DE102011003153A1 - Leadless package with a conductive coating for electrical shielding - Google Patents

Leadless package with a conductive coating for electrical shielding

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Publication number
DE102011003153A1
DE102011003153A1 DE102011003153A DE102011003153A DE102011003153A1 DE 102011003153 A1 DE102011003153 A1 DE 102011003153A1 DE 102011003153 A DE102011003153 A DE 102011003153A DE 102011003153 A DE102011003153 A DE 102011003153A DE 102011003153 A1 DE102011003153 A1 DE 102011003153A1
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Germany
Prior art keywords
package
coating
provided
according
example
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102011003153A
Other languages
German (de)
Inventor
Florian Grabmaier
Uwe Hansen
Eric Ochs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE102011003153A priority Critical patent/DE102011003153A1/en
Publication of DE102011003153A1 publication Critical patent/DE102011003153A1/en
Application status is Withdrawn legal-status Critical

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/552Protection against radiation, e.g. light or electromagnetic waves
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93Batch processes
    • H01L24/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/10Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
    • H01L2225/10All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices having separate containers
    • H01L2225/1005All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1017All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1023All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
    • H01L2225/10All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices having separate containers
    • H01L2225/1005All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1041Special adaptations for top connections of the lowermost container, e.g. redistribution layer, integral interposer
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2225/00Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00
    • H01L2225/10All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices having separate containers
    • H01L2225/1005All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047Details of electrical connections between containers
    • H01L2225/1058Bump or bump-like electrical connections, e.g. balls, pillars, posts
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • H01L2924/141Analog devices
    • H01L2924/142HF devices
    • H01L2924/1421RF devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151Die mounting substrate
    • H01L2924/153Connection portion
    • H01L2924/1531Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15313Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431Details of mounted components
    • H05K2201/10439Position of a single component
    • H05K2201/10454Vertically mounted
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product
    • Y02P70/60Greenhouse gas [GHG] capture, heat recovery or other energy efficient measures relating to production or assembly of electric or electronic components or products, e.g. motor control
    • Y02P70/613Greenhouse gas [GHG] capture, heat recovery or other energy efficient measures relating to production or assembly of electric or electronic components or products, e.g. motor control involving the assembly of several electronic elements

Abstract

The invention relates to packages in the electronics sector with electrical shielding, and in particular leadless packages and methods for their production. A leadless package (100) according to the invention comprises a conductive coating (116) for electrical shielding, wherein the coating (116) is structured in such a way that at least one electrical contact (120) is formed on one outer side of the package (100) by the coating (116). provided.

