DE102010042526A1 - contact element - Google Patents

contact element Download PDF

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Publication number
DE102010042526A1
DE102010042526A1 DE102010042526A DE102010042526A DE102010042526A1 DE 102010042526 A1 DE102010042526 A1 DE 102010042526A1 DE 102010042526 A DE102010042526 A DE 102010042526A DE 102010042526 A DE102010042526 A DE 102010042526A DE 102010042526 A1 DE102010042526 A1 DE 102010042526A1
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DE
Germany
Prior art keywords
conductive layer
contact element
layer
copper
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE102010042526A
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German (de)
Inventor
Dr. Tranitz Hans-Peter
Jan Keller
Frank Uibel
Heike Woldt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schempp und Decker Praezisionsteile und Oberflaechentechnik GmbH
Continental Automotive GmbH
Original Assignee
Schempp und Decker Praezisionsteile und Oberflaechentechnik GmbH
Continental Automotive GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schempp und Decker Praezisionsteile und Oberflaechentechnik GmbH, Continental Automotive GmbH filed Critical Schempp und Decker Praezisionsteile und Oberflaechentechnik GmbH
Priority to DE102010042526A priority Critical patent/DE102010042526A1/en
Priority to PCT/EP2011/068000 priority patent/WO2012049297A1/en
Publication of DE102010042526A1 publication Critical patent/DE102010042526A1/en
Ceased legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H01R13/035—Plated dielectric material

Abstract

Die Erfindung betrifft ein Kontaktelement aus einem Basismaterial mit wenigstens einer darauf aufgebrachten leitfähigen Schicht, die aus Indium oder aus Indium mit einer Beimischung oder Legierung von wenigstens einem der Elemente aus der Gruppe von Elementen enthaltend Kupfer, Silber, Gold, Bismut, Nickel, Antimon, Palladium, Eisen, Kohlenstoff und Phosphor besteht.The invention relates to a contact element made of a base material with at least one conductive layer applied thereon, made of indium or indium with an admixture or alloy of at least one of the elements from the group of elements containing copper, silver, gold, bismuth, nickel, antimony Palladium, iron, carbon and phosphorus exist.

Description

In elektrischen und elektronischen Apparaten und Geräten müssen häufig elektrische Verbindungen zwischen verschiedenen elektrischen und/oder elektronischen Bestandteilen der Apparate und Geräte hergestellt werden, welche in vielen Fällen aus dauerhaften Lötverbindungen bestehen.In electrical and electronic apparatus and devices, electrical connections between various electrical and / or electronic components of the apparatus and devices often have to be made, which in many cases consist of permanent solder joints.

Es wird jedoch zunehmend üblich, Steckverbindungen vorzusehen, wobei insbesondere bei der Verbindung von elektrischen und/oder elektronischen Bauteilen mit Leiterplatten Steckverbindungen mittels Einpresstechnik verwendet werden. Hierbei wird ein vorzugsweise elastischer Einpressstift in eine Bohrung der Leiterplatte eingepresst. Abhängig von den verwendeten Materialien und der aufzubringenden Einpresskraft werden zuverlässige elektrische Verbindungen geschaffen. Sowohl der Einpressstift als auch die diesen aufnehmende Öffnung bzw. Buchse müssen mit einem geeigneten elektrisch leitfähigen Material beschichtet sein, so dass beim Einpressen bzw. beim Einstecken ein zuverlässiger und beständiger elektrischer Kontakt zustande kommt. Als Kontaktelemente kommen unter anderem Einpresszonen, Steckkontakte, Schneid-Klemm-Kontakte (IDC) und Crimp-Kontakte in Frage.However, it is becoming increasingly common to provide connectors, in particular in the connection of electrical and / or electronic components with printed circuit boards plug-in connections are used by press-fitting. In this case, a preferably elastic press-fit pin is pressed into a bore of the printed circuit board. Depending on the materials used and the applied pressing force reliable electrical connections are created. Both the press-fit pin and the opening or socket receiving it must be coated with a suitable electrically conductive material, so that a reliable and stable electrical contact is achieved during insertion or insertion. Suitable contact elements include press-in zones, plug contacts, insulation displacement contacts (IDC) and crimp contacts.

