (Serial No. TSM11-1284), which application is also incorporated herein by reference Reference is taken in its entirety. This application is a continuation-in-part of US Patent Application No. 13 / 751,289, filed on Jan. 28, 2013, entitled "System and Method for an Improved Fine Pitch Joint" (Serial No. TSM12-0970), wherein this application still claims priority to US Provisional Application No. 61 / 746,687, filed on Dec. 28, 2012, entitled "System and Method for an Improved Fine Pitch Joint" (Serial No. TSM12-0970P) Applications are hereby incorporated by reference in their entirety. This application is a continuation-in-part of US Patent Application No. 13 / 913,599, filed Jun. 10, 2013, entitled "Interconnect Joint Protective Layer Apparatus and Method" (Serial No. TSM13-0082), this application claims priority of US Provisional Application No. 61 / 765,322, filed February 15, 2013, entitled "Interconnect Joint Protective Layer Apparatus and Method" (Serial No. TSM 13-0082P), which applications are also incorporated herein by reference taken in their entirety herein. This application is a continuation-in-part of US Patent Application No. 13 / 914,426, filed Jun. 10, 2013, entitled "Interconnect Structures and Methods of Forming Same" (Docket No. TSM13-0083), this application continues to be the priority of US Provisional Application No. 61 / 776,714, filed March 11, 2013, entitled "Interconnect Structures and Methods of Forming Same" (Serial No. TSM13-0083P), all of which are incorporated herein by reference Reference be included. This application is a continuation-in-part of US Patent Application No. 13 / 838,748 filed Mar. 15, 2013, entitled "Interconnect Structures and Methods of Forming Same" (Serial No. TSM13-0084), this application claims priority of US Provisional Application No. 61 / 776,684, filed March 11, 2013, entitled "Interconnect Structures and Methods of Forming Seed" (Serial No. TSM13-0084P), which applications are hereby incorporated by reference in US their entirety. This application is a continuation-in-part of US Patent Application No. 13 / 868,554, filed April 23, 2013, entitled "Apparatus and Method for Wafer Separation" (Serial No. TSM13-0085), this application further claiming priority to US Provisional Application No. 61 / 778,341, filed March 12, 2013, entitled "Apparatus and Method for Wafer Separation" (Serial No. TSM13-0085P), which applications are hereby incorporated in their entirety , This application is a continuation-in-part of US Patent Application No. 13 / 934,562, filed Jul. 3, 2013, entitled "Packaging Devices, Methods of Manufacture, and Packaging Methods" (Serial No. TSM13-0091). This application further claims the benefit of US Provisional Application No. 61 / 777,709, filed Mar. 12, 2013, entitled "Packaging Devices, Methods of Manufacture, and Packaging Device Design Methods" (Docket No. TSM13). 0091P), these applications being hereby incorporated in their entirety.
  • BACKGROUND
  • Since the invention of integrated circuit (IC), the semiconductor industry has experienced rapid growth due to the continuing improvements in the integration density of various electronic components (i.e., transistors, diodes, resistors, capacitors, etc.). For the most part, this improvement in integration density has resulted from the repeated reduction in minimum component size, allowing more components to be integrated into a given area. These smaller electronic components have resulted in smaller packages that take up less space than the previously used packages. Some smaller types of semiconductor package packages include Quad Flat Pack (QFP), Pin Grid Array (PGA), Ball Grid Array (BGA), Flip Chips (FC), Three-dimensional Integrated Circuits (3D ICs), Wafer Level Packages (WLPs), and Package on-package components (PoP). These types of packages are susceptible to tension and stress, which can damage the electrical connections between a package and a component to which the package is electrically connected.
  • For a more complete understanding of the present embodiments, and the advantages thereof, reference is now made to the following description, taken in conjunction with the accompanying drawings, in which:
  • the 1A illustrates a cross-sectional view of a reinforced package according to an embodiment;
  • the 1B a simplified plan view of the top of the device according to 1A illustrated;
  • the 1C a partial cross-sectional view of the reinforced package according to the 1A illustrated;
  • the 2A illustrates a cross-sectional view of another reinforced package according to another embodiment;
  • the 2 B a simplified plan view of the device according to 2A illustrated;
  • the 3A illustrates a cross-sectional view of another reinforced package according to another embodiment;
  • the 3B a simplified plan view of the top of the device according to 3A illustrated;
  • the 4 FIG. 4 illustrates a partial cross-sectional view of yet another reinforced package according to one embodiment; and FIG
  • the 5 illustrates a method according to an embodiment.