Description

  • State of the art
  • The invention relates to packages in the electronics sector with electrical shielding, and in particular leadless packages and methods for their production.
  • In the field of electronics, in particular in the field of integrated circuits, a "package" is understood to mean a constructive housing design for accommodating an IC ("integrated circuit"). For a long time, the use of packages with pins or leads ("legs") has been known for this purpose, for example in the form of SOICs ("Small Outline Integrated Circuits"). In such packages, a substrate as a carrier of circuit elements, for example, edged or "molded" in plastic at least on its upper side. Molded packages are highly standardized and therefore cost-effective to manufacture.
  • In recent times leadless packages are increasingly prevalent, i. H. Packages without pins or "little legs". Known designs are QFN ("Quad Flat No-lead") or LGA ("Leadless Grid Array" or "Land Grid Array"). Such packages are smaller and therefore generally used for limited-bay applications such as consumer applications or sensor applications in the automotive sector.
  • In many cases there is a requirement to protect a package. For example, sensor applications are often sensitive to EMC ("Electromagnetic Compatibility") - relevant radiation. There are also RF ("Radio Frequency") applications that have high levels of radiation and must also be shielded to avoid interference with the environment. A leadframe-based package with legs can be provided with an EMC shield by means of an inverted leadframe. For leadless packages, such a possibility does not exist.
  • The state of the art for an EMC shield of an LGA is a metal cap, which is soldered or glued on the substrate instead of the mold. However, the corresponding manufacturing process is expensive. In addition, there is the risk of Substratdurchwölbung with large packages, because a stabilization by the Moldkörper deleted.
  • Another known embodiment comprises a metal grid, which is also fitted to the substrate and then eingemolded. This variant is also comparatively expensive and requires additional space in the package for the soldering areas for attachment of the screen.
  • In another known method, a metal coating is applied to five sides of a Moldkörpers, only the side with the Kontaktlands remains free. This design is created by a "half cut" when separating the LGAs in series production. Here is sawed through the mold body to the substrate, d. H. it is exposed in the Sägestraße the top metal layer. Then the coating is applied and can be connected via the exposed metal to ground (GND). However, with this method, the footprint changes compared to a conventional LGA.
  • From the US 5,557,142 Furthermore, a shielded package is known which has a metallic coating surrounding a circuit embedded in a mold body. Due to the fact that the coating partially covers side surfaces of the molded body and the substrate and the underside of the substrate, the coating can be electrically connected to the semiconductor circuit.
  • US 6,998,532 B2 also discloses an electronic component on a substrate embedded in a resinous resin. On the resin body, a thin metal layer for electromagnetic shielding is shown. The metal layer completely surrounds the resin body and the side surfaces of the substrate.
  • From the US 6,566,596 B1 Various approaches for magnetic and / or electrical shielding of integrated circuits are known. Various layers of shields with different functions are provided, for example mechanical, magnetic and / or electrical shielding. The layers are provided in a sandwich construction. The shield surrounds circuit, bonding wires and / or contacts as completely as possible. Unshielded areas may be due to air bubbles, faults in the shielding or due to the design of the shielding. However, the circuit should be surrounded as completely as possible to maximize the shielding effect.
  • The examples discussed above represent different approaches for the shielding of leadless packages. In this case, contacts of the package are always provided only on the unshielded, ie exposed underside of the package, for example over land on the underside of an LGA. A greater flexibility in the Ankontaktierung, as for example for MIDs ("Molded Interconnect Devices" or injection molded circuit board) is known, the generally three-dimensional structure and with corresponding Ankontaktierungsmöglichkeiten Shielded leadless packages do not seem to be possible because the shield must surround the package as completely as possible and thus shield it.
  • Disclosure of the invention
  • According to the invention, a leadless package with a conductive coating for electrical shielding is proposed, wherein the coating is structured in such a way that at least one electrical contact is provided by the coating on an outer side of the package. The package may be, for example, an LGA or eWLP ("embedded wafer level package").
  • The contact then serves to electrically contact the package from the outside. The structured coating may contact at least one contact, for example a land of an LGA, on a bottom of the package. In certain embodiments of a package according to the invention, the at least one electrical contact is then provided on a side surface of the package. Here, the package may be provided for vertical mounting on a printed circuit board.
  • Additionally or alternatively, the at least one electrical contact may be provided on an upper side of the package. Thus, the electrical contact on the top of the package, for example, be performed as a bondable pad. For a package-on-package component having an upper and a lower package, the lower package may be implemented with electrical contacts on top of the package, as outlined above.
  • Furthermore, a use of a package according to the invention or a package-on-package component as outlined above in the automotive field is proposed. For example, the package may involve sensor applications such as acceleration or steering rate sensors, or RF applications.
  • According to the invention, a method is also proposed for producing a leadless package with a conductive coating for electrical shielding. The method comprises a step by which the coating is structured in such a way that at least one electrical contact is provided by the coating on an outer side of the package. The structuring can be produced for example by means of laser processing and / or masking.
  • Advantages of the invention
