DE102011084582B3 - Micromechanical sensor device, particularly micromechanical pressure sensors, microphones, acceleration sensors or optical sensors, has substrate, circuit chip fixed on substrate and mold package, in which circuit chip is packaged - Google Patents
Micromechanical sensor device, particularly micromechanical pressure sensors, microphones, acceleration sensors or optical sensors, has substrate, circuit chip fixed on substrate and mold package, in which circuit chip is packaged Download PDFInfo
- Publication number
- DE102011084582B3 DE102011084582B3 DE201110084582 DE102011084582A DE102011084582B3 DE 102011084582 B3 DE102011084582 B3 DE 102011084582B3 DE 201110084582 DE201110084582 DE 201110084582 DE 102011084582 A DE102011084582 A DE 102011084582A DE 102011084582 B3 DE102011084582 B3 DE 102011084582B3
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- Germany
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- circuit chip
- substrate
- chip
- sensor
- micromechanical
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
- B81C1/0023—Packaging together an electronic processing unit die and a micromechanical structure die
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/141—Monolithic housings, e.g. molded or one-piece housings
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
- B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
- B81C2201/0143—Focussed beam, i.e. laser, ion or e-beam
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/01—Packaging MEMS
- B81C2203/0136—Growing or depositing of a covering layer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
- G01L19/0627—Protection against aggressive medium in general
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/005—Electrostatic transducers using semiconductor materials
Abstract
Description
Die Erfindung betrifft eine mikromechanische Sensorvorrichtung und ein entsprechendes Herstellungsverfahren.The invention relates to a micromechanical sensor device and a corresponding manufacturing method.
Stand der TechnikState of the art
Obwohl auch beliebige mikromechanische Bauelemente anwendbar sind, werden die vorliegende Erfindung und die ihr zugrundeliegende Problematik anhand von mikromechanischen Drucksensoren bzw. Mikrofonen auf Siliziumbasis erläutert.Although any micromechanical components are applicable, the present invention and its underlying problem will be explained with reference to micromechanical pressure sensors or microphones based on silicon.
Gehäuse für mikromechanische Drucksensoren und Mikrofone benötigen einen offenen Zugang zu einem Erfassungsbereich des Sensorchips, wobei der Erfassungsbereich beispielsweise durch eine Membran gebildet ist. Eine mögliche Realisierung ist ein sogenanntes Premold-Gehäuse bzw. Mold-Premold-Gehäuse. Bei letzteren wird der ASIC-Schaltungschip übermoldet und zugleich eine Kavität beim Molden erzeugt. In die Kavität wird der mikromechanische Sensorchip eingesetzt. Diese Bauform lässt sich sowohl mit SOIC(Small Outline Integrated Circuit)- als auch mit LGA(Land Grid Array)-Verpackungen realisieren. Vorteilhaft am Mold-Premold-Gehäuse im Vergleich zum reinen Premold-Gehäuse ist, dass der ASIC-Schaltungschip übermoldet und somit besser vor mechanischen und Umwelteinflüssen geschützt ist. Daher wird bei Premold-Gehäusen oft Gel zum Schutz der freien Oberfläche des ASIC-Schaltungschips eingesetzt.Housings for micromechanical pressure sensors and microphones require open access to a detection area of the sensor chip, wherein the detection area is formed for example by a membrane. One possible realization is a so-called premold housing or mold-premold housing. In the case of the latter, the ASIC circuit chip is overmolded and, at the same time, a cavity is produced during molding. The micromechanical sensor chip is inserted into the cavity. This design can be realized with SOIC (Small Outline Integrated Circuit) as well as with LGA (Land Grid Array) packaging. An advantage of the Mold-Premold housing compared to the pure Premold housing is that the ASIC circuit chip is overmolded and thus better protected against mechanical and environmental influences. Therefore, in premold packages, gel is often used to protect the free surface of the ASIC circuit chip.