  • PRECISE DESCRIPTION
  • The manufacture and use of the embodiments of the present disclosure will be discussed in detail below. It should be appreciated, however, that the present disclosure describes many applicable inventive concepts that can be implemented in a wide range of specific contexts. The specific embodiments discussed are merely illustrative of particular ways to benefit from the disclosed subject matter, but are not intended to limit the scope of the various embodiments. Throughout the various views and illustrative embodiments, identical reference numerals are used to designate identical elements.
  • The 1A illustrates an enhanced package 100 according to one embodiment. As in 1A Illustrated is the reinforced package 100 a package component 110 , a variety of electrical connections 112 and a potting underfill ("MUF") 120. The package component 110 can be a first horizontal page 110a and a second horizontal side 110b exhibit. The package component 110 may have a thickness T. The variety of electrical connections 112 can on the second horizontal side 110b the package component 110 , and in one embodiment, a potting compound 114 over the second horizontal side 110b be formed, which each of the plurality of electrical connections 112 surrounds. The potting compound 114 can with a first height H1 on the second horizontal side 110b be formed of the package component. In various embodiments, the first height H1 is between about 15 μm and about 250 μm. The potting compound 114 can be the second horizontal page 110b the package component 110 encapsulate and / or seal. The package component 110 can be due to the variety of electrical connections 112 with a component 130 be electrically connected. Various processes for the formation of a package component and potting compound are described in co-pending U.S. Patent Application No. 13 / 838,748 entitled "Interconnect Structures and Methods of Forming Same", filed Mar. 15, 2013, which is incorporated herein by reference Entity is incorporated by reference.
  • The MUF 120 may be configured to include all or a selected number and / or a group of the plurality of electrical connections 120 between the package component 110 and the component 130 encapsulated. In one embodiment, the MUF 120 as it is in 1A is shown between the potting compound 114 and the component 130 be arranged and all the plurality of electrical connections 112 between the package component 110 and the component 130 encapsulate.
  • The 1B shows a simplified plan view of the device according to 1A , As in 1B is shown, the plurality of electrical connections 112 along N rows and M columns on the second horizontal side 110b the package component 110 be educated. The MUF 120 can, as in the embodiment according to 1B is shown, all of the plurality of electrical connections 112 encapsulate. Although the electrical connections 112 evenly over the package component 110 are shown distributed, the electrical connections 112 also be distributed according to an irregular pattern or with unequal spacing and the like. The distribution of electrical connections 112 is how it is in the 1A - 1B is shown for illustrative purposes only and is not intended to limit the scope of the embodiments described herein. As will be discussed in detail below, the number of the plurality of electrical connections 112 which of the MUF 120 be encapsulated, less than those in the 1A - 1B be illustrated number.
  • The MUF 120 may be a reinforcing stiffener against cracking, cracking, shearing or other possible damage to the electrical connection 112 showing the electrical connectivity between the package component 110 and the component 130 could compromise. Ultimately, the MUF 120 serve to formulate lateral, horizontal and / or torsional stresses between the package component 110 , the electrical connections 112 and / or the component 130 to minimize, which may occur in the subsequent production due to thermal fluctuations, physical changes, atmospheric pressure change, etc. At the in 1A In the embodiment shown, the MUF 120 along one or more vertical sides 110c the package component 110 with a second height H2 extend. The second height H2 can be adjusted to match the gain of the package component 110 to vary. In various embodiments, the second height H2 is between about 50 μm and about 250 μm. There may be a relationship between the thickness T of the package component 110 , the first height H1 and the second height H2 are in accordance with the following inequality: 1/3 (H1 + T) ≦ (H1 + H2) <(H1 + T).
  • In various embodiments, the MUF 120 be formed from post-processable or non-post-processable materials such as epoxy, deformable gel, silicone rubber, thermoplastic, thermoset, a combination of these or the like. In various embodiments, the MUF 120 have a filler material whose size is between 10 microns and 50 microns. The MUF 120 may have a glass transition temperature Tg between about 100 ° C and about 150 ° C. In various embodiments, the MUF 120 be formed using dispensing, injection and / or spraying techniques.
  • The 1C illustrates a detail view of the package component 110 according to one embodiment. As in 1C is shown, the package component comprises a substrate 111 , one or more connection pads 115 that on the substrate 111 are formed, a pair of passivation layers - a first and a second passivation layer 116 . 117 - above the substrate 111 where the or the connection pad (s) 115 and one or more post-passivation connections ("PPI") 118 above the pair of passivation layers 116 . 117 lie. The PPI 118 is using the connection pad 115 through the first and second passivation layers 116 . 117 electrically connected. The electrical connection 112 is with a connection pad 132 on the component 130 connected. The description below regarding the possible material compositions of the terminal pad 115 , the passivation layers 116 . 117 and the PPI 118 be with reference to the 4 performed.