  • The invention is based, inter alia, on the idea of departing from the hitherto prevailing approach in the prior art of covering a leadless package as completely as possible by shielding coating in that connections or contact connections at arbitrary locations on the surface are formed by structures formed by the coating. Outside) of the package are possible.
  • The coating thus serves, in addition to the electrical, magnetic and / or mechanical shielding, also the electrical conduction, for example from a land or other contact surface of an embedded circuit to a contact surface formed by the coating elsewhere on the underside, side surface or top side of the package. In this case, the shielding effect of the coating can be maintained as much as necessary by introducing correspondingly narrow or thin cuts, grooves, grooves or other depressions for structuring into the coating.
  • The inventive provision of Umkontaktierungen or rewiring on the package thus a shield with respect to EMC radiation as well as radiation is maintained in RF applications. Moreover, the invention does not result in any additional space requirement in the package (eg solder joints) or around the package, ie. H. the package outline (eg footprint) remains unchanged from a standard package such as a standard IGA. Thus, standardized handling and further processing, installation, etc. of a package according to the invention are readily possible.
  • The introduction of structures into the coating can be introduced as an additional, downstream step in a standard process for the production of packages. Thus, there are no additional costs for the conversion of the process, the production facilities, etc.
  • To protect against environmental influences, an additional outer protective layer such as silicone can be applied. It should be noted that instead of as previously not or not only, for example, the underside of a package must be released for contacting (or about the lands of a LGAs must be released for electrical contact), but that now additionally or alternatively by the coating provided contact surfaces are released.
  • The method according to the invention easily opens up a far more flexible use of leadless packages than hitherto possible. For example, packages for a side and / or top contact, for a vertical structure, for use in package on Package components etc. are easily provided. The flexibility of packages according to the invention is thus comparable to that of MIDs.
  • The invention can be used for all applications that are implemented in the form of a leadless (Mold) Package and sensitive to EMC radiation, for example, for acceleration or rotation rate sensors. Furthermore, the invention can be used for applications that emit electromagnetic interference signals, such as RF components for applications such as Bluetooth, WiFi, RFID, etc.
  • Brief description of the drawings
  • Further aspects and advantages of the invention will now be described in more detail with reference to the accompanying figures. Hereby shows:
  • characters
  • 1A - 1C a first embodiment of a package according to the invention in side view, in cross-section and in plan view;
  • 2 a package-on-package component according to the invention;
  • 3A a second embodiment of a package according to the invention;
  • 3B the package of the invention 3A in mounting on a printed circuit board; and
  • 4 in the form of a flow chart, an illustration of a manufacturing method for a package according to the invention.
  • Embodiments of the invention
  • In the 1A - 1C is a first embodiment of a package according to the invention 100 illustrated. 1A shows the package 100 in a side view, 1B on average and 1C in a top view. The package 100 has a substrate 102 and a Moldkörper 104 on, in the on the substrate 102 embedded circuits (not shown) are embedded. On the bottom 106 of the substrate 102 lie a plurality Lands 108 before, the electrical contacting of the package 100 serve (ie the package 100 points to its underside 106 a so-called metal level). As far as described so far, this is the package 100 in this respect, a known from the prior art LGA with particular standardized dimensions.
  • The LGA 102 . 104 is on side surfaces 110 and a top 112 with a coating 114 Mistake. The coating is electrically conductive and its composition comprises for this purpose, for example, at least one metal such as aluminum, silver or nickel. The bottom 106 of the package may be left blank, for example, insofar as the existing Kontaktland of the package are used directly for external Ankontaktierung.
  • The coating 114 can be electrically connected to ground (GND). For this purpose, the coating is carried out on GND tracks of the LGA exposed laterally on the package edge on an upper side of the substrate 102 or on the bottom 106 electrically connected. The substrate 102 For this purpose, for example, have laterally outstanding copper conductor tracks (not shown). Alternatively, a contacting of the coating 114 also via "through mold vias" (not shown), which are applied in the mold body, for example by means of a laser and a metal layer on the substrate 102 to contact.
  • As in the 1A . 1C Shown is the coating 114 not from a coherent coating or the package 100 completely or seamlessly surrounding (unstructured) metal layer. Instead, a plurality of individual structures that are not connected to one another or separate from one another are involved 116 educated. The structures 116 For example, they may be patterned out of a contiguous metal layer by laser processing or etching (masking). Each of the structures 116 is guided around the package in the manner of a three-dimensional track and thus allows rewiring on the package, more specifically on the package exterior, as heretofore known only by MID or comparable three-dimensional circuit types. In the example of the package 100 contact the structures 116 one country each 108 at the package bottom 106 , Every structure 116 then passes over a side area 110 of the package 100 (as in 1A particularly clearly shown) with a vertical path 118 to the top 112 of the package. On the top 112 form the structures 116 then contact surfaces 120 ,