Es war und ist teilweise immer noch üblich, für die Oberflächenbeschichtungen Zinn/Blei-haltige Materialien zu verwenden, da diese einerseits ausreichend weich sind, um eine gute Verbindung der Kontaktelemente zu gewährleisten und andererseits aufgrund des Bleigehalts eine Whiskerbildung des Zinns zu verhindern. Allerdings muss aufgrund gesetzlicher Vorgaben der Bleigehalt verringert oder gar völlig beseitigt werden. Durch den dann hohen Zinnanteil besteht jedoch die hohe Gefahr von Whiskerbildung, die das Problem von Kurzschlüssen mit sich bringt.It has been and still is quite common to use tin / lead-containing materials for the surface coatings because they are sufficiently soft to ensure good bonding of the contact elements and to prevent whisking of the tin due to the lead content. However, due to legal requirements, the lead content must be reduced or even completely eliminated. Due to the high tin content then there is a high risk of whisker formation, which brings the problem of short circuits with it.

Die DE 10 2007 047 007 A1 schlägt zur Lösung dieses Problems ein elektrisches Kontaktelement und ein Verfahren zum Herstellen derselben vor, bei dem als äußerste Schicht eines Schichtaufbaus bei einem Kontaktelement eine Legierung aus Zinn und wenigstens einem weiteren Metall aus einer Gruppe von Metallen verwendet wird. Aufgrund des immer noch vorhandenen reinen Zinns im Gefüge bleibt jedoch die Gefahr der Whiskerbildung erhalten.The DE 10 2007 047 007 A1 proposes to solve this problem an electrical contact element and a method for producing the same, in which an alloy of tin and at least one other metal from a group of metals is used as the outermost layer of a layer structure in a contact element. Due to the still existing pure tin in the structure, however, the risk of whisker formation is retained.

Die Aufgabe vorliegender Erfindung ist es daher, ein Kontaktelement anzugeben, bei dem die Gefahr von Whiskerbildung weitgehend beseitigt ist.The object of the present invention is therefore to provide a contact element in which the risk of whisker formation is largely eliminated.

Die Aufgabe wird gelöst durch ein Kontaktelement aus einem Basismaterial mit wenigstens einer darauf aufgebrachten leitfähigen Schicht, wobei als leitfähige Schicht oder einer dieser Schichten eine Schicht aus Indium aufgebracht ist. Vorzugsweise wird dabei reines Indium galvanisch aufgebracht, wobei unter reinem Indium auch Indium mit technologisch bedingten Verunreinigungen verstanden werden soll.The object is achieved by a contact element made of a base material with at least one conductive layer applied thereto, wherein a layer of indium is applied as the conductive layer or one of these layers. In this case, pure indium is preferably applied by electroplating, where indium with technologically determined impurities is to be understood as pure indium.

Die Aufgabe wird auch gelöst durch ein Kontaktelement aus einem Basismaterial mit wenigstens einer darauf aufgebrachten leitfähigen Schicht, wobei als leitfähige Schicht oder eine dieser Schichten eine Schicht aus Indium mit einer Beimischung oder Legierung von wenigstens einem der Elemente aus der Gruppe von Elementen enthaltend Kupfer, Silber, Gold, Bismut, Nickel, Antimon, Palladium, Eisen, Kohlenstoff oder Phosphor aufgebracht ist. Die Mischung bzw. Legierung kann dabei bereits vor dem Aufbringen der Schicht erfolgen, jedoch auch durch Aufbringen der Metallschichten nacheinander und nachträglichem Auflegieren beispielsweise durch eine Wärmebehandlung.The object is also achieved by a contact element made of a base material having at least one conductive layer applied thereto, wherein as the conductive layer or one of these layers is a layer of indium with an admixture or alloy of at least one of the elements from the group of elements containing copper, silver , Gold, bismuth, nickel, antimony, palladium, iron, carbon or phosphorus is applied. The mixture or alloy can be carried out before the application of the layer, but also by applying the metal layers in succession and subsequent alloying, for example by a heat treatment.