  • As in 1C shown, the MUF 120 on the sides of the package component 110 extend upward to the potting compound 114 as well as the pair of passivation layers 116 . 117 and the substrate 111 to encapsulate. The height H2, with which the MUF 120 on the sides of the package component 110 extends upward, can be adjusted to the volume of MUF 120 which between the package component 110 and the component 130 injected, adapt. As already mentioned, the first height may be between about 50 μm and about 250 μm and the second height H2 between about 50 μm and about 250 μm.
  • In various embodiments, as discussed in more detail below, the package 100 be formed without a potting compound on the second horizontal side 110b the package component 110 is applied. In such embodiments (not in the 1A - 1C shown), the MUF 120 between the component 130 and the package component 110 be designed such that the MUF 120 between the second horizontal side 110b the package component 110 and the component 130 is arranged, wherein they are the plurality of electrical connections 112 encapsulated. In such embodiments, the MUF 120 Connections and / or components on the second page 110b the package component 110 are trained protect.
  • In various embodiments, the package component 110 a wafer, a chip, a substrate, an interposer, or combinations of these, such as those used in stacked or 3D-IC type components (not shown) or in micro-electro-mechanical systems ("MEMS"). In various embodiments, the package component 110 comprise one or more layers of dielectric materials, metallic materials and / or non-conductive materials which may be used to form interlayer dielectrics ("ILDs") or intermetal dielectrics ("IMDs"). In various embodiments, the package component 110 active components such as transistors and / or sensors (not shown) include. In various embodiments, the package component 110 passive components such as resistors, capacitors, coils or other similar components (not shown). In various embodiments, the package component 110 free of active and / or passive components.
  • In various embodiments, the potting compound 114 be formed of a polymer, a liquid epoxy, combinations of these or the like. The potting compound 114 may comprise a filler material having a size of less than 10 microns. The potting compound 114 may have a glass transition temperature Tg between about 130 ° C and about 200 ° C. In various embodiments, the electrical connections 112 made of solder, non-eutectic lead, tin, copper, gold, nickel, aluminum alloys, combinations of these or the like. Although the electrical connections 112 as they are in 1A are illustrated spherically, the electrical connections 112 also be formed columnar or pillar-shaped.
  • In various embodiments, the component 130 a printed circuit board ("PCB"), a wafer, a chip, a substrate, an interposer, or combinations thereof, as used for example for 3D IC type components (not shown) or MEMS type (not shown) become. In various embodiments, the component 130 conductive pads (not shown) which interconnect the one or more electrical connections 112 enable with this.
  • The size, shape, type, composition and / or arrangement of the package component 110 , one or more electrical connections 112 , the potting compound 114 as well as the component 130 are given for illustrative purposes only and are not intended to limit the scope of the embodiments discussed herein.
  • The 2A illustrates another enhanced package 200 according to another embodiment. As the 2A Illustrated, the reinforced package 200 a package component 210 , a variety of electrical connections 212 as well as a MUF 220 include. The package component 210 can be a first horizontal page 210a and a second horizontal page 210b and have a thickness T. The variety of electrical connections 212 can on the second horizontal side 210b the package component 210 be formed, and in one embodiment, a potting compound 214 over the second horizontal side 210b be formed and each of the plurality of electrical connections 212 surround. The potting compound 214 can with a first height H1 on the second horizontal side 210b the package component 210 be formed, and it can be an encapsulation of the second horizontal side 210b the package component 210 provide. In various embodiments, the first height H1 may be between about 50 μm and about 250 μm. About the variety of electrical connections 212 can the package component 210 with a component 230 be electrically connected.
  • As in 2A In one embodiment, the MUF 220 between the potting compound 214 and the component 230 be arranged. In this embodiment, the MUF 220 along one or more vertical sides 210c the package component 210 extend to a second height H2. In various embodiments, the second height may be between about 50 μm and about 250 μm. According to the following inequality, a relationship between the thickness T of the package component 210 , the first height H1 and the second height H2 are 1/3 (H1 + T) ≦ (H1 + H2) <(H1 + T).