  • As in particular from the 1A . 1C visible, cover the structures 116 of the coating 114 outsides 110 . 112 of the package 100 only partially. Accordingly, a shielding effect of the coating 114 limited; this is limited in the in the 1A - 1C shown embodiment mainly on a shield of the side surfaces 110 of the package 100 , However, it will be readily apparent to those skilled in the art that modified structures 112 can be provided to meet requirements of stronger shielding of the package 100 for example on the top 116 to suffice. This can be done by using the contact surfaces 120 extended and the Interspaces (grooves, notches, grooves or grooves) 122 between the structures 112 be formed narrower and formed in extreme cases as closely as technically feasible and with an electrical insulation of the individual structures used as connecting lines 116 compatible. In general, any shapes of structuring 116 possible and apparent to those skilled in the art.
  • The structures 116 contact the package 100 the Lands 108 at the package bottom, around the electrical connections on top 112 of the package 100 to relocate. An application for this embodiment is in 2 shown schematically. Shown here is a package-on-package component 200 that the lower package 100 of the 1A - 1C and an upper package 202 includes. While the package 100 by means of the discussed structured coating 110 (partially) shielded, the package features 202 no electrical shielding, but only a mechanical protective layer 204 , Weitherin serve bumps 206 the electrical contact between the upper 202 and lower 100 Package. The bumps 206 For example, during the manufacture of the package 202 at the Lands 208 of the package.
  • Characterized in that according to the invention by means of the coating 110 Contact surfaces or pads 118 on top of the package 100 be provided, resulting in an easy-to-implement option for arranging a plurality of packages on top of each other (Package-on-Package). Referring again to the 1A - 1C it is noted that for this purpose at least the contact surfaces 120 the coating structures 116 in the form of bondable pads, for example, can be performed with gold.
  • 3A shows a second embodiment 300 an inventively designed package in a side view. To get an LGA with substrate 302 and moldings 304 is a coating 306 applied, which consists of individual structures 308 consists. These renegotiate Lands 310 on a bottom of the package 300 so that contact surfaces 312 on the website 314 of the package. A top 316 of the package 300 can remain free depending on the desired shielding effect or from the top to the top 314 continued structures 306 . 308 be covered (except for electrically insulating spaces between the structures 308 ).
  • The contact surfaces or pads 312 on the website 314 serve for electrical contacting of the package 300 with a circuit board 320 as in 3B shown. The side pads 312 Be about solder joints 322 with the circuit board 320 via a solder pad provided there 324 contacted. That way, the package can 300 installed vertically. Thus, the embodiment of the 3A . 3B with the relocation of the connection points from the Lands 310 on the lateral contact surfaces 312 by means of the electrical shielding 306 the greater flexibility afforded by the invention in the installation of leadless packages.
  • The above with reference to the 1 to 3B described package of the invention may also be provided with an additional applied protective coating. As a protective coating is a material such as silicone or other the outer sides of the package protective materials in question.
  • In 4 is an example in the form of a flow chart 400 a manufacturing method for packages according to the invention such as in the 1 and 3 illustrated illustrated. Basically, the process is used 400 the production of a leadless package with a conductive coating for electrical shielding ( 402 ). In step 404 previously mass-produced packages are isolated in whole or in part, for example by sawing.
  • In step 406 For example, a coating is applied to an outside of a package (for example, a mold package). The coating can be done for example by spraying dissolved in solvents metal flakes, or by galvanic growth on the Moldkörper. The coating material should have good conductivity and be non-corrosive or self-passivating (such as aluminum through alumina layer). For example, a metal layer may be between 10 microns (μm) and 40 μm thick. Such thicknesses are usually sufficient for shielding applications in the automotive sector, for example.
  • In step 408 the applied coating is structured in such a way that at least one electrical contact is provided by the coating on an outer side of the package. For this purpose, the applied coating can be structured with laser processing, for example laser cutting or laser ablation. An additional or alternative possibility is to provide corresponding structures in the coating on the outside of the package by the application of etching lacquer over a mask and subsequent etching.
  • In an (optional) step 410 On the outside of the package, ie on the structured coating and optionally the gaps or the exposed molding and / or substrate, a protective layer such as silicone may be applied to the coating or package, for example against abrasion, damage during installation or the like . to protect. The protective layer may additionally or alternatively serve as a passivation layer. The As a rule, contacts provided by the structured coating should remain free (or be uncovered downstream). In another embodiment of a method according to the invention, a protective layer can also be applied before the structuring of the coating. The structuring of the coating would then ablate or remove by means of laser processing at the designated areas protective layer and coating, for example.
  • Through the steps 406 - 410 the footprint of an isolated package no longer changes. The application and structuring of the coating in the steps 406 and 408 does not require a modified outline of the packages in comparison to known LGAs or other mold packages.
  • With step 412 the production of a package according to the invention is completed. Optionally, another method of making a package-on-package component, such as that described in U.S. Pat 2 shown component 200 connect at least two packages. One or both of the packages was doing after the procedure 400 produced.
  • The invention is not limited to the embodiments described herein and the aspects highlighted therein; Rather, within the scope given by the appended claims a variety of modifications are possible, which are within the scope of expert action.
  • QUOTES INCLUDE IN THE DESCRIPTION
  • This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
  • Cited patent literature
    • US 7451539 B2 [0008]
    • US 7576415 B2 [0008]
    • US 7342303 B1 [0008]
    • US 5557142 [0009]
    • US 6998532 B2 [0010]
    • US 6566596 B1 [0011]