Durch die erfindungsgemäßen Kontaktelemente ist eine potentielle Lösung zu der Forderung nach Bleifreiheit der „End of Life Vehicle Directive”, 2000/53/EC für „Compliant pin connecting systems” gelöst. Insbesondere kann dabei auf Zinn oder eine bleifreie Zinnlegierung verzichtet werden, da diese Whiskerwachstum zeigen. Durch die Zinnfreiheit ist außerdem ein Aufschmelzen der Schicht unterhalb typischer Anwendungstemperaturen in der Automobiltechnik von bis zu 150°C ausgeschlossen. Der niedrigste Schmelzpunkt bei Zinn-Indium-Legierungen ist signifikant niedriger als diese 150°C.By the contact elements according to the invention is a potential solution to the requirement for lead-free End of Life Vehicle Directive, 2000/53 / EC solved for "Compliant pin connecting systems". In particular, can be dispensed with tin or a lead-free tin alloy, as these show whisker growth. Due to the absence of tin, melting of the layer below typical application temperatures in automotive technology of up to 150 ° C is also excluded. The lowest melting point for tin-indium alloys is significantly lower than this 150 ° C.

In einer Weiterbildung der Erfindung kann zwischen dem Basismaterial des Kontaktelements und der leitfähigen Schicht eine Zwischenschicht als Diffusionssperre aus wenigstens einem der Elemente aus der Gruppe von Elementen enthaltend Nickel, Kupfer, Eisen und Wolfram aufgebracht sein.In one development of the invention, between the base material of the contact element and the conductive layer, an intermediate layer may be applied as a diffusion barrier of at least one of the elements of the group of elements containing nickel, copper, iron and tungsten.

Als Basismaterial kommt bei Kontaktsteckern bzw. Einpressstiften ein Metall wie Bronze, Messing, Kupfer, Nickel oder Kupfer-Nickel-Silizium Legierungen sowie Kupfer-Eisen in Frage.As a base material comes in contact plugs or Einpressstiften a metal such as bronze, brass, copper, nickel or copper-nickel-silicon alloys and copper-iron in question.

In einer Weiterbildung der Erfindung kann auf die leitfähige Schicht wenigstens eine weitere leitfähige Schicht aus Kupfer, Silber, Gold, Bismut, Nickel, Antimon, Palladium oder Kohlenstoff aufgebracht sein.In one development of the invention, at least one further conductive layer of copper, silver, gold, bismuth, nickel, antimony, palladium or carbon can be applied to the conductive layer.

Alternativ kann als Korrosionsschutz auch eine organische Schutzschicht aufgebracht sein.Alternatively, an organic protective layer can be applied as corrosion protection.

Das Aufbringen bzw. Abscheiden der metallischen Schichten kann auf galvanische, chemische oder schmelztechnische Weise sowie durch molekulare oder gasförmige Abscheidung erfolgen.The deposition or depositing of the metallic layers can be carried out in a galvanic, chemical or melting manner as well as by molecular or gaseous deposition.

Die erfindungsgemäßen Kontaktelemente können je nach gewähltem Material, der Materialdicke und dem Verhältnis der Durchmesser der Kontaktstifte bzw. Einpressstifte und der Buchsen aufgrund von Kaltverschweißung unlösbare Verbindungen ergeben, aber auch zu Reparaturzwecken teilweise lösbare oder wiederholt lösbare Kontakte. Depending on the selected material, the material thickness and the ratio of the diameters of the contact pins or press-fit pins and the sockets, the contact elements according to the invention can form non-detachable connections due to cold welding, but also partially detachable or repeatedly detachable contacts for repair purposes.

Durch die erfindungsgemäßen Kontaktelemente wird also eine Zinn- und damit eine Zinn-Whisker-freie Beschichtung vorgeschlagen, die außerdem die geforderte Bleifreiheit erfüllt.By the contact elements according to the invention thus a tin and thus a tin-whisker-free coating is proposed, which also meets the required lead-free.

ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION

Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Zitierte PatentliteraturCited patent literature

  • DE 102007047007 A1 [0004] DE 102007047007 A1 [0004]

Zitierte Nicht-PatentliteraturCited non-patent literature

  • „End of Life Vehicle Directive”, 2000/53/EC [0008] End of Life Vehicle Directive, 2000/53 / EC [0008]

Claims (6)