  • In various embodiments, the MUF 220 be made of reworkable or non-reworkable materials such as epoxy, deformable gel, silicone rubber, thermoplastic, thermoset, a combination of these or the like. In various embodiments, the MUF 220 comprise a filler material which is between 10 microns and 50 microns in size. The MUF 220 may have a glass transition temperature Tg between about 100 ° C and about 150 ° C. The package component 210 , the electrical connections 212 , the potting compound 214 as well as the component 230 may have properties and / or compositions similar to those previously described with reference to 1A similar to described embodiments.
  • The 2 B illustrates a simplified plan view of the device according to 2A , As in 2 B can be shown, a variety of electrical connections 212 along N rows and M columns on the second horizontal side 210b the package component 210 be educated. Compared to 1B which the MUF 120 illustrates which of the plurality of electrical connections 112 encapsulated, illustrates the 2 B that the MUF 220 a plurality of subsets 240 the multitude of electrical connections 212 at one or more corners of the package component 210 encapsulated. Each of the subsets 240 can be a group of the variety of electrical connections 212 with X rows and Y columns. For example, the number of X rows may be between 2 and (N / 2) -1 of the total number of N rows and the number of Y columns may be between 2 and (M / 2) -1 of the total number of M columns.
  • The configuration of the MUF 220 according to the 2A - 2 B at one or more corners of the package component 210 can be a reinforcing reinforcement of electrical connections 212 between the package component 210 and the component 230 provide. Compared to the in the 1A - 1B shown configuration of the MUF 120 which are all of the electrical connections 112 can cover the MUF 220 according to the 2A - 2 B a reinforcing reinforcement at a lower cost compared to the configuration according to the 1A - 1B provide. For example, when in the 2A - 2 B configuration shown less MUF 220 be used, so that the total cost of the reinforced package 200 can be reduced. Compared to the reinforcing stiffening of the MUF 120 according to the 1A - 1B can reinforce the stiffening of the MUF 220 the electrical connections 212 according to the 2A - 2 B However, for certain applications they are still sufficient for the formation of a reinforced package 200 is.
  • Everyone in 2 B shown subsets can be a group of 3-by-3 connectors of the variety of electrical connections 212 at the corresponding corners of the package component 210 exhibit, by the MUF 220 can be encapsulated. The number of electrical connections 212 in the phrases 240 can be larger or smaller than the one in 2 B be illustrated number. The number of electrical connections in each of the subsets 240 is how it is in 2 B is shown for illustrative purposes only and is not intended to limit the scope of the discussed embodiments. In addition, the number of corners of the package component 210 to which the subsets 240 electrical connections 212 by means of the MUF 220 can be encapsulated less than the number of in 2 B be illustrated corners. In one embodiment, the MUF covers 220 a pair of adjacent rows and columns of electrical connections 212 on each side of a corner at the corresponding corner of the package component 210 , In addition, as it can in 2 B shown is the MUF 220 some of the internal electrical connections 212 for the package component, but do not completely encapsulate. The volume of between the package component 210 and the component 230 applied MUF 220 can be varied to the number of electrical connections 212 which of the MUF 220 completely encapsulated, to vary.
  • The 3A illustrates another enhanced package 300 according to another embodiment. As in 3A Illustrated is the reinforced package 300 a package component 310 and a MUF 320 include. The package component 310 can be a first horizontal page 310a and a second horizontal side 310b at a thickness T. A variety of electrical connections 312 can on the second horizontal side 310b the package component 310 be formed, wherein in one embodiment, a potting compound 314 over the second horizontal side 310b may be formed and each of the plurality of electrical connections 312 can surround. The potting compound 314 can with a first height H1 on the second horizontal side 310b the package component 310 be formed, and it can be the second horizontal side 310b the package component 310 encapsulate. In various embodiments, the first height H1 may be between about 50 μm and about 250 μm. The package component 310 can about the variety of electrical connections 312 with a component 330 be electrically connected.
  • In one embodiment, the MUF 320 as it is in 3A is shown between the potting compound 314 and the component 330 be arranged. In this embodiment, the MUF 320 along one or more vertical sides 310c the package component 310 extend to a second height H2. In various embodiments, the second height H2 may be between about 50 μm and about 250 μm. According to the following inequality, a relationship between the thickness T of the package component 310 , the first height H1 and the second height H2 are 1/3 (H1 + T) ≦ (H1 + H2) <(H1 + T).
  • In various embodiments, the MUF 320 be formed from reworkable or non-post-processable materials such as epoxy, deformable gel, silicone rubber, a combination of these or the like. In various embodiments, the MUF 320 a filler material whose size is between 10 microns and 50 microns. The MUF 320 may have a glass transition temperature Tg between about 100 ° C and about 150 ° C. The package component 310 , the electrical connections 312 , the potting compound 314 as well as the component 330 may have properties and / or compositions similar to those described with reference to 1A similar to described embodiments.