Claims (11)

  1. Leadless package with a conductive coating for electrical shielding, whereby the coating ( 114 ) is structured such that by the coating ( 116 ) on an outside ( 112 ) of the package ( 100 ) at least one electrical contact ( 120 ) provided.
  2. Package according to claim 1, wherein the structured coating ( 116 ) at least one contact ( 108 ) on a lower side ( 106 ) of the package ( 100 ) contacted.
  3. Package according to claim 1 or 2, wherein the at least one electrical contact ( 312 ) on a side surface ( 314 ) of the package ( 300 ) provided.
  4. Package according to claim 3, wherein the package ( 300 ) for vertical mounting on a printed circuit board ( 320 ) is provided.
  5. Package according to claim 1 or 2, wherein the at least one electrical contact ( 120 ) on a top side ( 112 ) of the package ( 100 ) provided.
  6. Package according to claim 5, wherein the at least one electrical contact ( 120 ) on the top ( 112 ) of the package ( 300 ) is designed as a bondable pad.
  7. Package according to one of the preceding claims, wherein the package is provided with a protective coating.
  8. Package-on-Package Component ( 200 ) with a lower package ( 100 ) according to claims 1 and 6.
  9. Use of an object ( 100 . 200 . 300 ) according to one of the preceding claims in the automotive sector.
  10. Method for producing a leadless package ( 100 . 300 ) with a conductive coating ( 114 . 306 ) for electrical shielding, with a method step ( 408 ), through which the coating ( 114 . 306 ) is structured in such a way that by coating on an outer side ( 112 . 314 ) of the package ( 100 . 300 ) at least one electrical contact ( 120 . 312 ) provided.
  11. The method of claim 10, wherein the structuring is produced by means of laser processing and / or masking.
DE102011003153A 2011-01-26 2011-01-26 Leadless package with a conductive coating for electrical shielding Withdrawn DE102011003153A1 (en)