Kontaktelement aus einem Basismaterial mit wenigstens einer darauf aufgebrachten leitfähigen Schicht, dadurch gekennzeichnet, dass als leitfähige Schicht oder eine dieser Schichten eine Schicht aus Indium aufgebracht ist.Contact element made of a base material with at least one conductive layer applied thereto, characterized in that a layer of indium is applied as the conductive layer or one of these layers. Kontaktelement aus einem Basismaterial mit wenigstens einer darauf aufgebrachten leitfähigen Schicht, dadurch gekennzeichnet, dass als leitfähige Schicht oder eine dieser Schichten eine Schicht aus Indium mit einer Beimischung oder Legierung von wenigstens einem der Elemente aus der Gruppe von Elementen enthaltend Kupfer, Silber, Gold, Bismut, Nickel, Antimon, Palladium, Eisen, Kohlenstoff und Phosphor aufgebracht ist.Contact element of a base material having at least one conductive layer applied thereon, characterized in that as the conductive layer or one of these layers, a layer of indium with an admixture or alloy of at least one of the elements from the group of elements containing copper, silver, gold, bismuth , Nickel, antimony, palladium, iron, carbon and phosphorus is applied. Kontaktelement nach einem der Ansprüche 1 oder 2, dadurch gekennzeichnet, dass zwischen dem Basismaterial und der leitfähigen Schicht eine Zwischenschicht als Diffusionssperre aus wenigstens einem der Elemente aus der Gruppe von Elementen enthaltend Nickel, Kupfer, Silber, Eisen und Wolfram aufgebracht ist.Contact element according to one of claims 1 or 2, characterized in that between the base material and the conductive layer, an intermediate layer is applied as a diffusion barrier of at least one of the elements from the group of elements containing nickel, copper, silver, iron and tungsten. Kontaktelement nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass direkt auf das Basismaterial eine dünne Schicht aus Kupfer oder aus einer Kupferlegierung aufgebracht ist.Contact element according to one of Claims 1 to 3, characterized in that a thin layer of copper or of a copper alloy is applied directly to the base material. Kontaktelement nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass auf die leitfähige Schicht wenigstens eine weitere leitfähige Schicht aus Kupfer, Silber, Gold, Bismut, Nickel, Antimon, Palladium oder Kohlenstoff aufgebracht ist.Contact element according to one of claims 1 to 4, characterized in that on the conductive layer at least one further conductive layer of copper, silver, gold, bismuth, nickel, antimony, palladium or carbon is applied. Kontaktelement nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass auf die leitfähige Schicht eine organische Schutzschicht aufgebracht ist.Contact element according to one of claims 1 to 4, characterized in that an organic protective layer is applied to the conductive layer.
DE102010042526A 2010-10-15 2010-10-15 contact element Ceased DE102010042526A1 (en)

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DE102010042526A DE102010042526A1 (en) 2010-10-15 2010-10-15 contact element
PCT/EP2011/068000 WO2012049297A1 (en) 2010-10-15 2011-10-14 Electrical contact element

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WO2014013055A1 (en) * 2012-07-20 2014-01-23 Tyco Electronics France Sas Coating process and coating for press-fit contact
DE102012213505A1 (en) * 2012-07-31 2014-02-06 Tyco Electronics Amp Gmbh Layer for an electrical contact element, layer system and method for producing a layer
DE102015004651A1 (en) 2015-04-15 2016-10-20 Diehl Metal Applications Gmbh Method for coating a component and use of the method
DE202021001551U1 (en) 2021-04-28 2021-07-23 Possehl Electronics Deutschland Gmbh Contact element with at least one conductive layer applied thereon

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DE102018109059B4 (en) 2018-01-15 2020-07-23 Doduco Solutions Gmbh Electrical press-in contact pin

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WO2014013055A1 (en) * 2012-07-20 2014-01-23 Tyco Electronics France Sas Coating process and coating for press-fit contact
FR2993579A1 (en) * 2012-07-20 2014-01-24 Tyco Electronics France Sas COATING AND COATING PROCESS FOR FORCE-INSERT CONTACT
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CN104471112B (en) * 2012-07-20 2017-03-29 泰科电子法国公司 Coating processing and the coating for press-fit contacts
US10348017B2 (en) 2012-07-20 2019-07-09 Tyco Electronics France Sas Coating process and coating for press-fit contact
DE102012213505A1 (en) * 2012-07-31 2014-02-06 Tyco Electronics Amp Gmbh Layer for an electrical contact element, layer system and method for producing a layer
DE102015004651A1 (en) 2015-04-15 2016-10-20 Diehl Metal Applications Gmbh Method for coating a component and use of the method
DE102015004651B4 (en) 2015-04-15 2018-09-27 Diehl Metal Applications Gmbh Method for coating a component and use of the method
DE202021001551U1 (en) 2021-04-28 2021-07-23 Possehl Electronics Deutschland Gmbh Contact element with at least one conductive layer applied thereon

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