  • The 3B illustrates a simplified plan view of the embodiment according to 3A , As in 3B is shown, the plurality of electrical connections 312 along N rows and M columns on the second horizontal side 310b the package component 310 be educated. Compared to the MUF 120 according to the 1A - 1B and the MUF 220 according to the 2A - 2 B can the MUF 320 as it is in 3B is shown along a circumference of the package component 310 be formed and the electrical connections 312 between the package component 310 and the component 330 Encapsulate along the circumference. The electrical links 312 that of the MUF 320 may include a number of rows X representing a subset of the number N rows, and a number of columns Y containing a subset of the number M columns along the perimeter of the package component 310 represents. In various embodiments, the number of rows X may be between 2 and (N / 2) -1 of the total number of N rows, and the number of columns Y may be between 2 and (M / 2) -1 of the total number of M columns.
  • The configuration of the MUF 320 according to 3B along the periphery of the package component 310 may be a reinforcing reinforcement of the electrical connections 312 between the package component 310 and the component 330 provide. The MUF 320 according to the 3A - 3B For example, balanced gain stiffening and manufacturing cost tradeoff can be achieved between full coverage of all electrical components 112 as it is in the 1A - 1B is shown, and only the electrical connections 212 in the corners, as in the 2A - 2 B is shown.
  • As in 3B illustrates the scope of the electrical connections 312 , which of the MUF 320 can be encapsulated, three rows and three columns along the perimeter of the package component 310 include. The number of electrical connections 312 which of the MUF 320 along the periphery of the package component 310 can be encapsulated larger or smaller than those in 3B be illustrated number. The number of the MUF 320 encapsulated electrical connections 312 as they are in 3B is intended to be illustrative only and not intended to limit the scope of the discussed embodiments. The MUF 320 does not have to be along the entire scope of the package component 310 rather, it can only be formed along a partial circumference of the package component 310 be formed, for example, along one or more peripheral portions of the package component 310 , In one embodiment, the MUF encapsulates 320 a pair of adjacent rows and columns of electrical connections 312 on each side of a corner at the corresponding corner of the package component 310 , In one embodiment, the MUF 320 some of the internal electrical connections 312 for the package component 310 contact, but do not completely encapsulate. The volume of between the package component 310 and the component 330 applied MUF 320 can be varied to the number of electrical connections 312 which of the MUF 320 completely encapsulated, to influence.
  • The 4 illustrates a partial cross-sectional view of another reinforced package 400 according to another embodiment. The reinforced package 400 can be a package component 410 , a variety of electrical connections 420 as well as a MUF 430 include. The package component 410 can be a substrate 411 , one or more connection pads 412 that on the substrate 411 are formed, a pair of passivation layers - a first and a second passivation layer 413 . 414 - that over the substrate 411 as well as the connection pads 412 and one or more post-passivation connections ("PPI") 415 passing over the pair of passivation layers 413 . 414 lie, have. Every PPI 415 may be electrically connected to one of the corresponding connection pads.
  • About the variety of electrical connections 420 can the package component 410 with a component 440 be electrically connected. The component 440 can have one or more conductive pads 442 each of which has a connection location for one of the corresponding electrical connections 420 of the package 400 provides. By way of illustration, in 4 a single electrical connection 420 , a single connection pad 412 , a PPI 415 as well as a conductive pad 442 this is not intended to limit the scope of the embodiments described herein.
  • As in 4 shown, the MUF 430 between the package component 410 and the component 440 be educated. The MUF 430 can the variety of electrical connections 420 and continue the PPIs 415 , the second passivation layer 414 , the first passivation layer 413 and / or the substrate 411 the package component 410 encapsulate. Compared to the package component 110 according to 1A can no potting compound over the package component 410 according to 4 be formed; rather, the MUF offers 430 an encapsulation of the package component 410 and in addition, a reinforcing reinforcement of the electrical connections 420 between the package component 410 and the component 440 , The MUF 430 encapsulates the PPI 415 to protect it from oxidation. In one embodiment, the MUF 430 along the sides of the package component 410 extend. For example, the MUF 430 along the sides 414c the second passivation layer 414 , along the sides 413c the first passivation layer 413 and / or along the sides 411c of the substrate 411 extend to protect this component.