Priority Applications (1)

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DE102011003153A DE102011003153A1 (en) 2011-01-26 2011-01-26 Leadless package with a conductive coating for electrical shielding

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DE102011003153A DE102011003153A1 (en) 2011-01-26 2011-01-26 Leadless package with a conductive coating for electrical shielding
PCT/EP2012/050607 WO2012101001A1 (en) 2011-01-26 2012-01-17 Leadless package having a conducting coating for electrically shielding
TW101102363A TW201246504A (en) 2011-01-26 2012-01-20 Leadless package having a conducting coating for electrically shielding

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US6566596B1 (en) 1997-12-29 2003-05-20 Intel Corporation Magnetic and electric shielding of on-board devices
US6998532B2 (en) 2002-12-24 2006-02-14 Matsushita Electric Industrial Co., Ltd. Electronic component-built-in module
DE102006030805A1 (en) * 2006-06-30 2008-01-03 Continental Teves Ag & Co. Ohg Housing for receiving electronics, particularly integrated chips with sensors, particularly, acceleration sensors, has metallized cover in addition to existing cover, where electrically conducting cover is attached to earth contact
DE102006033319A1 (en) * 2006-07-17 2008-01-24 Infineon Technologies Ag Semiconductor chip semiconductor device with a semiconductor chip and method for producing the same
US7342303B1 (en) 2006-02-28 2008-03-11 Amkor Technology, Inc. Semiconductor device having RF shielding and method therefor
DE102006044836A1 (en) * 2006-09-22 2008-04-03 Infineon Technologies Ag Shielding unit and heat dissipation unit combined module, has shielding unit provided on principal surface of high frequency chip, by bond and comprising welding contact, where shielding unit is arranged in vicinity of chip
US7451539B2 (en) 2005-08-08 2008-11-18 Rf Micro Devices, Inc. Method of making a conformal electromagnetic interference shield
US7576415B2 (en) 2007-06-15 2009-08-18 Advanced Semiconductor Engineering, Inc. EMI shielded semiconductor package

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US7928538B2 (en) * 2006-10-04 2011-04-19 Texas Instruments Incorporated Package-level electromagnetic interference shielding
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Publication number Priority date Publication date Assignee Title
US5557142A (en) 1991-02-04 1996-09-17 Motorola, Inc. Shielded semiconductor device package
US5668406A (en) * 1994-05-31 1997-09-16 Nec Corporation Semiconductor device having shielding structure made of electrically conductive paste
US6566596B1 (en) 1997-12-29 2003-05-20 Intel Corporation Magnetic and electric shielding of on-board devices
US6998532B2 (en) 2002-12-24 2006-02-14 Matsushita Electric Industrial Co., Ltd. Electronic component-built-in module
US7451539B2 (en) 2005-08-08 2008-11-18 Rf Micro Devices, Inc. Method of making a conformal electromagnetic interference shield
US7342303B1 (en) 2006-02-28 2008-03-11 Amkor Technology, Inc. Semiconductor device having RF shielding and method therefor
DE102006030805A1 (en) * 2006-06-30 2008-01-03 Continental Teves Ag & Co. Ohg Housing for receiving electronics, particularly integrated chips with sensors, particularly, acceleration sensors, has metallized cover in addition to existing cover, where electrically conducting cover is attached to earth contact
DE102006033319A1 (en) * 2006-07-17 2008-01-24 Infineon Technologies Ag Semiconductor chip semiconductor device with a semiconductor chip and method for producing the same
DE102006044836A1 (en) * 2006-09-22 2008-04-03 Infineon Technologies Ag Shielding unit and heat dissipation unit combined module, has shielding unit provided on principal surface of high frequency chip, by bond and comprising welding contact, where shielding unit is arranged in vicinity of chip
US7576415B2 (en) 2007-06-15 2009-08-18 Advanced Semiconductor Engineering, Inc. EMI shielded semiconductor package

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WO2012101001A1 (en) 2012-08-02

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