Die
Aus der Schrift
Die Schrift
Aus der Schrift
Die Aufgabe der vorliegenden Erfindung besteht darin, gegenüber den bekannten LGA-Mold-Premold-Gehäusen eine deutliche Verringerung des Footprints zu erreichen.The object of the present invention is to achieve a significant reduction of the footprint compared to the known LGA mold premold housings.
Offenbarung der ErfindungDisclosure of the invention
Die Erfindung schafft eine mikromechanische Sensorvorrichtung nach Anspruch 1 und ein entsprechendes Herstellungsverfahren nach Anspruch 6.The invention provides a micromechanical sensor device according to
Bevorzugte Weiterbildungen sind Gegenstand der jeweiligen Unteransprüche.Preferred developments are the subject of the respective subclaims.
Vorteile der ErfindungAdvantages of the invention
Die der vorliegenden Erfindung zugrunde liegende Idee beruht darin, dass nach Vorsehen der Moldverpackung mit der Kavität innerhalb der Kavität ein Durchgangsloch in der Moldverpackung mittels eines Lasers geschaffen wird, durch das eine elektrische Verbindung des Sensorchips geführt wird.The idea underlying the present invention is based on the fact that, after provision of the mold package with the cavity inside the cavity, a through hole is created in the mold package by means of a laser, through which an electrical connection of the sensor chip is guided.
Die erfindungsgemäße Vorgehensweise ermöglicht, den Kontaktbereich für die elektrische Verbindung, beispielsweise eine Bondverbindung oder eine Flip-Chip-Verbindung, zu öffnen. Flashfreiheit für die Weiterverarbeitung wird mit geeigneten Öffnungsverfahren, z. B. Lasern, erreicht.The procedure according to the invention makes it possible to open the contact region for the electrical connection, for example a bond connection or a flip-chip connection. Flash freedom for further processing is provided with suitable opening methods, eg. As lasers achieved.
Vorteilhafterweise ermöglicht die vorliegende Erfindung eine deutliche Verringerung des Footprints gegenüber bekannten LGA-Mold-Premold-Gehäusen. Damit verbunden ist eine Kostenreduktion.Advantageously, the present invention allows a significant reduction in footprint over known LGA mold premold packages. This is associated with a cost reduction.
Wird die elektrische Verbindung direkt vom Sensorchip zum ASIC-Schaltungschip geführt, so werden die Verbindungslängen vom Sensorchip zum ASIC-Schaltungschip signifikant kürzer als im Vergleich zum Standard-LGA-Prozess. Somit erfolgt eine Reduktion parasitärer Widerstände, Kapazitäten und Induktivitäten.If the electrical connection is made directly from the sensor chip to the ASIC circuit chip, the connection lengths from the sensor chip to the ASIC circuit chip are significantly shorter than in comparison to the standard LGA process. Thus, parasitic resistances, capacitances and inductances are reduced.
Das erfindungsgemäße Verfahren lässt sich mit einem relativ einfachen Moldwerkzeug realisieren, wobei die Erzeugung der Kavität und des Übermoldens des ASIC-Schaltungschips im gleichen Schritt erfolgt. Die Flash-Freiheit des Kontaktbereichs der elektrischen Verbindung wird durch die Kontrolle des Laserprozesses sichergestellt. The method according to the invention can be realized with a relatively simple mold tool, the generation of the cavity and overmolding of the ASIC circuit chip taking place in the same step. The flash freedom of the contact area of the electrical connection is ensured by the control of the laser process.
Kurze Beschreibung der ZeichnungenBrief description of the drawings
Weitere Merkmale und Vorteile der vorliegenden Erfindung werden nachfolgend anhand von Ausführungsformen mit Bezug auf die Figuren erläutert.Further features and advantages of the present invention will be explained below with reference to embodiments with reference to the figures.
Es zeigen:Show it:
Ausführungsformen der ErfindungEmbodiments of the invention
In den Figuren bezeichnen gleiche Bezugszeichen gleiche bzw. funktionsgleiche Elemente.In the figures, like reference numerals designate the same or functionally identical elements.