  • In various embodiments, the MUF 430 be formed from reworkable or non-post-processable material, such as epoxy, deformable gel, Silicone rubber, thermoplastic, thermoset, combinations of these or the like. The MUF 430 may comprise a filler material having a size of between about 10 microns and about 50 microns, and having a glass transition temperature Tg between about 100 ° C and about 150 ° C. In various embodiments, the MUF 430 be formed using dispensing, injection and / or spraying techniques.
  • In various embodiments, the substrate may be 411 a wafer, a chip, an interposer, or a combination thereof, such as those used for, for example, stacked devices or components of the 3D-IC type (not shown) or MEMS-type devices (not shown). In various embodiments, one or more layers of dielectric materials, metallic materials, and / or non-conductive materials may be used to form interlayer dielectrics (ILDs), intermetallic dielectrics (IMDs), and / or passivation layers (not shown) within the substrate. In various embodiments, the substrate may be 411 active components such as transistors and / or sensors (both not shown). In various embodiments, the substrate may be 411 passive components such as resistors, capacitors, coils or other similar components (not shown). In various embodiments, the substrate may be 411 free of active and / or passive components.
  • In various embodiments, the connection pad or pads may be used 412 of copper, tin, nickel, gold, silver, platinum, palladium, aluminum, alloys of these or the like may be formed. In various embodiments, the connection pad (s) may be formed by means of thermal chemical vapor deposition (CVD), physical vapor deposition (PVD), such as sputter deposition or evaporation, by means of an electron gun, an ion beam, an energetic beam, by plating, by one or more subtractive etching processes, a single damascene process and / or a double damascene process, or by similar or other acceptable methods.
  • In various embodiments, the first and / or the second passivation layer 413 . 414 for example, a polyimide, polybenzoxazole (PBO), benzocyclobutene (BCB), a non-photosensitive polymer, and in alternative embodiments, a nitride, a carbide, a silicon oxide, a silicon nitride, low-k dielectrics, such as Carbon doped oxides, of extremely low k dielectric, such as porous carbon-doped silica, be formed of combinations of these and / or other suitable materials.
  • In various embodiments, the plurality of electrical connections 420 made of solder, non-eutectic lead, tin, copper, gold, nickel, aluminum alloys, combinations of these or the like. Although the electrical connections 420 as it is in 4 is illustrated in spherical form, the electrical connections 420 also be formed columnar or pillar-shaped. In various embodiments, the component 440 a printed circuit board (PCB), a wafer, a chip, a substrate, an interposer, or combinations thereof, such as those used for, for example, 3D IC type devices (not shown) or MEMS type devices. In various embodiments, the conductive pads 442 of copper, tin, nickel, gold, silver, platinum, palladium, aluminum, alloys of these or the like may be formed.
  • In various embodiments, the PPIs are 415 formed of copper, tin, nickel, gold, silver, platinum, palladium, aluminum, alloys of these or the like. In various embodiments, the connection pads may be formed by thermal chemical vapor deposition (CVD), physical vapor deposition (PVD), such as sputter deposition or evaporation, electron gun, ion beam, energetic beam, plating, by one or more subtractive etching processes , by a single damascene process and / or by a double damascene process, as well as by similar or other suitable methods.
  • The 5 illustrates a method 500 according to one embodiment. The procedure 500 forms a plurality of electrical connections on a first horizontal side of a package component (block 510 ) out. The procedure 500 forms the electrical connections along N rows and M columns on the first horizontal side of the package component. Optionally, the procedure forms 500 a potting compound on the first horizontal side of the package component to a first height (block 512 ). The potting compound is formed around the plurality of electrical connections around to the first height.
  • The procedure 500 connects the package component to a substrate using the plurality of electrical connections (block 520 ). The procedure 500 forms a casting underfill between the package component and the substrate (block 530 ). The potting underfill encapsulates one or more of the plurality of electrical connections between the package component and the substrate. In one embodiment, the encapsulant underfill may be formed to a second height along vertical sides of the package component. If a potting compound is used on the first horizontal side of the package component, the process forms 500 the potting underfill between the potting compound of the package component and the substrate.
  • The potting underfill may be configured to encapsulate a subset of the electrical connections. For example, the encapsulation underfill may encapsulate a subset of X rows and Y columns of the plurality of electrical connections along a perimeter of the package component. The number of X rows may be less than (N / 2) -1 of the total number of N rows, and the number of Y columns may be less than (M / 2) -1 of the M columns of electrical connections.
