DE102010040221A1 - Schleifvorrichtung mit Waferlademechanismus - Google Patents

Schleifvorrichtung mit Waferlademechanismus Download PDF

Info

Publication number
DE102010040221A1
DE102010040221A1 DE201010040221 DE102010040221A DE102010040221A1 DE 102010040221 A1 DE102010040221 A1 DE 102010040221A1 DE 201010040221 DE201010040221 DE 201010040221 DE 102010040221 A DE102010040221 A DE 102010040221A DE 102010040221 A1 DE102010040221 A1 DE 102010040221A1
Authority
DE
Germany
Prior art keywords
wafer
grinding
suction
pressure
pressure pins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE201010040221
Other languages
German (de)
English (en)
Inventor
Gerald Strzalka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of DE102010040221A1 publication Critical patent/DE102010040221A1/de
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
DE201010040221 2009-09-07 2010-09-03 Schleifvorrichtung mit Waferlademechanismus Ceased DE102010040221A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009206044A JP2011060841A (ja) 2009-09-07 2009-09-07 研削装置
JP2009-206044 2009-09-07

Publications (1)

Publication Number Publication Date
DE102010040221A1 true DE102010040221A1 (de) 2011-03-10

Family

ID=43536361

Family Applications (1)

Application Number Title Priority Date Filing Date
DE201010040221 Ceased DE102010040221A1 (de) 2009-09-07 2010-09-03 Schleifvorrichtung mit Waferlademechanismus

Country Status (2)

Country Link
JP (1) JP2011060841A (ja)
DE (1) DE102010040221A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115847257A (zh) * 2023-02-28 2023-03-28 烟台聚通智能设备有限公司 一种柜体柔性打磨自动化流水线

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6101095B2 (ja) * 2013-02-05 2017-03-22 東京応化工業株式会社 搬送ハンド、搬送装置および搬送方法
JP6186256B2 (ja) * 2013-11-20 2017-08-23 株式会社ディスコ 加工装置
JP2016157718A (ja) * 2015-02-23 2016-09-01 株式会社ディスコ ウエーハの搬送方法及びウエーハの搬送機構
JP6879807B2 (ja) * 2017-04-07 2021-06-02 株式会社ディスコ 加工装置
CN114393468B (zh) * 2021-12-29 2023-03-10 江苏威森美微电子有限公司 一种半导体晶圆磨边加工用磨边机

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001007135A (ja) 1999-06-23 2001-01-12 Toshiba Corp 半導体装置の製造方法
JP2004091196A (ja) 2002-09-04 2004-03-25 Disco Abrasive Syst Ltd 板状物搬送装置及び隙間規制部材

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11233597A (ja) * 1998-02-12 1999-08-27 Nikon Corp 基板保持装置及び方法
JP5180557B2 (ja) * 2007-10-31 2013-04-10 株式会社ディスコ 加工装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001007135A (ja) 1999-06-23 2001-01-12 Toshiba Corp 半導体装置の製造方法
JP2004091196A (ja) 2002-09-04 2004-03-25 Disco Abrasive Syst Ltd 板状物搬送装置及び隙間規制部材

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115847257A (zh) * 2023-02-28 2023-03-28 烟台聚通智能设备有限公司 一种柜体柔性打磨自动化流水线

Also Published As

Publication number Publication date
JP2011060841A (ja) 2011-03-24

Similar Documents

Publication Publication Date Title
DE102008060490B4 (de) Schleifvorrichtung
DE10295893T5 (de) Verfahren zur Herstellung von Halbleiterchips
DE102017217793A1 (de) Einspannung zum Fixieren eines Rahmens
DE102012220161B4 (de) Bearbeitungsverfahren für einen Wafer mit einem abgeschrägten Abschnitt entlang des äusseren Umfangs davon
DE102010040221A1 (de) Schleifvorrichtung mit Waferlademechanismus
DE102015216193A1 (de) Waferbearbeitungsverfahren
DE102022207364A1 (de) Schleifverfahren für harte wafer
DE10162945A1 (de) Schleifmaschine
DE102009004168A1 (de) Schichtbauelement-Herstellungsverfahren
DE102009004567A1 (de) Wafertrennverfahren
DE102010007769A1 (de) Waferbearbeitungsverfahren
DE112007000520T5 (de) Halbleiterscheibenbearbeitungsverfahren
DE102018215510A1 (de) Bearbeitungsvorrichtung zum Bearbeiten eines Wafers
DE102008017061A1 (de) Wafer-Bearbeitungsverfahren
DE102014206527A1 (de) Aufteilungsverfahren für scheibenförmiges Werkstück
DE102016221544A1 (de) Waferbearbeitungsverfahren
DE102019212581A1 (de) Polierscheibe
DE10124739A1 (de) Halbleiterwaferanordnung und Bearbeitungsvorrichtung mit Ansaugtischen zum Halten derselben
DE102013208835A1 (de) Haftbandbefestigungsverfahren
DE102017209189A1 (de) Schneidvorrichtung
DE102015222535A1 (de) Schleifverfahren für Werkstücke
DE3033944C2 (de) Werkstückhalter und Verfahren zu seiner Herstellung
DE10054166C2 (de) Vorrichtung zum Polieren von Halbleiterscheiben
DE3430359A1 (de) Befestigungseinrichtung fuer eine polierplattenauflage
DE102018210109A1 (de) Bearbeitungsverfahren für einen wafer

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R016 Response to examination communication
R002 Refusal decision in examination/registration proceedings
R003 Refusal decision now final