In
Gemäß
Anschließend erfolgt mit Bezug auf
Nach dem Moldprozess sind der ASIC-Schaltungschip
Wie in
Wie in
Wie in
Schließlich mit Bezug auf
Bei der zweiten Ausführungsform liegt der Kontaktbereich für den Anschluss des Sensorchips
Insbesondere wird nach Bereitstellen des Substrats
Mit Bezug auf
In der Kavität K', welche beim Ummolden gebildet wird, wird anschließend mit Bezug auf
Wie in
Wie in
Analog zu
Obwohl die vorliegende Erfindung anhand bevorzugter Ausführungsbeispiele beschrieben wurde, ist sie darauf nicht beschränkt. Insbesondere sind die genannten Materialien und Topologien nur beispielhaft und nicht auf die erläuterten Beispiele beschränkt.Although the present invention has been described in terms of preferred embodiments, it is not limited thereto. In particular, the materials and topologies mentioned are only examples and not limited to the illustrated examples.
Obwohl bei den oben beschriebenen Ausführungsformen die elektrische Verbindung des Sensorchips mit dem Substrat bzw. dem ASIC-Schaltungschip über Bondverbindungen realisiert wurde, ist es ebenfalls möglich, diese in Flip-Chip-Technologie oder mittels Lötbonds zu realisieren.Although in the embodiments described above, the electrical connection of the sensor chip to the substrate or the ASIC circuit chip has been realized via bonds, it is also possible to realize them in flip-chip technology or by means of solder bonds.
Obwohl vorstehend in Bezug auf einen Drucksensor beschrieben, lässt sich die vorliegende Erfindung u. a. auch für Mikrofone, Beschleunigungssensoren, optische Sensoren, Drehratensensoren usw. verwenden, welche einen externen Zugang zur Außenwelt benötigen, aber gegen Umwelteinflüsse geschützt sein müssen.Although described above with respect to a pressure sensor, the present invention can i. a. Also for microphones, acceleration sensors, optical sensors, gyroscopes, etc., which need external access to the outside world, but must be protected against environmental influences.
Claims (8)
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DE201110084582 DE102011084582B3 (en) | 2011-10-17 | 2011-10-17 | Micromechanical sensor device, particularly micromechanical pressure sensors, microphones, acceleration sensors or optical sensors, has substrate, circuit chip fixed on substrate and mold package, in which circuit chip is packaged |
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DE201110084582 DE102011084582B3 (en) | 2011-10-17 | 2011-10-17 | Micromechanical sensor device, particularly micromechanical pressure sensors, microphones, acceleration sensors or optical sensors, has substrate, circuit chip fixed on substrate and mold package, in which circuit chip is packaged |
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Cited By (12)
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WO2015180859A1 (en) | 2014-05-27 | 2015-12-03 | Robert Bosch Gmbh | Method for producing a micromechanical component and a correspondingly produced micromechanical component |
US9539814B2 (en) | 2013-02-28 | 2017-01-10 | Hewlett-Packard Development Company, L.P. | Molded printhead |
DE102015223399A1 (en) * | 2015-11-26 | 2017-06-01 | Robert Bosch Gmbh | Method for packaging at least one semiconductor device and semiconductor device |
US9751319B2 (en) | 2013-02-28 | 2017-09-05 | Hewlett-Packard Development Company, L.P. | Printing fluid cartridge |
DE102016210940A1 (en) | 2016-06-20 | 2017-12-21 | Robert Bosch Gmbh | Arrangement with a carrier and a housing body, and method for producing a device with a component |
CN107539943A (en) * | 2016-06-23 | 2018-01-05 | 黄卫东 | The hybrid package structure and its method for packing of mems chip and IC chip |
DE102017202023A1 (en) | 2017-02-09 | 2018-08-09 | Robert Bosch Gmbh | Micromechanical sensor device with integrated housing seal, micromechanical sensor arrangement and corresponding manufacturing method |