  • The volume of potting underfill injected between the package component and the substrate along the circumference may be varied to accommodate the number of X rows and Y columns of electrical connections completely encapsulated by potting underfill. For example, the volume of the injected grout underfill can be increased to encapsulate more of the X rows and Y columns of electrical interconnects circumferentially, and it can be reduced to encapsulate less of the X rows and Y columns of electrical interconnects along the perimeter of the package component. In addition, some of the electrical connections on the inside of the package component may be contacted by the potting underfill, but are not completely encapsulated by the potting underfill. It should again be noted that the volume of applied encapsulation underfill between the package component and the substrate determines the number of electrical connections that are completely encapsulated by the encapsulant underfill, or the electrical connections that are contacted but not fully encapsulated.
  • In another example, the encapsulation underfill may encapsulate a plurality of subsets of the plurality of electrical connections at a plurality of corners of the package component. In such an embodiment, each of the plurality of sets may comprise a set of X-series times Y columns of the plurality of electrical connections at a corner of the package component, where X is between 2 and (N / 2) -1 of the total number of N rows and Y is between 2 and ( N / 2) - 1 of the total number M of electrical connections. Again, the volume of potting underfill injected between the package component and the substrate may be varied at a particular corner to adjust the number of X rows and Y columns of electrical interconnects completely encapsulated by the potting underfill.
  • According to one embodiment, an apparatus is provided. The device comprises: a package component, the package component having a first side and a second side; a plurality of electrical connections on the second side of the package component; a member that is electrically connectable to the plurality of electrical connections; a potting compound formed on the second side of the package component to a first height, the plurality of electrical connections extending through the potting compound; and a potting underfill between the potting compound and the component, the potting underfill encapsulating a subset of the plurality of electrical connections.
  • In another embodiment, another device is provided. The device comprises: a first substrate having a first side and a second side; a plurality of electrical connections formed on the second side of the first substrate; a second substrate electrically connected to the one or more electrical connections; and a potting underfill disposed immediately between the first substrate and the second substrate, the potting underfill encapsulating at least one port formed over the second side of the first substrate.
  • According to another embodiment, a method is provided. The method includes providing a package component, the package component having a plurality of electrical connections and a potting compound on a first side, the potting compound extending to a first height; bonding the package component to a substrate using the plurality of electrical connections; and forming a potting underfill to encapsulate a subset of the plurality of electrical connections between the package component and the substrate.
  • Although the present embodiments and their advantages have been described in detail, it should be understood that various changes, substitutions and alterations can be made without thereby departing from the scope of the disclosure as defined in the appended claims. For example, one skilled in the art will readily appreciate that the structures described above and the order of the steps may be varied so as not to depart from the scope of the present disclosure.
  • Moreover, the scope of the present application is not intended to be limited to particular embodiments of the process, the machine, the manufacturing method, the composition of matter, the means, the methods and steps as set forth in the specification. It will be readily apparent to those skilled in the art from the disclosure that such processes, machines, methods of manufacture, compositions of matter, means, methods or steps that already exist or will be developed later, and which perform substantially the same function or substantially the same result as those achieve corresponding embodiments described herein, can also be used according to the present disclosure. Accordingly, the appended claims are intended to include within their scope such processes, machines, methods of manufacture, compositions of matter, means, methods or steps.

Claims (20)

  1. Apparatus comprising: a package component, the package component having a first page and a second page; a plurality of electrical connections on the second side of the package component; a component electrically connected to the plurality of electrical connections; a potting compound on the second side of the package component, the potting compound having a first height, and wherein the plurality of electrical connections extend through the potting compound; and a potting underfill between the potting compound and the component, the potting underfill encapsulating a subset of the plurality of electrical connections.
  2. The device of claim 1, wherein the encapsulant underfill is disposed along vertical sides of the package component to a second height.
  3. The device of claim 1 or 2, wherein the plurality of electrical connections are formed along N rows and M columns on the second side of the package component.
  4. The device of claim 3, wherein the subset comprises one or more sets of electrical connections at one or more corners of the package component.
  5. The device of claim 4, wherein each of the groups comprises X rows Y times of the plurality of electrical connections at each of the corners of the package component, where X is between 2 and (N / 2) -1 and Y is between 2 and (M / 2). 1 lies.
  6. Apparatus according to claim 5, wherein X and Y are the same.
  7. Apparatus according to any of claims 4 to 6, wherein the subset X has rows and Y columns of the plurality of electrical connections along a perimeter of the package component, and where X is less than (N / 2) -1 and Y is less than (M / 2) - 1 is.
  8. Apparatus according to claim 7, wherein the subset comprises all page sizes of the package component.
  9. Apparatus according to claim 7 or 8, wherein X and Y are the same.
  10. Apparatus according to any one of the preceding claims, wherein the component is a printed circuit board (PCB), a substrate, a chip or an interposer.