CN108996467A (en) * | 2018-08-08 | 2018-12-14 | 宁波琻捷电子科技有限公司 | Sensor-packaging structure and method |
DE102019201224A1 (en) | 2019-01-31 | 2020-08-06 | Robert Bosch Gmbh | Micromechanical sensor device and corresponding manufacturing method |
US11292257B2 (en) | 2013-03-20 | 2022-04-05 | Hewlett-Packard Development Company, L.P. | Molded die slivers with exposed front and back surfaces |
US11426900B2 (en) | 2013-02-28 | 2022-08-30 | Hewlett-Packard Development Company, L.P. | Molding a fluid flow structure |
WO2023169904A1 (en) | 2022-03-08 | 2023-09-14 | Robert Bosch Gmbh | Micromechanical component and corresponding production method |
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Cited By (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10189265B2 (en) | 2013-02-28 | 2019-01-29 | Hewlett-Packard Development Company, L.P. | Printing fluid cartridge |
US9539814B2 (en) | 2013-02-28 | 2017-01-10 | Hewlett-Packard Development Company, L.P. | Molded printhead |
US11541659B2 (en) | 2013-02-28 | 2023-01-03 | Hewlett-Packard Development Company, L.P. | Molded printhead |
US9751319B2 (en) | 2013-02-28 | 2017-09-05 | Hewlett-Packard Development Company, L.P. | Printing fluid cartridge |
US11426900B2 (en) | 2013-02-28 | 2022-08-30 | Hewlett-Packard Development Company, L.P. | Molding a fluid flow structure |
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DE102015223399B4 (en) * | 2015-11-26 | 2018-11-08 | Robert Bosch Gmbh | Method for packaging at least one semiconductor device and semiconductor device |
DE102015223399A1 (en) * | 2015-11-26 | 2017-06-01 | Robert Bosch Gmbh | Method for packaging at least one semiconductor device and semiconductor device |
DE102016210940A1 (en) | 2016-06-20 | 2017-12-21 | Robert Bosch Gmbh | Arrangement with a carrier and a housing body, and method for producing a device with a component |
WO2017220319A1 (en) | 2016-06-20 | 2017-12-28 | Robert Bosch Gmbh | Arrangement having a carrier and having a housing body, and method for producing an arrangement having a component |
CN107539943A (en) * | 2016-06-23 | 2018-01-05 | 黄卫东 | The hybrid package structure and its method for packing of mems chip and IC chip |
DE102017202023A1 (en) | 2017-02-09 | 2018-08-09 | Robert Bosch Gmbh | Micromechanical sensor device with integrated housing seal, micromechanical sensor arrangement and corresponding manufacturing method |
US11085846B2 (en) | 2017-02-09 | 2021-08-10 | Robert Bosch Gmbh | Micromechanical sensor device with integrated housing seal, micromechanical sensor assembly, and corresponding manufacturing method |
DE102017202023B4 (en) * | 2017-02-09 | 2020-09-03 | Robert Bosch Gmbh | Micromechanical sensor device with integrated housing seal, micromechanical sensor arrangement and corresponding manufacturing process |
WO2018145950A1 (en) | 2017-02-09 | 2018-08-16 | Robert Bosch Gmbh | Micromechanical sensor device with integrated housing seal, micromechanical sensor assembly, and corresponding production method |
CN108996467A (en) * | 2018-08-08 | 2018-12-14 | 宁波琻捷电子科技有限公司 | Sensor-packaging structure and method |
WO2020156852A1 (en) | 2019-01-31 | 2020-08-06 | Robert Bosch Gmbh | Micromechanical sensor device and corresponding production method |
DE102019201224A1 (en) | 2019-01-31 | 2020-08-06 | Robert Bosch Gmbh | Micromechanical sensor device and corresponding manufacturing method |
US11906383B2 (en) | 2019-01-31 | 2024-02-20 | Robert Bosch Gmbh | Micromechanical sensor device having an ASIC chip integrated into a capping unit and corresponding manufacturing method |
WO2023169904A1 (en) | 2022-03-08 | 2023-09-14 | Robert Bosch Gmbh | Micromechanical component and corresponding production method |
DE102022202299A1 (en) | 2022-03-08 | 2023-09-14 | Robert Bosch Gesellschaft mit beschränkter Haftung | Micromechanical component and corresponding manufacturing process |
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