  11. Apparatus comprising: a first substrate having a first side and a second side; a plurality of electrical connections formed on the second side of the first substrate; a second substrate electrically connected to one or more electrical connections; and a potting underfill disposed directly between the first substrate and the second substrate, the potting underfill encapsulating at least one port formed over the second side of the first substrate.
  12. The device of claim 11, wherein the encapsulant underfill encapsulates a pair of passivation layers disposed between the second side of the first substrate and the at least one terminal.
  13. Apparatus according to claim 11 or 12, wherein the potting underfill consists of epoxy, deformable gel, silicone rubber or combinations thereof.
  14. Apparatus according to any one of claims 11 to 13, wherein the second substrate is a printed circuit board (PCB), a chip or an interposer.
  15. A method, comprising: providing a package component, the package component having a plurality of electrical connections and a potting compound on a first side, the potting compound extending to a first height; Bonding the package component to a substrate using the plurality of electrical connections; and forming a potting underfill to encapsulate a subset of the plurality of electrical connections between the package component and the substrate.
  16. The method of claim 15, further comprising: Forming the potting underfill so that it extends along sides of the package component to a second height.
  17. The method of claim 15 or 16, wherein forming the encapsulation underfill to encapsulate a subset of the plurality of electrical connections comprises Forming the encapsulant underfill for encapsulating a subset of rows and columns of the plurality of electrical connections along at least one circumference of the package component.
  18. The method of claim 17, wherein the number of rows and columns is the same.
  19. The method of any one of claims 15 to 18, wherein forming the encapsulant underfill to encapsulate a subset of the plurality of electrical connections comprises: Forming the encapsulant underfill to encapsulate a subset of rows and columns of the plurality of electrical connections at one or more corners of the package component.
  20. The method of claim 19, wherein the number of rows and columns is the same.
DE201310109531 2012-01-12 2013-09-02 Apparatus useful as reinforced package comprises a package component, electrical connections, a device electrically coupled to electrical connections, a molding compound, and a molding underfill between the molding compound and the device Pending DE102013109531A1 (en)

Priority Applications (28)

Application Number Priority Date Filing Date Title
US201261746687P true 2012-12-28 2012-12-28
US61/746,687 2012-12-28
US13/751,289 2013-01-28
US13/751,289 US9263839B2 (en) 2012-12-28 2013-01-28 System and method for an improved fine pitch joint
US201361765322P true 2013-02-15 2013-02-15
US61/765,322 2013-02-15
US201361776684P true 2013-03-11 2013-03-11
US201361776714P true 2013-03-11 2013-03-11
US201361776282P true 2013-03-11 2013-03-11
US61/776,714 2013-03-11
US61/776,684 2013-03-11
US61/776,282 2013-03-11
US201361778341P true 2013-03-12 2013-03-12
US201361777709P true 2013-03-12 2013-03-12
US61/778,341 2013-03-12
US61/777,709 2013-03-12
US13/838,748 2013-03-15
US13/838,748 US9257333B2 (en) 2013-03-11 2013-03-15 Interconnect structures and methods of forming same
US13/868,554 US8987058B2 (en) 2013-03-12 2013-04-23 Method for wafer separation
US13/868,554 2013-04-23
US13/913,599 2013-06-10
US13/914,426 2013-06-10
US13/914,426 US9589862B2 (en) 2013-03-11 2013-06-10 Interconnect structures and methods of forming same
US13/913,599 US10015888B2 (en) 2013-02-15 2013-06-10 Interconnect joint protective layer apparatus and method
US13/934,562 2013-07-03
US13/934,562 US9401308B2 (en) 2013-03-12 2013-07-03 Packaging devices, methods of manufacture thereof, and packaging methods
US13/939,966 US9287143B2 (en) 2012-01-12 2013-07-11 Apparatus for package reinforcement using molding underfill
US13/939,966 2013-07-11

Publications (1)

Publication Number Publication Date
DE102013109531A1 true DE102013109531A1 (en) 2014-07-03

Family

ID=50928565

Family Applications (1)

Application Number Title Priority Date Filing Date
DE201310109531 Pending DE102013109531A1 (en) 2012-01-12 2013-09-02 Apparatus useful as reinforced package comprises a package component, electrical connections, a device electrically coupled to electrical connections, a molding compound, and a molding underfill between the molding compound and the device

Country Status (1)

Country Link
DE (1) DE102013109531A1 (en)

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